CN205812499U - A kind of LED circuit board of side paster - Google Patents
A kind of LED circuit board of side paster Download PDFInfo
- Publication number
- CN205812499U CN205812499U CN201620788514.2U CN201620788514U CN205812499U CN 205812499 U CN205812499 U CN 205812499U CN 201620788514 U CN201620788514 U CN 201620788514U CN 205812499 U CN205812499 U CN 205812499U
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- wiring board
- pad
- sidewall
- boring
- connecting portion
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Abstract
The utility model discloses the LED circuit board of a kind of side paster, including wiring board and pad, the sidewall of described wiring board is provided with N number of boring, described pad includes being arranged on wiring board sidewall and the weld part vertical with wiring board plate face and connecting portion, and described connecting portion is structure as a whole with weld part；Described connecting portion is arranged in boring, between the upper surface of wiring board and lower surface.LED circuit board of the present utility model has simple for structure, wiring board quality is high, practical, coordinated with pad by boring, the adhesion between wiring board sidewall and the connecting portion of pad can be increased so that fixedly securing of the sidewall of pad and wiring board, it is to avoid by copper billet pull-up during subsequent production, decrease the scrappage of product, cost-effective；Use the wiring board that manufacture method of the present utility model is made, it is possible to avoid wiring board to pull the copper of wiring board sidewall when secondary drilling, reduce by the defective products scrappage of more than 3%, improve the quality of wiring board simultaneously.
Description
Technical field
This utility model belongs to wiring board techniques field, is specifically related to the LED circuit board of a kind of side paster.
Background technology
Along with the development of LED technology, promote also to be rapidly developed as the carrier wiring board techniques of LED product, side
A as in LED product of the LED of paster, enjoys consumer to like.At present, existing line plate manufacturing enterprise is generally adopting
With: sawing sheet → making internal layer circuit plate → typesetting → pressing → groove milling → boring → heavy copper → electric plating of whole board → patch dry film → image
Transfer, graphic plating → secondary drilling → circuit etching → anti-welding process → surface process → sharp processing → electrical measurement → FQC inspection
Test → production and processing technology of OQC → packaging produces the LED circuit board of side paster, as depicted in figs. 1 and 2.But producing
Cheng Zhong, wiring board manufacturing enterprise finds, wiring board scrappage is higher, and main cause is when wiring board is carried out two brills, due to
Using the mode boring nozzle machining, the pad of LED is less, and the most isolated between each pad, therefore bores nozzle in cutting
During easily pull pad, cause subsequent etch to add and stung erosion by liquid medicine man-hour and occur that pad damages, shown in Fig. 3, cause circuit
Plate is scrapped, and the ratio of scrapping is up to more than 3%, increases enterprise's Productive statistics.Simultaneously through putting into practice surface, the wiring board of this type
When welding LED, the combination between pad and wiring board is poor, the disengaging of pad easily occurs, affect the quality of wiring board with
Goodwill.
Therefore, in order to reduce production cost, reduce scrappage, improve wiring board quality and become wiring board manufacturing enterprise urgently
The problem solved.
Summary of the invention
In view of this, the technical problems to be solved in the utility model is a kind of side paster simple for structure, practical
LED circuit board.
In order to solve above-mentioned technical problem, this utility model uses following scheme to realize: the LED line road of a kind of side paster
Plate, including 2N Rotating fields wiring board be fixed on wiring board sidewall and the pad connected with wiring board internal layer circuit circuit, institute
The sidewall of the wiring board stated is provided with N number of boring, and described pad includes being arranged on wiring board sidewall and vertical with wiring board plate face
Weld part and be connected to fixing for pad connecting portion in the circuit board with weld part, described connecting portion with weld part is
Integrative-structure；Described connecting portion is arranged in boring, between the upper surface of wiring board and lower surface.
Wherein, the wiring board of described 2N Rotating fields is successively by outer-layer circuit plate, (N-1) layer internal layer circuit plate, outer layer line
Road plate pressing forms, and described boring is arranged between outer-layer circuit plate and internal layer circuit plate, internal layer circuit plate and internal layer circuit
Between plate.
Wherein, described pad be fixed on by the way of heavy copper is electroplated wiring board sidewall and with wiring board internal layer circuit line
Road connects.
Wherein, the quantity of described pad is multiple.
Wherein, the shape of described connecting portion, size and quantity are all with the shape of boring, size and quantity mutually
Join.
Wherein, described N is natural number, and N 2.
Compared with prior art, LED circuit board of the present utility model has simple for structure, and wiring board quality is high, practicality
By force, coordinated with pad by boring, and outside between sandwich circuit board and internal layer circuit plate, internal layer circuit plate and internal layer circuit plate it
Between arrange and hole and the connecting portion of pad be combined with each other, the combination between wiring board sidewall and the connecting portion of pad can be increased
Power so that fixedly securing of the sidewall of pad and wiring board, it is to avoid by copper billet pull-up during subsequent production, damages pad,
Affect the quality of wiring board, decrease the scrappage of product, cost-effective, improve the quality of wiring board.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED circuit board of existing side paster.
Fig. 2 is the side view of the LED circuit board of existing side paster.
Fig. 3 is the defective products structural representation of the LED circuit board of existing side paster.
Fig. 4 is structural representation of the present utility model.
Fig. 5 is the structural representation of wiring board of the present utility model.
Fig. 6 is the structural representation of pad of the present utility model.
Fig. 7 is six layers of LED circuit board structural representation of the present utility model.
Fig. 8 is the structural representation of the wiring board of six layers of LED circuit board of the present utility model.
Fig. 9 is the structural representation of the pad of six layers of LED circuit board of the present utility model.
Detailed description of the invention
In order to allow those skilled in the art be more fully understood that the technical solution of the utility model, below in conjunction with the accompanying drawings to this
Utility model is further elaborated.
As shown in Figures 4 to 6, the LED circuit board of a kind of side paster, including the wiring board 1 of 2N Rotating fields be fixed on
Wiring board sidewall and the pad 2 connected with wiring board internal layer circuit circuit.Described multiple pads 2 are separately positioned on wiring board
Sidewall, by the assembling being implemented in combination with LED chip and wiring board of pad Yu LED chip.
The wiring board 1 of described 2N Rotating fields includes two sandwich circuit boards and (N-1) layer internal layer circuit plate, its typesetting and pressing
Order is followed successively by outer-layer circuit plate, (N-1) layer internal layer circuit plate, outer-layer circuit plate.The sidewall of described wiring board 1 is provided with N number of
Boring 11, N number of boring 11 is separately positioned between outer-layer circuit plate and internal layer circuit plate, internal layer circuit plate and internal layer circuit plate it
Between.Described boring is drilled in the sidewall of wiring board by boring nozzle, facilitates postorder production and processing, improves the adhesive force of pad.
Described pad 2 be fixed on by the way of heavy copper is electroplated wiring board 1 sidewall and with wiring board internal layer circuit circuit
Connection.The lateral part of pad is vertical with wiring board plate face.Needs according to client and the requirement of LED chip, specifically arrange pad
Quantity, the quantity of general pad is multiple.Described pad 2 includes being arranged on wiring board sidewall and hanging down with wiring board plate face
Straight weld part 21 and be connected to fixing for pad connecting portion 22 in the circuit board with weld part, described connecting portion 22 with
Weld part 21 is structure as a whole.Described connecting portion 22 is arranged in boring 11, between the upper surface of wiring board 1 and lower surface.
Connection in order to be better achieved between pad and wiring board is fixed, the shape of described connecting portion, size and quantity all with
Shape, size and the quantity of boring 11 match so that heavy copper plating connecting portion 22 in boring and boring strong bonded.
The quantity of described connecting portion is N number of so that contact point between pad and wiring board increases, add wiring board and pad it
Between active force and absorption affinity.
In 2N sandwich circuit board, described N is natural number, and N 2, i.e. wiring board are four layers of Above Transmission Lines plate.Preferably circuit
Plate is 4 sandwich circuit boards, 6 sandwich circuit boards and 8 sandwich circuit boards.
Six layers of LED circuit board of embodiment 1 side paster
As shown in Figure 7 to 9, six layers of LED circuit board of a kind of side paster, including wiring board 1 He of six structures layer by layer
It is fixed on wiring board sidewall and the pad 2 connected with wiring board internal layer circuit circuit.Described multiple pads 2 are respectively provided with online
The sidewall of road plate, by the assembling being implemented in combination with LED chip and wiring board of pad Yu LED chip.Six described floor LED line roads
Plate is formed by outer-layer circuit plate, internal layer circuit plate, internal layer circuit plate and the typesetting successively of outer-layer circuit plate, pressing.Layer line outside
Between road plate and internal layer circuit plate, between internal layer circuit plate and internal layer circuit plate and between internal layer circuit plate and outer-layer circuit plate
It is drilled with a boring 11 successively.Wiring board is carried out hole wall the most again and sinks copper so that the sidewall at wiring board covers one layer of layers of copper,
Layers of copper is electroplated one layer of tin layers protect, it is to avoid corroded by liquid medicine in etching, cause the defective products of pad to produce.Circuit
Plate sidewall forms pad at wiring board sidewall by the way of heavy copper, then is got out by pad by boring nozzle.Described pad includes
Weld part 21 and the connecting portion 22 being connected with weld part, described connecting portion is respectively acting on the upper surface of boring kernel wiring board
And lower surface, change traditional pad structure so that can be connected with pad between wiring board, improve the attachment of wiring board
Power, it is to avoid bore when nozzle makes pad and damage layers of copper, cause the generation of defective products, reduce scrappage.
Above-described embodiment is only wherein specific implementation of the present utility model, and it describes more concrete and detailed, but also
Therefore the restriction to this utility model the scope of the claims can not be interpreted as.It should be pointed out that, for the ordinary skill of this area
For personnel, without departing from the concept of the premise utility, it is also possible to make some deformation and improvement, these are apparent
Alternative forms belong to protection domain of the present utility model.
Claims (6)
1. a LED circuit board for side paster, including the wiring board (1) of 2N Rotating fields be fixed on wiring board sidewall and and line
The pad (2) of road inner cord circuit circuit connection, it is characterised in that the sidewall of described wiring board (1) is provided with N number of boring
(11), described pad (2) include being arranged on wiring board sidewall and the weld part (21) vertical with wiring board plate face and with weld
Portion is connected to fixing for pad connecting portion (22) in the circuit board, and described connecting portion (22) is integrated with weld part (21)
Structure；Described connecting portion is arranged in boring, between the upper surface of wiring board and lower surface.
The LED circuit board of side the most according to claim 1 paster, it is characterised in that the circuit of described 2N Rotating fields
Plate (1) is formed by outer-layer circuit plate, (N-1) layer internal layer circuit plate, outer-layer circuit plate pressing successively, and described boring (11) is arranged
Outside between sandwich circuit board and internal layer circuit plate, between internal layer circuit plate and internal layer circuit plate.
The LED circuit board of side the most according to claim 1 and 2 paster, it is characterised in that described pad (2) passes through
The mode of heavy copper plating is fixed on wiring board (1) sidewall and connects with wiring board internal layer circuit circuit.
The LED circuit board of side the most according to claim 3 paster, it is characterised in that the quantity of described pad 2 is many
Individual.
The LED circuit board of side the most according to claim 4 paster, it is characterised in that the shape of described connecting portion (22)
Shape, size and quantity all match with the boring shape of (11), size and quantity.
The LED circuit board of side the most according to claim 5 paster, it is characterised in that described N is natural number, and N
2。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620788514.2U CN205812499U (en) | 2016-07-26 | 2016-07-26 | A kind of LED circuit board of side paster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620788514.2U CN205812499U (en) | 2016-07-26 | 2016-07-26 | A kind of LED circuit board of side paster |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205812499U true CN205812499U (en) | 2016-12-14 |
Family
ID=57507285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620788514.2U Active CN205812499U (en) | 2016-07-26 | 2016-07-26 | A kind of LED circuit board of side paster |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205812499U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106132082A (en) * | 2016-07-26 | 2016-11-16 | 胜宏科技（惠州）股份有限公司 | A kind of LED circuit board of side paster and preparation method thereof |
| CN108767084A (en) * | 2018-04-24 | 2018-11-06 | 湖南省方正达电子科技有限公司 | A kind of printed circuit and preparation method thereof of three-dimensional assembling LED |
-
2016
- 2016-07-26 CN CN201620788514.2U patent/CN205812499U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106132082A (en) * | 2016-07-26 | 2016-11-16 | 胜宏科技（惠州）股份有限公司 | A kind of LED circuit board of side paster and preparation method thereof |
| CN108767084A (en) * | 2018-04-24 | 2018-11-06 | 湖南省方正达电子科技有限公司 | A kind of printed circuit and preparation method thereof of three-dimensional assembling LED |
| CN108767084B (en) * | 2018-04-24 | 2019-09-03 | 湖南省方正达电子科技有限公司 | A kind of printed circuit and preparation method thereof of three-dimensional assembling LED |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |