CN106132081A - A kind of high-frequency high-speed PCB and preparation method thereof - Google Patents
A kind of high-frequency high-speed PCB and preparation method thereof Download PDFInfo
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- CN106132081A CN106132081A CN201610515171.7A CN201610515171A CN106132081A CN 106132081 A CN106132081 A CN 106132081A CN 201610515171 A CN201610515171 A CN 201610515171A CN 106132081 A CN106132081 A CN 106132081A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
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- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of high-frequency high-speed PCB and preparation method thereof.High-frequency high-speed PCB includes at least two-layer rigid substrate central layer, at least one of which PTFE base material central layer and at least one of which FR4 base material central layer, being overlapped into PCB main body successively according to rigid substrate central layer, PTFE base material central layer, FR4 base material central layer, PTFE base material central layer, the order of rigid substrate central layer from the bottom to top, between each central layer, equal pressing has PTFE type prepreg；It is drilled with through hole in described PCB main body.The manufacture method of this high-frequency high-speed PCB include sawing sheet, rough surface process, inner figure making, drying-plate process, lamination pressing, hole, the step such as heavy copper, welding resistance, surface process.It is little that the PCB of the present invention has the high speed/frequency transfer characteristic of excellence, loss, and the production and processing technology such as boring, profile, nog plate is more prone to management and control, solves the solder mask caducous problem of appearance.
Description
Technical field
The present invention relates to the design of printed circuit board (PCB) (PCB), manufacture technology field, be specifically related to a kind of high-frequency high-speed PCB
And preparation method thereof.
Background technology
Printed wiring board (PCB) is the carrier that electronic devices and components electrical equipment connects, and it is widely used in various electronic product.
At present, in the manufacturing process of PCB, many employing FR4 materials are as the base material of making wiring board, complete line the most on the substrate
The making on road.Due to dielectric constant Dk and the restriction of dielectric loss factor Df of FR4 material itself, this base material is only applicable to transmission
Speed is at the printed circuit board of below 1Gbps, but is as electronics, the developing rapidly of communications industry, and electronics and IT products are continuous
Developing to high-frequency high-speed direction, therefore the performance to base material used by PCB it is also proposed higher requirement, i.e. as signal vehicle
Base material need to have relatively low dielectric constant and dielectric loss factor.
At present PCB presses the size of dielectric loss factor with base material, be broadly divided into Standard Loss (Df > 0.02),
Middle Loss(0.01<Df<0.02)、Low Loss(0.006<Df<0.01)、Very Low Loss(0.003<Df<
0.006), Ultra Low Loss (Df < 0.003) several classes, at present, conventional high speed substrate resin system is mainly by polyphenylene oxide
(PPO), cyanic acid resin (CE), nytron objects system, politef (PTFE) etc., wherein, the dielectric loss of PTFE base material
The factor is minimum, the product made with this base material, i.e. PTFE material PCB can show the signal transmission performance of excellence, and medium
Fissipation factor is not so good as PTFE material PCB more than the PCB that other base materials of PTFE base material make in terms of signal transmission performance, but
These base materials are rigid material, have more preferable machining property compared with PTFE material.Additionally, PTFE base material not only has
There are extremely low dielectric constant and a dielectric loss factor, and there is the performances such as good high-low temperature resistant, ageing-resistant and low water absorption,
Therefore, along with PCB signal transmission frequencies and transfer rate improve constantly, PTFE base material energy preferably meeting the market requirement, at PCB
Application increasing.
Although PTFE base material shows the signal transmission performance of excellence, but this base material still suffers from process of manufacture
Many limitation, specific as follows: owing to the surface energy of PTFE base material is low and its surface is the most smooth, to make solder mask and PTFE base
The poor adhesive force on material surface, the problem that oil easily occurs during processing and use；And owing to PTFE base material hardness is low, because of
This easily produces burr during machining (such as boring, contour milling, V-CUT operation etc.), not only affects product
Attractive in appearance and reliability, and certain manual repair's burr need to be expended, reduce production efficiency；Additionally, the above-mentioned property of PTFE base material
Can also make in process of manufacture, cannot be carried out machinery nog plate, cause being both needed to use special place during many manufacturing procedure operations
Reason mode, and during processing, easily there is impression, deformation etc. in plate face.
Summary of the invention
In order to overcome the deficiencies in the prior art, it is an object of the invention to provide a kind of high-frequency high-speed PCB, it is ensured that PCB has
There are the high speed/frequency transfer characteristic of excellence, dielectric loss little.
The second object of the present invention is to provide the manufacture method of a kind of high-frequency high-speed pcb board PCB, it is ensured that PCB has excellent
Different high speed/frequency transfer characteristic, dielectric loss is little and the production and processing technology such as boring, profile, nog plate is more prone to management and control,
And solve the solder mask caducous problem of appearance.
For solving the problems referred to above, the technical solution adopted in the present invention is as follows:
A kind of high-frequency high-speed PCB, it includes at least two-layer rigid substrate central layer, at least one of which PTFE base material central layer and extremely
Few one layer of FR4 base material central layer, the most from the bottom to top according to rigid substrate central layer, PTFE base material central layer, FR4 base material central layer, PTFE
Base material central layer, the order of rigid substrate central layer are formed by stacking successively, and between each central layer, equal pressing has PTFE type prepreg；Described
It is drilled with in PCB main body and penetrates rigid substrate central layer, PTFE base material central layer, the through hole of FR4 base material central layer.
Rigid substrate central layer of the present invention is rigidity low-loss base material central layer；Further in scheme, the present invention
Described low-loss rigid substrate is that the rigid material that electrical property is poorer than PTFE, the i.e. fissipation factor of material are slightly larger than PTFE material
Material.
A kind of manufacture method of high-frequency high-speed PCB, this manufacture method comprises the following steps:
1) sawing sheet: according to pre-set dimension, PTFE base material, rigid substrate and FR4 copper-clad plate are carried out sawing sheet respectively, to obtain
Pre-set dimension PTFE base material central layer, rigid substrate central layer, FR4 base material central layer；
2) rough surfaceization processes: be roughened the core plate surface after sawing sheet so that each core plate surface is formed slightly
Rough surface；
3) figure transfer: in step 2) process after each central layer plate face of obtaining paste dry film and carry out figure transfer to obtain
Inner figure；
4) drying-plate processes: each central layer after shifting figure carries out drying-plate process, to discharge the stress of central layer and to remove it
Middle moisture；
5) lamination pressing: each central layer after processing drying-plate carries out lamination and pressing processes to form PCB substrate；
6) boring: PCB substrate is holed；
7) machinery nog plate: the PCB substrate after boring is carried out machinery nog plate, to remove flash removed；
8) plasma: PCB substrate is carried out plasma treatment, to bore dirt in removing hole；
9) heavy copper, plating, figure transfer processing: the PCB substrate after machinery nog plate is carried out heavy copper, electroplating processes, and right
PCB substrate outer layer carries out figure transfer, to obtain outer graphics；
10) welding resistance: PCB substrate is carried out welding resistance pre-treatment, and prints solder mask, to form resistance on PCB substrate surface
Layer；
11) surface processes: PCB substrate is carried out surface process, to ensure that PCB has good solderability and electrical property；
12) sharp processing: use milling machine or V-cut machine that PCB is carried out sharp processing, has preset shape to obtain
PCB。
As further scheme, in said method, step 2) rough surfaceization process mode for washing, nog plate or micro-
Erosion.
As further scheme, in said method, step 4) drying-plate process in, temperature is 100-150 DEG C, the drying-plate time
For 30-90min.
As further scheme, in said method, step 9) welding resistance pre-treatment be the plate face of PCB printing low-loss
Solder mask.
As further scheme, this manufacture method is additionally included in step 3) figure transfer after, step 4) drying-plate process before
Each central layer copper face is carried out process step, processing mode be brown process or whitening processing.
Compared to existing technology, the beneficial effects of the present invention is:
High-frequency high-speed PCB the most of the present invention is suitable with the PCB electrical property using pure PTFE material to make, and can meet height
Speed/high-frequency signal requirement, and material cost and the processing cost of product, the sexual valence of improving product can be reduced to a certain extent
Ratio；
High-frequency high-speed PCB the most of the present invention uses the central layer of multiple layers of different materials overlapping, relative to using pure PTFE
The PCB that material makes has more preferable machining property, will not produce burr or burr when forming processes, it is to avoid add man-hour
The manpower waste repairing burr and cause, improving production efficiency and product quality；
In the manufacturing process of high-frequency high-speed PCB the most of the present invention, make outer graphics or during welding resistance pre-treatment without
Special handling, time saving and energy saving；
Rigidity overall for high-frequency high-speed PCB the most of the present invention is obviously improved, can use when finished article design bridging or
V-Cut etc. design, and plate will not be caused because PTFE material is soft to damage in processing or handling process and scrap；
5. the high-frequency high-speed PCB outer layer obtained by the manufacture method of the present invention uses rigidity low loss core panel material, and
Collocation low-loss solder mask uses, and its electrical property and outer layer use PTFE material to be close, but there is not PTFE material and resistance
, easily there is the problem that solder mask comes off in layer poor adhesive force.
With detailed description of the invention, the present invention is described in further detail below in conjunction with the accompanying drawings.
Accompanying drawing explanation
Fig. 1 is the high-frequency high-speed PCB construction schematic diagram of the specific embodiment of the invention；
Wherein, each reference is: 101, rigidity low-loss base material central layer；102, PTFE base material central layer；103, FR4 base material
Central layer.
Detailed description of the invention
A kind of high-frequency high-speed PCB of the present invention, it includes at least two-layer rigid substrate central layer, at least one of which PTFE base
Material central layer and at least one of which FR4 base material central layer, from the bottom to top according to rigid substrate central layer, PTFE base material central layer, FR4 base material core
Plate, PTFE base material central layer, the order of rigid substrate central layer are formed by stacking successively, and between each central layer, equal pressing has PTFE type semi-solid preparation
Sheet；It is drilled with in described pcb board main body and penetrates rigid substrate central layer, PTFE base material central layer, the through hole of FR4 base material central layer.
Rigid substrate central layer of the present invention is rigidity low-loss base material central layer；Further in scheme, the present invention
Described low-loss rigid substrate is that the rigid material that electrical property is poorer than PTFE, the i.e. fissipation factor of material are slightly larger than PTFE material
Material.
In high-frequency high-speed PCB of the present invention, the number of plies of central layer need to be more than or equal to 8 layers, and top number does not limit,
Can be adjusted as required, but need to limit in PCB outermost layer as rigidity low-loss base material central layer, to ensure that PCB's is firm
Property.See Fig. 1, in a particular embodiment of the present invention, as a example by the high-frequency high-speed PCB with 10 Rotating fields, its laminated construction
Can be found in table 1, wherein, top layer signals layer (Layer1) and the bottom layer signal layer (Layer10) of PCB all use low-loss rigidity
Base material central layer 101, this low-loss rigid substrate use dielectric loss factor Df≤0.020 all can be used in PCB except
Other PCB substrate beyond PTFE material, these low-loss rigid substrates relatively PTFE base material has more preferable rigidity, adds at machinery
The performance of work aspect is good, and its electrical property (being mainly manifested on the dielectric loss factor of base material) is the most weak compared with PTFE base material；In order to
Ensureing the signal transmission performance of PCB, the internal layer signals layer (Layer3-4, Layer7-8) of the PCB in the present embodiment all uses
PTFE base material central layer 102, the bus plane (Layer5) of PCB internal layer and ground plane (Layer6) then use FR4 copper-clad plate 103 i.e.
Can, so, the above-mentioned PCB with 10 Rotating fields have employed PTFE base material due to its internal layer, and the low-loss rigidity that outer layer uses
The electrical property of base material is the most weak compared with PTFE base material, but it has good rigidity, and in terms of machining, performance is good, therefore,
The PCB using said structure can promote the integral rigidity of PCB while ensureing signal transmission performance so that it is in machining
During machinery nog plate, the problem being not likely to produce burr, impression or deformation etc., thus save cost of labor, and be greatly improved
Production efficiency and improving product quality.Additionally, the bus plane and ground plane that use FR4 copper-clad plate are arranged on by the present embodiment
In PCB internal layer, owing to FR4 copper-clad plate itself has good rigidity, therefore can be combined with outer layer rigid substrate, promote further
The machining property that PCB is overall, and cost-effective.
Table 1
| SM | Low-loss solder mask |
| Layer 1 | Signals layer 1 |
| CORE (low loss rigid material) | |
| Layer 2 | GND |
| PREPREG(PTFE) | |
| Layer 3 | Signals layer 2 |
| CORE(PTFE) | |
| Layer 4 | Signals layer 3 |
| PREPREG(PTFE) | |
| Layer 5 | Power |
| CORE (common FR4 material) | |
| Layer 6 | GND |
| PREPREG(PTFE) | |
| Layer 7 | Signals layer 4 |
| CORE(PTFE) | |
| Layer 8 | Signals layer 5 |
| PREPREG(PTFE) | |
| Layer 9 | GND |
| CORE (low loss rigid material) | |
| Layer 10 | Signals layer 6 |
| SM | Low-loss solder mask |
And for the top layer signals layer of PCB outer layer signals layer, i.e. PCB and the selection of bottom layer signal layer base material, ensureing PCB
There is certain rigidity, after being beneficial to machining, in order to improve the signal transmission performance of PCB further, layer signal layer institute in addition
Select base material electrical property (predominantly dielectric loss factor) with PTFE base material closer to being preferred.Concrete, PCB in the present embodiment
The PTFE base material that used of internal layer signals layer can select the RO3000 series of Rogers company, RT5880, Taconic company
TLX series, TLY series, RF series, EZIO series, the product such as AD350D, AD450 of Arlon company, and outer layer signals layer
The low-loss rigid substrate used be then dielectric loss factor then with PTFE base material close to and there is the material of certain rigidity, as
The Megtron 7 of PANASONIC, the Tachyon 100G of Isola company, TU-933, Park company of platform company
The products such as Meteorwave 3000 and Meteorwave 4000, internal layer bus plane and ground plane then use common FR4 to cover copper
Plate, such that it is able to promote signal transmission performance overall for PCB and machining property simultaneously.
PCB of the present invention is along with the lifting of its rigidity, in the techniques such as follow-up bridging, V-Cut, it is ensured that
The machining property of PCB, thus avoid the plates such as the fracture of PCB, bending to damage problem.
Further, in order to make the electrical property of low-loss rigid substrate try one's best close with PTFE base material, it is also possible to make outer layer
Low-loss rigid substrate in signals layer is arranged in pairs or groups with low profile copper foil (such as HVLP)；Further, it is also possible to make solder mask use low damage
The solder mask of consumption, this low-loss solder mask is possible not only to reduce the loss of signal of outer layer signals layer so that it is electrical property connects
Nearly PTFE base material, but also the adhesive force of solder mask and outer layer signals layer can be strengthened, PCB is reduced or avoided and in processing and makes
During with fall oil problem.
Consider the impact when PCB frequency transmission signal up to number GHz on PCB electric property of the glass-fiber-fabric weave effect, because of
This, in order to avoid the glass-fiber-fabric weave effect likely occurred when outer layer signals layer uses low-loss rigid substrate, low-loss is firm
Property base material can be used in combination with flat glass-fiber-fabric, or use the glass of more than two to join the core material of this structure
A kind of manufacture method of high-frequency high-speed PCB, this manufacture method comprises the following steps:
1) sawing sheet: according to pre-set dimension, PTFE base material, rigid substrate and FR4 copper-clad plate are carried out sawing sheet respectively, to obtain
Pre-set dimension PTFE base material central layer, rigid substrate central layer, FR4 base material central layer；
2) rough surfaceization processes: be roughened the core plate surface after sawing sheet so that each core plate surface is formed slightly
Rough surface；
3) figure transfer: in step 2) process after each central layer plate face of obtaining paste dry film and carry out in figure transfer obtains
Layer pattern；
4) drying-plate processes: each central layer after shifting figure carries out drying-plate process, to discharge the stress of central layer and to remove it
Middle moisture；
5) lamination pressing: each central layer after processing drying-plate carries out lamination and pressing processes to form PCB substrate；
6) boring: PCB substrate is holed；
7) machinery nog plate: the PCB substrate after boring is carried out machinery nog plate, to remove flash removed；
8) plasma: PCB substrate is carried out plasma treatment, to bore dirt in removing hole；
9) heavy copper, plating, figure transfer processing: the PCB substrate after machinery nog plate is carried out heavy copper, electroplating processes, and warp
Pad pasting, expose, etching etc. processes and obtains outer graphics；
10) welding resistance pre-treatment: PCB substrate is carried out welding resistance pre-treatment, to form solder mask on PCB substrate surface；This step
In Zhou, by printing low-loss solder mask at PCB surface, the electrical property of PCB can be strengthened.
11) sharp processing: use milling machine or V-cut machine that PCB is carried out sharp processing, has preset shape to obtain
PCB.In this step, the instrument such as conventional milling cutters, cover plate can be used to be processed, it is not necessary to use special adjuvant, and can effectively keep away
Exempt from the PCB of the PTFE material Burr Problem in sharp processing.
As further scheme, in said method, step 2) rough surfaceization process mode can be nog plate or microetch.
Wherein PTFE material due to material softer, rough surfaceization process ideal style be use microetch mode process.
In manufacture method of the present invention, drying-plate parameter need to adjust according to concrete technology and base material.As entering one
The scheme of step, in said method, step 5) during drying-plate processes, temperature is 100-150 DEG C, and the drying-plate time is 30-90min.Preferably
The drying-plate time be 90 minutes, drying-plate temperature is 120 DEG C.
As further scheme, this manufacture method is additionally included in step 3) figure transfer after, step 4) drying-plate process before
Each central layer copper face is carried out process step, processing mode be brown process or whitening processing.With each central layer after enhancing pressing
Between adhesion.
As further scheme, in said method, step 10) welding resistance pre-treatment be the plate face of PCB print low-loss
Solder mask.Wherein common solder mask sees table 2 with the difference of low-loss solder mask.
Table 2
| Dielectric constant@1GHz | Fissipation factor@1GHz | |
| Common solder mask | 3.6～4 | >0.02 |
| Low-loss solder mask | 3.2～3.6 | 0.01～0.02 |
Step 3) in due to the harmomegathus performance difference of low-loss rigid material, FR4 material and PTFE material, preferable method
It is before carrying out figure transfer, according to the characteristic of low-loss rigid material, FR4 material and PTFE material, each layer pattern file is entered
Row is put in advance, and the pre-coefficient of putting of three kinds of central layers need to be treated with a certain discrimination.Wherein, the pre-coefficient of putting of three kinds of materials sees table 3.
Table 3
In manufacture method of the present invention, FR4 base material central layer has been placed on the centre of PCB during lamination by PCB
Layer, and low-loss rigidity central layer has been placed on the outer layer of PCB, it is thereby possible to reduce off normal in the operation engineering of lamination and pressing
Generation, to improve the aligning accuracy between multi-layer sheet, it is possible to improve the warpage performance of PCB.
