CN208016096U - A kind of pcb board of the blue glue-line of coating - Google Patents
A kind of pcb board of the blue glue-line of coating Download PDFInfo
- Publication number
- CN208016096U CN208016096U CN201721728098.8U CN201721728098U CN208016096U CN 208016096 U CN208016096 U CN 208016096U CN 201721728098 U CN201721728098 U CN 201721728098U CN 208016096 U CN208016096 U CN 208016096U
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- China
- Prior art keywords
- copper foil
- layers
- layer
- foil layer
- solder mask
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Abstract
The utility model discloses a kind of pcb boards of the blue glue-line of coating, are related to technical field of PCB board；Including the first solder mask, the first copper foil layer, the first PP layers, the first core layer, the 2nd PP layers, the second core layer, the 3rd PP layers and the second copper foil layer；First solder mask, the first copper foil layer, the first PP layers, the first core layer, the 2nd PP layers, the second core layer, the conductive through hole being provided through on the 3rd PP layers and the second copper foil layer, which electrically conducts for making to be formed between the first copper foil layer, the first core layer, the second core layer and the second copper foil layer；Blue glue-line is coated in the upper surface of first solder mask and conductive through hole, tin on pad when the indigo plant glue-line is for preventing PCBA board patch；The utility model has the beneficial effects that：Tin on the pad in PCBA board can be prevented, insulating effect is played, after the completion of patch, blue glue-line is removed, it is very convenient quick, improve efficiency when PCBA board patch.
Description
Technical field
The utility model is related to technical field of PCB board, more specifically, the utility model is related to a kind of blue glue-lines of coating
Pcb board.
Background technology
PCB (Printed Circuit Board, printed circuit board) is important electronic unit, is the branch of electronic component
Support body is the supplier of electronic component connection.Since it is made of terahertz wave quasi-optics, therefore it is referred to as " print
Brush " circuit board.Before printed circuit board appearance, the interconnection between electronic component is all to be directly connected to and formed by electric wire
Whole circuit.PCBA is the abbreviation of English Printed Circuit Board+Assembly, that is to say, that PCB hollow plates pass through
SMT piece uploadings, using the entire processing procedure of DIP plug-in units, in brief, PCBA board is exactly welded, assembles electronic component
Pcb board.
In the prior art, in patch on pcb board, pad on pcb board is easy upper tin, causes short between adjacent pad
Road needs individually to handle pad after the completion of patch, leads to patch tedious process.
Utility model content
For overcome the deficiencies in the prior art, the utility model provides a kind of pcb board of the blue glue-line of coating, the coating indigo plant glue
The pcb board of layer is by the design of blue glue-line, and tin on pad, plays insulating effect, after the completion of patch when avoiding PCBA board patch
Convenient for stripping.
Technical solution adopted by the utility model to solve its technical problems is：A kind of pcb board of the blue glue-line of coating, changes
It is into place：Including the first solder mask, the first copper foil layer, the first PP layers, the first core layer, the 2nd PP layers, the second core plate
Layer, the 3rd PP layers and the second copper foil layer；
First solder mask, the first copper foil layer and the first PP layers of phase poststack successively, are tightly attached to the first core layer
Upper surface；
Described 2nd PP layers between the first core layer and the second core layer, the described 3rd PP layers be tightly attached to second
The lower surface of core layer, second copper foil layer are tightly attached to the lower surface of PP layers of described the 3rd；
First solder mask, the first copper foil layer, the first PP layers, the first core layer, the 2nd PP layers, the second core layer,
The conductive through hole being provided through on 3rd PP layers and the second copper foil layer, the conductive through hole is for making the first copper foil layer, first
It is formed and is electrically conducted between core layer, the second core layer and the second copper foil layer；The upper surface of first solder mask and described
Conductive through hole in be coated with blue glue-line, indigo plant glue-line tin on pad when preventing PCBA board patch.
In such a configuration, the pcb board of the blue glue-line of the described coating further includes the second solder mask, on the second solder mask
It is provided with conductive through hole, and is provided with blue glue-line in the conductive through hole.
