CN111716773B - Preparation method of high-performance modified polyimide flexible substrate - Google Patents

Preparation method of high-performance modified polyimide flexible substrate Download PDF

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Publication number
CN111716773B
CN111716773B CN202010528716.4A CN202010528716A CN111716773B CN 111716773 B CN111716773 B CN 111716773B CN 202010528716 A CN202010528716 A CN 202010528716A CN 111716773 B CN111716773 B CN 111716773B
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cured
mpi
glue
semi
flexible substrate
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CN111716773A (en
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钱令习
张维熙
郑全智
宛如晴
陈伟
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Sichuan Bolimingde Technology Co ltd
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Sichuan Bolimingde Technology Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/02—Thermal after-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/02—Thermal after-treatment
    • B29C2071/027—Tempering, i.e. heating an object to a high temperature and quenching it
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a preparation method of a high-performance modified polyimide flexible substrate, which comprises the steps of adding Modified Polyimide (MPI) glue and a performance enhancing component into an organic solvent, carrying out pretreatment and grinding to prepare MPI glue, then coating or sputtering the MPI glue on a metal foil, carrying out pre-curing, post-curing and tempering treatment, and thus obtaining the high-performance MPI flexible substrate. The composite film prepared by the invention has lower dielectric constant, dielectric loss and moisture absorption rate, and can meet the high-frequency and high-speed requirements in 5G application; the high-voltage-resistant insulating property, the mechanical strength and the toughness are better; the preparation process is simple, the yield is up to more than 92%, and the requirements of various process windows and low-cost production are met.

Description

Preparation method of high-performance modified polyimide flexible substrate
Technical Field
The invention belongs to the technical field of electronic materials, and particularly relates to a preparation method of a high-performance modified polyimide flexible substrate.
Background
With the rapid development of the electronic industry, electronic devices such as personal computers, mobile phones, servers, GPS navigation devices and other household electronic devices are more and more popular, and meanwhile, the volume of the electronic devices is more and more small, and the functions are more and more powerful, so that the current electronic devices are developed towards the aspects of "lightening and thinning" and "miniaturization", the flexible substrate is an indispensable core component in the electronic circuit field, and the products are limited by the environmental regulations such as RoHS and REACH, and higher requirements are also provided for the flexible substrate as the core component, which is specifically shown in the following steps: firstly, the dielectric constant (Dk), dielectric loss (Df) and moisture absorption rate of the conventional flexible substrate are large, and the high-frequency and high-speed requirements in 5G application cannot be met; secondly, the high-voltage insulation performance is insufficient, the requirements of high-voltage insulation and high current bearing cannot be met, and the method is particularly applied to ultrathin insulating films (less than or equal to 5 um); the mechanical strength and toughness are insufficient, the ultra-thin film (less than or equal to 5um) cannot be made, the thin film (less than or equal to 10um) is easy to break and has poor bending property, and the film forming process is complex, the production efficiency is low, the production yield is low, and the cost is high; fourthly, the preparation process is complex, the yield is low, the cost is high, and the requirements of wide process window (such as medium-low temperature and medium-low pressure process), low equipment investment and low processing cost cannot be met.
Disclosure of Invention
The technical problem solved by the invention is as follows: the preparation method of the high-performance Modified Polyimide (MPI) flexible substrate is provided, the prepared flexible substrate has lower dielectric constant, dielectric loss and moisture absorption rate, and can meet the high-frequency and high-speed requirements in 5G application; the high-voltage-resistant insulating property, the mechanical strength and the toughness are better; the preparation process is simple, the yield is up to more than 92%, and the requirements of various process windows and low-cost production are met.
The technical scheme adopted by the invention is as follows:
a preparation method of a high-performance modified polyimide flexible substrate comprises the following steps:
step 1: adding Modified Polyimide (MPI) glue and a performance enhancing component into a solvent, and preparing MPI glue after pretreatment and grinding;
step 2: coating or sputtering the MPI glue obtained in the step (1) on a layer of high polymer film, then using a tunnel oven to dry and perform intervening curing to enable the glue to become a pre-cured glue layer, and applying a release film/paper to obtain a single-side semi-cured MPI glue layer substrate, wherein the single-side semi-cured MPI glue layer substrate comprises a semi-cured glue layer and a foil layer;
and step 3: preheating the single-side semi-cured MPI glue layer substrate in the step 2, compounding the semi-cured glue layer with a high-molecular film, or compounding the semi-cured glue layer with a foil layer of the single-side semi-cured MPI glue layer substrate, and then drying and solidifying the single-side semi-cured MPI glue layer substrate by using a tunnel oven to enable the glue to be the pre-cured glue layer, so as to obtain a multilayer semi-cured substrate;
And 4, step 4: drying and curing the single-sided semi-cured MPI glue layer substrate obtained in the step 2 or the multi-layer semi-cured substrate obtained in the step 3, and gradually and completely curing the glue layer to obtain a cured MPI flexible substrate;
and 5: and (4) putting the cured MPI flexible substrate obtained in the step (4) into a medium-low temperature oven for tempering treatment to obtain the high-performance MPI flexible substrate.
Preferably, the step 2 is repeated on the multilayer semi-cured film obtained in the step 3, or the step 2 and the step 3 are repeated, and then the steps 4 and 5 are performed to obtain the high-performance MPI flexible substrate.
Preferably, the cured film of the MPI flexible substrate obtained in step 4 is subjected to step 2, or step 2 and step 3 are repeated to obtain a multilayer semi-cured substrate, and then the steps 4 and 5 are performed to obtain a high-performance MPI flexible substrate.
