CN110828425A - Anti-irradiation packaging structure and manufacturing method thereof - Google Patents
Anti-irradiation packaging structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN110828425A CN110828425A CN201910989174.8A CN201910989174A CN110828425A CN 110828425 A CN110828425 A CN 110828425A CN 201910989174 A CN201910989174 A CN 201910989174A CN 110828425 A CN110828425 A CN 110828425A
- Authority
- CN
- China
- Prior art keywords
- tungsten metal
- metal layers
- metal layer
- holes
- tungsten
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention discloses an anti-irradiation packaging structure and a manufacturing method thereof, and the packaging structure comprises a substrate, wherein the substrate comprises two tungsten metal layers which are parallel to each other and a ceramic layer which is fixedly arranged between the two tungsten metal layers, through holes are arranged on the tungsten metal layers, and orthographic projections of the through holes on the two tungsten metal layers on a plane which is parallel to the tungsten metal layers do not have an intersecting part; according to the invention, the tungsten metal layer and the ceramic layer are alternately superposed, the through holes are arranged on the tungsten metal layer, the adverse effect when the deformation of the tungsten metal layer and the deformation of the ceramic layer in the packaging structure are inconsistent is reduced, the radiation resistance is ensured by the staggered design of the through holes on different tungsten metal layers, the method can be realized by utilizing the conventional HTCC ceramic preparation process, and the method has the characteristics of less input equipment, low cost, short production period and the like, and meanwhile, the radiation resistance is remarkable, and the requirement of normal use of electronic components in a severe radiation environment is met.
Description
Technical Field
The invention relates to the technical field of electronic component packaging, in particular to an anti-irradiation packaging structure and a manufacturing method thereof.
Background
With the continuous development and progress of science and technology, space has gradually become a hot spot field for human research and exploration, and various space spacecraft such as satellites and spacecrafts are different day by day.
The electronic component radiation-resistant technology is inevitably subjected to radiation of various high-energy particles and rays in the space environment, and a large number of electronic components carried in the electronic component radiation-resistant technology are easy to lose effectiveness temporarily or permanently due to the influence of radiation, so that the normal operation of a spacecraft is seriously damaged, and under the condition, the radiation-resistant technology of the electronic components is increasingly paid attention to by people. The traditional radiation-resistant reinforcing measures for electronic components mainly comprise chip reinforcement, circuit redundancy design, packaging reinforcement and the like, wherein the chip reinforcement and the circuit redundancy design have the defects of large equipment investment, high production cost, long development period and the like, so that the large-scale popularization and application of the electronic components are limited.
Disclosure of Invention
In order to solve the technical problems, the invention provides an anti-irradiation packaging structure and a manufacturing method thereof, which can be realized by utilizing the conventional HTCC ceramic preparation process, have the characteristics of less input equipment, low cost, short production period and the like, have remarkable anti-irradiation performance and meet the requirement of normal use of electronic components in a harsh irradiation environment.
In order to solve the technical problems, the invention adopts the following technical scheme:
the utility model provides a packaging structure for irradiation resistance, includes the base member, the base member includes two tungsten metal layers that are parallel to each other to and set firmly the ceramic layer between two tungsten metal layers, be provided with the through-hole on the tungsten metal layer, and the orthographic projection of through-hole on two tungsten metal layers on the plane parallel with the tungsten metal layer does not have intersecting part.
The utility model provides a packaging structure for irradiation resistance, includes the base member, the base member includes at least three tungsten metal layer and sets firmly the ceramic layer between arbitrary two adjacent tungsten metal layers, be provided with the through-hole on the tungsten metal layer, be parallel to each other between arbitrary two tungsten metal layers, and the orthographic projection of through-hole on arbitrary two tungsten metal layers on the plane parallel with the tungsten metal layer does not have intersecting part.
Furthermore, each tungsten metal layer is provided with at least two rows of through holes, the through holes on any two adjacent tungsten metal layers are orthographically projected to a plane parallel to the tungsten metal layers to form through hole orthographies, and the orthographies of any two rows of through holes are respectively formed by the projection of the through holes on different tungsten metal layers.
Further, the cross section of the through hole is in any one of a circular shape, a rectangular shape, a triangular shape, a pentagonal shape, a hexagonal shape and an octagonal shape.
A manufacturing method of a packaging structure for resisting radiation comprises the following steps:
the method comprises the following steps: printing a first tungsten metal layer with a through hole on the lower surface of the ceramic layer;
step two: and when the through hole of the second tungsten metal layer and the through hole of the first tungsten metal layer are orthographically projected onto a plane parallel to the first tungsten metal layer, no intersection part exists.
Specifically, when the first tungsten metal layer is printed in the first step and the second tungsten metal layer is printed in the second step, a screen printing process is used for printing.
Specifically, if three or more tungsten metal layers are required, the following steps are continued:
step three: placing a second ceramic layer on the upper surface of the second tungsten metal layer;
step four: and repeating the second step and the third step until the thickness of the composite structure of the ceramic layer and the tungsten metal layer meets the requirement.
Specifically, in the fourth step, after the thickness of the composite structure of the ceramic layer and the tungsten metal layer meets the requirement, the composite structure is sintered and molded through an HTCC process.
Specifically, nickel is plated on the outer surface of the composite structure before the composite structure is sintered and molded.
Compared with the prior art, the invention has the beneficial technical effects that:
1. the tungsten metal layers and the ceramic layers are alternately superposed, so that the irradiation resistance of the packaging structure is effectively improved, the through holes are arranged on the tungsten metal layers, the adverse effect when the deformation of the tungsten metal layers and the deformation of the ceramic layers in the packaging structure are inconsistent is reduced, the through holes on different tungsten metal layers are designed in a staggered mode, the through hole is arranged on any one tungsten metal layer, the corresponding position on the adjacent tungsten metal layer is of a solid structure, the stress requirement is ensured due to the staggered arrangement, high-energy particles can be effectively blocked, the situation that the through holes on the tungsten metal layers on all layers have intersecting parts in the thickness direction of the substrate is avoided, and the irradiation resistance of the packaging structure is improved.
2. The method can be realized by utilizing the conventional HTCC ceramic preparation process, has the advantages of less input equipment, low cost, short production period and remarkable anti-irradiation performance, and meets the requirement of normal use of electronic components in a harsh irradiation environment.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an exploded view of the present invention;
FIG. 3 is a flow chart of the manufacturing method of the present invention.
Detailed Description
A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
The aircraft is inevitably subjected to radiation of various high-energy particles and rays in the space environment, and a large number of electronic components carried in the aircraft are easy to lose effectiveness temporarily or permanently due to the influence of radiation, so that the normal operation of the spacecraft is seriously damaged.
Under the condition, the anti-radiation technology of electronic components is increasingly paid more attention by people. The traditional radiation-resistant reinforcing measures for electronic components mainly comprise chip reinforcement, circuit redundancy design, packaging reinforcement and the like, wherein the chip reinforcement and the circuit redundancy design have the defects of large equipment investment, high production cost, long development period and the like, so that the large-scale popularization and application of the electronic components are limited.
As shown in fig. 1 and 2, a package structure for radiation resistance comprises a substrate, wherein the substrate comprises two tungsten metal layers 10 parallel to each other and a ceramic layer 20 fixedly arranged between the two tungsten metal layers, a through hole 11 is arranged on the tungsten metal layers, and no intersection part exists in orthographic projections of the through holes on the two tungsten metal layers on a plane parallel to the tungsten metal layers.
As shown in fig. 1 and 2, a package structure for radiation resistance is characterized in that: the tungsten-tungsten composite material comprises a base body, wherein the base body comprises at least three tungsten metal layers and a ceramic layer 20 fixedly arranged between any two adjacent tungsten metal layers, through holes are formed in the tungsten metal layers, any two tungsten metal layers are parallel to each other, and orthographic projections of the through holes in any two tungsten metal layers on a plane parallel to the tungsten metal layers do not have intersecting parts.