In such a configuration, first solder mask and the second solder mask are green, black, red, blue, white
Or the ink of yellow, circuit interferes with each other or upper tin when the first solder mask and the second solder mask are for preventing welding.
In such a configuration, first copper foil layer and the second copper foil layer are routing layer or shielded layer, the first copper foil
Welding electronic component is used on layer and the second copper foil layer.
In such a configuration, the described first PP layers, the 2nd PP layers and the 3rd PP layers of main material be asphalt mixtures modified by epoxy resin
Fat and glass fabric, for avoiding interfering with each other between the first copper foil layer and the second copper foil layer.
The utility model has the beneficial effects that：It is coated with blue glue in the upper surface of first solder mask and the conductive through hole
Layer, in patch in PCBA board, by the design of blue glue-line, can prevent tin on the pad in PCBA board, play insulation and make
With, after the completion of patch, blue glue-line is removed, it is very convenient quick, improve efficiency when PCBA plate patches.
Description of the drawings
Fig. 1 is a kind of schematic cross-section of the pcb board of coating indigo plant glue-line of the utility model.
Specific implementation mode
The utility model is further illustrated with reference to the accompanying drawings and examples.
The technique effect of the design of the utility model, concrete structure and generation is carried out below with reference to embodiment and attached drawing
It clearly and completely describes, to be completely understood by the purpose of this utility model, feature and effect.Obviously, described embodiment
It is a part of the embodiment of the utility model, rather than whole embodiments, it is based on the embodiments of the present invention, the skill of this field
The other embodiment that art personnel are obtained without creative efforts belongs to the model of the utility model protection
It encloses.In addition, all connection/connection relations arrived involved in patent, not singly refer to component and directly connect, and referring to can be according to specific
Performance, by adding or reducing couple auxiliary, to form more preferably coupling structure.Each skill in the utility model creation
Art feature, can be with combination of interactions under the premise of not conflicting conflict.
Shown in referring to Fig.1, the utility model discloses a kind of pcb board of the blue glue-line of coating, specifically, the coating indigo plant glue-line
Pcb board include the first solder mask 101, the first copper foil layer 102, the first PP layers 103, the first core layer 104, the 2nd PP layers 105,
Second core layer 106, the 3rd PP layers 107 and the second copper foil layer 108；First solder mask 101, the first copper foil layer 102
And the first phase poststack successively of PP layers 103, it is tightly attached to the upper surface of the first core layer 104, in general, in the first copper foil layer 102
On be provided with surface-treated layer, common process of surface treatment includes but not limited to turmeric, spray tin or electricity gold, and primarily serving prevents
Copper face oxidation, corrosion, convenient for being easy upper tin when PCBA welding；The 2nd PP layers 105 are located at the first core layer 104 and
Between two core layers 106, the 3rd PP layers 107 are tightly attached to the lower surface of the second core layer 106, second copper foil
Layer 108 is tightly attached to the lower surface of the 3rd PP layers 107；Wherein, the first PP layers 103, the 2nd PP layers 105 and the 3rd PP
The main material of layer 107 is epoxy resin and glass fabric, for avoid the first copper foil layer 102 and the second copper foil layer 108 it
Between interfere with each other and be connected, convenient for combining well between layers of copper, fire-retardant and insulation.
Further, the pcb board of the blue glue-line of the coating further includes the second solder mask 109, first solder mask
101, the first copper foil layer 102, the first PP layers 103, the first core layer 104, the 2nd PP layers 105, the second core layer 106, the 3rd PP
The conductive through hole 110 being provided through on the 107, second copper foil layer 108 of layer and the second solder mask 109, the conductive through hole 110 are used
It is electrically led in making to be formed between the first copper foil layer 102, the first core layer 104, the second core layer 106 and the second copper foil layer 108
It is logical, carry out the transmission of signal；In the present embodiment, in the upper surface of first solder mask 101 and the conductive through hole 110
It is coated with blue glue-line 111, in patch on PCBA plates, by the design of blue glue-line 111, the pad in PCBA board can be prevented
Upper tin, plays insulating effect, and after the completion of patch, blue glue-line 111 is removed, very convenient quick, improves PCBA board
Efficiency when patch.