Preferably, the MPI glue obtained in the step 1 is coated or sputtered on a foil layer of the single-sided semi-cured MPI glue layer substrate obtained in the step 2, and then is dried and pre-cured by a tunnel oven to obtain a double-sided semi-cured MPI glue layer substrate, wherein the double-sided semi-cured MPI glue layer substrate comprises the foil layer and semi-cured MPI glue layers arranged on two side faces of the foil layer, and the double-sided semi-cured MPI glue layer substrate is subjected to the treatment in the steps 4 and 5 to obtain a high-performance MPI flexible substrate.
Preferably, the step 3 is repeated on the double-sided semi-cured MPI glue line substrate to obtain a multi-layer semi-cured substrate, and then the steps 4 and 5 are performed to obtain the high-performance MPI flexible substrate.
According to the invention, the high-performance MPI flexible substrate is obtained by the method, the crosslinking network of the adhesive layer of the obtained MPI flexible substrate can be well constructed, the high-temperature resistance and the lasting viscosity are greatly improved, and the residual micromolecule flame retardance in the adhesive layer can be sufficiently removed, so that the low dielectric constant, the low dielectric loss, the low moisture absorption rate, the high dielectric strength, the high mechanical strength and the high finished product yield of the MPI flexible substrate are ensured.
Preferably, the pretreatment in the step 1 comprises any one of distillation, stirring and preheating or a plurality of matching treatment modes; the reinforcing component in the step 1 comprises one or more of an antioxidant, a toughening agent, an accelerator, a curing agent, an anti-aging agent, a stabilizer, a plasticizer, a flame retardant and an ultraviolet absorber; the solvent in the step 1 is one or more of N-methylpyrrolidone (NMP), N-Dimethylformamide (DMF), dimethyl sulfoxide (DMSO), N-Dimethylacetamide (DMAC), butanone, acetone, xylene, toluene, ethanol, methanol, ethyl acetate, diethyl ether, dichloromethane, trichloromethane, tetrachloroethane, phenol, benzene, cyclohexane and cyclohexanone.
In the invention, the reinforcing component in the step 1 is more preferably one or more of an antioxidant, a toughening agent, an accelerator, a curing agent, an anti-aging agent and a flame retardant, and the solvent is more preferably one or more of butanone, acetone, ethanol, methanol, ethyl acetate, diethyl ether, N-Dimethylformamide (DMF), dimethyl sulfoxide (DMSO), N-Dimethylacetamide (DMAC), cyclohexane and cyclohexanone, or a mixed solvent of the above solvents.
Preferably, the polymer film in step 2 is any one of a copper foil, an aluminum foil and a silver foil; the thickness of the polymer film is 0.005 mm-0.3 mm; and in the step 2, during coating or sputtering, the linear velocity of the polymer film is 1-26m/min, and the coating or sputtering thickness is 0.001 mm-3.0 mm.
In the present invention, the polymer film is more preferably one of a PI film, a PET film, an LCP film, a PPS film, and a PTFE film; the thickness of the polymer film is more preferably 0.005mm to 0.200 mm.
Preferably, when the baking in step 2 and step 3 is performed for curing, the temperature of the tunnel oven is set to be 80-280 ℃; when the release film/release paper is pasted in the step 2, the pasting temperature is 60-320 ℃, and the pasting pressure is 0.06-10 MPa; the compounding temperature in the compounding in the step 3 is 30-320 ℃, and the compounding pressure is 0.05-10 MPa.
In the invention, step 2 and step 3 adopt the tunnel oven to dry and intervene the solidification; and the compounding in the step 3 is carried out by adopting compounding equipment, wherein the compounding equipment comprises any one of a high-temperature press, a pressure tank, a medium-low temperature press, a laminator and the like.
Preferably, the curing temperature of the drying and curing in the step 4 is set to be 80-320 ℃, and the time is set to be 0.5-12 hours.
In the invention, the step 4 adopts a program oven to dry and then solidify, wherein the post-solidification means that intermolecular reaction basically stops after the adhesive layer is pre-solidified, at the moment, the adhesive layer is heated and kept at a constant temperature for a period of time, the molecular reaction continues, and the density is continuously increased; the combination of temperature and time is set according to the difference of the components in the step 1 and the difference of the polymer film in the step 2, so as to ensure that the optimal post-curing effect is achieved.
Preferably, the temperature for tempering treatment in the low-temperature oven in the step 5 is set to be 60-150 ℃ and the time is set to be 1-8 hours.
In the invention, the combination of temperature and time is set according to the difference of the components in the step 1 and the difference of the metal foil or the polymer film in the step 2, so as to ensure that the effects of optimally releasing internal stress, improving the adhesive holding property of the adhesive layer and removing residual VOC are achieved.
In addition, the modified polyimide is soluble polyester imino resin polymer material, and is composed of 10-90% of repeating units of formula I, 10-90% of formula II, 0-40% of formula III and 0-40% of formula IV in molar percentage:
Figure BDA0002534600940000051
wherein each X in formulas I-IV is independently selected from one of the following structures:
Figure BDA0002534600940000052
each R is1Independently selected from H, or one of the following structures:
Figure BDA0002534600940000061
each R is2、R
3And R4Independently are: hydrogen, hydroxy, fluoro, trifluoromethyl, amino, substituted or unsubstituted phenyl, substituted or unsubstituted phenoxy, substituted or unsubstituted C1-C10Alkyl, substituted or unsubstituted C1-C10Alkoxy, substituted or unsubstituted C1-C8Hydroxyalkyl, substituted or unsubstituted C1-C8Aminoalkyl radicals or substituted or unsubstituted C2-C8A hydroxyalkoxy group of (a); said substitution is by 1-3 substituents selected from D, F, Cl, Br, I, -CN, -NO2、-NH2、-OH、-SH、-COOH、-CONH2、-C(＝O)NHCH3、-C(＝O)N(CH3)2、-C(＝O)-(C1-C6Alkyl), -C (═ O) - (C)1-C6Alkoxy group), C1-C6Alkyl radical, C2-C6Alkenyl radical, C2-C6Alkynyl, C1-C6Haloalkyl, C1-C6Alkoxy radical, C1-C6Haloalkoxy, C1-C6Alkylthio radical, C1-C6Alkyl amino group.
