CN207820302U - A kind of new structural countersunk head orifice plate - Google Patents
A kind of new structural countersunk head orifice plate Download PDFInfo
- Publication number
- CN207820302U CN207820302U CN201721728149.7U CN201721728149U CN207820302U CN 207820302 U CN207820302 U CN 207820302U CN 201721728149 U CN201721728149 U CN 201721728149U CN 207820302 U CN207820302 U CN 207820302U
- Authority
- CN
- China
- Prior art keywords
- solder mask
- hole
- core layer
- countersunk head
- orifice plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The utility model discloses a kind of new structural countersunk head orifice plates, are related to technical field of PCB board；Including the first solder mask, core layer and the second solder mask, and core layer is arranged between the first solder mask and the second solder mask；It is provided with first through hole on first solder mask, it is provided with the second through-hole on second solder mask, a stepped hole is provided in the core layer, and the diameter of the stepped hole upper end is equal with the diameter of first through hole, stepped hole lower end it is direct equal with the diameter of the second through-hole；The stepped hole forms an annular step surface in core layer, the upper plane parallel of the annular step surface and first solder mask；A groove is provided in the annular step surface, groove is provided with a buffer unit；The utility model has the beneficial effects that：Screw is set to lock the firm of a laggard step, the damage of countersunk head orifice plate, simple in structure caused by effectively preventing screw, easy to operate, highly practical.
Description
Technical field
The utility model is related to technical field of PCB board, more specifically, the utility model is related to a kind of new structural heavy
Head bore plate.
Background technology
It is well known that substrate is all very popular in every field, and substrate is when in use, can't do without consolidating it
It is fixed, the fixation generally use screw contraposition of substrate is locked in the counter sink on substrate, therefore, the direct shadow of quality of counter sink
Ring the firm effect of substrate.Currently, traditional counter sink it is simple in structure, using traditional spiral locking, screw lock after be easy
It loosens, also, screw easily damages substrate.
Utility model content
For overcome the deficiencies in the prior art, the utility model provides a kind of new structural countersunk head orifice plate, the counter sink
Plate can play cushioning effect to screw, and screw is avoided to cause to damage to countersunk head orifice plate.
Technical solution adopted by the utility model to solve its technical problems is：A kind of new structural countersunk head orifice plate,
It thes improvement is that：Including the first solder mask, core layer and the second solder mask, and core layer setting is in the first solder mask and the
Between two solder masks；
It is provided with first through hole on first solder mask, the second through-hole, institute are provided on second solder mask
A stepped hole is provided in the core layer stated, and the diameter of the stepped hole upper end is equal with the diameter of first through hole, under stepped hole
The diameter at end is equal with the diameter of the second through-hole；
The stepped hole forms an annular step surface in core layer, the annular step surface and first solder mask
Upper plane parallel；A groove is provided in the annular step surface, groove is provided with a buffer unit.
In such a configuration, the buffer unit includes buffer stopper, buffer spring and guide holder；
The guide holder is fixedly mounted in the groove, and it is logical that the buffer stopper lower surface is provided with a guiding
The top in hole, the guide holder is inserted into the guide through hole of buffer stopper, and the buffer spring setting is in buffer stopper and guiding
Between seat, the upper surface of buffer stopper is higher than the annular step surface.
In such a configuration, first solder mask and the second solder mask are green ink, black ink, reddish oil
Ink, blue ink, white ink or Yellow ink；Circuit is mutual when first solder mask and the second solder mask are for preventing welding
Interference.
In such a configuration, the core layer is formed by copper foil and PP layers of bonding.
In such a configuration, the upper surface of the copper foil also has surface-treated layer.
The utility model has the beneficial effects that：After locking screw in stepped hole, screw in compression is on buffer stopper, by slow
The effect for rushing spring plays cushioning effect to screw, so that screw is locked the firm of a laggard step, while effectively preventing screw from making
At countersunk head orifice plate damage, it is simple in structure, it is easy to operate, it is highly practical.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of new structural countersunk head orifice plate of the utility model.
Fig. 2 is a kind of specific implementation illustration of new structural countersunk head orifice plate of the utility model.
Fig. 3 is the partial enlarged view at A in Fig. 2.
Specific implementation mode
The utility model is further illustrated with reference to the accompanying drawings and examples.
The technique effect of the design of the utility model, concrete structure and generation is carried out below with reference to embodiment and attached drawing
It clearly and completely describes, to be completely understood by the purpose of this utility model, feature and effect.Obviously, described embodiment
It is a part of the embodiment of the utility model, rather than whole embodiments, it is based on the embodiments of the present invention, the skill of this field
The other embodiment that art personnel are obtained without creative efforts belongs to the model of the utility model protection
It encloses.In addition, all connection/connection relations arrived involved in patent, not singly refer to component and directly connect, and referring to can be according to specific
Performance, by adding or reducing couple auxiliary, to form more preferably coupling structure.Each skill in the utility model creation
Art feature, can be with combination of interactions under the premise of not conflicting conflict.