The packaging structure can be formed by matching a flat plate type shell with a cover cap with a cavity, or can be designed to be formed by matching a cavity type shell with a flat plate cover, wherein the flat plate type shell, the cover cap, the cavity type shell and the flat plate cover are all made of the substrate; when the flat plate type shell is matched with the cap with the cavity, the cap can also be prepared from high-quality metal materials with excellent radiation resistance, such as tantalum, tungsten, lead and the like.
The invention alternately superposes the tungsten metal layer and the ceramic layer, the tungsten metal layer can effectively improve the radiation resistance of the packaging structure, but the thermal expansion systems of the ceramic layer and the tungsten metal layer are different, the tungsten metal layer and the ceramic layer are superposed, sintered and formed, the deformation of the ceramic layer and the tungsten metal layer is inconsistent after being heated, so that the packaging structure is cracked, the radiation resistance and the service life of the packaging structure are influenced, a through hole is required to be arranged on the tungsten metal layer, the through hole can buffer stress, the adverse effect when the deformation of the tungsten metal layer and the ceramic layer in the packaging structure is inconsistent is reduced, the through hole on the tungsten metal layer and the through hole on the adjacent tungsten metal layer do not have an intersection part in the thickness direction of the substrate, when high-energy particles pass through the through hole on any one tungsten metal layer, the corresponding position of the adjacent tungsten metal layer is a solid structure, the permeability of the high-energy particles, the anti-irradiation performance of the packaging structure is ensured, the packaging structure can be realized by utilizing the conventional HTCC ceramic preparation process, the packaging structure has the characteristics of less input equipment, low cost, short production period and the like, and the requirements of normal use of electronic components in a severe irradiation environment are met.
As shown in fig. 2, each tungsten metal layer has at least two rows of through holes, and the through holes on any two adjacent tungsten metal layers are orthographically projected onto a plane parallel to the tungsten metal layer to form through hole orthographies, and then the orthographies of any two rows of through holes are respectively projected by the through holes on different tungsten metal layers; the arrangement mode enables the through holes on the single-layer tungsten metal layer to be distributed uniformly, stress of the base body can be eliminated uniformly, the production yield of the packaging structure is improved, and the service life of the packaging structure is prolonged.
Further, the cross section of the through hole 11 has any one of a circular shape, a rectangular shape, a triangular shape, a pentagonal shape, a hexagonal shape, and an octagonal shape.
A manufacturing method of a packaging structure for resisting radiation comprises the following steps:
s1: printing a first tungsten metal layer with a through hole on the lower surface of the ceramic layer;
s2: and when the through hole of the second tungsten metal layer and the through hole of the first tungsten metal layer project to a plane parallel to the first tungsten metal layer, no intersection part exists.
Specifically, if three or more tungsten metal layers are required, the following steps are performed:
s3: placing a second ceramic layer on the upper surface of the second tungsten metal layer;
s4: and repeating the second step and the third step until the thickness of the composite structure of the ceramic layer and the tungsten metal layer meets the requirement.
Specifically, when the first tungsten metal layer is printed in the first step and the second tungsten metal layer is printed in the second step, a screen printing process is used for printing.
Specifically, in the fourth step, after the thickness of the composite structure of the ceramic layer and the tungsten metal layer meets the requirement, sintering and molding the composite structure by an HTCC process; the preparation process of the HTCC ceramic is a common process, and has the advantages of less input equipment, low cost and short production period.
