CN103287042A - Composite board, composite substrate and preparation method thereof - Google Patents
Composite board, composite substrate and preparation method thereof Download PDFInfo
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- CN103287042A CN103287042A CN2013100665956A CN201310066595A CN103287042A CN 103287042 A CN103287042 A CN 103287042A CN 2013100665956 A CN2013100665956 A CN 2013100665956A CN 201310066595 A CN201310066595 A CN 201310066595A CN 103287042 A CN103287042 A CN 103287042A
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Abstract
The invention provides a composite board, which comprises polyarylether resin and a reinforcing material. The invention simultaneously provides a composite substrate, which is obtained by attaching a conductive layer on the composite board. The composite board and the composite substrate have excellent heat resistance, mechanical properties and radiation resistance, and low dielectric constant and dielectric loss, can improve high frequency characteristics of the substrate, reduce signal delay, distortion and loss, and ensure high quality signal transmission.
Description
Technical field
The invention belongs to the substrate field, be specifically related to a kind of composite plate, composite base plate and preparation method thereof.
Background technology
Along with information products constantly to high speed and high frequency development, the increase of the substrate number of plies, wiring density, the miniaturization of conductor size, the attenuate of thickness of insulating layer, require baseplate material to have better hear resistance, lower thermal coefficient of expansion, lower dielectric constant and dielectric loss particularly, to improve the high frequency characteristics of substrate, reduce signal delay, distortion and loss, and interference between signals, guaranteeing high-quality signal transmission, traditional copper-clad plate such as phenolic aldehyde/paper substrate, its performance of epoxy/glass cloth can not reach the requirement of high performance copper clad laminate.
The high-frequency circuit baseplate material has higher demand to dielectric properties, generally requires dielectric constant to be stabilized in about 3 under GHz, and dielectric loss is equal to or less than 10
-3The resin that is applied to high frequency printed circuit boards at present mainly contains: PTFE, PI, CE etc., all there are pluses and minuses separately in these high performance resins.PTFE glass cloth copper-clad plate dielectric constant is very low, is generally 2.5, and the loss I is to reach 10
-5The characteristic of excellent chemical proofing, resistance to acids and bases, moisture-proof, but the PTFE vitrification point is low, material is too soft, boring property is slightly poor, the processing and forming temperature is very high, tonnage big, the time is longer, is difficult to activate, and hole wall is difficult to plating firmly in via is made, thermal coefficient of expansion is very big, can't carry out the making of fine circuit.The CE resin has the various good performance of similar FR-4, but still exists that water imbibition is higher, easily has that lamination takes place, fragility is big, solidification temperature is high after the compression moulding processing and problem such as price height.The PI resin has high glass-transition temperature, and dielectric constant is lower, but has very easily suction, problem such as easy layering during press process, and also cost is also than higher.
Summary of the invention
In order to solve the problem that exists in the existing substrate, the invention provides a kind of composite plate, composite base plate and preparation method thereof, utilize polyarylether resin to dissolve in the characteristic of organic solvent, select reinforcing material for use, prepare the composite plate of excellent hear resistance, mechanical property and radiation resistance, to achieve these goals, the present invention is by the following technical solutions:
A kind of composite plate comprises polyarylether resinoid and reinforcing material.
Further, described polyarylether resinoid comprises polyaryl ether sulphone resin, PAEK resin, PPESK or poly (arylene ether nitrile) resin.
Further, described polyarylether resinoid has how ketone biphenyl structural of the assorted naphthalene biphenyl structural that reduces the wastage or diaza.
Further, described reinforcing material is the fiber-like reinforcing material.
Further, described fiber-like reinforcing material is glass fibre, carbon fiber, aramid fiber, quartz fibre, boron fibre, asbestos fibre, silicon carbide fibre or its braid.
Further, the mass ratio of described polyarylether resinoid and described reinforcing material is 0.5-99.5:99.5-0.5.
Further, the mass ratio of described polyarylether resinoid and described reinforcing material is 20-80:80-20.
