CN108966511A - A kind of internal layer surface processing method reducing High-Speed PCB signal insertion loss - Google Patents
A kind of internal layer surface processing method reducing High-Speed PCB signal insertion loss Download PDFInfo
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- CN108966511A CN108966511A CN201810853010.8A CN201810853010A CN108966511A CN 108966511 A CN108966511 A CN 108966511A CN 201810853010 A CN201810853010 A CN 201810853010A CN 108966511 A CN108966511 A CN 108966511A
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- China
- Prior art keywords
- core material
- copper
- insertion loss
- signal insertion
- internal layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Abstract
A kind of internal layer surface processing method reducing High-Speed PCB signal insertion loss, comprising the following steps: (1), make the core material containing inner figure, which includes PP and the layers of copper for being pressed together on the front and back sides PP；(2), it is surface-treated, oil removing, washing process is successively passed through to core material, remove the impurity on core material surface, guarantee the layers of copper clean surface of core material；(3), interface adhesion promoter is generated, in one layer of imidazole derivative of layers of copper Surface Creation of core material；(4), the copper face roughness of core plate is tested, when the result of measurement meets the requirements, core material is flowed into subsequent processing and is handled；(5), force fit plate is made, core material and prepreg are overlapped, and force fit plate is made in pressing at high temperature under high pressure.The present invention enhances peel strength, and obtained PCB copper face microetch amount is small, and copper face roughness, promotion signal Insertion Loss ability is effectively reduced.
Description
Technical field
The present invention relates to a kind of PCB production technologies, more particularly to a kind of internal layer for reducing High-Speed PCB signal insertion loss
Surface treatment method.
Background technique
High-frequency current on the section of conductor not be it is equally distributed, leading intracorporal magnetic field can make electric current tend to conductor table
Face, this current distribution can be such that the resistance of conductor greatly increases, and this phenomenon is known as skin effect in transmission line.
PCB industry can increase inter-layer bonding force by way of increasing copper face roughness before pressing, generally use brownification
Processing, entire brownification treatment process is the following steps are included: ultrasonic wave embathes → pickling → washing → alkali cleaning → DI washing → preimpregnation
→ brownification → DI washing → drying is generally higher than 1.9 μm using the Rz of the copper face roughness after traditional brownification process.And
The copper face roughness value of transmission line is excessive to seriously affect loss of signal, and electrical characteristic is influenced obviously, to reduce product by skin effect
Quality.
Summary of the invention
Based on this, the purpose of the present invention is to provide a kind of internal layer surface processing for reducing High-Speed PCB signal insertion loss
Method.
A kind of internal layer surface processing method reducing High-Speed PCB signal insertion loss, comprising the following steps:
(1), the core material containing inner figure is made, which includes PP and the layers of copper for being pressed together on the front and back sides PP；
(2), it is surface-treated, oil removing, washing process is successively passed through to core material, remove the impurity on core material surface,
Guarantee the layers of copper clean surface of core material；
(3), interface adhesion promoter is generated, in one layer of imidazole derivative of layers of copper Surface Creation of core material；
(4), the copper face roughness of core plate is tested, when the result of measurement meets the requirements, core material is flowed into next work
It is handled in sequence；
(5), force fit plate is made, core material and prepreg are overlapped, and force fit plate is made in pressing at high temperature under high pressure.
Further, in step (3), using horizontal wet process, imidazole derivative is generated.
Further, in step (3), treatment temperature when reaction is 32 DEG C~40 DEG C, the processing time for 120s~
180s。
Further, in step (3), temperature when reaction is 36 DEG C, reacting treatment time 150s.
The beneficial effect of internal layer surface processing method that the present invention reduces High-Speed PCB signal insertion loss is: by
The chemical bond that one layer of imidazole derivative is generated in the layers of copper of core material, connects between copper foil and resin, and enhancing antistripping is strong
Degree, obtained PCB copper face microetch amount is small, and copper face roughness, promotion signal Insertion Loss ability is effectively reduced.
Specific embodiment
In order to enable technical solution of the present invention more clearly to show, below the invention will be further described.
The present invention provides a kind of internal layer surface processing method for reducing High-Speed PCB signal insertion loss comprising following step
It is rapid:
(1), the core material containing inner figure is made, which includes PP and the layers of copper for being pressed together on the front and back sides PP；
(2), it is surface-treated, oil removing, washing process is successively passed through to core material, remove the impurity on core material surface,
Guarantee the layers of copper clean surface of core material；
(3), interface adhesion promoter is generated, using horizontal wet process, in one layer of imidazoles of layers of copper Surface Creation of core material
Derivative；Treatment temperature when reaction is 32 DEG C~40 DEG C, and optimum temperature is 36 DEG C, and the processing time is 120s~180s, most preferably
For 150s；
(4), the copper face roughness of core plate is tested, when the result of measurement meets the requirements, core material is flowed into next work
It is handled in sequence；
(5), force fit plate is made, core material and prepreg are overlapped, and force fit plate is made in pressing at high temperature under high pressure, is led to
Cross and imidazole derivative be applied to the processing of PCB internal layer surface, using the chemical bond of the imidazole derivative of copper face, copper foil with
It is connected between resin, reaches the bonding purposes in bonding processes, promote pressing reliability performance.Copper face roughness is reduced simultaneously, is mentioned
Rise loss of signal ability.
The following are the present invention and traditional handicraft copper face roughening process contrast tables before pressing:
The beneficial effect of internal layer surface processing method that the present invention reduces High-Speed PCB signal insertion loss is: by
The chemical bond that one layer of imidazole derivative is generated in the layers of copper of core material, is used for connection copper foil and resin, and enhancing antistripping is strong
Degree, obtained PCB copper face microetch amount is small, and copper face roughness, promotion signal Insertion Loss ability is effectively reduced.
One embodiment of the present invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (4)
1. a kind of internal layer surface processing method for reducing High-Speed PCB signal insertion loss, which comprises the following steps:
(1), the core material containing inner figure is made, which includes PP and the layers of copper for being pressed together on the front and back sides PP；
(2), it is surface-treated, oil removing, washing process is successively passed through to core material, remove the impurity on core material surface, guarantee
The layers of copper clean surface of core material；
(3), interface adhesion promoter is generated, in one layer of imidazole derivative of layers of copper Surface Creation of core material；
(4), the copper face roughness of core plate is tested, when the result of measurement meets the requirements, core material is flowed into subsequent processing
It is handled；
(5), force fit plate is made, core material and prepreg are overlapped, and force fit plate is made in pressing at high temperature under high pressure.
2. the internal layer surface processing method according to claim 1 for reducing High-Speed PCB signal insertion loss, feature exist
In: in step (3), imidazole derivative is generated using horizontal wet process.
3. the internal layer surface processing method according to claim 2 for reducing High-Speed PCB signal insertion loss, feature exist
In: in step (3), treatment temperature when reaction is 32 DEG C~40 DEG C, and the processing time is 120s~180s.
4. the internal layer surface processing method according to claim 1 for reducing High-Speed PCB signal insertion loss, feature exist
In: in step (3), temperature when reaction is 36 DEG C, reacting treatment time 150s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810853010.8A CN108966511A (en) | 2018-07-30 | 2018-07-30 | A kind of internal layer surface processing method reducing High-Speed PCB signal insertion loss |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810853010.8A CN108966511A (en) | 2018-07-30 | 2018-07-30 | A kind of internal layer surface processing method reducing High-Speed PCB signal insertion loss |
Publications (1)
| Publication Number | Publication Date |
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| CN108966511A true CN108966511A (en) | 2018-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810853010.8A Pending CN108966511A (en) | 2018-07-30 | 2018-07-30 | A kind of internal layer surface processing method reducing High-Speed PCB signal insertion loss |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0978289A (en) * | 1995-09-11 | 1997-03-25 | Fukuda Metal Foil & Powder Co Ltd | Copper foil for printed wiring board and its surface treatment |
| JPH11343476A (en) * | 1998-06-02 | 1999-12-14 | Tokai Rubber Ind Ltd | Adhesive composition and copper-clad laminate |
| CN1422924A (en) * | 1994-12-12 | 2003-06-11 | 阿尔菲弗赖伊有限公司 | Binding-aid composition, multilayer printed circuit making method and rotary coating copper surface |
| JP2004140268A (en) * | 2002-10-18 | 2004-05-13 | Matsushita Electric Works Ltd | Manufacturing method of multilayer printed circuit board for high frequency |
| KR20070043629A (en) * | 2005-10-20 | 2007-04-25 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Adhesive composition and sheet having an adhesive layer of the composition |
| JP2012187933A (en) * | 2005-05-27 | 2012-10-04 | Hitachi Chemical Co Ltd | Metal foil with adhesion-assisting agent and printed wiring board using the same, and method of manufacturing the printed wiring board |
| US20150034369A1 (en) * | 2011-07-14 | 2015-02-05 | Mitsubishi Gas Chemical Company, Inc. | Resin composition for printed wiring boards |
| CN106132081A (en) * | 2016-06-30 | 2016-11-16 | 广州兴森快捷电路科技有限公司 | A kind of high-frequency high-speed PCB and preparation method thereof |
-
2018
- 2018-07-30 CN CN201810853010.8A patent/CN108966511A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1422924A (en) * | 1994-12-12 | 2003-06-11 | 阿尔菲弗赖伊有限公司 | Binding-aid composition, multilayer printed circuit making method and rotary coating copper surface |
| JPH0978289A (en) * | 1995-09-11 | 1997-03-25 | Fukuda Metal Foil & Powder Co Ltd | Copper foil for printed wiring board and its surface treatment |
| JPH11343476A (en) * | 1998-06-02 | 1999-12-14 | Tokai Rubber Ind Ltd | Adhesive composition and copper-clad laminate |
| JP2004140268A (en) * | 2002-10-18 | 2004-05-13 | Matsushita Electric Works Ltd | Manufacturing method of multilayer printed circuit board for high frequency |
| JP2012187933A (en) * | 2005-05-27 | 2012-10-04 | Hitachi Chemical Co Ltd | Metal foil with adhesion-assisting agent and printed wiring board using the same, and method of manufacturing the printed wiring board |
| KR20070043629A (en) * | 2005-10-20 | 2007-04-25 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Adhesive composition and sheet having an adhesive layer of the composition |
| US20150034369A1 (en) * | 2011-07-14 | 2015-02-05 | Mitsubishi Gas Chemical Company, Inc. | Resin composition for printed wiring boards |
| CN106132081A (en) * | 2016-06-30 | 2016-11-16 | 广州兴森快捷电路科技有限公司 | A kind of high-frequency high-speed PCB and preparation method thereof |
Non-Patent Citations (1)
| Title |
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| 余振中;: "铜箔粗糙度对高速材料信号损耗影响分析", 覆铜板资讯, no. 02 * |
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