Specifically, before sintering and forming the composite structure, nickel is plated on the outer surface of the composite structure; the outer surface can be welded by soldering after being plated with nickel.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. A packaging structure for radiation resistance, characterized in that: the tungsten-coated ceramic substrate comprises a substrate body, wherein the substrate body comprises two tungsten metal layers (10) which are parallel to each other and a ceramic layer (20) which is fixedly arranged between the two tungsten metal layers, through holes (11) are formed in the tungsten metal layers, and the orthographic projections of the through holes in the two tungsten metal layers on a plane parallel to the tungsten metal layers do not have intersecting parts.
2. A packaging structure for radiation resistance, characterized in that: the tungsten-tungsten composite material comprises a base body, wherein the base body comprises at least three tungsten metal layers and a ceramic layer (20) fixedly arranged between any two adjacent tungsten metal layers, through holes are formed in the tungsten metal layers, any two tungsten metal layers are parallel to each other, and orthographic projections of the through holes in any two tungsten metal layers on planes parallel to the tungsten metal layers do not have intersecting parts.
3. The encapsulation structure for radiation resistance according to claim 1 or 2, characterized in that: at least two rows of through holes are formed in each tungsten metal layer, the through holes in any two adjacent tungsten metal layers are orthographically projected to a plane parallel to the tungsten metal layers to form through hole orthographies, and the through hole orthographies in any two rows are formed by projecting through holes in different tungsten metal layers respectively.
4. The encapsulation structure for radiation resistance according to claim 1 or 2, characterized in that: the cross section of the through hole (11) is in any one shape of circle, rectangle, triangle, pentagon, hexagon and octagon.
5. A method for manufacturing the packaging structure for radiation resistance according to claim 1, comprising the steps of:
the method comprises the following steps: printing a first tungsten metal layer with a through hole on the lower surface of the ceramic layer;
step two: and when the through hole of the second tungsten metal layer and the through hole of the first tungsten metal layer are orthographically projected onto a plane parallel to the first tungsten metal layer, no intersection part exists.
6. The method for manufacturing the packaging structure for radiation resistance according to claim 5, characterized in that: and when the first tungsten metal layer is printed in the first step and the second tungsten metal layer is printed in the second step, printing is carried out by using a screen printing process.
7. The method for manufacturing the packaging structure for radiation resistance according to claim 5, characterized in that: if three or more tungsten metal layers are needed, the following steps are continued:
step three: placing a second ceramic layer on the upper surface of the second tungsten metal layer;
step four: and repeating the second step and the third step until the thickness of the composite structure of the ceramic layer and the tungsten metal layer meets the requirement.
8. The method for manufacturing the packaging structure for radiation resistance according to claim 7, wherein: and in the fourth step, after the thickness of the composite structure of the ceramic layer and the tungsten metal layer meets the requirement, sintering and molding the composite structure by an HTCC process.
9. The method for manufacturing the packaging structure for radiation resistance according to claim 8, characterized in that: plating nickel on the outer surface of the composite structure before sintering and forming the composite structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910989174.8A CN110828425A (en) | 2019-10-17 | 2019-10-17 | Anti-irradiation packaging structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910989174.8A CN110828425A (en) | 2019-10-17 | 2019-10-17 | Anti-irradiation packaging structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110828425A true CN110828425A (en) | 2020-02-21 |
Family
ID=69549378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910989174.8A Pending CN110828425A (en) | 2019-10-17 | 2019-10-17 | Anti-irradiation packaging structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110828425A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0211619A2 (en) * | 1985-08-05 | 1987-02-25 | Hitachi, Ltd. | A multilayer ceramic circuit board |
| JPH01218827A (en) * | 1988-02-29 | 1989-09-01 | Nkk Corp | Light-weight insulating component and manufacture thereof |
| EP1293429A1 (en) * | 2001-09-18 | 2003-03-19 | The Boeing Company | Multilayered hypervelocity impact shield for spacecraft |
| JP2003227896A (en) * | 2002-02-01 | 2003-08-15 | Mitsubishi Heavy Ind Ltd | Radiation shield |
| US20070176281A1 (en) * | 2006-01-27 | 2007-08-02 | Advanced Semiconductor Engineering, Inc. | Semiconductor package |
| CN101859927B (en) * | 2010-04-14 | 2012-12-05 | 电子科技大学 | LTCC lamination double-fed circularly polarized micro-strip paster antenna |
| CN103287042A (en) * | 2012-03-01 | 2013-09-11 | 深圳光启创新技术有限公司 | Composite board, composite substrate and preparation method thereof |
-
2019
- 2019-10-17 CN CN201910989174.8A patent/CN110828425A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0211619A2 (en) * | 1985-08-05 | 1987-02-25 | Hitachi, Ltd. | A multilayer ceramic circuit board |
| JPH01218827A (en) * | 1988-02-29 | 1989-09-01 | Nkk Corp | Light-weight insulating component and manufacture thereof |
| EP1293429A1 (en) * | 2001-09-18 | 2003-03-19 | The Boeing Company | Multilayered hypervelocity impact shield for spacecraft |
| JP2003227896A (en) * | 2002-02-01 | 2003-08-15 | Mitsubishi Heavy Ind Ltd | Radiation shield |
| US20070176281A1 (en) * | 2006-01-27 | 2007-08-02 | Advanced Semiconductor Engineering, Inc. | Semiconductor package |
| CN101859927B (en) * | 2010-04-14 | 2012-12-05 | 电子科技大学 | LTCC lamination double-fed circularly polarized micro-strip paster antenna |
| CN103287042A (en) * | 2012-03-01 | 2013-09-11 | 深圳光启创新技术有限公司 | Composite board, composite substrate and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106531647B (en) | A kind of encapsulating structure being fanned out to cake core and its packaging method | |
| US5336547A (en) | Electronic components mounting/connecting package and its fabrication method | |
| CN102403283B (en) | Ball grid array packaging structure with basic islands and manufacturing method thereof | |
| CN103296014A (en) | Fan-out wafer level semiconductor chip three-dimensional stacking packaging structure and technology | |
| DE102010036678A1 (en) | Multichip module and method for its production | |
| TWI564408B (en) | Evaporation mask, evaporation method, and manufacturing method of the evaporation mask | |
| US20160323996A1 (en) | Multilayer circuit board and inspection apparatus including the same | |
| EA037475B1 (en) | Nuclear fuel pebble and method of manufacturing the same | |
| JPS5827665B2 (en) | multilayer ceramic substrate | |
| CN113097078A (en) | Method for forming a terminal pad, related terminal pad, substrate, assembly and system | |
| CN110828425A (en) | Anti-irradiation packaging structure and manufacturing method thereof | |
| KR101077784B1 (en) | A method for manufacturing solar cells using silicon balls and the solar cells manufactured by the same | |
| US9478386B2 (en) | Integrated gas discharge tube and preparation method therefor | |
| US6621010B2 (en) | Multilayer integrated substrate and manufacturing method for multilayer ceramic element | |
| CN112928035B (en) | Board-level flip chip packaging structure with electromagnetic shielding function and preparation method thereof | |
| CN113161755A (en) | Structural function integrated wave-transmitting cover embedded with electromagnetic metamaterial and preparation method thereof | |
| CN105575911A (en) | Semiconductor package and fabrication method thereof | |
| CN111816641A (en) | Electromagnetic shielding packaging structure and method based on secondary plastic packaging | |
| JP2013179039A (en) | Membrane electrode assembly and method of manufacturing membrane electrode assembly | |
| CN111199809B (en) | IMDP core block additive manufacturing method and IMDP core block | |
| US10256181B2 (en) | Package substrates | |
| WO2002009122A1 (en) | Laminated rare earth structure and method of making | |
| CN214796959U (en) | Array type thick film chip resistor | |
| CN208045476U (en) | The anti-layered warping structure of VDMOS power device plastic packagings | |
| CN110391214A (en) | Multisection type two-in-series polycrystalline group structure diodes element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200221 |
|
| RJ01 | Rejection of invention patent application after publication |