Further, also comprise coupling agent.
Further, described coupling agent is silane coupler, silicochromium complex compound coupling agent, titante coupling agent, aluminic acid class coupling agent.
Further, described silane coupler can be expressed as R-SiX
3, wherein, R is-OCH=CHCH3 ,-CH=CHZ ,-NHCH3 ,-SCH3 or-OCH3.
Further, the mass ratio of described polyarylether resinoid, described reinforcing material and described coupling agent is 2-97:95-2.5:3-0.5.
Further, the mass ratio of described polyarylether resinoid, described reinforcing material and described coupling agent is 49-60:50-38:1-2.
A kind of composite base plate comprises above-mentioned composite plate and is overlying on conductive layer on the described composite plate.
Further, described conductive layer is metal level.
Further, described metal level is Copper Foil, aluminium foil, goldleaf or silver foil.
Further, described conductive layer is metal alloy layer.
Further, described metal alloy layer is aluminium alloy layer, copper alloy layer, silver alloy, nickel alloy etc.
Further, described conductive layer is nonmetal conductive layer.
Further, described nonmetal conductive layer is conductive ink layer, conductor polymer, chromic lanthanum ceramics or conductivity ceramics.
Further, described conductor polymer is electrically conductive polyaniline.
A kind of preparation method of composite plate may further comprise the steps:
1) preparation mixed liquor: polyarylether resin and solvent are obtained mixed liquor;
2) reinforcing material preliminary treatment: reinforcing material is immersed in the alcohol solution, takes out drying then;
3) impregnation: will be immersed in the mixed liquor through pretreated reinforcing material, and take out the back and remove solvent, and obtain bonding sheet;
4) compacting: with the bonding sheet moulding, obtain composite plate.
Further, described step 4) also comprises a plurality of bonding sheets is stacked aftershaping, obtains composite plate.
Further, also be included in described step 2) and add coupling agent in the alcohol solution.
Further, described alcohol solution pH value is adjusted to 4-6.
Further, in described step 2) in, described reinforcing material soaked in described alcohol solution 1-40 minute.
Further, in described step 2) in, described drying is carried out under 5-300 ℃.
Further, described dry duration is 1-4 hour.
A kind of preparation method of composite base plate comprises:
1) preparation mixed liquor: polyarylether resin and solvent are obtained mixed liquor;
2) reinforcing material preliminary treatment: reinforcing material is immersed in the alcohol solution, takes out drying then;
3) impregnation: will be immersed in the mixed liquor through pretreated reinforcing material, and take out the back and remove solvent, and obtain bonding sheet;
4) conductive layer preliminary treatment: mixed liquor is coated in the surface of conductive layer, drying;
5) compacting: described bonding sheet and conductive layer are stacked the repressed composite base plate that obtains.
Further, also be included in the described mixed liquor in the described step 4) and add coupling agent.
Further, compacting again after a plurality of described bonding sheets overlay between the two-layer described conductive layer in the described step 5).
Further, hot pressing mode is adopted in described step 5) compacting.
Further, described hot pressing temperature scope is 200-400 ℃.
Further, described hot pressing temperature scope is 280-380 ℃.
Further, described hot pressing time is 5-240min.
Further, described hot pressing time is 20-50min.
Further, described hot pressing adopts the mode that heats up, is incubated, heats up to heat.
Further, described step 2) solvent is one or more mixture of methyl pyrrolidone, dimethylacetylamide, dimethyl formamide, chlorobenzene.
Composite plate of the present invention and composite base plate have excellent hear resistance, mechanical property and radiation resistance, have lower dielectric constant and dielectric loss, can improve the high frequency characteristics of substrate, reduce signal delay, distortion and loss, guarantee the signal high quality transmission.
The specific embodiment
Below by specific embodiment the present invention is done a step explanation.Except specifying all according to the mass fraction.
Embodiment 1
Get 1 part of 49 parts of poly (aryl ether sulfone ketone)s, 50 parts of glass fabrics and propyl trimethoxy silicane, at first 49 parts of poly (aryl ether sulfone ketone)s are dissolved in 60 parts of methyl pyrrolidones and obtain resin adhesive liquid; The preparation alcohol solution, ethanol and water volume ratio are 95:5, and using the vinegar acid for adjusting pH value is 4.5, adds 0.5 part of propyl trimethoxy silicane, and 50 parts of glass fabrics were immersed in the alcohol solution 10 minutes, and taking-up is dried, and descends drying 2 hours at 110 ℃; With the glass fabric handled under the deflector roll effect by the groove of resin adhesive liquid is housed, scrape off unnecessary glue by spreading roller again and enter heater, temperature programming to 230 ℃; 10 ℃ of every intensifications, constant temperature 10min, cutting obtains dry bonding sheet behind the removal solvent; 0.5 part of propyl trimethoxy silicane added in the described resin adhesive liquid obtain blend, blend is coated in copper foil surface after cleaning, place dry; A bonding sheet is overlayed between two-layer Copper Foil, be placed on again in the hot press, hot pressing 15min under 315 ℃ of temperature, pressure 20atm, the bonding sheet melt molding cools off fixed, the demoulding then, namely obtains required copper-clad plate.
Embodiment 2
Get 1.5 parts of 49.5 parts of PAEKs, 49 parts of glass fabrics and propyl trimethoxy silicanes, at first 49.5 parts of PAEKs are dissolved in 58 parts of methyl pyrrolidones and the chlorobenzene mixed liquor and obtain resin adhesive liquid; The preparation alcohol solution, ethanol and water volume ratio are 95:5, and using the vinegar acid for adjusting pH value is 5, adds 0.6 part of propyl trimethoxy silicane, and 49 parts of glass fabrics were immersed in the alcohol solution 15 minutes, and taking-up is dried, and descends drying 3 hours at 130 ℃; With the glass fabric handled under the deflector roll effect by the groove of resin adhesive liquid is housed, scrape off unnecessary glue by spreading roller again and enter heater, temperature programming to 230 ℃; 10 ℃ of every intensifications, constant temperature 10min, cutting obtains dry bonding sheet behind the removal solvent; 0.9 part of propyl trimethoxy silicane added in the described resin adhesive liquid obtain blend, blend is coated in copper foil surface after cleaning, place dry; Three bonding sheets are overlayed between two-layer Copper Foil, be placed on again in the hot press, hot pressing 15min under 330 ℃ of temperature, pressure 20atm, the bonding sheet melt molding cools off fixed, the demoulding then, namely obtains required copper-clad plate.
Embodiment 3
Get 1 part of 60 parts of polyether sulphones, 39 parts of glass fabrics and propyl trimethoxy silicane, at first 60 parts of polyether sulphones are dissolved in 70 parts of dimethylacetylamides and obtain resin adhesive liquid; The preparation alcohol solution, ethanol and water volume ratio are 95:5, and using the vinegar acid for adjusting pH value is 5.5, adds 0.6 part of propyl trimethoxy silicane, and 39 parts of glass fabrics were immersed in the alcohol solution 13 minutes, and taking-up is dried, and descends drying 2.5 hours at 120 ℃; With the glass fabric handled under the deflector roll effect by the groove of resin adhesive liquid is housed, scrape off unnecessary glue by spreading roller again and enter heater, temperature programming to 230 ℃; 10 ℃ of every intensifications, constant temperature 10min, cutting obtains dry bonding sheet behind the removal solvent; 0.4 part of propyl trimethoxy silicane added in the described resin adhesive liquid obtain blend, blend is coated in copper foil surface after cleaning, place dry; Four bonding sheets are overlayed between two-layer Copper Foil, be placed on again in the hot press, hot pressing 30min under 320 ℃ of temperature, pressure 25atm, the bonding sheet melt molding cools off fixed, the demoulding then, namely obtains required copper-clad plate.
Embodiment 4
Get 0.75 part of 54.25 parts in polyarylether eyeball, 45 parts of glass fabrics and propyl trimethoxy silicane, at first 54.25 parts of polyarylether eyeballs are dissolved in 70 parts of methyl pyrrolidones, dimethylacetylamide, dimethyl formamide and the chlorobenzene mixed liquor and obtain resin adhesive liquid; The preparation alcohol solution, ethanol and water volume ratio are 95:5, and using the vinegar acid for adjusting pH value is 5.2, adds 0.3 part of propyl trimethoxy silicane, and 45 parts of glass fabrics were immersed in the alcohol solution 12 minutes, and taking-up is dried, and descends drying 2.2 hours at 125 ℃; With the glass fabric handled under the deflector roll effect by the groove of resin adhesive liquid is housed, scrape off unnecessary glue by spreading roller again and enter heater, temperature programming to 230 ℃; 10 ℃ of every intensifications, constant temperature 10min, cutting obtains dry bonding sheet behind the removal solvent; 0.45 part of propyl trimethoxy silicane added in the described resin adhesive liquid obtain blend, blend is coated in copper foil surface after cleaning, place dry; Four bonding sheets are overlayed between two-layer Copper Foil, be placed on again in the hot press, hot pressing 40min under 325 ℃ of temperature, pressure 28atm, the bonding sheet melt molding cools off fixed, the demoulding then, namely obtains required copper-clad plate.
Embodiment 5
Get 1.5 parts of 55.5 parts in polyarylether eyeball, 43 parts of glass fabrics and propyl trimethoxy silicanes, at first 55.5 parts of polyarylether eyeballs are dissolved in 50 parts of chlorobenzenes and obtain resin adhesive liquid; The preparation alcohol solution, ethanol and water volume ratio are 95:5, and using the vinegar acid for adjusting pH value is 4.8, adds 0.7 part of propyl trimethoxy silicane, and 50 parts of glass fabrics were immersed in the alcohol solution 14 minutes, and taking-up is dried, and descends drying 2.8 hours at 115 ℃; With the glass fabric handled under the deflector roll effect by the groove of resin adhesive liquid is housed, scrape off unnecessary glue by spreading roller again and enter heater, temperature programming to 230 ℃; 10 ℃ of every intensifications, constant temperature 10min, cutting obtains dry bonding sheet behind the removal solvent; 0.8 part of propyl trimethoxy silicane added in the described resin adhesive liquid obtain blend, blend is coated in copper foil surface after cleaning, place dry; Four bonding sheets are overlayed between two-layer Copper Foil, be placed on again in the hot press, hot pressing 50min under 325 ℃ of temperature, pressure 23atm, the bonding sheet melt molding cools off fixed, the demoulding then, namely obtains required copper-clad plate.
The above-mentioned specific embodiment only is schematically, rather than has restrictively, and those of ordinary skill in the art is under enlightenment of the present invention, and any improvement technical scheme not breaking away under the aim of the present invention all is within protection scope of the present invention.
Claims (36)
1. a composite plate is characterized in that, comprises polyarylether resinoid and reinforcing material.
2. composite plate according to claim 1 is characterized in that, described polyarylether resinoid comprises polyaryl ether sulphone resin, PAEK resin, PPESK and poly (arylene ether nitrile) resin.
3. composite plate according to claim 2 is characterized in that, described polyarylether resinoid has how ketone biphenyl structural of the assorted naphthalene biphenyl structural that reduces the wastage or diaza.
4. composite plate according to claim 1 is characterized in that, described reinforcing material is the fiber-like reinforcing material.
5. composite plate according to claim 4 is characterized in that, described fiber-like reinforcing material is glass fibre, carbon fiber, aramid fiber, quartz fibre, boron fibre, asbestos fibre, silicon carbide fibre or its braid.
6. composite plate according to claim 1 is characterized in that, the mass ratio of described polyarylether resinoid and described reinforcing material is 0.5-99.5:99.5-0.5.