In conclusion, the invention has the beneficial effects that:
1. in the invention, the flexible MPI glue line substrate adopts MPI glue of modified polyimide as a flexible structure layer, and has lower dielectric constant (Dk is less than or equal to 3.3), dielectric loss (Df is less than or equal to 0.0018) and moisture absorption rate (less than or equal to 0.031) by matching with a proper preparation process, so that the high-frequency and high-speed requirements in 5G application can be met.
2. In the invention, because the coating/sputtering, pre-curing and post-curing processes are adopted, the adhesive layer can be gradually cured to completely form a high-quality three-dimensional cross-linked network, and the cohesion, high permanent viscosity, high temperature resistance and stability of the comprehensive performance of the adhesive layer are ensured, so that the adhesive layer has better high-pressure-resistant insulating property, mechanical strength and toughness.
3. In the invention, because the MPI formula of the modified polyimide and the matched process are adopted, high performance is obtained, a relatively simple preparation process is provided, the yield reaches more than 92 percent, and the requirements of various process windows and low-cost production are met.
Detailed Description
The present invention is further illustrated by the following description and examples, including but not limited to the following examples.
Example 1
A preparation method of a high-performance modified polyimide flexible substrate comprises the following steps:
step 1: adding Modified Polyimide (MPI) glue and an antioxidant, a toughening agent, a curing agent, an anti-aging agent and a flame retardant into a mixed solvent of butanone and xylene, and preparing MPI glue after pretreatment and grinding; the pretreatment is distillation pretreatment;
And 2, step: coating the MPI glue obtained in the step 1 on a copper foil with the thickness of 0.005mm, wherein the coating thickness is 0.001mm, then, entering a tunnel oven with the temperature of 80 ℃ at the linear speed of 1m/min for drying and pre-curing to enable the glue to be a pre-cured glue layer, and attaching a release film/paper at the temperature of 320 ℃ and the pressure of 0.06MPa to obtain a single-side semi-cured MPI glue layer substrate, wherein the single-side semi-cured MPI glue layer substrate comprises a semi-cured glue layer and a foil layer;
and step 3: the single-sided semi-cured MPI glue layer substrate obtained in the step 2 is placed into a program oven for curing after being unwound, the temperature is set to be 80 ℃, the time is 12 hours, baking is carried out, and after the glue layer is gradually and completely cured, the cured MPI flexible substrate is obtained;
and 4, step 4: and (4) putting the cured MPI flexible substrate obtained in the step (4) into a medium-low temperature oven for tempering treatment, and treating at 60 ℃ for 8h to obtain the high-performance MPI flexible substrate.
Example 2:
a preparation method of a high-performance modified polyimide flexible substrate comprises the following steps:
step 1: adding Modified Polyimide (MPI) glue and an antioxidant, a toughening agent, a stabilizer and a plasticizer into a mixed solvent of N-methyl pyrrolidone (NMP), methanol and chloroform, and preparing MPI glue after pretreatment and grinding; the pretreatment is stirring pretreatment;
And 2, step: coating the MPI glue obtained in the step 1 on a silver foil with the thickness of 0.5mm, wherein the coating thickness is 3mm, then, entering a tunnel oven with the temperature of 280 ℃ at the linear speed of 26m/min for drying and pre-curing to enable the glue to be a pre-cured glue layer, and attaching a release film/paper at the temperature of 60 ℃ and the pressure of 10MPa to obtain a single-side semi-cured MPI glue layer substrate, wherein the single-side semi-cured MPI glue layer substrate comprises a semi-cured glue layer and a foil layer;
and 3, step 3: preheating the single-side semi-cured MPI glue layer substrate in the step 2, compounding the semi-cured glue layer and the silver foil through a high-temperature press at the temperature of 60 ℃ and the pressure of 10MPa, and then, entering a tunnel oven at the temperature of 280 ℃ at the linear speed of 26m/min for drying and pre-curing to enable the glue to be the pre-cured glue layer, so as to obtain a multilayer semi-cured substrate;
and 4, step 4: the multi-layer semi-cured substrate obtained in the step 3 is placed into a program oven for curing after being unwound, the temperature is set to be 320 ℃, the time is 0.5h, baking is carried out, and after the glue layer is cured completely step by step, the cured MPI flexible substrate is obtained;
and 5: and (4) putting the cured MPI flexible substrate obtained in the step (4) into a medium-low temperature oven for tempering treatment, and treating at 150 ℃ for 1h to obtain the high-performance MPI flexible substrate.
