CN206775820U

CN206775820U - A kind of PCB of electromagnetism interference

Info

Publication number: CN206775820U
Application number: CN201720460664.5U
Authority: CN
Inventors: 吕桃东
Original assignee: Shenzhen Is To Forceful Electric Power Lu Co Ltd
Current assignee: Shenzhen Is To Forceful Electric Power Lu Co Ltd
Priority date: 2017-04-27
Filing date: 2017-04-27
Publication date: 2017-12-19
Anticipated expiration: 2027-04-27

Abstract

The utility model discloses a kind of PCB of electromagnetism interference, including three sandwich circuit layers, the three sandwich circuits layer is respectively bus plane, signals layer and ground plane, and the three sandwich circuits layer is internal layer circuit layer；First side surface of the PCB is provided with the metal screen layer of electromagnetism interference, and the second side surface of the PCB is pasted with electronic component, and the electrographite piece PGS layers for covering the electronic component are additionally provided with second side surface.

Description

A kind of PCB of electromagnetism interference

Technical field

It the utility model is related to PCB technical fields, and in particular to a kind of PCB of electromagnetism interference.

Background technology

PCB is one of most important parts of Application to Electronic Industry, for providing electronic component electrical connection.Peace Circuit of high-frequency signal etc. is walked loaded on electronic component in PCB such as inductance capacitance, and in PCB, all can Substantial amounts of electromagnetic interference is produced, has a strong impact on the normal work of PCB, reduces the work quality of PCB.

Utility model content

The utility model embodiment aims to provide a kind of PCB of electromagnetism interference.

In order to solve the above technical problems, the utility model embodiment adopts the following technical scheme that：

A kind of PCB of electromagnetism interference, including three sandwich circuit layers, respectively bus plane, signals layer and ground plane, And the three sandwich circuits layer is internal layer circuit layer；First side surface of the PCB is provided with the metal of electromagnetism interference Screen layer, the second side surface of the PCB is pasted with electronic component, and is additionally provided with covering on second side surface The electrographite piece PGS layers of the electronic component.

Optionally, the bus plane is made up of the copper billet and/or copper bar being embedded in the PCB.

Optionally, the circuit of the bus plane is distributed mainly on the first area of the PCB, the signals layer Circuit is distributed mainly on the second area of the PCB.

Optionally, there is plated through-hole, the plated through-hole is used to realize that line layer interlayer connects in the PCB Connect, the coating of electromagnetism interference is provided with the inwall of the plated through-hole.

Optionally, it is provided with insulating barrier between the PGS layers and the electronic component.

As can be seen from the above technical solutions, the utility model embodiment has advantages below：

1st, by the way that power supply, signal and ground connection are layered, electromagnetic interference can effectively be reduced；

2nd, metal screen layer, further electromagnetism interference are set in a side surface of PCB；

3rd, electrographite piece is set in the one side for being pasted with electronic component of PCB（Pyrolytic Graphite Sheet, PGS）Layer, on the one hand can further electromagnetism interference, on the other hand can effectively improve radiating efficiency.

To sum up, there is provided a kind of stronger PCB of anti-electromagnetic interference capability.

Brief description of the drawings

In order to illustrate more clearly of the utility model embodiment technical scheme, make required in being described below to embodiment Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the utility model, For those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings Other accompanying drawings.

Fig. 1 is a kind of structural representation of the PCB for electromagnetism interference that the utility model embodiment provides.

Embodiment

In order that those skilled in the art more fully understand the utility model, it is real below in conjunction with the utility model The accompanying drawing in example is applied, the technical scheme in the embodiment of the utility model is clearly and completely described, it is clear that be described Embodiment is only the embodiment of the utility model part, rather than whole embodiments.Based on the reality in the utility model Example is applied, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all should When the scope for belonging to the utility model protection.

Term " first " in specification and claims of the present utility model and above-mentioned accompanying drawing, " second ", " the 3rd " Etc. being for distinguishing different objects, rather than for describing particular order.In addition, term " comprising " and " having " and they Any deformation, it is intended that cover non-exclusive include.Such as contain the process of series of steps or unit, method, system, The step of product or equipment are not limited to list or unit, but alternatively also include the step of not listing or unit, Or alternatively also include for the intrinsic other steps of these processes, method, product or equipment or unit.