7. composite plate according to claim 1 is characterized in that, the mass ratio of described polyarylether resinoid and described reinforcing material is 20-80:80-20.
8. according to each described composite plate of claim 1-7, it is characterized in that, also comprise coupling agent.
9. composite plate according to claim 8 is characterized in that, described coupling agent is silane coupler, silicochromium complex compound coupling agent, titante coupling agent, aluminic acid class coupling agent.
10. composite plate according to claim 9 is characterized in that, described silane coupler can be expressed as R-SiX
3, wherein, R is-OCH=CHCH3 ,-CH=CHZ ,-NHCH3 ,-SCH3 or-OCH3.
11. composite plate according to claim 8 is characterized in that, the mass ratio of described polyarylether resinoid, described reinforcing material and described coupling agent is 2-97:95-2.5:3-0.5.
12. composite plate according to claim 8 is characterized in that, the mass ratio of described polyarylether resinoid, described reinforcing material and described coupling agent is 49-60:50-38:1-2.
13. a composite base plate is characterized in that, comprises each described composite plate of claim 1-11 and is overlying on conductive layer on the described composite plate.
14. composite base plate according to claim 13 is characterized in that, described conductive layer is metal level.
15. composite base plate according to claim 14 is characterized in that, described metal level is Copper Foil, aluminium foil, goldleaf or silver foil.
16. composite base plate according to claim 13 is characterized in that, described conductive layer is metal alloy layer.
17. composite base plate according to claim 16 is characterized in that, described metal alloy layer is aluminium alloy layer, copper alloy layer, silver alloy or nickel alloy.
18. composite base plate according to claim 13 is characterized in that, described conductive layer is nonmetal conductive layer.
19. composite base plate according to claim 18 is characterized in that, described nonmetal conductive layer is conductive ink layer, conductor polymer, chromic lanthanum ceramics or conductivity ceramics.
20. the preparation method of a composite plate is characterized in that, may further comprise the steps:
1) preparation mixed liquor: polyarylether resin and solvent are obtained mixed liquor;
2) reinforcing material preliminary treatment: reinforcing material is immersed in the alcohol solution, takes out drying then;
3) impregnation: will be immersed in the mixed liquor through pretreated reinforcing material, and take out the back and remove solvent, and obtain bonding sheet;
4) compacting: with the bonding sheet moulding, obtain composite plate.
21. preparation method according to claim 20 is characterized in that, described step 4) also comprises a plurality of bonding sheets is stacked aftershaping, obtains composite plate.
22. preparation method according to claim 21 is characterized in that, described step 2) in also be included in and add coupling agent in the alcohol solution.
23., it is characterized in that described alcohol solution pH value is adjusted to 4-6 according to the described preparation method of claim 20-22.
24. according to each described preparation method of claim 20-22, it is characterized in that, in described step 2) in, described reinforcing material soaked in described alcohol solution 1-40 minute.
25. according to each described preparation method of claim 20-22, it is characterized in that, in described step 2) in, described drying is carried out under 5-300 ℃.
26. preparation method according to claim 25 is characterized in that, described dry duration is 1-4 hour.
27. the preparation method of a composite base plate is characterized in that, comprising:
1) preparation mixed liquor: polyarylether resin and solvent are obtained mixed liquor;
2) reinforcing material preliminary treatment: reinforcing material is immersed in the alcohol solution, takes out drying then;
3) impregnation: will be immersed in the mixed liquor through pretreated reinforcing material, and take out the back and remove solvent, and obtain bonding sheet;
4) conductive layer preliminary treatment: mixed liquor is coated in the surface of conductive layer, drying;
5) compacting: described bonding sheet and conductive layer are stacked the repressed composite base plate that obtains.
28. preparation method according to claim 27 is characterized in that, also is included in the described mixed liquor in the described step 4) to add coupling agent.
