CN107666782A - Has circuit board of thick copper circuit and preparation method thereof - Google Patents
Has circuit board of thick copper circuit and preparation method thereof Download PDFInfo
- Publication number
- CN107666782A CN107666782A CN201610604631.3A CN201610604631A CN107666782A CN 107666782 A CN107666782 A CN 107666782A CN 201610604631 A CN201610604631 A CN 201610604631A CN 107666782 A CN107666782 A CN 107666782A
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- China
- Prior art keywords
- layer
- opening portion
- conducting wire
- wire pattern
- circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
A kind of preparation method for the circuit board for having thick copper circuit, its step are as follows：Copper-clad base plate is provided, the copper-clad base plate includes the first copper foil layer of insulating barrier and formation on the one of surface of the insulating barrier；One layer of photosensitive film is formed in the first copper foil layer surface；Multiple openings are formed in the photosensitive film, the opening exposes first copper foil layer；First time etching is carried out to first copper foil layer from the position of the opening, obtain the first conducting wire pattern, the first conducting wire pattern includes the first opening portion that is multiple connected trapezoidal and being formed between adjacent trapezoidal, and first opening portion includes two side walls and connects the bottom wall of two side walls；One layer of overcoat is formed on the surface of the side wall；Second is carried out to first copper foil layer to etch, form the second conducting wire pattern from the position of the bottom wall；And the dry film is removed, the first conducting wire pattern collectively forms conductive circuit layer with the second conducting wire pattern, so as to obtain having the circuit board of thick copper circuit.
Description
Technical field
The present invention relates to circuit board making field, more particularly to a kind of circuit board for having thick copper circuit and preparation method thereof.
Background technology
With the high speed development of electronic product, as component supporter and the printed circuit board of transmitting telecommunication carrier
Should gradually it walk to miniaturization, lightweight, high density with multi-functional, and then the making to printed circuit board essence thick copper circuit proposes
Higher requirement.Conventional printed circuit boards production technology line width is limited to copper layer thickness, the thicker copper of the thinner circuit of copper layer thickness, therefore
There is limitation in itself with thick copper to make thick copper circuit；And the conducting wire of conventional printed circuit boards is usually subtractive process, but
Copper thickness is limited to, making thick copper circuit can only arrange in pairs or groups thin copper, and have that etching factor is poor after making, and Net does not form flash for etching；It is anti-
Solder paste ink is difficult to fill, the problems such as being also easy to produce bubble.
The content of the invention
In view of this, it is necessary to provide what a kind of circuit board manufacturing method that can solve the problem that above-mentioned technical problem was made
Circuit board.
A kind of preparation method for the circuit board for having thick copper circuit, its step are as follows：
Copper-clad base plate is provided, the copper-clad base plate includes insulating barrier and formed the first of the one of surface of the insulating barrier
Copper foil layer；
One layer of photosensitive film is formed in the first copper foil layer surface；
Multiple openings are formed in the photosensitive film, the opening exposes first copper foil layer；
First time etching is carried out to first copper foil layer from the position of the opening, obtains the first conducting wire pattern, this
One conducting wire pattern includes the first opening portion that is multiple connected trapezoidal and being formed between adjacent trapezoidal, first opening portion
Include the bottom wall of two side walls of two side walls and connection；
One layer of overcoat is formed on the surface of the side wall；
Second is carried out to first copper foil layer to etch, form the second conducting wire pattern from the position of the bottom wall；And
The dry film is removed, the first conducting wire pattern collectively forms conducting wire with the second conducting wire pattern
Layer, so as to obtain having the circuit board of thick copper circuit.
A kind of circuit board for having thick copper circuit, it includes：Insulating barrier and formed surface of insulating layer conductive circuit layer, should
Conductive circuit layer includes being formed in the second conducting wire pattern of the surface of insulating layer and mutually being stacked with the second conductive line pattern
The first conducting wire pattern, the first conducting wire pattern includes multiple connected trapezoidal and formed between adjacent trapezoidal
First opening portion, first opening portion include two side walls and connect the bottom wall of two side walls, and the side wall is anti-formed with one layer
Sheath, the first conducting wire pattern is formed with multiple first opening portions, and the second conducting wire pattern is formed with multiple difference
The second opening portion communicated with first opening portion, second opening portion expose the insulating barrier.
