CN107791617A - A kind of low-dielectric loss copper-clad plate and its preparation technology - Google Patents

A kind of low-dielectric loss copper-clad plate and its preparation technology Download PDF

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Publication number
CN107791617A
CN107791617A CN201711030456.2A CN201711030456A CN107791617A CN 107791617 A CN107791617 A CN 107791617A CN 201711030456 A CN201711030456 A CN 201711030456A CN 107791617 A CN107791617 A CN 107791617A
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copper
clad plate
dielectric loss
low
prepreg tape
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CN107791617B (en
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王勇
蒋子康
井新利
薛枫
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Suzhou Xintianxin High Precision Mechanical Co Ltd
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Suzhou Xintianxin High Precision Mechanical Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
    • C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D123/04—Homopolymers or copolymers of ethene
    • C09D123/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
    • C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D123/04—Homopolymers or copolymers of ethene
    • C09D123/08—Copolymers of ethene
    • C09D123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
    • C09D125/02—Homopolymers or copolymers of hydrocarbons
    • C09D125/04—Homopolymers or copolymers of styrene
    • C09D125/06—Polystyrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09D171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09D171/12—Polyphenylene oxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Abstract

Present invention is disclosed a kind of low-dielectric loss copper-clad plate and its preparation technology, matrix material is used as using a kind of improved polyalkene with low-dielectric loss, using the quartz fiber cloth with superior dielectric performance, heat resistance and dimensional stability as reinforcing material, the copper-clad plate of extremely low dielectric loss is prepared by die press technology for forming.The present invention possesses the characteristic of extremely low dielectric loss, and is also equipped with good mechanical property and adhesive strength, excellent processing characteristics and low water absorption rate by the prepreg tape obtained by quartz fiber cloth and modified polyolefin solution, the copper-clad plate with being formed after copper foil pressing.Copper-clad plate preparation technology is succinct, and convenient operation, cost of manufacture is cheap, the substrate for printed circuit board for the high frequency electronic equipment that is particularly suitable for use in.

Description

A kind of low-dielectric loss copper-clad plate and its preparation technology
Technical field
The present invention relates to a kind of copper-clad plate, more particularly to a kind of low-dielectric loss copper-clad plate and its preparation technology, belongs to electricity The technical field of sub- new material.
Background technology
In recent years, modern communicationses product constantly develops towards high integration direction, and this performance to microwave dielectric material carries Higher requirement is gone out., it is necessary to possess that small volume, signaling rate be fast, signal quality for current electronic product Well, the features such as reliability is high and inexpensive, these all cause the printed circuit board (PCB) of communication products（PCB）Complexity constantly carries Height, and then cause the copper-clad plate for preparing circuit to possess higher standard, i.e., same with excellent manufacturability and mechanical property When, it is necessary to there is lower dielectric coefficient, low-dielectric loss and excellent heat resistance.
Polymer matrix composites are compared with inorganic material, and polymer matrix composites heat resistance is poor, dielectric loss is higher, but Its moulding process is simple, in light weight, intensity is high, advantage of lower cost.Currently used PCB substrate plate is mainly polytetrafluoroethylene (PTFE) （PTFE）, epoxy resin and phenolic resin, the dielectric properties and processing characteristics of these resins are poor, it is impossible to meet PCB application Demand.Polyolefin is a kind of material with low-dielectric loss, but it is impossible to meet need due to its mechanical property and heat resistance Ask and be not used as PCB substrate, thus select main chain with cyclic structure and not the polyolefin of polar functionalities as matrix material Material, can both meet low-dielectric loss, can ensure enough mechanical property and heat resistance again.In addition, currently used increasing Strong material is all glass fibre, and the dielectric loss of this kind of composite is higher（Tan δ values are about 0.02）, high frequency can not be met Lower PCB use demand, therefore it is to compel to be essential to develop the polymer matrix composites with low-k and extremely low dielectric loss Want.We use the lower quartz fibre of dielectric loss as reinforcing material, in conjunction with the polyolefin with low-dielectric loss The composite of low-k and extremely low dielectric loss is prepared, while also assures that it possesses good mechanical property, resistance to Hot property and processing characteristics.
Chinese patent ZL201510148269.9, using Ni0.5Ti0.5NbO4 ceramic powders and bisphenol A cyanate ester tree Fat has prepared the composite under a kind of high frequency with low-dielectric loss.Composite tan δ values under 9060MHz frequencies Minimum to can reach 4.76 × 10-3, dielectric coefficient is adjustable between 4.48 ~ 13.28.Although the composite possesses in high frequency Low-dielectric loss, but its dielectric coefficient is higher, and preparation process is relatively complicated.
Chinese patent ZL201110243285.8, it is still compound with superperformance up to more than 1GHz to disclose a kind of frequency Material, have dielectric coefficient concurrently<3.2, tan δ<0.005, high glass-transition temperature, high heat stability and low moisture-absorption characteristics.This is compound Material by HMW polybutadiene, low molecular weight polybutadiene resin, by modified polyphenylene oxide thermosetting resin, nothing Allotment forms jointly for machine powder, fire retardant, crosslinking agent, adhesive agent and cure initiator.Although the dielectric of this composite Better performances, but a large amount of auxiliary agents are added in production process, the dielectric properties of composite will certainly be influenceed.
Chinese patent ZL200910106628.9 have developed a kind of low-dielectric loss composite, and it comprises thermosetting to mix Compound, account for 20 ~ 70 parts of total component；A kind of molecular weight contains more than 60 vinyl for less than 11000 by what carbon hydrogen element formed Resin；A kind of solid allyl resin of low molecule amount；The glass fabric of coupling agent treatment；Powder filler, fire retardant and solid Change initiator.The composite is under 10GHz frequencies, and tan δ values are 0.0026, dielectric coefficient 3.15, although dielectric properties are good It is good, but equally exist the deficiencies of addition auxiliary agent is excessive and preparation process is relatively complicated.
In a word, although the dielectric properties for studying the high frequency low-dielectric loss composite of preparation at present are low compared with traditional Dielectric loss material is greatly improved, and tan δ values can reach (2 ~ 4) × 10-3 substantially.But face high speed development Microelectronic product, such dielectric properties are still slightly inadequate, while these composites are also present that processing technology is poor, mechanics Performance and heat resistance deficiency, the preparation method complexity and drawback such as cycle length.
The content of the invention
The present invention is higher and can not be in order to solve the existing polymer matrix composites dielectric loss of above-mentioned prior art simultaneously The problem of taking into account dielectric properties, mechanical property and heat resistance, there is provided a kind of low-dielectric loss copper-clad plate and its preparation technology.
First purpose of the present invention is：A kind of low-dielectric loss copper-clad plate is provided, coats and changes in quartz fiber cloth Property polyolefin solution, bake into prepreg tape, the prepreg tape forms copper-clad plate with copper foil after pressing.
Preferably, the thickness of the quartz fiber cloth is 0.05mm ~ 0.5mm, and the thickness of the copper foil is 5 μm ~ 150 μm.
Preferably, the volume accounting of improved polyalkene is 1% ~ 80% in the modified polyolefin solution, and remaining is solvent, institute Solvent is stated as one kind or its mixture in ether, carbon tetrachloride, propyl ether, chlorobenzene, dimethylbenzene, toluene or hexamethylene.
Preferably, it is 5% ~ 95% to change containing cyclic structure that the improved polyalkene, which includes aliphatic poly alkene and weight accounting, Property agent, wherein aliphatic olefin and modifying agent containing cyclic structure are combined as a whole by the method for being blended or being copolymerized.
Preferably, the hydrocarbon ring of the cyclic structure of the cyclic molecules including cycloolefin, cyclodiene hydrocarbon ring, Hydrocarbon ring, sulfur heterocyclic ring, nitrogen heterocyclic ring, the oxygen heterocycle of aromatic ring class.