29. preparation method according to claim 28 is characterized in that, compacting again after a plurality of described bonding sheets overlay between the two-layer described conductive layer in the described step 5).
30., it is characterized in that hot pressing mode is adopted in described step 5) compacting according to each described preparation method of claim 27-29.
31. preparation method according to claim 30 is characterized in that, described hot pressing temperature scope is 200-400 ℃.
32. preparation method according to claim 30 is characterized in that, described hot pressing temperature scope is 280-380 ℃.
33. preparation method according to claim 30 is characterized in that, described hot pressing time is 5-240min.
34. preparation method according to claim 30 is characterized in that, described hot pressing time is 20-50min.
35. preparation method according to claim 30 is characterized in that, the mode that described hot pressing is adopted and heated up, is incubated, heats up heats.
36. preparation method according to claim 27 is characterized in that, described step 2) solvent is one or more mixture of methyl pyrrolidone, dimethylacetylamide, dimethyl formamide, chlorobenzene.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104031376A (en) * | 2014-06-17 | 2014-09-10 | 大连理工大学 | Continuous carbon fiber reinforced phthalazinone structure containing polyarylether nitrile resin-based composite material and preparation method thereof |
| CN105437657A (en) * | 2015-12-08 | 2016-03-30 | 太仓斯普宁精密机械有限公司 | Thermoplastic metal material |
| CN106032326A (en) * | 2015-03-20 | 2016-10-19 | 深圳光启高等理工研究院 | Multilayer composite ceramic plate and preparation method thereof |
| CN107791617A (en) * | 2017-10-27 | 2018-03-13 | 苏州欣天新精密机械有限公司 | A kind of low-dielectric loss copper-clad plate and its preparation technology |
| CN110828425A (en) * | 2019-10-17 | 2020-02-21 | 合肥圣达电子科技实业有限公司 | Anti-irradiation packaging structure and manufacturing method thereof |
| CN111457211A (en) * | 2020-05-06 | 2020-07-28 | 丹阳丹金航空材料科技有限公司 | High-strength and high-conductivity carbon fiber composite board support and process method thereof |
| CN114179400A (en) * | 2021-12-15 | 2022-03-15 | 苏州市华研富士新材料有限公司 | Production device and process of high-strength high-temperature-resistant glass fiber composite board |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104031376A (en) * | 2014-06-17 | 2014-09-10 | 大连理工大学 | Continuous carbon fiber reinforced phthalazinone structure containing polyarylether nitrile resin-based composite material and preparation method thereof |
| CN106032326A (en) * | 2015-03-20 | 2016-10-19 | 深圳光启高等理工研究院 | Multilayer composite ceramic plate and preparation method thereof |
| CN105437657A (en) * | 2015-12-08 | 2016-03-30 | 太仓斯普宁精密机械有限公司 | Thermoplastic metal material |
| CN107791617A (en) * | 2017-10-27 | 2018-03-13 | 苏州欣天新精密机械有限公司 | A kind of low-dielectric loss copper-clad plate and its preparation technology |
| CN110828425A (en) * | 2019-10-17 | 2020-02-21 | 合肥圣达电子科技实业有限公司 | Anti-irradiation packaging structure and manufacturing method thereof |
| CN111457211A (en) * | 2020-05-06 | 2020-07-28 | 丹阳丹金航空材料科技有限公司 | High-strength and high-conductivity carbon fiber composite board support and process method thereof |
| CN111457211B (en) * | 2020-05-06 | 2021-06-29 | 丹阳丹金航空材料科技有限公司 | High-strength and high-conductivity carbon fiber composite board support and process method thereof |
| CN114179400A (en) * | 2021-12-15 | 2022-03-15 | 苏州市华研富士新材料有限公司 | Production device and process of high-strength high-temperature-resistant glass fiber composite board |
| CN114179400B (en) * | 2021-12-15 | 2024-03-29 | 苏州市华研富士新材料有限公司 | High-strength high-temperature-resistant glass fiber composite board production device and technology |
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Application publication date: 20130911 |