A kind of circuit board for having thick copper circuit, it includes：Insulating barrier and formed at two of opposite two surfaces of insulating barrier
Conductive circuit layer, each conductive circuit layer include being formed in the second conducting wire pattern of the surface of insulating layer and with second
The first conducting wire pattern that conductive line pattern mutually stacks, the first conducting wire pattern include multiple connected trapezoidal and formation
The first opening portion between adjacent trapezoidal, first opening portion include two side walls and connect the bottom wall of two side walls, should
Side wall is formed with one layer of overcoat, and the first conducting wire pattern is formed with multiple first opening portions, the second conducting wire figure
Case exposes the insulating barrier formed with multiple the second opening portions communicated respectively with first opening portion, second opening portion.
Compared with prior art, the circuit board manufacturing method of tool thick copper circuit provided by the invention and thus it is made
Circuit board, the conductive circuit layer is formed by etching twice for first copper foil layer on the one of surface of the insulating barrier, such as
This, can reduce the risk that circuit side wall is etched, and effectively reduce the flash phenomenon of circuit, and can obtain the line of thicker copper
Road, by detection, line width is about 50 μm, forms the metallic tin in the first conducting wire pattern sidewalls, can be to conducting wire
Layer is protected, and makes the oxidation resistance of conductive circuit layer stronger.
Brief description of the drawings
Fig. 1 is the sectional view for the copper-clad base plate that first embodiment of the invention provides.
Fig. 2 is to form the sectional view of photosensitive film on copper-clad base plate surface.
Fig. 3 is that the sectional view that development forms opening is exposed to photosensitive film.
Fig. 4 is that the sectional view that etching for the first time forms the first conducting wire pattern is carried out to the first copper foil layer.
Fig. 5 is the profile that overcoat is formed in the first conducting wire patterned surfaces.
Fig. 6 is the sectional view of the overcoat for the bottom wall for removing the first conducting wire pattern.
Fig. 7 is that the profile that second of etching forms the second conducting wire pattern is carried out to the first copper foil layer.
Fig. 8 is the sectional view for removing etch stop layer.
Fig. 9 is that the sectional view of pure glue will be filled between the surface of insulating layer, the conductive circuit layer.
Figure 10 is the section view in one layer of cover layer of conducting wire layer surface pressing, the circuit board for forming tool thick copper circuit
Figure.
Figure 11 is the sectional view of the circuit board for another tool thick copper circuit that third embodiment of the invention provides.
Main element symbol description
Following embodiment will combine above-mentioned accompanying drawing and further illustrate the present invention.
Embodiment
Below in conjunction with drawings and Examples, circuit board provided by the invention and preparation method thereof is made further detailed
Explanation.
Fig. 1-9 are referred to, first embodiment of the invention provides a kind of preparation method for the circuit board for having thick copper circuit, and it is walked
Suddenly include：
The first step, referring to Fig. 1, providing a copper-clad base plate 10, the copper-clad base plate 10 is one side copper-clad base plate.This covers copper
Substrate includes the first copper foil layer 14 of insulating barrier 12 and formation on the surface of insulating barrier 12.The thickness of first copper foil layer 14 is
70 μm, the thickness of the insulating barrier 12 is about 25um.
Second step：Refer to Fig. 2 and Fig. 3, first copper foil layer 14 surface formed one layer of photosensitive film 16 and
Multiple openings 160 are formed in the photosensitive film 16, the opening 160 exposes first copper foil layer 14.In the present embodiment, should
Photosensitive film 16 is dry film, and the plurality of opening 160 is formed by micro-photographing process.The thickness of the photosensitive film 16 is 15 μm.
It is exposed the photosensitive film 16 after development and forms etch stop layer 162, first bronze medal covered by the etch stop layer 162
Layers of foil 14 will not be etched.
3rd step, referring to Fig. 4, carrying out first time etching to first copper foil layer 14 from the position of the opening 160, obtain
First conducting wire pattern 20, the first conducting wire pattern 20 include multiple connected trapezoidal 201 and formation in adjacent trapezoidal
The first opening portion 202 between 201, the first opening portion 202 include side wall 22 and connect the bottom wall 24 of adjacent wall 22.From this
The depth that the position of opening 160 carries out first time etching to first copper foil layer 14 is about the half of the thickness of the first copper foil layer 14,
In the present embodiment, the depth of etching is 35 μm for the first time.During due to being etched to the first copper foil layer 14 exist etching because
The phenomenon of son, so that the inverted trapezoidal that the section of the plurality of first opening portion 202 formed is substantially spaced.
4th step, referring to Fig. 5, forming overcoat 240 on the surface of the bottom wall 24 and side wall 22.The overcoat 240 is logical
Plating metal is crossed to be formed.The metal of the plating is tin or nickel.The Hou Du Approximately 1-3um of the metal of the plating.In other embodiment party
In formula, the overcoat 240 can also be formed on the surface of the first conducting wire pattern 20 by way of changing tin (heavy tin).By this
The first conducting wire pattern 20 that overcoat 240 covers will not be etched.The overcoat 240 is used to protect the first line figure
Case 20, aoxidized to prevent the first line pattern 20.