Preferably, including individual layer copper-clad plate and multilayer copper-clad plate, more than one layer of prepreg tape stack to form insulating barrier,
The individual layer copper-clad plate includes insulating barrier, and insulating barrier side sets the copper foil,
The multilayer copper-clad plate includes at least two layers of copper foil, and insulating barrier is provided between adjacent copper foil.
Second object of the present invention is：A kind of preparation technology of low-dielectric loss copper-clad plate, including following step are provided Suddenly：
S1, quartz fiber cloth cleaning, quartz fiber cloth is positioned in detergent and soaked, and is taken out simultaneously after removing surface impurity Drying；
S2, modified polyolefin solution configuration step, improved polyalkene and solvent are configured to modified polyolefin solution, modified polyolefin The volume accounting of hydrocarbon is 1% ~ 80%, and solvent is one in ether, carbon tetrachloride, propyl ether, chlorobenzene, dimethylbenzene, toluene or hexamethylene Kind or its mixture；
S3, prepreg tape making step, modified polyolefin solution are evenly applied to the surface of quartz fiber cloth, and normal temperature hangs 2 ~ 48h, it is prepreg tape then to be baked at 40 DEG C ~ 200 DEG C, and the gel content of prepreg tape is 15% ~ 85%,
S4, laying step, copper-clad plate include individual layer copper-clad plate and multilayer copper-clad plate, and more than one layer of prepreg tape stacks to form insulation Layer, individual layer copper-clad plate include insulating barrier, and insulating barrier side sets the copper foil, and multilayer copper-clad plate includes at least two layers of copper foil, phase Insulating barrier is provided between adjacent copper foil,
According to the demand of copper-clad plate, determine the number of plies of prepreg tape and the number of plies of copper foil and sequentially stack to form plate embryo,
S5, pressing step, carry out pressing to plate embryo using die press technology for forming and form copper-clad plate,
S6, cutting step, copper-clad plate is cut according to size requirements, finished product.
Preferably, in step S1, the detergent is acetone, toluene, dimethylbenzene, ethyl acetate, tetrahydrofuran or N, N- Dimethylformamide（DMF）In one kind or its mixture, soak time be 1 ~ 24h, drying temperature is 80 DEG C ~ 240 DEG C.
Preferably, in step S5, die press technology for forming selection molding temperature is 80 DEG C ~ 300 DEG C, molding pressure 1.5 ~ 15MPa, contact pressure time are 1 ~ 60min, the dwell time is 1 ~ 180min, and room temperature is cooled to the furnace after pressing.
The beneficial effects are mainly as follows：
1. pass through the prepreg tape obtained by quartz fiber cloth and modified polyolefin solution, the copper-clad plate base with being formed after copper foil pressing Material possesses the characteristic of extremely low dielectric loss, and is also equipped with good mechanical property, excellent processing characteristics and low water suction Rate.
2. the copper-clad plate synthesis being prepared is excellent, the adhesive strength between base material and copper foil is high, and be particularly suitable for use in high frequency The substrate for printed circuit board of electronic equipment,
3. copper-clad plate preparation technology is succinct, convenient operation, cost of manufacture is cheap.
Brief description of the drawings
Fig. 1 is a kind of flow chart of the preparation technology of low-dielectric loss copper-clad plate of the present invention.
Embodiment
The present invention provides a kind of low-dielectric loss copper-clad plate and its preparation technology.Below in conjunction with accompanying drawing to the technology of the present invention side Case is described in detail, so that it is more readily understood and grasped.
A kind of low-dielectric loss copper-clad plate, coats modified polyolefin solution in quartz fiber cloth, bakes into prepreg tape, in advance Leaching band forms copper-clad plate with copper foil after pressing.Using the improved polyalkene with low-dielectric loss as matrix material, quartz Reinforcement of the fiber cloth as composite, it has extremely low dielectric loss（Tan δ values can reach 2 × 10 under 1GHz-4）, with Conventional glass fabric, which is compared, to improve mechanical property on the premise of composite low-dielectric loss is ensured and size is steady Qualitative energy.