In manufacture method of the present invention, the drilling parameter used during boring can refer to PTFE material PCB of routine
Drilling parameter, to obtain good hole wall quality, naturally it is also possible to according to practical situation, drilling parameter is carried out certain excellent
Change, to improve drilling quality and efficiency.
Owing to PCB outer layer of the present invention have employed low-loss rigid substrate, the rigidity of PCB substrate therefore can be promoted, so that
Mechanical nog plate technique in this step on the premise of the size not affecting PCB substrate, can effectively remove drill hole burr,
Burr etc., and be cleaned in hole.Meanwhile, the edges of boards Burr Problem during sharp processing can be prevented effectively from.
Above-mentioned embodiment is only the preferred embodiment of the present invention, it is impossible to limit the scope of protection of the invention with this,
The change of any unsubstantiality that those skilled in the art is done on the basis of the present invention and replacement belong to institute of the present invention
Claimed scope.
Claims (6)
1. a high-frequency high-speed PCB, it is characterised in that it includes at least two-layer rigid substrate central layer, at least one of which PTFE base material
Central layer and at least one of which FR4 base material central layer, be from the bottom to top according to rigid substrate central layer, PTFE base material central layer, FR4 base material core
Plate, PTFE base material central layer, the order of rigid substrate central layer are formed by stacking successively, and between each central layer, equal pressing has PTFE type semi-solid preparation
Sheet；It is drilled with in described PCB main body and penetrates rigid substrate central layer, PTFE base material central layer, the through hole of FR4 base material central layer.
2. the manufacture method of the high-frequency high-speed PCB described in claim 1, it is characterised in that this manufacture method comprises the following steps:
1) sawing sheet: according to pre-set dimension, PTFE base material, rigid substrate and FR4 copper-clad plate are carried out sawing sheet respectively, presets to obtain
Size PTFE base material central layer, rigid substrate central layer, FR4 base material central layer；
2) rough surfaceization processes: be roughened the core plate surface after sawing sheet so that each core plate surface forms coarse table
Face；
3) figure transfer: in step 2) process after each central layer plate face of obtaining paste dry film and carry out figure and shift to obtain internal layer
Figure；
4) drying-plate processes: each central layer after shifting figure carries out drying-plate process, to discharge the stress of central layer and to remove wherein water
Point；
5) lamination pressing: each central layer after processing drying-plate carries out lamination and pressing processes to form PCB substrate；
6) boring: PCB substrate is holed；
7) machinery nog plate: the PCB substrate after boring is carried out machinery nog plate, to remove flash removed；
8) plasma: PCB substrate is carried out plasma treatment, to bore dirt in removing hole；
9) heavy copper, plating, figure transfer processing: the PCB substrate after machinery nog plate is carried out heavy copper, electroplating processes, and to PCB base
Plate outer layer carries out figure transfer, to obtain outer graphics；
10) welding resistance: PCB substrate is carried out welding resistance pre-treatment, and prints solder mask, to form solder mask on PCB substrate surface；
11) surface processes: PCB substrate is carried out surface process, to ensure that PCB has good solderability and electrical property；
12) sharp processing: use milling machine or V-cut machine that PCB is carried out sharp processing, to obtain the PCB with preset shape.
The manufacture method of high-frequency high-speed PCB the most according to claim 2, it is characterised in that step 2) at rough surface
The mode of reason is nog plate or microetch.
The manufacture method of high-frequency high-speed PCB the most according to claim 2, it is characterised in that step 4) drying-plate process in, temperature
Degree is for 100-150 DEG C, and the drying-plate time is 30-90min.
The manufacture method of high-frequency high-speed PCB the most according to claim 2, it is characterised in that step 9) welding resistance is at PCB
Low-loss solder mask is printed in plate face.
6. according to the manufacture method of the high-frequency high-speed PCB described in any one of claim 2-4, it is characterised in that this manufacture method
Be additionally included in step 3) figure transfer after, step 4) drying-plate before treatment each central layer copper face is carried out process step, processing mode
Process or whitening processing for brown.
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