Example 3:
a preparation method of a high-performance modified polyimide flexible substrate comprises the following steps:
step 1: adding Modified Polyimide (MPI) glue and a stabilizer, a plasticizer and an ultraviolet absorber into a mixed solvent of N, N-Dimethylformamide (DMF), phenol, cyclohexanone and trichloromethane, and preparing MPI glue after pretreatment and grinding; the pretreatment is a preheating pretreatment;
step 2: coating the MPI glue obtained in the step 1 on an aluminum foil with the thickness of 0.025mm, wherein the coating thickness is 0.010mm, then, entering a tunnel oven with the temperature of 200 ℃ at the linear velocity of 20m/min for drying and pre-curing to enable the glue to be a pre-cured glue layer, and attaching a release film/paper at the temperature of 200 ℃ and the pressure of 0.175MPa to obtain a single-side semi-cured MPI glue layer substrate, wherein the single-side semi-cured MPI glue layer substrate comprises a semi-cured glue layer and a foil layer;
and step 3: preheating the single-sided semi-cured MPI glue layer substrate in the step 2, compounding the semi-cured glue layer with the foil layer of the single-sided semi-cured MPI glue layer substrate through a pressure tank at the temperature of 200 ℃ and the pressure of 0.175, and then, entering a tunnel oven at the temperature of 200 ℃ at the linear speed of 20m/min for drying and pre-curing to enable the glue to become a pre-cured glue layer, so as to obtain a multilayer semi-cured substrate;
And 4, step 4: the multi-layer semi-cured substrate obtained in the step 3 is placed into a program oven for curing after being unwound, the temperature is set to be 280 ℃, the baking is carried out for 2 hours, and after the glue layer is gradually and completely cured, the cured MPI flexible substrate is obtained;
and 5: and (4) putting the cured MPI flexible substrate obtained in the step (4) into a medium-low temperature oven for tempering treatment, and treating at 120 ℃ for 2h to obtain the high-performance MPI flexible substrate.
Example 4:
a preparation method of a high-performance modified polyimide flexible substrate comprises the following steps:
step 1: adding Modified Polyimide (MPI) glue and an accelerant, a stabilizer, a plasticizer and an ultraviolet absorber into a mixed solvent of dimethyl sulfoxide (DMSO), ethyl acetate, diethyl ether and dichloromethane, and preparing MPI glue after pretreatment and grinding; the pretreatment is a preheating pretreatment;
step 2: sputtering the MPI glue obtained in the step 1 on a copper foil with the thickness of 0.020mm, coating the copper foil with the thickness of 0.050mm, then, entering a tunnel oven with the temperature of 180 ℃ at a linear speed of 18m/min for drying and pre-curing to enable the glue to be a pre-cured glue layer, and attaching a release film/paper at the temperature of 150 ℃ and the pressure of 1.100MPa to obtain a single-side semi-cured MPI glue layer substrate, wherein the single-side semi-cured MPI glue layer substrate comprises a semi-cured glue layer and a foil layer;
And 3, step 3: preheating the single-side semi-cured MPI glue layer substrate in the step 2, compounding the semi-cured glue layer and the 0.020mm copper foil through a pressure tank at the temperature of 150 ℃ and the pressure of 1.100, and then, entering a tunnel oven at the temperature of 180 ℃ at the linear speed of 18m/min for drying and pre-curing to enable the glue to become the pre-cured glue layer, so as to obtain a multilayer semi-cured substrate;
and 4, step 4: sputtering MPI glue on the multilayer semi-cured substrate to the foil layer of the multilayer semi-cured film substrate in the step 1 to obtain the multilayer semi-cured substrate added with one layer of MPI glue layer;
and 5: the multi-layer semi-cured substrate obtained in the step 4 is placed into a program oven for curing after being unwound, the temperature is set to be 180 ℃, the time is 4 hours, baking is carried out, and after the glue layer is gradually and completely cured, the cured MPI flexible substrate is obtained;
and 6: and (5) putting the cured MPI flexible substrate obtained in the step (5) into a medium-low temperature oven for tempering treatment, and treating at 100 ℃ for 3h to obtain the high-performance MPI flexible substrate.
Example 5
A preparation method of a high-performance modified polyimide flexible substrate comprises the following steps:
step 1: adding Modified Polyimide (MPI) glue and an antioxidant, a toughening agent, a plasticizer and a flame retardant into a mixed solvent of N, N-Dimethylacetamide (DMAC) and cyclohexane, and preparing MPI glue after pretreatment and grinding; the pretreatment is stirring pretreatment;
And 2, step: sputtering the MPI glue obtained in the step 1 on a copper foil with the thickness of 0.050mm, coating the copper foil with the thickness of 0.020mm, then entering a tunnel oven with the temperature of 150 ℃ at the linear speed of 15m/min for drying and pre-curing to enable the glue to be a pre-cured glue layer, and attaching a release film/paper at the temperature of 90 ℃ and the pressure of 5.175MPa to obtain a single-side semi-cured MPI glue layer substrate, wherein the single-side semi-cured MPI glue layer substrate comprises a semi-cured glue layer and a foil layer;
and 3, step 3: preheating the single-sided semi-cured MPI glue layer substrate in the step 2, compounding the semi-cured glue layer and 0.050mm copper foil through a medium-low temperature press at the temperature of 90 ℃ and the pressure of 5.175MPa, and then entering a tunnel oven at the temperature of 150 ℃ at the linear speed of 15m/min for drying and pre-curing to enable the glue to become a pre-cured glue layer, so as to obtain a multilayer semi-cured substrate;
and 4, step 4: sputtering MPI glue on the multilayer semi-cured substrate to the foil layer of the multilayer semi-cured film substrate in the step 1 to obtain the multilayer semi-cured substrate added with one MPI glue layer;
and 5: preheating the multilayer semi-cured substrate obtained in the step 4 to the temperature of 90 ℃, enabling a semi-cured adhesive layer and a copper foil with the thickness of 0.050mm to be compounded through a medium-low temperature press at the pressure of 5.175MPa, then entering a tunnel oven with the temperature of 150 ℃ at the linear speed of 15m/min for drying and pre-curing, enabling the glue to become the pre-cured adhesive layer, and obtaining the multilayer semi-cured substrate with the added layers again;
Step 6: the multi-layer semi-cured substrate obtained in the step 5 is placed into a program oven for curing after being unwound, the temperature is set to be 120 ℃, the time is 7 hours, baking is carried out, and after the glue layer is gradually and completely cured, the cured MPI flexible substrate is obtained;
and 7: and (4) putting the cured MPI flexible substrate obtained in the step (6) into a medium-low temperature oven for tempering treatment, and treating at 120 ℃ for 5 hours to obtain the high-performance MPI flexible substrate.
Example 6:
a preparation method of a high-performance modified polyimide flexible substrate comprises the following steps:
step 1: adding Modified Polyimide (MPI) glue and an antioxidant, a toughening agent, an anti-aging agent and a stabilizer into a mixed solvent of acetone, benzene and cyclohexane, and preparing MPI glue after pretreatment and grinding; the pretreatment is stirring pretreatment;
step 2: sputtering the MPI glue obtained in the step 1 on a silver foil with the thickness of 0.080mm, coating the silver foil with the thickness of 0.060mm, then feeding the silver foil into a tunnel oven with the temperature of 120 ℃ at a linear speed of 10m/min for drying and pre-curing to enable the glue to be a pre-cured glue layer, and attaching a release film/paper at the temperature of 120 ℃ and 3.245MPa to obtain a single-sided semi-cured MPI glue layer substrate, wherein the single-sided semi-cured MPI glue layer substrate comprises a semi-cured glue layer and a foil layer;
And step 3: preheating the single-sided semi-cured MPI glue layer substrate in the step 2, compounding the semi-cured glue layer and the foil layer of the single-sided semi-cured MPI glue layer substrate at the temperature of 120 ℃ and the pressure of 3.245MPa through a medium-low temperature press, and then, entering a tunnel oven at the temperature of 120 ℃ at the linear speed of 10m/min for drying and pre-curing to enable the glue to become a pre-cured glue layer, thereby obtaining a multilayer semi-cured substrate;
and 4, step 4: the multi-layer semi-cured substrate obtained in the step 3 is placed into a program oven for curing after being unwound, the temperature is set to be 90 ℃, the time is 6 hours, baking is carried out, and after the glue layer is gradually and completely cured, the cured MPI flexible substrate is obtained;
and 5: the MPI glue obtained in the step (1) is sputtered onto the foil layer of the cured MPI flexible substrate obtained in the step (4), the coating thickness is 0.020mm, and then the MPI glue enters a tunnel oven with the temperature of 100 ℃ at the linear speed of 10m/min for drying and pre-curing, so that the glue becomes a pre-cured glue layer, and a multilayer laminated semi-cured substrate is obtained;
step 6: the multi-layer semi-cured substrate obtained in the step 5 is placed into a program oven for curing after being unwound, the temperature is set to be 90 ℃, the time is set to be 10 hours, baking is carried out, and after the glue layer is gradually and completely cured, the cured MPI flexible substrate is obtained;
And 7: and (4) putting the cured MPI flexible substrate obtained in the step (6) into a medium-low temperature oven for tempering treatment, and treating at 80 ℃ for 7h to obtain the high-performance MPI flexible substrate.
Example 7:
a preparation method of a high-performance modified polyimide flexible substrate comprises the following steps:
step 1: adding Modified Polyimide (MPI) glue and an antioxidant, a toughening agent, an anti-aging agent and an ultraviolet absorber into a mixed solvent of toluene, ethanol and cyclohexanone, and preparing MPI glue after pretreatment and grinding; the pretreatment is stirring pretreatment;
step 2: sputtering the MPI glue obtained in the step 1 on an aluminum foil with the thickness of 0.080mm, coating the aluminum foil with the thickness of 0.080mm, then drying and pre-curing the aluminum foil in a tunnel oven with the temperature of 150 ℃ at the linear speed of 15m/min to enable the glue to be a pre-cured glue layer, and pasting a release film/paper at the temperature of 90 ℃ and the pressure of 5.175MPa to obtain a single-side semi-cured MPI glue layer substrate, wherein the single-side semi-cured MPI glue layer substrate comprises a semi-cured glue layer and a foil layer;
and step 3: preheating the single-sided semi-cured MPI glue layer substrate in the step 2, compounding the semi-cured glue layer and 0.080mm aluminum foil through a medium-low temperature press at the temperature of 90 ℃ and the pressure of 5.175MPa, and then feeding the mixture into a tunnel oven at the temperature of 150 ℃ at the linear speed of 15m/min for drying and pre-curing to enable the glue to become a pre-cured glue layer, so as to obtain a multilayer semi-cured substrate;
And 4, step 4: the multi-layer semi-cured substrate obtained in the step 3 is placed into a program oven for curing after being unwound, the temperature is set to be 120 ℃, the time is 7 hours, baking is carried out, and after the glue layer is gradually and completely cured, the cured MPI flexible substrate is obtained;
and 5: sputtering the MPI glue obtained in the step 1 on the cured MPI flexible substrate obtained in the step 4 to form a coating layer with the thickness of 0.080mm, and then, drying and pre-curing the coating layer in a tunnel oven at the temperature of 150 ℃ at the linear speed of 15m/min to enable the glue to form a pre-cured glue layer, thereby obtaining a multilayer build-up semi-cured substrate;
step 6: preheating the multilayer semi-cured substrate obtained in the step 5 to the temperature of 90 ℃, enabling the semi-cured glue layer to be compounded with 0.080mm aluminum foil through a medium-low temperature press under the pressure of 5.175MPa, and then entering a tunnel oven with the temperature of 150 ℃ at the linear speed of 15m/min for drying and pre-curing to enable the glue to become the pre-cured glue layer, so as to obtain the multilayer semi-cured substrate with the added layers again;
and 7: the multi-layer semi-cured substrate obtained in the step 6 is placed into a program oven for curing after being unwound, the temperature is set to be 120 ℃, the time is 7 hours, baking is carried out, and after the glue layer is gradually and completely cured, the cured MPI flexible substrate is obtained;
And step 8: and (4) putting the cured MPI flexible substrate obtained in the step (7) into a medium-low temperature oven for tempering, and performing treatment at 120 ℃ for 2h to obtain the high-performance MPI flexible substrate.
Example 8
A preparation method of a high-performance modified polyimide flexible substrate comprises the following steps:
step 1: adding Modified Polyimide (MPI) glue and an antioxidant, a toughening agent, an anti-aging agent, a flame retardant and an ultraviolet absorber into a mixed solvent of tetrachloroethane, phenol, benzene and cyclohexanone, and preparing MPI glue after pretreatment and grinding; the pretreatment is stirring pretreatment;
and 2, step: sputtering the MPI glue obtained in the step 1 on a copper foil with the thickness of 0.050mm, coating the copper foil with the thickness of 0.070mm, then, entering a tunnel oven with the temperature of 150 ℃ at the linear speed of 15m/min for drying and pre-curing to enable the glue to be a pre-cured glue layer, and attaching a release film/paper at the temperature of 120 ℃ and the pressure of 3.245MPa to obtain a single-side semi-cured MPI glue layer substrate, wherein the single-side semi-cured MPI glue layer substrate comprises a semi-cured glue layer and a foil layer;
and 3, step 3: coating or sputtering the MPI glue obtained in the step 1 on a foil layer of the single-sided semi-cured MPI glue layer substrate obtained in the step 2, wherein the coating thickness is 0.030mm, then, the single-sided semi-cured MPI glue layer substrate enters a tunnel oven with the temperature of 150 ℃ at the linear speed of 15m/min for drying and pre-curing, so that the glue becomes a pre-cured glue layer, release film/paper is pasted at the temperature of 120 ℃ and the pressure of 3.245MPa, and a double-sided semi-cured MPI glue layer substrate is obtained, wherein the double-sided semi-cured film comprises the foil layer and semi-cured MPI glue layers arranged on two side faces of the foil layer;
And 4, step 4: the double-sided semi-cured MPI glue layer substrate obtained in the step 3 is placed in a program oven for curing after being unwound, the temperature is set to be 90 ℃, the baking is carried out for 10 hours, and the cured MPI flexible substrate is obtained after the glue layer is cured completely and gradually;
and 5: and (4) putting the cured MPI flexible substrate obtained in the step (4) into a medium-low temperature oven for tempering treatment, and treating at 120 ℃ for 2h to obtain the high-performance MPI flexible substrate.
Example 9
A preparation method of a high-performance modified polyimide flexible substrate comprises the following steps:
step 1: adding Modified Polyimide (MPI) glue and an anti-aging agent, a flame retardant and an ultraviolet absorber into a mixed solvent of N-methylpyrrolidone (NMP), tetrachloroethane, phenol, benzene and cyclohexanone, and preparing MPI glue after pretreatment and grinding; the pretreatment is stirring pretreatment;
step 2: sputtering the MPI glue obtained in the step 1 on a silver foil with the thickness of 0.050mm, coating the silver foil with the thickness of 0.070mm, then, entering a tunnel oven with the temperature of 120 ℃ at the linear speed of 10m/min for drying and pre-curing to enable the glue to be a pre-cured glue layer, and attaching a release film/paper at the temperature of 150 ℃ and the pressure of 1.100MPa to obtain a single-side semi-cured MPI glue layer substrate, wherein the single-side semi-cured MPI glue layer substrate comprises a semi-cured glue layer and a foil layer;
And 3, step 3: sputtering the MPI glue obtained in the step (1) on a foil layer of the single-sided semi-cured MPI glue layer substrate obtained in the step (2), coating the coating with the thickness of 0.030mm, then drying and pre-curing the single-sided semi-cured MPI glue layer substrate in a tunnel oven with the temperature of 120 ℃ at the linear speed of 10m/min to enable the glue to be a pre-cured glue layer, and attaching release film/paper at the temperature of 150 ℃ and the pressure of 1.100MPa to obtain a double-sided semi-cured MPI glue layer substrate, wherein the double-sided semi-cured film comprises the foil layer and semi-cured MPI glue layers arranged on two side surfaces of the foil layer;
and 4, step 4: preheating the double-sided semi-cured MPI glue layer substrate in the step 3, compounding the semi-cured glue layer with a silver foil with the thickness of 0.080mm at the temperature of 150 ℃ and the pressure of 1.100MPa through a high-temperature press, and then, entering a tunnel oven with the temperature of 120 ℃ at the linear speed of 10m/min for drying and pre-curing to enable the glue to become a pre-cured glue layer, so as to obtain a multilayer semi-cured substrate;
and 5: the double-sided semi-cured MPI glue layer substrate obtained in the step (4) is placed in a program oven for curing after being unwound, the temperature is set to be 180 ℃, the baking is carried out for 4 hours, and the cured MPI flexible substrate is obtained after the glue layer is cured completely and gradually;
and 6: and (5) putting the cured MPI flexible substrate obtained in the step (5) into a medium-low temperature oven for tempering, and performing treatment at 120 ℃ for 2h to obtain the high-performance MPI flexible substrate.