During selection, the thickness of quartz fiber cloth is 0.05mm ~ 0.5mm, and the thickness of copper foil is 5 μm ~ 150 μm.
Modified polyolefin solution is specifically described, wherein the volume accounting of improved polyalkene is 1% ~ 80%, and remaining is Solvent, solvent are one kind or its mixture in ether, carbon tetrachloride, propyl ether, chlorobenzene, dimethylbenzene, toluene or hexamethylene.It is modified The concentration and viscosity of polyolefin solution will directly affect the gel content of its penetrating power and prepreg tape to quartz fiber cloth.
It should be noted that it is 5% ~ 95% to contain cyclic structure that improved polyalkene, which includes aliphatic poly alkene and weight accounting, Modifying agent, wherein aliphatic olefin and modifying agent containing cyclic structure are combined as a whole by the method for being blended or being copolymerized.
The cyclic structure of cyclic molecules includes the hydrocarbon ring of cycloolefin, the hydrocarbon ring of cyclodiene, the carbon of aromatic ring class Hydrogen ring, sulfur heterocyclic ring, nitrogen heterocyclic ring, oxygen heterocycle.
The low-dielectric loss copper-clad plate of this case includes individual layer copper-clad plate and multilayer copper-clad plate, and more than one layer of prepreg tape stacks Insulating barrier is formed, individual layer copper-clad plate includes insulating barrier, and insulating barrier side sets the copper foil, and multilayer copper-clad plate includes at least two layers Copper foil, insulating barrier is provided between adjacent copper foil.
A kind of specific steps of the preparation technology of low-dielectric loss copper-clad plate of this case are illustrated with reference to accompanying drawing 1：
Quartz fiber cloth cleaning, quartz fiber cloth is positioned in detergent and soaked, and is taken out and is dried after removing surface impurity It is dry, the impurity on its surface is removed, ensures that it can have been formed viscous under the premise of possessing excellent mechanical performances with improved polyalkene Connect；
Modified polyolefin solution configuration step, improved polyalkene and solvent are configured to modified polyolefin solution, improved polyalkene Volume accounting be 1% ~ 80%, solvent be ether, carbon tetrachloride, propyl ether, chlorobenzene, dimethylbenzene, toluene or hexamethylene in one kind Or its mixture；
Prepreg tape making step, modified polyolefin solution being evenly applied to the surface of quartz fiber cloth, normal temperature hangs 2 ~ 48h, Then it is prepreg tape to be baked at 40 DEG C ~ 200 DEG C, and the gel content of prepreg tape is 15% ~ 85%,
Laying step, copper-clad plate include individual layer copper-clad plate and multilayer copper-clad plate, and more than one layer of prepreg tape stacks to form insulating barrier, Individual layer copper-clad plate includes insulating barrier, and insulating barrier side sets the copper foil, and multilayer copper-clad plate includes at least two layers of copper foil, adjacent copper Insulating barrier is provided between paper tinsel,
According to the demand of copper-clad plate, determine the number of plies of prepreg tape and the number of plies of copper foil and sequentially stack to form plate embryo,
Step is pressed, pressing is carried out to plate embryo using die press technology for forming and forms copper-clad plate,
Cutting step, copper-clad plate is cut according to size requirements, finished product.
Refinement description is carried out to quartz fiber cloth cleaning, wherein detergent is acetone, toluene, dimethylbenzene, acetic acid second Ester, tetrahydrofuran or N,N-dimethylformamide（DMF）In one kind or its mixture, soak time be 1 ~ 24h, drying temperature For 80 DEG C ~ 240 DEG C.
Refinement description is carried out to pressing step, die press technology for forming selection molding temperature is 80 DEG C ~ 300 DEG C, molding pressure 1.5 ~ 15MPa, contact pressure time are 1 ~ 60min, the dwell time is 1 ~ 180min, and room temperature is cooled to the furnace after pressing.
Embodiment 1
The quartz fiber cloth that 1kg thickness is 0.13 mm is soaked in 5kg acetone solvents, takes out and dries after immersion 4h, Ran Houyu Dried at 80 DEG C；
Will 1 part of polystyrene resin and 1 part of polyphenylene oxide resin mix after be dissolved in toluene, forms volume fraction and changes for 40% Property polyolefin solution.
Above-mentioned modified polyolefin solution is evenly applied to the outer surface of quartz fiber cloth, the h of room temperature 12, then Bake and done as prepreg tape at 100 DEG C, the gel content of prepreg tape is 40%.
The three-point bending resistance intensity of the prepreg tape reaches 157.65MPa, and three-point bending resistance modulus can reach 8.84GPa.
Prepreg tape is stacked into stratification, the number of plies is 5 layers, and places the copper foil that thickness is 35 μm in upper and lower surface, forms slab.
By slab compression molding, forming temperature is 140 DEG C, briquetting pressure 2MPa, and the contact pressure time is 5min, during pressurize Between be 15 min.
Copper-clad plate after pressing is cooled to room temperature with mould, and thickness is obtained after taking-up as double face copper thick 1.0mm, root Product is cut into according to the size of product.
Embodiment 2
The quartz fiber cloth that thickness is 0.10 mm is soaked in ethyl acetate solvent, takes out and dries after immersion 12h, Ran Houyu Dried at 60 DEG C；
Cyclic polyolefin resin (COC) is dissolved in chlorobenzene, forms the modified polyolefin solution that mass fraction is 40%.Wherein COC is the copolymer of ethene and ENB, and the content of ethene is 60% wherein in copolymer.
Above-mentioned modified polyolefin solution is evenly applied to the outer surface of quartz fiber cloth, room temperature 24h, Ran Hou Bake and done as prepreg tape at 120 DEG C, the gel content of prepreg tape is 35%.
Prepreg tape is stacked into stratification, the number of plies is 4 layers, and places the copper foil that thickness is 35 μm in upper and lower surface, forms slab.
By slab compression molding, forming temperature is 180 DEG C, briquetting pressure 2.5MPa, and the contact pressure time is 10min, is protected The pressure time is 30 min.
Copper-clad plate after pressing is cooled to room temperature with mould, and thickness is obtained after taking-up as double face copper thick 0.8 mm, Product is cut into according to the size of product.
Embodiment 3
The quartz fiber cloth that 1kg thickness is 0.15 mm is soaked in 2kg DMF solvents, takes out and dries after 6 h of immersion, then Dried at 150 DEG C；
It is molten after 3 parts of polyvinyl resins, 1 part of dicyclopentadiene phenol type epoxy resin and 0.3 part of MDA are mixed Solution forms the modified polyolefin solution that mass fraction is 35% in hexamethylene.
Above-mentioned modified polyolefin solution is evenly applied to the outer surface of quartz fiber cloth, the h of room temperature 12, then Bake and done as prepreg tape at 90 DEG C, the gel content of prepreg tape is 35%.
Prepreg tape is stacked into stratification, the number of plies is 5 layers, and the copper foil that thickness is 35 μm is placed in upper surface, forms slab.
By slab compression molding, forming temperature is 130 DEG C, and briquetting pressure is 1.5 MPa, and the contact pressure time is 20min, is protected The pressure time is 60 min.
Copper-clad plate after pressing is cooled to room temperature with mould, and thickness is obtained after taking-up as single-side coated copper plate thick 1.2mm, root Product is cut into according to the size of product.
By above description it can be found that a kind of low-dielectric loss copper-clad plate of the present invention and its preparation technology.The present invention is logical Cross copper-clad plate of the quartz fiber cloth with the prepreg tape obtained by modified polyolefin solution, with being formed after copper foil pressing and possess extremely low Jie The characteristic of electrical loss, and it is also equipped with good mechanical property, excellent processing characteristics and low water absorption rate.It is prepared by copper-clad plate Concise in technology, convenient operation, cost of manufacture is cheap, and is applicable to the substrate for printed circuit board of high frequency electronic equipment.