In the above-described embodiment, first solder mask 101 and the second solder mask 109 be green, black, red,
Circuit interferes with each other when the ink of blue, white or yellow, the first solder mask 101 and the second solder mask 109 are for preventing welding
Or upper tin, it causes heterogeneous networks to cause short circuit, in addition also acts the effect for preventing copper face oxidation, corrosion；First bronze medal
Layers of foil 102 and the second copper foil layer 108 are routing layer or shielded layer, are used to weld on the first copper foil layer 102 and the second copper foil layer 108
In addition electronic component can also shield electromagnetic radiation well, reduce loss of signal output, also avoid pollution and to human body
Injury.
It is to be illustrated to the preferable implementation of the utility model, but the utility model creation is not limited to institute above
Embodiment is stated, those skilled in the art can also make various be equal without departing from the spirit of the present invention
Deformation is replaced, these equivalent deformations or replacement are all contained in the application claim limited range.
Claims (5)
1. a kind of pcb board of the blue glue-line of coating, it is characterised in that：Including the first solder mask, the first copper foil layer, the first PP layers,
One core layer, the 2nd PP layers, the second core layer, the 3rd PP layers and the second copper foil layer；
First solder mask, the first copper foil layer and the first PP layers of phase poststack successively, are tightly attached to the upper table of the first core layer
Face；
Described 2nd PP layers between the first core layer and the second core layer, the described 3rd PP layers be tightly attached to the second core plate
The lower surface of layer, second copper foil layer are tightly attached to the lower surface of PP layers of described the 3rd；
First solder mask, the first copper foil layer, the first PP layers, the first core layer, the 2nd PP layers, the second core layer, third
The conductive through hole being provided through on PP layers and the second copper foil layer, the conductive through hole is for making the first copper foil layer, the first core plate
It is formed and is electrically conducted between layer, the second core layer and the second copper foil layer；It the upper surface of first solder mask and described leads
Blue glue-line is coated in electric through-hole, tin on pad when the indigo plant glue-line is for preventing PCBA board patch.
2. a kind of pcb board of the blue glue-line of coating according to claim 1, it is characterised in that：The blue glue-line of the coating
Pcb board further includes the second solder mask, conductive through hole is also equipped on the second solder mask, and blue glue is provided in the conductive through hole
Layer.
3. a kind of pcb board of the blue glue-line of coating according to claim 2, it is characterised in that：First solder mask and
Second solder mask is green, the ink of black, red, blue, white or yellow, the first solder mask and the second solder mask are for preventing
Circuit interferes with each other or upper tin when only welding.
4. a kind of pcb board of the blue glue-line of coating according to claim 1, it is characterised in that：First copper foil layer and
Second copper foil layer is routing layer or shielded layer, and welding electronic component is used on the first copper foil layer and the second copper foil layer.
5. a kind of pcb board of the blue glue-line of coating according to claim 1, it is characterised in that：Described first PP layers, second
PP layers and the 3rd PP layers of material are epoxy resin and glass fabric, for avoid the first copper foil layer and the second copper foil layer it
Between interfere with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721728098.8U CN208016096U (en) | 2017-12-11 | 2017-12-11 | A kind of pcb board of the blue glue-line of coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721728098.8U CN208016096U (en) | 2017-12-11 | 2017-12-11 | A kind of pcb board of the blue glue-line of coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208016096U true CN208016096U (en) | 2018-10-26 |
Family
ID=63880563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721728098.8U Expired - Fee Related CN208016096U (en) | 2017-12-11 | 2017-12-11 | A kind of pcb board of the blue glue-line of coating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208016096U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112235961A (en) * | 2020-10-14 | 2021-01-15 | 大连崇达电路有限公司 | Manufacturing method for improving tin coating on gold surface of blue rubber plate |
-
2017
- 2017-12-11 CN CN201721728098.8U patent/CN208016096U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112235961A (en) * | 2020-10-14 | 2021-01-15 | 大连崇达电路有限公司 | Manufacturing method for improving tin coating on gold surface of blue rubber plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181026 Termination date: 20211211 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |