CN206775818U

CN206775818U - A kind of multilayer circuit board of high transfer rate

Info

Publication number: CN206775818U
Application number: CN201720458095.0U
Authority: CN
Inventors: 吕桃东
Original assignee: Shenzhen Is To Forceful Electric Power Lu Co Ltd
Current assignee: Shenzhen Is To Forceful Electric Power Lu Co Ltd
Priority date: 2017-04-27
Filing date: 2017-04-27
Publication date: 2017-12-19
Anticipated expiration: 2027-04-27

Abstract

The utility model discloses a kind of multilayer circuit board of high transfer rate, the multilayer circuit board is mainly formed by multilayer line layer and the lamination of multilayer insulation dielectric layer interval, the insulating medium layer is electron glass fiber or LTCC, and the multilayer line layer includes two outer layers line layer and at least one layer of internal layer circuit layer；The surface of the multilayer circuit board opens up fluted, neighbouring internal layer circuit layer is arrived in the bottom of the groove, there is the first metal derby that plating is formed, the outer-layer circuit layer of the multilayer circuit board is electrically connected with neighbouring internal layer circuit layer by first metal derby in the groove.The utility model embodiment technical scheme, dielectric coefficient is reduced by using electron glass fiber or the layer insulation dielectric layer of LTCC material, and interlayer interconnection is realized to reduce signal delay by metal derby substituted metal hole, signal transmission rate can be effectively improved.

Description

A kind of multilayer circuit board of high transfer rate

Technical field

It the utility model is related to circuit board technology field, and in particular to a kind of multilayer circuit board of high transfer rate.

Background technology

At present, as the integration and miniaturization of electronic product is, it is necessary to increasing multilayer circuit board；Also, with To the requirements at the higher level of electronic product performance, also require that multilayer circuit board has higher transmission rate.

Traditional multilayer circuit board is usually to be formed using the class F insulating material Fs such as FR4 and copper foil layer pressing, and interlayer is general Interlayer interconnection is carried out using plated through-hole.

Practice finds, the signal transmission rate of conventional multilayer circuit board can not meet it is growing it is higher will Ask.

Utility model content

The utility model embodiment aims to provide a kind of multilayer circuit board of high transfer rate.

In order to solve the above technical problems, the utility model embodiment adopts the following technical scheme that：

A kind of multilayer circuit board of high transfer rate, the multilayer circuit board are mainly situated between by multilayer line layer and multilayer insulation Matter interlayer interlayer pressure forms, and the insulating medium layer is electron glass fiber or LTCC, the multilayer line layer bag Include two outer layers line layer and at least one layer of internal layer circuit layer；The surface of the multilayer circuit board opens up fluted, the groove Bottom arrive at neighbouring internal layer circuit layer, the first metal derby that there is plating to be formed in the groove, the multilayer circuit board Outer-layer circuit layer electrically connected with neighbouring internal layer circuit layer by first metal derby.

Optionally, in a kind of implementation, offer and keep away on the insulating medium layer between two layers adjacent of internal layer circuit layer Allow groove, the second metal derby is provided with the avoid holes, two layers adjacent of internal layer circuit layer passes through second metal derby electricity Connection.Wherein, first and second metal derby can be copper billet or block tin.

Optionally, in another implementation, offered on the insulating medium layer between two layers adjacent of internal layer circuit layer Avoid holes, metal column are provided with the avoid holes, two layers adjacent of internal layer circuit layer is electrically connected by the metal column.Its In, the metal column can be copper post or tin post.Optionally, the diameter of the copper post is not less than 0.3mm.

Optionally, in some implementations, the thickness of the internal layer circuit layer is not less than 2OZ.

Optionally, in some implementations, the cabling spacing on the multilayer circuit board is not less than 0.3mm.

As can be seen from the above technical solutions, the utility model embodiment has advantages below：

Layer insulation dielectric layer uses electron glass fiber or LTCC, compared with FR4 grade materials, electronics glass Glass fiber or LTCC have relatively low dielectric coefficient, and therefore, and relatively low dielectric coefficient can effectively improve internal layer The signal transmission rate of line layer；Also, realize outer-layer circuit layer and internal layer circuit using the metal derby formed in interlayer groove The electrical connection of layer, no longer using plated through-hole, compared with plated through-hole, metal derby can effectively reduce signal delay, improve letter Number transmission rate.

