CN102173172B - Method for preparing polytetrafluoroethylene copper-clad plate - Google Patents
Method for preparing polytetrafluoroethylene copper-clad plate Download PDFInfo
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- CN102173172B CN102173172B CN 201110044654 CN201110044654A CN102173172B CN 102173172 B CN102173172 B CN 102173172B CN 201110044654 CN201110044654 CN 201110044654 CN 201110044654 A CN201110044654 A CN 201110044654A CN 102173172 B CN102173172 B CN 102173172B
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Abstract
The invention discloses a method for preparing a polytetrafluoroethylene copper-clad plate, which comprises the following steps of: pretreating glass fiber cloth, preparing impregnation liquid, preparing dielectric cloth by impregnating the glass fiber cloth, and cladding copper and aluminum on the dielectric cloth, wherein the step of cladding copper and aluminum on the dielectric cloth comprises the following sub-steps of: a, cutting the dielectric cloth, copper foils and aluminum foils according to required sizes; and b, staking on a template in a sequence of an aluminum foil, a copper foil, the dielectric cloth, a copper foil and an aluminum foil, putting into a hot press, raising the temperature in a mode of wave bands, applying pressure of 6-9MPa when the temperature is between 360 and 380DEG C, cooling, and quenching when the temperature is reduced to be 200DEG C to obtain the modified polytetrafluoroethylene copper-clad plate. The dielectric cloth copper-clad plate has the dielectric loss factor reduced from 1*10<-3> to 7*10<-4>, the surface insulation resistance improved from 1*10<10> to the average 10<15>, the bending strength improved from 80MPa to average 140MPa, and the peel strength from 1.5kN/m to average 3kN/m.
Description
Technical field
The present invention relates to the preparation method that copper-clad plate is used, relate in particular to a kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene.
Background technology
Printed wiring board is widely used in the fields such as computer, communication, instrument, military project, automobile, science equipment, for components and parts plug-in mounting, welding, inspection and maintenance provide identification and figure.The substrate of printed wiring board claims again copper-clad plate.Along with communication, electronic product gradually at a high speed, the high frequency development, the high-frequency high-performance Copper Clad Laminates Based On Polytetrafluoroethylene market demand also increases rapidly.
Copper Clad Laminates Based On Polytetrafluoroethylene is to obtain dielectric cloth, dielectric cloth and Copper Foil combination are made again through a series of processing with glass-fiber-fabric, so the preparation of glass-fiber-fabric is very large to the performance impact of copper-clad plate.For the high-frequency microwave circuit, dielectric constant will be stablized, dielectric loss factor and the smaller the better.
Yet copper-clad plate dielectric loss factor of the prior art is higher, and surface insulation resistance is little, and bending strength is low, and peel strength is low.
Summary of the invention
The present invention is intended to overcome the deficiency that above prior art exists, and a kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene is provided, and to reducing the dielectric loss factor of polyethylene copper-clad plate, improves surface insulation resistance, increases bending strength, improves peel strength.
Technical solution problem of the present invention adopts following technical scheme:
A kind of Copper Clad Laminates Based On Polytetrafluoroethylene preparation method, preparation, the glass-fiber-fabric dipping that comprises preliminary treatment, the maceration extract of glass-fiber-fabric makes dielectric cloth and dielectric cloth and covers copper and cover aluminium, and described dielectric cloth covers copper and covers aluminium and may further comprise the steps:
A, dielectric cloth, Copper Foil, aluminium foil be cut into the size that needs;
B, sequentially overlay on the template according to aluminium foil, Copper Foil, dielectric cloth, Copper Foil, aluminium foil, then put into hot press, temperature is wave band and rises, when temperature reaches 360～380 ℃, apply 6～9MPa pressure, and with this state maintenance naturally cooling after 2～3 hours, chilling got described Copper Clad Laminates Based On Polytetrafluoroethylene in 30 minutes when temperature is cooled to 200 ℃.