Above technical scheme fully describe, it is necessary to explanation is, specific embodiment party of the invention Formula is simultaneously not limited by the description set out above, one of ordinary skill in the art according to the present invention Spirit Essence structure, method or All technical schemes that function etc. is formed using equivalents or equivalent transformation, all fall within protection scope of the present invention Within.

Claims (9)

  1. A kind of 1. low-dielectric loss copper-clad plate, it is characterised in that：Modified polyolefin solution is coated in quartz fiber cloth, is baked into Prepreg tape, the prepreg tape form copper-clad plate with copper foil after pressing.
  2. A kind of 2. low-dielectric loss copper-clad plate according to claim 1, it is characterised in that：The thickness of the quartz fiber cloth is 0.05mm ~ 0.5mm, the thickness of the copper foil is 5 μm ~ 150 μm.
  3. A kind of 3. low-dielectric loss copper-clad plate according to claim 1, it is characterised in that：Change in the modified polyolefin solution Property polyolefin volume accounting be 1% ~ 80%, remaining is solvent, the solvent be ether, carbon tetrachloride, propyl ether, chlorobenzene, diformazan One kind or its mixture in benzene, toluene or hexamethylene.
  4. A kind of 4. low-dielectric loss copper-clad plate according to claim 3, it is characterised in that：The improved polyalkene includes fat Adoption alkene and the modifying agent containing cyclic structure that weight accounting is 5% ~ 95%, wherein aliphatic olefin and modifying agent containing cyclic structure It is combined as a whole by the method for being blended or being copolymerized.
  5. A kind of 5. low-dielectric loss copper-clad plate according to claim 4, it is characterised in that：The ring-type of the cyclic molecules Structure includes the hydrocarbon ring of cycloolefin, the hydrocarbon ring of cyclodiene, the hydrocarbon ring of aromatic ring class, sulfur heterocyclic ring, nitrogen heterocyclic ring, oxygen-containing Heterocycle.
  6. A kind of 6. low-dielectric loss copper-clad plate according to claim 1, it is characterised in that：Covered including individual layer copper-clad plate and multilayer Copper coin, more than one layer of prepreg tape stack to form insulating barrier,
    The individual layer copper-clad plate includes insulating barrier, and insulating barrier side sets the copper foil,
    The multilayer copper-clad plate includes at least two layers of copper foil, and insulating barrier is provided between adjacent copper foil.
  7. 7. one kind is based on the preparation technology of low-dielectric loss copper-clad plate described in claim 1 ~ 6 any one, it is characterised in that bag Include following steps：
    S1, quartz fiber cloth cleaning, quartz fiber cloth is positioned in detergent and soaked, and is taken out simultaneously after removing surface impurity Drying；
    S2, modified polyolefin solution configuration step, improved polyalkene and solvent are configured to modified polyolefin solution, modified polyolefin The volume accounting of hydrocarbon is 1% ~ 80%, and solvent is one in ether, carbon tetrachloride, propyl ether, chlorobenzene, dimethylbenzene, toluene or hexamethylene Kind or its mixture；
    S3, prepreg tape making step, modified polyolefin solution are evenly applied to the surface of quartz fiber cloth, and normal temperature hangs 2 ~ 48h, it is prepreg tape then to be baked at 40 DEG C ~ 200 DEG C, and the gel content of prepreg tape is 15% ~ 85%,
    S4, laying step, copper-clad plate include individual layer copper-clad plate and multilayer copper-clad plate, and more than one layer of prepreg tape stacks to form insulation Layer, individual layer copper-clad plate include insulating barrier, and insulating barrier side sets the copper foil, and multilayer copper-clad plate includes at least two layers of copper foil, phase Insulating barrier is provided between adjacent copper foil,
    According to the demand of copper-clad plate, determine the number of plies of prepreg tape and the number of plies of copper foil and sequentially stack to form plate embryo,
    S5, pressing step, carry out pressing to plate embryo using die press technology for forming and form copper-clad plate,
    S6, cutting step, copper-clad plate is cut according to size requirements, finished product.