Optionally, connected between internal layer circuit layer also by metal derby or metal column, do not use plated through-hole, one can be entered The reduction signal delay of step, improve signal transmission rate.

Brief description of the drawings

, below will be to embodiment and description of the prior art in order to illustrate more clearly of the utility model embodiment technical scheme In the required accompanying drawing used be briefly described, it should be apparent that, drawings in the following description are only of the present utility model Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to this A little accompanying drawings obtain other accompanying drawings.

Fig. 1 is the structural representation of the multilayer circuit board for the high transfer rate that one embodiment provides；

Fig. 2 is the configuration schematic diagram of multilayer circuit board as shown in Figure 1；

Fig. 3 is the structural representation of the multilayer circuit board for the high transfer rate that another embodiment provides；

Fig. 4 is the configuration schematic diagram of multilayer circuit board as shown in Figure 2；

Reference is as follows in figure：10, multilayer circuit board；11, line layer；111, outer-layer circuit layer；112, internal layer circuit Layer；13, groove；14, the first metal derby；15, escape groove；16, the second metal derby；17, avoid holes；18, metal column.

Embodiment

In order that those skilled in the art more fully understand the utility model, it is real below in conjunction with the utility model The accompanying drawing in example is applied, the technical scheme in the embodiment of the utility model is clearly and completely described, it is clear that be described Embodiment is only the embodiment of the utility model part, rather than whole embodiments.Based on the reality in the utility model Example is applied, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all should When the scope for belonging to the utility model protection.

Term " first " in specification and claims of the present utility model and above-mentioned accompanying drawing, " second ", " the 3rd " Etc. being for distinguishing different objects, rather than for describing particular order.In addition, term " comprising " and " having " and they Any deformation, it is intended that cover non-exclusive include.Such as contain the process of series of steps or unit, method, system, The step of product or equipment are not limited to list or unit, but alternatively also include the step of not listing or unit, Or alternatively also include for the intrinsic other steps of these processes, method, product or equipment or unit.

Below by specific embodiment, it is described in detail respectively.

Fig. 1 and Fig. 2 are refer to, the utility model embodiment provides a kind of multilayer circuit board of high transfer rate.

The multilayer circuit board 10 is mainly spaced lamination by multilayer line layer 11 and multilayer insulation dielectric layer 12 and formed, described exhausted Edge dielectric layer 12 is electron glass fiber or LTCC, and the multilayer line layer 11 includes two outer layers line layer 111 With at least one layer of internal layer circuit layer 112；

The surface of the multilayer circuit board 10 opens up fluted 13, and neighbouring internal layer circuit is arrived in the bottom of the groove 13 Layer 112, there is the first metal derby 14 that plating is formed, the outer-layer circuit layer 111 of the multilayer circuit board 10 in the groove 13 Electrically connected with neighbouring internal layer circuit layer 112 by first metal derby 14.

As described above, insulating medium layer 12 uses electron glass fiber or LTCC.Electron glass fiber is referred to as Electronics cloth, there is good electrical insulation capability, fire protection flame retarding, waterproof, ageing-resistant, against weather, high intensity, high-modulus.It is low Warm common burning porcelain is that low-temperature sintered ceramics powder is made into the accurate and fine and close green band of thickness, as circuit base material.Electricity Sub- glass fibre or LTCC can have the dielectric constant lower than class F insulating material Fs such as FR4.Research is found, electric Signal propagation delays depend primarily on the dielectric constant of dielectric material in the plate of road, and propagation delay depends on the dielectric of dielectric material Geometry of constant, length of transmission line and transmission line cross section etc..In general, signal transmission rate and dielectric constant is flat Root is inversely proportional.That is, dielectric constant is lower, then signal transmission rate is higher.Therefore, in the utility model, by adopting There can be higher signal to transmit as layer insulation medium, multilayer circuit board by the use of electron glass fiber or LTCC Speed.

In addition, traditional circuit-board typically realizes that interlayer interconnects using plated through-hole, the transmission section of plated through-hole is smaller, Larger delay can be caused, influences signal transmission rate.And in the utility model embodiment, outer-layer circuit layer 111 with it is neighbouring Internal layer circuit layer 112 between, interlayer connection is carried out using the first metal derby 14 in groove 13 is formed, with plated through-hole phase Than the transmission sectional area of the first metal derby 14 is much older, it is possible to reduce signal delay, further improves effectiveness.