Parametric properties for examples 1-9, as shown in table 1:
TABLE 1 table of parametric properties for the examples
Figure BDA0002534600940000151
Figure BDA0002534600940000161
As can be seen from table 1 above, the MPI flexible substrate prepared by the present invention has a lower dielectric constant, a lower dielectric loss, a lower moisture absorption rate, a higher dielectric strength, a high temperature resistance, and a higher yield,
comparative example 1
A preparation method of a high-performance modified polyimide flexible substrate comprises the following steps:
step 1: adding Modified Polyimide (MPI) glue and an antioxidant, a toughening agent, a stabilizer and a plasticizer into a mixed solvent of N-methyl pyrrolidone (NMP), methanol and chloroform, and preparing MPI glue after pretreatment and grinding; the pretreatment is stirring pretreatment;
step 2: coating the MPI glue obtained in the step (1) on a silver foil with the thickness of 0.5mm, wherein the coating thickness is 3mm, then, entering a tunnel oven with the temperature of 280 ℃ at the linear velocity of 26m/min for drying and pre-curing to enable the glue to be a pre-cured glue layer, and attaching a release film/paper at the temperature of 60 ℃ and the pressure of 10MPa to obtain a single-sided semi-cured MPI glue layer substrate, wherein the single-sided semi-cured MPI glue layer substrate comprises a semi-cured glue layer and a foil layer;
and step 3: preheating the single-sided semi-cured MPI glue layer substrate in the step 2, compounding the semi-cured glue layer and the silver foil through a high-temperature press at the temperature of 60 ℃ and the pressure of 10MPa, and then feeding the mixture into a tunnel oven at the temperature of 280 ℃ at the linear speed of 26m/min for drying and pre-curing to enable the glue to be a pre-cured glue layer, so as to obtain a multilayer semi-cured substrate;
And 4, step 4: the multi-layer semi-cured substrate obtained in the step 3 is placed into a program type oven for curing after being unwound, the temperature is set to 320 ℃, the time is 0.5h, baking is carried out, the glue layer is cured completely step by step, and then the cured MPI flexible substrate is obtained;
comparative example 2
A preparation method of a high-performance modified polyimide flexible substrate comprises the following steps:
step 1: adding Modified Polyimide (MPI) glue and an antioxidant, a toughening agent, a stabilizer and a plasticizer into a mixed solvent of N-methyl pyrrolidone (NMP), methanol and chloroform, and preparing MPI glue after pretreatment and grinding; the pretreatment is stirring pretreatment;
and 2, step: coating the MPI glue obtained in the step (1) on a silver foil with the thickness of 0.5mm, wherein the coating thickness is 3mm, then, entering a tunnel oven with the temperature of 280 ℃ at the linear velocity of 26m/min for drying and pre-curing to enable the glue to be a pre-cured glue layer, and attaching a release film/paper at the temperature of 60 ℃ and the pressure of 10MPa to obtain a single-sided semi-cured MPI glue layer substrate, wherein the single-sided semi-cured MPI glue layer substrate comprises a semi-cured glue layer and a foil layer;
and step 3: preheating the single-sided semi-cured MPI glue layer substrate in the step 2, compounding the semi-cured glue layer and the silver foil through a high-temperature press at the temperature of 60 ℃ and the pressure of 10MPa, and then feeding the mixture into a tunnel oven at the temperature of 280 ℃ at the linear speed of 26m/min for drying and pre-curing to enable the glue to be a pre-cured glue layer, so as to obtain a multilayer semi-cured substrate;
And 4, step 4: and (4) putting the multilayer semi-cured substrate obtained in the step (3) into a medium-low temperature oven for tempering treatment, and treating at 150 ℃ for 1h to obtain the high-performance MPI flexible substrate.
The parametric performance tables for the examples and comparative examples are shown in table 2:
TABLE 2 table of parametric properties for examples and comparative examples
Figure BDA0002534600940000171
Figure BDA0002534600940000181
As can be seen from table 2, comparative example 1 did not undergo the tempering treatment, comparative example 2 did not achieve the gradual curing, the dielectric constant was higher than that of example 5, the dielectric strength was small, the high temperature of 300 ℃ or more was not resisted, and the yield was not high.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.

Claims (8)

1. A preparation method of a high-performance modified polyimide flexible substrate is characterized by comprising the following steps:
step 1: adding Modified Polyimide (MPI) glue and a performance enhancing component into a solvent, and preparing MPI glue after pretreatment and grinding;
And 2, step: coating or sputtering the MPI glue obtained in the step (1) on a metal foil, then baking and intervening curing the metal foil by using a tunnel oven to enable the glue to become a pre-cured glue layer, and attaching a release film/paper to obtain a single-side semi-cured MPI glue layer substrate, wherein the single-side semi-cured MPI glue layer substrate comprises a semi-cured glue layer and a foil layer;
and step 3: preheating the single-side semi-cured MPI glue layer substrate in the step 2, compounding the semi-cured glue layer with a metal foil, or compounding the semi-cured glue layer with a foil layer of the single-side semi-cured MPI glue layer substrate, or compounding the semi-cured glue layer with a polymer film, and then drying and intervening curing the single-side semi-cured MPI glue layer substrate by using a tunnel oven to enable the glue to be a pre-cured glue layer, so as to obtain a multilayer semi-cured substrate;
and 4, step 4: drying and curing the single-sided semi-cured MPI glue layer substrate obtained in the step 2 or the multi-layer semi-cured substrate obtained in the step 3, and gradually and completely curing the glue layer to obtain a cured MPI flexible substrate; wherein the curing temperature of the dried and cured product is 80-320 ℃, and the time is 0.5-12 hours;
and 5: putting the cured MPI flexible substrate obtained in the step (4) into a medium-low temperature oven for tempering treatment to obtain a high-performance MPI flexible substrate; wherein the tempering temperature is 60-150 ℃, and the time is 1-8 hours;
The Modified Polyimide (MPI) glue is a soluble polyester imino resin polymer material and consists of 10-90% of a formula I, 10-90% of a formula II, 0-40% of a formula III and 0-40% of a repeating unit of a formula IV in molar percentage:
Figure 874946DEST_PATH_IMAGE001
wherein each X in formulas I-IV is independently selected from one of the following structures:
Figure 123525DEST_PATH_IMAGE002
each R is1Independently selected from H, or one of the following structures:
Figure 987576DEST_PATH_IMAGE003
each R is2、R3And R4Independently are: hydrogen, hydroxy, fluoro, trifluoromethyl, amino, substituted or unsubstituted phenyl, substituted or unsubstituted phenoxy, substituted or unsubstituted C1 -C10Alkyl, substituted or unsubstituted C1 -C10Alkoxy, substituted or unsubstituted C1 -C8Hydroxyalkyl, substituted or unsubstituted C1 -C8Aminoalkyl radicals or substituted or unsubstituted C2 -C8A hydroxyalkoxy group of (a); said substitution is by 1-3 substituents selected from D, F, Cl, Br, I, -CN, -NO2、-NH2、-OH、-SH、-COOH、- CONH2、-C(＝O)NHCH3、-C(＝O)N(CH3)2、-C(＝O)-(C1 -C6Alkyl), -C (═ O) - (C)1 -C6Alkoxy group), C1 - C6Alkyl radical, C2 -C6Alkenyl radical, C2 -C6Alkynyl, C1 -C6Haloalkyl, C1 -C6Alkoxy radical, C1 -C6Haloalkoxy, C1 -C6Alkylthio radical, C1 -C6 Alkyl amino group.
2. The method for preparing a high-performance modified polyimide flexible substrate according to claim 1, wherein the step 2 is repeated on the foil layer of the multilayer semi-cured substrate obtained in the step 3, or the step 2 and the step 3 are repeated, and then the steps 4 and 5 are performed to obtain the high-performance MPI flexible substrate.
3. The method for preparing the high-performance modified polyimide flexible substrate according to claim 1, wherein the step 2, or the step 2 and the step 3 are repeated on the cured MPI flexible substrate obtained in the step 4 to obtain a plurality of layers of semi-cured substrates, and then the steps 4 and 5 are performed to obtain the high-performance MPI flexible substrate.
4. The method for preparing a high-performance modified polyimide flexible substrate according to claim 1, wherein the MPI glue obtained in step 1 is coated or sputtered on a foil layer of the single-sided semi-cured MPI glue layer substrate obtained in step 2, and then is dried and pre-cured by a tunnel oven to obtain a double-sided semi-cured MPI glue layer substrate, the double-sided semi-cured MPI glue layer substrate comprises the foil layer and semi-cured MPI glue layers arranged on two side surfaces of the foil layer, and the double-sided semi-cured MPI glue layer substrate is subjected to the treatment of steps 4 and 5 to obtain the high-performance MPI flexible substrate.
5. The preparation method of the high-performance modified polyimide flexible substrate as claimed in claim 4, wherein step 3 is repeated on a double-sided semi-cured MPI glue line substrate to obtain a multi-layer semi-cured substrate, and then the treatment of step 4 and step 5 is performed to obtain the high-performance MPI flexible substrate.
6. The method for preparing a high-performance modified polyimide flexible substrate according to any one of claims 1 to 5, wherein the pretreatment in step 1 comprises any one or more of distillation, stirring and preheating; the reinforcing component in the step 1 comprises one or more of an antioxidant, a toughening agent, an accelerator, a curing agent, an anti-aging agent, a stabilizer, a plasticizer, a flame retardant and an ultraviolet absorber; the solvent in the step 1 is one or more of N-methylpyrrolidone (NMP), N-Dimethylformamide (DMF), dimethyl sulfoxide (DMSO), N-Dimethylacetamide (DMAC), butanone, acetone, xylene, toluene, ethanol, methanol, ethyl acetate, diethyl ether, dichloromethane, trichloromethane, tetrachloroethane, phenol, benzene, cyclohexane and cyclohexanone.
7. The method for preparing a high-performance modified polyimide flexible substrate according to any one of claims 1 to 5, wherein the metal foil in the step 2 is any one of a copper foil, an aluminum foil and a silver foil; the thickness of the metal foil is 0.005 mm-0.5 mm; and in the step 2, during coating or sputtering, the linear speed of the polymer film is 1-26m/min, and the coating or sputtering thickness is 0.001 mm-3.0 mm.
8. The method for preparing a high-performance modified polyimide flexible substrate according to any one of claims 1 to 5, wherein the temperature of a tunnel oven is set to 80 ℃ to 280 ℃ when the baking intervention curing is carried out in the steps 2 and 3; when the release film/release paper is pasted in the step 2, the pasting temperature is 60-320 ℃, and the pasting pressure is 0.06 MPa-10 MPa; the compounding temperature in the compounding in the step 3 is 60-320 ℃, and the compounding pressure is 0.06 MPa-10 MPa.
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