Below by specific embodiment, it is described in detail respectively.

Fig. 1 is refer to, the utility model embodiment provides a kind of PCB of electromagnetism interference.

The PCB 10 includes three sandwich circuit layers, and the three sandwich circuits layer is respectively bus plane 11, signals layer 12 and connect Stratum 13, signals layer 12 is positioned at centre, and the three sandwich circuits layer is internal layer circuit layer；By insulating barrier between each sandwich circuit layer 14 are spaced apart, and the outside of bus plane 11 and the outside of ground plane 13 also are provided with insulating barrier 14.

First side surface of the PCB 10 is provided with the metal screen layer 15 of electromagnetism interference, the PCB 10 the second side surface is pasted with electronic component 16, such as inductance, electric capacity, resistance, chip etc., and on second side surface also It is provided with the electrographite piece PGS layers 17 for covering the electronic component 16.

PGS has higher heat dispersion, can prevent PCB 10 from overheating；Meanwhile PGS also has certain anti-electricity Magnetic disturbance performance.It should be noted that it is provided with insulating barrier 14 between the PGS layers 17 and the electronic component 16.

In the utility model embodiment, signals layer 12 is between bus plane 11 and ground plane 13, bus plane 11 and ground connection Layer 13 can be that signals layer 12 provides certain electromagnetic shielding, improve the electromagnetism interference performance of signals layer 12, it is ensured that signal passes It is defeated undistorted.

In the utility model embodiment, the bus plane 11 can use conventional etch process to process shape to copper foil layer Into.In some embodiments, in order to carry high current, the bus plane 11 can also be by the copper billet in the embedment PCB And/or copper bar is formed.Copper billet and/or copper bar have larger cross section, stronger current capacity, inherently have stronger resist Electromagnetic interference capability.

In some embodiments of the utility model, the circuit of the bus plane 11 is distributed mainly on the PCB 10 First area, the circuit of the signals layer 12 are distributed mainly on the second area of the PCB.By by power supply sandwich circuit Different regions is arranged on signal sandwich circuit, can avoid or reduce electromagnetic interference between the two, improve PCB Electromagnetism interference performance.

In some embodiments of the utility model, there is plated through-hole 18, the plated through-hole 18 in the PCB 10 For realizing that line layer interlayer connects, the coating of electromagnetism interference is provided with the inwall of the plated through-hole 18, such as inhale ripple Powder or inorganic silicate etc..

As described above, the utility model embodiment provides a kind of anti-electromagnetic interference capability stronger PCB.The PCB Circuit board achieves following technique effect：

In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in some embodiment Part, may refer to the associated description of other embodiments.

Above-described embodiment is only to illustrate the technical solution of the utility model, rather than its limitations；The common skill of this area Art personnel should be understood：It can still modify to the technical scheme described in the various embodiments described above, or to its middle part Technical characteristic is divided to carry out equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from this practicality The spirit and scope of new each embodiment technical scheme.

Claims

A kind of 1. PCB of electromagnetism interference, it is characterised in that including three sandwich circuit layers, the three sandwich circuits layer difference For bus plane, signals layer and ground plane, and the three sandwich circuits layer is internal layer circuit layer；First side of the PCB Surface is provided with the metal screen layer of electromagnetism interference, and the second side surface of the PCB is pasted with electronic component, and described The electrographite piece PGS layers for covering the electronic component are additionally provided with second side surface.
2. PCB according to claim 1, it is characterised in that

The bus plane is made up of the copper billet and/or copper bar being embedded in the PCB.
3. PCB according to claim 1, it is characterised in that

The circuit of the bus plane is distributed mainly on the first area of the PCB, and the circuit of the signals layer mainly divides It is distributed in the second area of the PCB.
4. PCB according to claim 1, it is characterised in that

There is plated through-hole, the plated through-hole is used to realize that line layer interlayer connects, the metallization in the PCB The coating of electromagnetism interference is provided with the inwall in hole.
5. PCB according to claim 1, it is characterised in that

Insulating barrier is provided between the PGS layers and the electronic component.