Described glass-fiber-fabric preliminary treatment is undertaken by following operation: glass is distributed in 410 ℃ of lower heat treatments 2 minutes, infiltrates 13 seconds in distilled water, dry through 60 ℃～250 ℃ five sections intensification drying tunnels (seeing Table 2).
The preparation of described maceration extract is undertaken by following operation: 1:1 takes by weighing the concentrated dispersion liquid of perfluoro alkoxy and distilled water in mass ratio, puts into agitator, stirs 30 minutes with the 200r/min rotating speed, filters with the EW60 glass-fiber-fabric, gets the maceration extract I; Perfluoro alkoxy concentrates dispersion liquid in mass ratio: polytetrafluoroethylene (PTFE) concentrates dispersion liquid: distilled water=1:8:2 and micro-Nonyl pheno base ether, after taking by weighing each material, put into agitator, stirred 30～90 minutes with the 200r/min rotating speed, filter with the EW60 glass-fiber-fabric, get the maceration extract II.
The dipping of described glass-fiber-fabric carries out as follows: the glass-fiber-fabric of processing in the step I flooded in the maceration extract I 20～40 seconds, and in the drying tunnel of 60 ℃～250 ℃ of five sections intensifications (seeing Table 2), dry with 0.2～0.8m/min speed.Glass-fiber-fabric after processing among the step c in the maceration extract II, was flooded 20～40 seconds, in (seeing Table 2) drying tunnel, dry with 0.2～0.8m/min speed in the drying tunnel of 60 ℃～250 ℃ of five sections intensifications; Glass-fiber-fabric after processing among the step c is cured in 350 ℃～400 ℃ three sections intensification drying tunnels (seeing Table 3).
Table 2
| Stage | Phase I | Second stage | Phase III | The quadravalence section | Five-stage |
| Temperature (℃) | 60±10 | 120±10 | 160±10 | 220±10 | 250±10 |
Table 3
| Stage | Phase I | Second stage | Phase III |
| Temperature (℃) | 350±10 | 390±10 | 400±10 |
Beneficial effect of the present invention is as follows:
The copper-clad plate dielectric loss factor that uses dielectric cloth of the present invention from 1 *
-3Drop to 7 * 10
-4, surface insulation resistance is from 1 * 10
10Bring up to average 10
15, bending strength is brought up to average 140MPa from 80MPa, and peel strength is brought up to average 3kN/m from 1.5kN/m.
Below be four groups of performance datas of using the copper-clad plate of dielectric cloth of the present invention: (table 1)
Table 1
The specific embodiment
Embodiment 1
A kind of preparation method of polyethylene copper-clad plate,, preparation, the glass-fiber-fabric dipping that comprises preliminary treatment, the maceration extract of glass-fiber-fabric makes dielectric cloth and dielectric cloth and covers copper and cover aluminium, and dielectric cloth covers copper and covers aluminium, and described dielectric cloth covers copper and covers aluminium and may further comprise the steps:
A, dielectric cloth, Copper Foil, aluminium foil are cut into 330mm * 460mm specification;
B, sequentially overlay on the template according to aluminium foil, Copper Foil, dielectric cloth, Copper Foil, aluminium foil, then put into hot press, temperature is wave band and rises, when temperature reaches 370 ℃, apply 6～8MPa pressure, and with this state maintenance naturally cooling after 2.5 hours, chilling got described modified polytetrafluoroethylcopper copper clad plate in 30 minutes when temperature is cooled to 200 ℃.
Each material performance indications described in the present invention are as follows:
Polytetrafluoroethylene (PTFE) concentrates dispersion liquid: FR301G solid content 60%, and 327 ℃ of melting point resins, single liability company is liked to be rich in Shanghai three;
Perfluoro alkoxy concentrates dispersion liquid: FR503 solid content 30%, and 302 ℃ of melting point resins, single liability company is liked to be rich in Shanghai three;
Glass-fiber-fabric: EW60 Sichuan Fibre Glass Co., Ltd.;
Copper Foil: thickness 0.035 mm;
Aluminium foil: thickness 0.04mm.
Claims (1)
1. Copper Clad Laminates Based On Polytetrafluoroethylene preparation method, the dipping that comprises preparation, the glass-fiber-fabric of preliminary treatment, the maceration extract of glass-fiber-fabric makes dielectric cloth and dielectric cloth and covers copper and cover aluminium, it is characterized in that, and described dielectric cloth covers copper and covers aluminium and may further comprise the steps:
A, dielectric cloth, Copper Foil, aluminium foil be cut into the size that needs;
B, sequentially overlay on the template according to aluminium foil, Copper Foil, dielectric cloth, Copper Foil, aluminium foil, then put into hot press, temperature is wave band and rises, when temperature reaches 360-380 ℃, apply 6-9MPa pressure, and with this state maintenance naturally cooling after 2-3 hour, chilling got described Copper Clad Laminates Based On Polytetrafluoroethylene in 30 minutes when temperature is cooled to 200 ℃
Described glass-fiber-fabric preliminary treatment is undertaken by following operation: glass is distributed in 410 ℃ of heat treatment 2min, in distilled water, infiltrate 13 seconds, through 60 ℃ of-250 ℃ of five sections intensification drying tunnels oven dry, the temperature of its five sections intensification drying tunnels is followed successively by 60 ± 10 ℃, 120 ± 10 ℃, 160 ± 10 ℃, 220 ± 10 ℃, 250 ± 10 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110044654 CN102173172B (en) | 2011-02-24 | 2011-02-24 | Method for preparing polytetrafluoroethylene copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110044654 CN102173172B (en) | 2011-02-24 | 2011-02-24 | Method for preparing polytetrafluoroethylene copper-clad plate |
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| Publication Number | Publication Date |
|---|---|
| CN102173172A CN102173172A (en) | 2011-09-07 |
| CN102173172B true CN102173172B (en) | 2013-09-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201110044654 Expired - Fee Related CN102173172B (en) | 2011-02-24 | 2011-02-24 | Method for preparing polytetrafluoroethylene copper-clad plate |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104149420A (en) * | 2014-05-12 | 2014-11-19 | 华东理工大学 | Preparation for non-sintered forming of high-performance polytetrafluoroethylene copper-clad laminate for high-frequency communication |
| CN109629243A (en) * | 2018-12-13 | 2019-04-16 | 广德瓯科达电子有限公司 | A kind of preparation method of copper-clad plate dielectric cloth |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1828452A (en) * | 2004-03-11 | 2006-09-06 | 日东工业株式会社 | Fixing rotating body |
| CN101039546A (en) * | 2007-03-16 | 2007-09-19 | 广东生益科技股份有限公司 | Lead-free compatible high frequency copper clad laminate and its preparing method |
| CN101735456A (en) * | 2009-11-24 | 2010-06-16 | 广东生益科技股份有限公司 | High weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby |
| CN101838431A (en) * | 2010-05-21 | 2010-09-22 | 广东生益科技股份有限公司 | Fluororesin mixture, copper-clad plate prepared therefrom and manufacturing method thereof |
| CN101942180A (en) * | 2010-09-08 | 2011-01-12 | 广东生益科技股份有限公司 | Epoxy resin composition and copper clad laminate manufactured by using same |
-
2011
- 2011-02-24 CN CN 201110044654 patent/CN102173172B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1828452A (en) * | 2004-03-11 | 2006-09-06 | 日东工业株式会社 | Fixing rotating body |
| CN101039546A (en) * | 2007-03-16 | 2007-09-19 | 广东生益科技股份有限公司 | Lead-free compatible high frequency copper clad laminate and its preparing method |
| CN101735456A (en) * | 2009-11-24 | 2010-06-16 | 广东生益科技股份有限公司 | High weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby |
| CN101838431A (en) * | 2010-05-21 | 2010-09-22 | 广东生益科技股份有限公司 | Fluororesin mixture, copper-clad plate prepared therefrom and manufacturing method thereof |
| CN101942180A (en) * | 2010-09-08 | 2011-01-12 | 广东生益科技股份有限公司 | Epoxy resin composition and copper clad laminate manufactured by using same |
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| CN102173172A (en) | 2011-09-07 |
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