5th step, referring to Fig. 6, removing the overcoat 240 formed on the bottom wall 24, make first opening portion 202 sudden and violent
Dew part first copper foil layer 14.In the present embodiment, the mode of laser ablation (Laser Ablating) can be utilized to remove
Remove the overcoat 240 of the bottom wall 24.
6th step, etched referring to Fig. 7, carrying out second to first copper foil layer 14 from the position of the bottom wall 24, will be by
Remaining first copper foil layer 14, which makes, after etching for the first time forms the second conducting wire pattern 30, the second conducting wire pattern
30 include multiple be sequentially connected trapezoidal 301 and the second opening portion 302 formed between adjacent trapezoidal.Each second opens
Oral area 302 communicates with first opening portion 202 respectively, and second opening portion 302 exposes the insulating barrier 12.The plurality of
The inverted trapezoidal that the section of two opening portions 302 is substantially spaced.First conducting wire pattern 20 and second line pattern 30
It is collectively forming the conductive circuit layer 60 positioned at the surface of insulating barrier 12.The line width of the conductive circuit layer 60 can reach 50 μm.
7th step, referring to Fig. 8, peelling off the etch stop layer 162 on the surface of the first conducting wire pattern 20.
8th step, refers to Fig. 9 and Figure 10, in the first opening that the surface of insulating barrier 12, the conductive circuit layer 60 include
Pure glue 40 is filled in portion 202 and second opening portion 302, the pure glue 40 full of first opening portion 202, the second opening portion 302 and
The first conducting wire pattern 20 is covered, one layer of cover layer 50 (CoverLay) is pressed on the surface of the pure glue 40, so as to obtain
Has the circuit board 200 of thick copper circuit.
What it is due to this case formation is thick copper thick copper circuit, is formed by the first conducting wire pattern 20 and the second conductive pattern 30
The first opening portion 202 that includes of conductive circuit layer 60 and the second opening portion 302 (Pitch) it is narrower, and only in conductive circuit layer
60 surfaces press cover layer 50, it is difficult to make the melting colloid that cover layer 50 includes full of the first opening portion 202 and second opening
Portion 302, so, it is first in the first opening portion 202 of the conductive circuit layer 60 and second opening portion in the present embodiment
The 302 pure glue 40 of filling, then press cover layer 50 on the surface of the conductive circuit layer 60 again, and the pure glue 40 is common with the cover layer 50
With for being protected to the conductive circuit layer 60.
Referring to Figure 10, second embodiment of the invention is also provided by the circuit board manufacturing method of above-mentioned tool thick copper circuit
The circuit board 200 being made, it includes insulating barrier 12 and formation in the conductive circuit layer 60 on the surface of insulating barrier 12, the conductor wire
Road floor 60 include formed the surface of insulating barrier 12 the second conducting wire pattern 20 and with the phase heap of the second conductive line pattern 20
The first folded conducting wire pattern 30.
The first conducting wire pattern 20 includes multiple connected trapezoidal 201 and formed between adjacent trapezoidal 201 the
One opening portion 202, first opening portion 202 include two side walls 22 and connect the bottom wall 24 of two side walls 22, the side wall 22
Formed with one layer of overcoat 240.The overcoat 240 is metal protection layer.
The second conducting wire pattern 30 is roughly the same with the shape of the first conducting wire pattern 20, and it includes multiple be connected
Trapezoidal 301 and form the second opening portion 302 between adjacent trapezoidal 301, each second opening portion 302 respectively with an institute
State the first opening portion 202 communicate, size and first opening portion 202 it is roughly equal, second opening portion 302 expose the insulation
Layer 12.First opening portion 202, the section substantially inverted trapezoidal of the second opening portion 302
First opening portion 202, second opening portion 302 are filled with pure glue 40, and pure glue 40 also covers first conductor wire
The surface of road pattern 20, the formation on the pure surface of glue 40 have cover layer 50.
Figure 11 is referred to, third embodiment of the invention also provides the circuit board manufacturing method making by above-mentioned tool thick copper circuit
The circuit board 300 formed, it includes two conductive circuit layers 60 of insulating barrier and formation on 12 opposite two surfaces of insulating barrier, often
The individual conductive circuit layer 60 include formed the surface of insulating barrier 12 the second conducting wire pattern 30 and with the second conductor wire
The first conducting wire pattern 20 that the phase of pattern 30 stacks.