  8. A kind of 8. preparation technology of low-dielectric loss copper-clad plate according to claim 7, it is characterised in that：
    In step S1, the detergent is acetone, toluene, dimethylbenzene, ethyl acetate, tetrahydrofuran or DMF （DMF）In one kind or its mixture, soak time be 1 ~ 24h, drying temperature is 80 DEG C ~ 240 DEG C.
  9. A kind of 9. preparation technology of low-dielectric loss copper-clad plate according to claim 7, it is characterised in that：
    In step S5, die press technology for forming selection molding temperature is 80 DEG C ~ 300 DEG C, 1.5 ~ 15MPa of molding pressure, contact The pressure time is 1 ~ 60min, the dwell time is 1 ~ 180min, and room temperature is cooled to the furnace after pressing.
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CN112063025A (en) * 2020-09-28 2020-12-11 常州中英科技股份有限公司 Thermosetting hydrocarbon polymer-based prepreg and copper-clad plate prepared from same
CN112549688A (en) * 2019-09-25 2021-03-26 深圳大学 Flexible copper-clad plate and preparation method and application thereof
CN114437435A (en) * 2022-02-24 2022-05-06 无锡睿龙新材料科技有限公司 High-thermal-conductivity hydrocarbon resin-based prepreg and high-frequency copper-clad plate prepared from same
CN115216087A (en) * 2022-07-14 2022-10-21 中广核俊尔(浙江)新材料有限公司 Preparation, forming method and application of novel low-thermal expansion coefficient and low-dielectric composite material
CN115771308A (en) * 2022-09-23 2023-03-10 江苏耀鸿电子有限公司 Flexible aging-resistant hydrocarbon resin-based copper-clad plate and preparation method thereof

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CN101081921A (en) * 2006-05-30 2007-12-05 日本油脂公司 Resin composition for printed wiring board film and use thereof
CN103287042A (en) * 2012-03-01 2013-09-11 深圳光启创新技术有限公司 Composite board, composite substrate and preparation method thereof
CN205584624U (en) * 2016-03-11 2016-09-14 上海万寅安全环保科技有限公司 Flexible panel's circuit board

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CN103287042A (en) * 2012-03-01 2013-09-11 深圳光启创新技术有限公司 Composite board, composite substrate and preparation method thereof
CN205584624U (en) * 2016-03-11 2016-09-14 上海万寅安全环保科技有限公司 Flexible panel's circuit board

Cited By (6)

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Publication number Priority date Publication date Assignee Title
CN112549688A (en) * 2019-09-25 2021-03-26 深圳大学 Flexible copper-clad plate and preparation method and application thereof
CN112063025A (en) * 2020-09-28 2020-12-11 常州中英科技股份有限公司 Thermosetting hydrocarbon polymer-based prepreg and copper-clad plate prepared from same
CN114437435A (en) * 2022-02-24 2022-05-06 无锡睿龙新材料科技有限公司 High-thermal-conductivity hydrocarbon resin-based prepreg and high-frequency copper-clad plate prepared from same
CN115216087A (en) * 2022-07-14 2022-10-21 中广核俊尔(浙江)新材料有限公司 Preparation, forming method and application of novel low-thermal expansion coefficient and low-dielectric composite material
CN115771308A (en) * 2022-09-23 2023-03-10 江苏耀鸿电子有限公司 Flexible aging-resistant hydrocarbon resin-based copper-clad plate and preparation method thereof
CN115771308B (en) * 2022-09-23 2023-12-29 江苏耀鸿电子有限公司 Flexible aging-resistant hydrocarbon resin-based copper-clad plate and preparation method thereof

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