In order to further reduce signal delay, in the utility model embodiment, for mutual between internal layer circuit layer 112 Even, traditional plated through-hole can also otherwise be substituted.

In a kind of embodiment, it can be realized using metal derby.As depicted in figs. 1 and 2, it is adjacent in the embodiment Two layers of internal layer circuit layer 112 between insulating medium layer 12 on offer escape groove 15, second is provided with the avoid holes 15 Metal derby 16, two layers adjacent of internal layer circuit layer 12 are electrically connected by second metal derby 16.

Wherein, first metal derby and the second metal derby can be copper billet or block tin or silver bullion etc..

In another embodiment, it can be realized using metal column.As shown in Figure 3 and Figure 4, in the embodiment, phase Avoid holes 17 are offered on insulating medium layer 12 between two layers adjacent of internal layer circuit layer 112, gold is provided with the avoid holes 17 Belong to post 18, two layers adjacent of internal layer circuit layer 112 is electrically connected by the metal column 18.

Wherein, the metal column can be copper post or tin post or silver-colored post etc..Optionally, the diameter of the copper post is not less than 0.3mm, to ensure enough sectional areas.

The parameter such as the width of each circuit and thickness and spacing in line layer, it can also influence the speed of line transmissions. In some embodiments, the thickness of the internal layer circuit layer is not less than 2OZ.In some embodiments, walking on the multilayer circuit board Line spacing is not less than 0.3mm.To ensure sufficiently high transmission rate.

In summary, in the utility model embodiment, disclose a kind of multilayer circuit board of high transfer rate, achieve with Lower technique effect：

Between insulating medium layer use electron glass fiber or LTCC, compared with FR4 grade materials, electronic glass Fiber or LTCC have relatively low dielectric coefficient, and therefore, and relatively low dielectric coefficient can effectively improve interior layer line The signal transmission rate of road floor；Also, realize outer-layer circuit layer and internal layer circuit layer using the metal derby formed in interlayer groove Electrical connection, no longer using plated through-hole, compared with plated through-hole, metal derby can effectively reduce signal delay, improve signal Transmission rate.

In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in some embodiment Part, may refer to the associated description of other embodiments.

Above-described embodiment is only to illustrate the technical solution of the utility model, rather than its limitations；The common skill of this area Art personnel should be understood：It can still modify to the technical scheme described in the various embodiments described above, or to its middle part Technical characteristic is divided to carry out equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from this practicality The spirit and scope of new each embodiment technical scheme.

Claims

A kind of 1. multilayer circuit board of high transfer rate, it is characterised in that

The multilayer circuit board is mainly formed by multilayer line layer and the lamination of multilayer insulation dielectric layer interval, the insulating medium layer For electron glass fiber or LTCC, the multilayer line layer includes layer line in two outer layers line layer and at least one layer Road floor；

The surface of the multilayer circuit board opens up fluted, and neighbouring internal layer circuit layer is arrived in the bottom of the groove, described recessed There is the first metal derby that plating is formed, the outer-layer circuit layer of the multilayer circuit board passes through with neighbouring internal layer circuit layer in groove The first metal derby electrical connection.
2. multilayer circuit board according to claim 1, it is characterised in that

Escape groove is offered on insulating medium layer between two layers adjacent of internal layer circuit layer, the second gold medal is provided with the avoid holes Belong to block, two layers adjacent of internal layer circuit layer is electrically connected by second metal derby.
3. multilayer circuit board according to claim 2, it is characterised in that

First and second metal derby is copper billet or block tin.
4. multilayer circuit board according to claim 1, it is characterised in that

Avoid holes are offered on insulating medium layer between two layers adjacent of internal layer circuit layer, metal is provided with the avoid holes Post, two layers adjacent of internal layer circuit layer are electrically connected by the metal column.
5. multilayer circuit board according to claim 4, it is characterised in that

The metal column is copper post or tin post.
6. multilayer circuit board according to claim 5, it is characterised in that

The diameter of the copper post is not less than 0.3mm.
7. according to any described multilayer circuit board in claim 1-6, it is characterised in that

The thickness of the internal layer circuit layer is not less than 2OZ.
8. according to any described multilayer circuit board in claim 1-6, it is characterised in that

Cabling spacing on the multilayer circuit board is not less than 0.3mm.