The first conducting wire pattern 20 includes first opening of multiple connected trapezoidal and formation between adjacent trapezoidal
Portion 202, first opening portion 202 include two side walls 22 and connect two side walls 22 bottom wall 24, the side wall 22 formed with
One layer of overcoat 240.The overcoat 240 is metal protection layer.
The second conducting wire pattern 30 includes second opening of multiple connected trapezoidal and formation between adjacent trapezoidal
Portion 302, each second opening portion 302 communicate with first opening portion 202 respectively.
First opening portion 202, second opening portion 302 are filled with pure glue 40, and pure glue 40 also covers first conductor wire
The surface of road pattern 20, the formation on the pure surface of glue 40 have cover layer 50.
In summary, the circuit board manufacturing method of tool thick copper circuit provided by the invention and the circuit being thus made
Plate, the conductive circuit layer 60 is formed by etching twice for first copper foil layer 14 on the one of surface of the insulating barrier, such as
This, can reduce the risk that circuit side wall is etched, and effectively reduce the flash phenomenon of circuit, and can obtain thinner line
Road, by detection, line width is about 50 μm, forms the overcoat 240 in the side wall of the first conducting wire pattern 20, can be to leading
Electric line layer 60 is protected, and makes the oxidation resistance of conductive circuit layer 60 stronger.
It is understood that above example is only used for illustrating the present invention, limitation of the invention is not used as.For this
For the those of ordinary skill in field, other various corresponding changes and deformation that technique according to the invention design is made, all
Fall within the protection domain of the claims in the present invention.
Claims (12)
1. a kind of preparation method for the circuit board for having thick copper circuit, its step are as follows：
Copper-clad base plate is provided, the copper-clad base plate includes the first copper foil of insulating barrier and formation on the one of surface of the insulating barrier
Layer；
One layer of photosensitive film is formed in the first copper foil layer surface；
Multiple openings are formed in the photosensitive film, the opening exposes first copper foil layer；
First time etching is carried out to first copper foil layer from the position of the opening, obtains the first conducting wire pattern, this first is led
Electric line pattern includes the first opening portion that is multiple connected trapezoidal and being formed between adjacent trapezoidal, and first opening portion includes
Two side walls and the bottom wall for connecting two side walls；
One layer of overcoat is formed on the surface of the side wall；
Second is carried out to first copper foil layer to etch, form the second conducting wire pattern from the position of the bottom wall；And
The photosensitive film is removed, the first conducting wire pattern collectively forms conducting wire with the second conducting wire pattern
Layer, so as to obtain having the circuit board of thick copper circuit.
2. the preparation method of the circuit board of tool thick copper circuit as claimed in claim 1, it is characterised in that being formed in the side wall should
The step of overcoat is：
The bottom wall and side wall are carried out respectively to electroplate layer of metal layer；
The metal level of bottom wall is removed to the metal level for only retaining the side wall, the metal level of reservation using the mode of laser ablation
Form the overcoat.
3. the preparation method of the circuit board of tool thick copper circuit as claimed in claim 2, it is characterised in that the metal level of plating
For tin or nickel.
4. the preparation method of the circuit board of tool thick copper circuit as claimed in claim 1, it is characterised in that to first copper foil layer
Carry out deep equality of the depth of first time etching with carrying out second of etching to first copper foil layer.
5. the preparation method of the circuit board of tool thick copper circuit as claimed in claim 4, it is characterised in that second conducting wire
Pattern includes the second opening portion that is multiple connected trapezoidal and being formed between adjacent trapezoidal, and each second opening portion is respectively with one
Individual first opening portion communicates.
6. the preparation method of the circuit board of tool thick copper circuit as claimed in claim 5, it is characterised in that it is thin to remove the photonasty
It is additionally included in after film and pure glue is filled in first opening portion and the second opening portion and presses one layer of cover layer on the surface of the pure glue
The step of.
7. a kind of circuit board for having thick copper circuit, it includes：Insulating barrier and formed surface of insulating layer conductive circuit layer, this is led
Electric line layer includes being formed in the second conducting wire pattern of the surface of insulating layer and mutually being stacked with second conductive line pattern
The first conducting wire pattern, the first conducting wire pattern includes multiple connected trapezoidal and formed between adjacent trapezoidal
First opening portion, each first opening portion include two side walls and connect the bottom wall of two side walls, and the side wall is formed with one
Layer overcoat, the second conducting wire pattern include multiple the second opening portions communicated respectively with first opening portion, should
Second opening portion exposes the insulating barrier.
8. the circuit board of tool thick copper circuit as claimed in claim 7, it is characterised in that the second conducting wire pattern also includes
Multiple connected trapezoidal, second opening portion is formed between adjacent trapezoidal of each two.
9. the circuit board of tool thick copper circuit as claimed in claim 8, it is characterised in that first opening portion and the second opening portion
In be also filled with pure glue, the surface of the pure glue is formed with cover layer.
10. a kind of circuit board for having thick copper circuit, it includes：Insulating barrier and being formed is led in two of opposite two surfaces of insulating barrier
Electric line layer, each conductive circuit layer are formed in the second conducting wire pattern of the surface of insulating layer and second conductive with this
The first conducting wire pattern that line pattern mutually stacks, the first conducting wire pattern include multiple connected trapezoidal and formation in phase
The first opening portion between neighbour is trapezoidal, each first opening portion include two side walls and connect the bottom wall of two side walls, should
Side wall formed with one layer of overcoat, the second conducting wire pattern include it is multiple communicated respectively with first opening portion
Two opening portions, second opening portion expose the insulating barrier.
11. the circuit board of tool thick copper circuit as claimed in claim 10, it is characterised in that the second conducting wire pattern also wraps
Include multiple connected trapezoidal, second opening portion is formed between adjacent trapezoidal of each two.
12. the circuit board of tool thick copper circuit as claimed in claim 11, it is characterised in that first opening portion and the second opening
Pure glue is also filled with portion, the surface of the pure glue is formed with cover layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610604631.3A CN107666782A (en) | 2016-07-28 | 2016-07-28 | Has circuit board of thick copper circuit and preparation method thereof |
| TW105133114A TW201811136A (en) | 2016-07-28 | 2016-10-13 | Printed circuit board with thick copper conducting line and method same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610604631.3A CN107666782A (en) | 2016-07-28 | 2016-07-28 | Has circuit board of thick copper circuit and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107666782A true CN107666782A (en) | 2018-02-06 |
Family
ID=61114259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610604631.3A Pending CN107666782A (en) | 2016-07-28 | 2016-07-28 | Has circuit board of thick copper circuit and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107666782A (en) |
| TW (1) | TW201811136A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312682A (en) * | 2019-07-30 | 2021-02-02 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board with thick copper circuit and manufacturing method thereof |
| CN113630977A (en) * | 2020-05-06 | 2021-11-09 | 鹏鼎控股(深圳)股份有限公司 | Thick copper circuit board and manufacturing method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114501801A (en) * | 2020-10-28 | 2022-05-13 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0361192A2 (en) * | 1988-09-29 | 1990-04-04 | Siemens Aktiengesellschaft | Method of making circuit boards |
| TW551016B (en) * | 2002-07-31 | 2003-09-01 | Uni Circuit Inc | Circuit board manufacturing process of embedded resistor |
| CN102291941A (en) * | 2011-06-23 | 2011-12-21 | 深南电路有限公司 | Method for processing lines of thick copper plate |
| WO2012148332A1 (en) * | 2011-04-29 | 2012-11-01 | Telefonaktiebolaget L M Ericsson (Publ) | Manufacturing method for printed circuit boards |
| CN103491714A (en) * | 2012-06-11 | 2014-01-01 | 深南电路有限公司 | Circuit board line processing method |
-
2016
- 2016-07-28 CN CN201610604631.3A patent/CN107666782A/en active Pending
- 2016-10-13 TW TW105133114A patent/TW201811136A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0361192A2 (en) * | 1988-09-29 | 1990-04-04 | Siemens Aktiengesellschaft | Method of making circuit boards |
| TW551016B (en) * | 2002-07-31 | 2003-09-01 | Uni Circuit Inc | Circuit board manufacturing process of embedded resistor |
| WO2012148332A1 (en) * | 2011-04-29 | 2012-11-01 | Telefonaktiebolaget L M Ericsson (Publ) | Manufacturing method for printed circuit boards |
| CN102291941A (en) * | 2011-06-23 | 2011-12-21 | 深南电路有限公司 | Method for processing lines of thick copper plate |
| CN103491714A (en) * | 2012-06-11 | 2014-01-01 | 深南电路有限公司 | Circuit board line processing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312682A (en) * | 2019-07-30 | 2021-02-02 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board with thick copper circuit and manufacturing method thereof |
| CN113630977A (en) * | 2020-05-06 | 2021-11-09 | 鹏鼎控股(深圳)股份有限公司 | Thick copper circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201811136A (en) | 2018-03-16 |
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 066000 No. 18 Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Peng Ding Polytron Technologies Inc Address before: 518105 Yanchuan Yanluo Road, Songgang Street, Baoan District, Shenzhen City, Guangdong Province Applicant before: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180206 |