Shown in referring to Fig.1, the utility model discloses a kind of new structural countersunk head orifice plate, specifically, including the first resistance
Layer 101, core layer 103 and the second solder mask 102, and core layer 103 is arranged in the first solder mask 101 and the second welding resistance
Between layer 102；First solder mask 101 and the second solder mask 102 is green ink, black ink, red ink, blue
Ink, white ink or Yellow ink；Circuit is mutual when first solder mask 101 and the second solder mask 102 are for preventing welding
Interference or upper tin, short circuit caused by avoiding heterogeneous networks are also prevented from copper face oxidation and corrosion；The core layer 103 by copper foil with
PP layers of bonding are formed, and main more effectively to be manufactured convenient for high-rise density pcb board, the upper surface of the copper foil also has
Surface-treated layer, which is mainly by turmeric, sprays tin or electricity gold formation, mainly for preventing copper face oxidation, corruption
Erosion, convenient for being easy upper tin when electronic component welding.It is provided with first through hole on first solder mask 101, described
It is provided with the second through-hole on two solder masks 102, is provided with a stepped hole in the core layer 103, and the stepped hole upper end
Diameter is equal with the diameter of first through hole, and the diameter of stepped hole lower end is equal with the diameter of the second through-hole.
Further, as shown in Figure 2 and Figure 3, the stepped hole forms an annular step surface 104 in core layer 103,
The upper plane parallel of the annular step surface 104 and first solder mask 101；It is provided in the annular step surface 104
One groove 105, groove 105 is provided with a buffer unit 20, after locking screw in stepped hole, is played by buffer unit 20 slow
Punching acts on；Specifically, the buffer unit 20 includes buffer stopper 201, buffer spring 202 and guide holder 203；Described leads
It is fixedly mounted on to seat 203 in the groove 105,201 lower surface of buffer stopper is provided with a guide through hole 204, institute
The top for stating guide holder 203 is inserted into the guide through hole 204 of buffer stopper 201, and the buffer spring 202 is arranged in buffer stopper
Between 201 and guide holder 203, the upper surface of buffer stopper 201 is higher than the annular step surface 104；When locking spiral shell in stepped hole
After nail, screw in compression is on buffer stopper 201, by the effect of buffer spring 202, plays cushioning effect to screw, makes screwed lock
It is further firm after fixed, at the same it is effective prevent screw caused by countersunk head orifice plate damage, it is simple in structure, it is easy to operate,
It is highly practical.
It is to be illustrated to the preferable implementation of the utility model, but the utility model creation is not limited to institute above
Embodiment is stated, those skilled in the art can also make various be equal without departing from the spirit of the present invention
Deformation is replaced, these equivalent deformations or replacement are all contained in the application claim limited range.
Claims (5)
1. a kind of new structural countersunk head orifice plate, it is characterised in that：Including the first solder mask, core layer and the second solder mask,
And core layer is arranged between the first solder mask and the second solder mask；
It is provided with first through hole on first solder mask, the second through-hole is provided on second solder mask, it is described
A stepped hole is provided in core layer, and the diameter of the stepped hole upper end is equal with the diameter of first through hole, stepped hole lower end
Diameter is equal with the diameter of the second through-hole；
The stepped hole forms an annular step surface in core layer, and the annular step surface is upper flat with first solder mask
Face is parallel；A groove is provided in the annular step surface, groove is provided with a buffer unit.
2. a kind of new structural countersunk head orifice plate according to claim 1, it is characterised in that：The buffer unit includes
Buffer stopper, buffer spring and guide holder；
The guide holder is fixedly mounted in the groove, and the buffer stopper lower surface is provided with a guide through hole, institute
The top for stating guide holder is inserted into the guide through hole of buffer stopper, and the setting of the described buffer spring buffer stopper and guide holder it
Between, the upper surface of buffer stopper is higher than the annular step surface.
3. a kind of new structural countersunk head orifice plate according to claim 1, it is characterised in that：First solder mask and
Second solder mask is green ink, black ink, red ink, blue ink, white ink or Yellow ink；First welding resistance
Circuit interferes with each other when layer and the second solder mask are for preventing welding.
4. a kind of new structural countersunk head orifice plate according to claim 1, it is characterised in that：The core layer by copper foil with
PP layers of bonding are formed.
5. a kind of new structural countersunk head orifice plate according to claim 4, it is characterised in that：The upper surface of the copper foil
Also there is surface-treated layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721728149.7U CN207820302U (en) | 2017-12-11 | 2017-12-11 | A kind of new structural countersunk head orifice plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721728149.7U CN207820302U (en) | 2017-12-11 | 2017-12-11 | A kind of new structural countersunk head orifice plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207820302U true CN207820302U (en) | 2018-09-04 |
Family
ID=63332021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721728149.7U Expired - Fee Related CN207820302U (en) | 2017-12-11 | 2017-12-11 | A kind of new structural countersunk head orifice plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207820302U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113709973A (en) * | 2021-09-10 | 2021-11-26 | 苏州浪潮智能科技有限公司 | PCB with screw through hole stress buffering and aligning device and processing method |
-
2017
- 2017-12-11 CN CN201721728149.7U patent/CN207820302U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113709973A (en) * | 2021-09-10 | 2021-11-26 | 苏州浪潮智能科技有限公司 | PCB with screw through hole stress buffering and aligning device and processing method |
| CN113709973B (en) * | 2021-09-10 | 2023-01-24 | 苏州浪潮智能科技有限公司 | PCB with screw through hole stress buffering and aligning device and processing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180904 Termination date: 20211211 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |