CN113539549B - Thermosetting conductive adhesive film and preparation method and application thereof - Google Patents
Thermosetting conductive adhesive film and preparation method and application thereof Download PDFInfo
- Publication number
- CN113539549B CN113539549B CN202110799705.4A CN202110799705A CN113539549B CN 113539549 B CN113539549 B CN 113539549B CN 202110799705 A CN202110799705 A CN 202110799705A CN 113539549 B CN113539549 B CN 113539549B
- Authority
- CN
- China
- Prior art keywords
- adhesive film
- conductive adhesive
- epoxy resin
- parts
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Conductive Materials (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a thermosetting conductive adhesive film, a preparation method and application thereof, wherein the thermosetting conductive adhesive film comprises the following components in parts by weight: 25-45 parts of polyethylene terephthalate, 3-5 parts of epoxy resin and 50-70 parts of dendritic silver-coated copper powder. The preparation method of the thermosetting conductive adhesive film comprises the following steps: and uniformly mixing the saturated polyester resin, the epoxy resin, the dendritic silver-coated copper powder and the optional antioxidant to obtain the thermosetting conductive adhesive film. The thermosetting conductive adhesive film has the advantages of strong adhesiveness, high temperature resistance, good flexibility and excellent shielding performance, and can be used as a conductive shielding material in a flexible printed circuit board.
Description
Technical Field
The invention belongs to the technical field of conductive shielding materials, and particularly relates to a thermosetting conductive adhesive film, a preparation method and application thereof.
Background
The flexible printed wiring board has excellent bending resistance, and meets the requirements of high performance and miniaturization of electronic products such as tablet computers, communication equipment, mobile phones and the like in recent years. In order to shield electromagnetic noise generated by a flexible printed circuit board, a conductive shielding film having shielding performance is generally attached to the flexible printed circuit board. The conductive shielding adhesive film generally comprises a base material and a thermosetting conductive adhesive film with conductive shielding performance, wherein the thermosetting conductive adhesive film is arranged on the surface of the base material, and the thickness of the base material is thinner, so that a printed circuit board with resistance can be better attached, and the bending resistance of the printed circuit board is not damaged.
In recent years, more and more researches on conductive electromagnetic shielding materials are carried out, for example, CN111138706a discloses a polymer electromagnetic shielding composite foam with a gradient filler structure and a preparation method thereof, and conductive metal is loaded on hollow glass microspheres to obtain low-density conductive particles during preparation; then preparing a conductive particle-polymer composite material; and finally, foaming the composite material to obtain the electromagnetic shielding composite foam. CN112126197a discloses a preparation method of an alternating multilayer epoxy resin based conductive composite microporous foaming material: reacting 100 parts of epoxy resin, 60-100 parts of curing agent and 0.05-1 part of auxiliary agent at 80-95 ℃ and cooling to obtain a solid mixture; taking 100 parts of the epoxy resin and 0 to 30 parts of conductive particles and 0.3 to 3 parts of foaming agent, and performing ball milling and dispersing for 2 to 30 minutes to obtain epoxy mixture powder; firstly, compacting one epoxy mixture powder, then pouring the epoxy mixture powder with the same mass and another formula into a two-layer structure, repeatedly obtaining a multi-layer to-be-foamed sample, and foaming and molding for 2-4 h at 90-160 ℃; then heating to 180-200 ℃ for heat preservation for 2h, naturally cooling to room temperature and demoulding. Although these materials all have certain conductive shielding performance at present, the shielding effect is not ideal.
Therefore, a thermosetting conductive adhesive film with excellent shielding performance is researched, and the thermosetting conductive adhesive film has important practical significance.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a thermosetting conductive adhesive film, a preparation method and application thereof.
To achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides a thermosetting conductive adhesive film, which comprises the following components in parts by weight: 25-45 parts of polyethylene terephthalate, 3-5 parts of epoxy resin and 50-70 parts of dendritic silver-coated copper powder.
According to the invention, polyethylene terephthalate is selected as matrix resin, so that the thermosetting conductive adhesive film has excellent high temperature resistance, and has strong viscosity after curing, and meanwhile, the film formation is facilitated; the epoxy resin plays a role in viscosity reinforcement, and is compounded with polyethylene terephthalate, so that the prepared thermosetting conductive adhesive film has strong adhesive force with a base material, and meanwhile, the high temperature resistance is enhanced; the introduction of the dendritic silver-coated copper powder enables the thermosetting conductive adhesive film to have excellent shielding performance and conductivity.
In the present invention, the polyethylene terephthalate 25 to 45 parts may be, for example, 26 parts, 30 parts, 32 parts, 34 parts, 35 parts, 40 parts, 41 parts, 42 parts or 43 parts, and specific point values among the above point values, which are limited in space and for the sake of brevity, the present invention is not intended to be exhaustive.
In the invention, when the content of the polyethylene terephthalate in the thermosetting conductive adhesive film component is too small, the high temperature resistance and the viscosity of the thermosetting conductive adhesive film component are reduced, and the final thermosetting conductive adhesive film is not facilitated to be formed; when the content of the polyethylene terephthalate is too high, the toughness of the thermosetting conductive adhesive film is reduced, the content of the dendritic silver-coated copper powder of the conductive particles is relatively reduced, and the shielding performance is reduced.
3 to 5 parts of epoxy resin may be, for example, 3.2 parts, 3.5 parts, 3.8 parts, 4 parts, 4.2 parts, 4.4 parts, 4.5 parts, 4.7 parts or 4.9 parts, and specific point values between the above point values, are limited in length and for brevity, the present invention is not intended to be exhaustive of the specific point values included in the ranges.
When the content of the epoxy resin is too low, the viscosity reinforcing effect is not obvious, and the high temperature resistance is also reduced; when the content of the epoxy resin is too high, film formation of the heat-curable conductive adhesive film is not facilitated.
The dendritic silver-coated copper powder 50-70 parts can be, for example, 51 parts, 52 parts, 53 parts, 55 parts, 60 parts, 61 parts, 62 parts, 63 parts, 64 parts, 65 parts, 66 parts, 67 parts, 68 parts or 69 parts, and specific point values among the above point values, are limited in length and for brevity, the present invention is not intended to be exhaustive list of the specific point values included in the range.
Compared with silver-coated copper powder and conductive particles with other shapes, the dendritic silver-coated copper powder has more excellent shielding performance due to the unique structure and the simple substance silver and simple substance copper. When the content of the dendritic silver-coated copper powder in the thermosetting conductive adhesive film is too low, the conductive shielding performance of the thermosetting conductive adhesive film is reduced; when the content of the dendritic silver-coated copper powder in the thermosetting conductive adhesive film is too high, the flexibility of the thermosetting conductive adhesive film is reduced, and the film formation of the adhesive film is not facilitated.
Preferably, the thickness of the thermally cured conductive adhesive film is 20 to 60 μm, for example, 22 μm, 25 μm, 30 μm, 35 μm, 40 μm, 42 μm, 50 μm, 55 μm or 58 μm, and specific point values between the above point values are limited in space and for the sake of brevity, the present invention is not exhaustive of the specific point values included in the range.
In the present invention, the epoxy resin includes any one or a combination of at least two of bisphenol a type epoxy resin, phosphorus-containing epoxy resin, isocyanate modified epoxy resin, o-cresol formaldehyde epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, or alicyclic epoxy resin.
Preferably, the particle size of the dendritic silver-coated copper powder is 5-15 μm, and may be, for example, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm or 14 μm, and specific point values between the above point values, are limited in space and for the sake of brevity, the present invention is not exhaustive of the specific point values included in the range.
Preferably, copper in the dendritic silver-coated copper powder is elemental copper.
Preferably, silver in the dendritic silver-coated copper powder is elemental silver.
Preferably, the silver content of the dendritic silver-coated copper powder is 3-30% by mass, for example, may be 5%, 6%, 8%, 9%, 10%, 11%, 12%, 13%, 15%, 17%, 20%, 21%, 22%, 23%, 25%, 27% or 29%, and specific point values among the above point values are limited in space and for brevity, the present invention is not exhaustive of the specific point values included in the range.
Preferably, the polyethylene terephthalate has a degree of polymerization of 100 to 200, and may be, for example, 110, 120, 130, 140, 150, 160, 170, 180 or 190, and specific point values between the above point values, which are limited in space and for the sake of brevity, the present invention is not exhaustive of the specific point values included in the range.
In the present invention, the heat-curable conductive adhesive film further includes 0.2 to 0.5 part of an antioxidant in parts by weight, and the antioxidant may be, for example, 0.22 part, 0.24 part, 0.25 part, 0.3 part, 0.32 part, 0.35 part, 0.4 part, 0.42 part, 0.45 part, 0.47 part or 0.49 part, and specific point values between the above point values, which are limited in space and for brevity, the present invention does not exhaustively list the specific point values included in the range.
Preferably, the antioxidant comprises a phosphite antioxidant and/or a hindered phenol antioxidant.
In a second aspect, the present invention provides a method for preparing the thermosetting conductive adhesive film according to the first aspect, the method comprising the steps of: and uniformly mixing polyethylene terephthalate, epoxy resin, dendritic silver-coated copper powder and optionally an antioxidant to obtain the thermosetting conductive adhesive film.
Preferably, the method of mixing is stirring.
Preferably, the stirring time is 60 to 90min, for example, 62min, 65min, 68min, 70min, 72min, 75min, 78min, 80min, 82min, 84min, 85min, 86min, 88min or 89min, and specific point values among the above point values, which are limited in space and are not exhaustive for the sake of brevity.
In a third aspect, the present invention provides the use of a heat-curable conductive adhesive film according to the first aspect for conductive shielding materials in flexible printed circuit boards.
In the present invention, the conductive shielding material includes a substrate and the thermosetting conductive adhesive film according to the first aspect disposed on a single side of the substrate.
Preferably, the substrate comprises a PET release film and/or a PE release film.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, specific types of polyethylene terephthalate, epoxy resin and dendritic silver-coated copper powder are selected and compounded according to specific contents, so that the finally prepared thermosetting conductive adhesive film has excellent conductive shielding performance, the shielding efficiency can reach 58.3-61.8 dB under the condition of 3GHz, meanwhile, the adhesive force is strong, the adhesive force can reach 3460-4460 gf when the thickness is 25mm, no bubbles, melting and ablation are generated at 260 ℃, and the high temperature resistance is excellent.
Detailed Description
The technical scheme of the invention is further described by the following specific embodiments. It will be apparent to those skilled in the art that the examples are merely to aid in understanding the invention and are not to be construed as a specific limitation thereof.
The materials used in the following examples and comparative examples of the present invention include:
(1) Polyethylene terephthalate: shanghai with cautions for chemical industry, inc., ES100;
(2) Saturated polyester resin: chemical industry of Wuhan energy kernel, 3501-5;
(3) O-cresol formaldehyde epoxy resin: guangzhou Taiji New Material Co., ltd., taiLuck-HP7200;
(4) Dendritic silver coated copper powder: YH-JJ-4, a tobacco stand, sea technologies Co., ltd;
(5) Flake silver coated copper powder: YH-T-4 is a great deal of sea technology Co., ltd.
Examples 1 to 6 and comparative examples 1 to 7
Examples 1-6 and comparative examples 1-7 provide a heat-curable conductive adhesive film comprising the following components: the composition formulation of each example is shown in Table 1, together with polyethylene terephthalate, o-cresol formaldehyde epoxy, dendritic silver-coated copper powder and Pasteur antioxidant 168.
The preparation method comprises the following steps: and mixing and stirring the polyethylene terephthalate, the o-cresol formaldehyde epoxy resin, the dendritic silver-coated copper powder and the antioxidant according to the proportion of the table 1 for 60 minutes to obtain the thermosetting conductive adhesive film.
TABLE 1
Comparative example 8
This comparative example provides a heat-curable conductive adhesive film comprising the following components: 33 parts of saturated polyester resin, 4 parts of o-cresol formaldehyde epoxy resin, 61 parts of dendritic silver-coated copper powder and 0.3 part of antioxidant 168.
The preparation method is the same as in example 1.
Comparative example 9
This comparative example provides a heat-curable conductive adhesive film comprising the following components: 33 parts of polyethylene terephthalate, 4 parts of o-cresol formaldehyde epoxy resin, 61 parts of flake silver-coated copper powder and 0.3 part of antioxidant 168.
The preparation method is the same as in example 1.
Comparative example 10
This comparative example provides a commercially available heat curable conductive adhesive film, which is designated CBF-800.
Performance test:
1. shielding effectiveness test: the heat-curing conductive adhesive films provided in examples 1 to 6 and comparative examples 1 to 10 were subjected to shielding effectiveness test according to GB/T30142-2013 method for measuring shielding effectiveness of planar electromagnetic shielding material;
2. adhesive force test: the thermosetting conductive adhesive films provided in examples 1 to 6 and comparative examples 1 to 10 were laminated with a flexible circuit board (FPC), the lamination temperature was 170℃and the lamination pressure was 2MPa, the time was 180s, then the curing was carried out at 150℃for 60 minutes, a composite film of the conductive adhesive film and FPC was obtained, and finally 180℃peeling was carried out on the composite film by using a tensile machine (friendship, RS-8010), and the maximum value of the force in the peeling process, namely, the adhesive force of the conductive adhesive film was recorded, and the speed was 300mm/min.
3. And (3) testing the high temperature resistance of the adhesive film: and (3) pressing the thermosetting conductive adhesive films provided in examples 1-6 and comparative examples 1-10 with the FPC at a pressing temperature of 170 ℃, a pressing pressure of 2Mpa and a pressing time of 180s, then curing at 150 ℃ for 60min to obtain a composite film of the conductive adhesive film and the FPC, and finally placing the composite film in a constant-temperature tin furnace at 260 ℃ for 5s, and observing that no bubble, melting or ablation phenomenon exists on the surface of the composite film.
The results of the above performance tests are shown in Table 2:
TABLE 2
From the data in table 2, it can be seen that:
(1) As is clear from the comparison of the data of example 1 and comparative examples 1, 2, 3, when the epoxy resin content in the conductive adhesive film is too low or the conductive adhesive film does not contain epoxy resin, the high temperature resistance of the conductive adhesive film is deteriorated, and the phenomena of bubble melting and ablation occur; when the content of the epoxy resin is too high, the adhesive film is easy to shrink, and the film forming property is reduced; the content is reduced and the heat resistance of the adhesive film is deteriorated.
(2) As is evident from the comparison of the data of example 1 with the data of comparative examples 4 and 5, the polyethylene terephthalate content is increased, the adhesion is increased, the dendritic silver-coated copper powder is increased, and the shielding performance is improved.
(2) It can be seen from a comparison of example 1 and example 6 that the antioxidant has no significant effect on the above three properties, but the subsequent storage time does not perform well in the effect on the properties, and the shelf life of the material is drastically shortened.
(4) As can be seen from the comparison of example 1 and comparative examples 6 and 7, the conductive powder was reduced, resulting in a sharp decrease in the shielding effectiveness of the material from 60.4dB to 42.8dB; the content is increased, so that the adhesive film cannot be hot pressed, and the use value is lost.
(5) As can be seen from the comparison of example 1 and comparative example 8, when polyethylene terephthalate is replaced with other saturated polyester resin, the adhesion of the material is lowered and the high temperature resistance is also lowered;
(6) As can be seen from the comparison of example 1 and comparative example 9, the type of the conductive powder was changed, so that the shielding performance and the adhesive force of the conductive adhesive film were reduced.
(7) As can be seen from the comparison of the embodiment 1 and the comparative example 10, the conductive adhesive film provided by the invention has more excellent shielding performance, stronger adhesive force and high temperature resistance.
In conclusion, the prepared conductive adhesive film has excellent shielding effect by the synergistic effect of the components in the conductive adhesive film, reaches 58.3-61.8 dB, has strong adhesive force, can reach 3460-4460 gf when the thickness is 25mm, and has no foaming, melting and ablation phenomena after being placed for 5 seconds at 260 ℃.
The applicant states that the present invention is described by way of the above examples of the heat-curable conductive adhesive film of the present invention, and the method of preparing and using the same, but the present invention is not limited to the above examples, i.e., it is not meant that the present invention must be practiced by relying on the above examples. It should be apparent to those skilled in the art that any modification of the present invention, equivalent substitution of raw materials for the product of the present invention, addition of auxiliary components, selection of specific modes, etc., falls within the scope of the present invention and the scope of disclosure.
Claims (16)
1. The thermosetting conductive adhesive film is characterized by comprising the following components in parts by weight: 35-45 parts of polyethylene terephthalate, 4.7-5 parts of epoxy resin and 55-70 parts of dendritic silver-coated copper powder.
2. The heat-curable conductive adhesive film according to claim 1, wherein the thickness of the heat-curable conductive adhesive film is 20 to 60 μm.
3. The heat curable conductive adhesive film of claim 1, wherein the epoxy resin comprises any one or a combination of at least two of bisphenol a epoxy resin, phosphorous epoxy resin, isocyanate modified epoxy resin, o-cresol formaldehyde epoxy resin, biphenyl epoxy resin, dicyclopentadiene epoxy resin, or cycloaliphatic epoxy resin.
4. The thermally cured conductive adhesive film of claim 1, wherein the dendritic silver-coated copper powder has a particle size of 5 to 15 μm.
5. The thermally cured conductive adhesive film of claim 1, wherein the copper in the dendritic silver-coated copper powder is elemental copper.
6. The thermally cured conductive adhesive film of claim 1, wherein the silver in the dendritic silver-coated copper powder is elemental silver.
7. The heat-curable conductive adhesive film according to claim 1, wherein the mass percentage of silver in the dendritic silver-coated copper powder is 3-30%.
8. The heat-curable electroconductive film according to claim 1, wherein the polyethylene terephthalate has a degree of polymerization of 100 to 200.
9. The heat-curable conductive adhesive film according to claim 1, further comprising 0.2 to 0.5 parts by weight of an antioxidant.
10. The heat curable conductive adhesive film of claim 9, wherein the antioxidant comprises a phosphite antioxidant and/or a hindered phenol antioxidant.
11. A method for preparing a heat-curable electroconductive adhesive film according to any one of claims 1 to 10, comprising the steps of: and uniformly mixing polyethylene terephthalate, epoxy resin, dendritic silver-coated copper powder and optionally an antioxidant to obtain the thermosetting conductive adhesive film.
12. The method of claim 11, wherein the mixing is by stirring.
13. The method of claim 12, wherein the stirring is for a period of 60 to 90 minutes.
14. Use of a heat-curable conductive film according to any one of claims 1 to 10 for conductive shielding materials in flexible printed circuit boards.
15. The use according to claim 14, wherein the conductive shielding material comprises a substrate and the heat curable conductive adhesive film according to any one of claims 1 to 10 arranged on a single side of the substrate.
16. Use according to claim 15, wherein the substrate comprises a PET release film and/or a PE release film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110799705.4A CN113539549B (en) | 2021-07-15 | 2021-07-15 | Thermosetting conductive adhesive film and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110799705.4A CN113539549B (en) | 2021-07-15 | 2021-07-15 | Thermosetting conductive adhesive film and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113539549A CN113539549A (en) | 2021-10-22 |
| CN113539549B true CN113539549B (en) | 2023-08-01 |
Family
ID=78099387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110799705.4A Active CN113539549B (en) | 2021-07-15 | 2021-07-15 | Thermosetting conductive adhesive film and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113539549B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114163874A (en) * | 2021-12-29 | 2022-03-11 | 东莞市古川胶带有限公司 | Black conductive ink for adhesive tape and preparation method and application thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03166284A (en) * | 1989-11-24 | 1991-07-18 | Matsushita Electric Ind Co Ltd | Electrically conductive adhesive |
| JP2009230952A (en) * | 2008-03-21 | 2009-10-08 | Fukuda Metal Foil & Powder Co Ltd | Conductive paste composition, electronic circuit, and electronic parts |
| JP2016138301A (en) * | 2015-01-26 | 2016-08-04 | 住友金属鉱山株式会社 | Manufacturing method of dendritic copper powder, and conductive copper paste, conductive coating and conductive sheet using the same |
| CN108300345A (en) * | 2017-10-11 | 2018-07-20 | 广东正业科技股份有限公司 | A kind of epoxide resin conductive adhesive film and preparation method |
| CN110951369A (en) * | 2019-12-12 | 2020-04-03 | 深圳市利红金科技有限公司 | Coating for electromagnetic shielding, preparation method and use method |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001176326A (en) * | 1999-12-21 | 2001-06-29 | Shin Etsu Polymer Co Ltd | Anisotropic conductive adhesive, heat seal connector and manufacturing method of connector |
| EP3167979A4 (en) * | 2014-07-07 | 2018-03-14 | Sumitomo Metal Mining Co., Ltd. | Copper powder and electrically conductive paste, electrically conductive coating, electrically conductive sheet, and antistatic coating using same |
| WO2016031286A1 (en) * | 2014-08-26 | 2016-03-03 | 住友金属鉱山株式会社 | Silver-coated copper powder, and conductive paste, conductive coating material and conductive sheet each of which uses same |
| CN104527170A (en) * | 2014-12-16 | 2015-04-22 | 苏州城邦达力材料科技有限公司 | Conductive adhesive film for reinforcing metal steel in printed circuit board and manufacture process of conductive adhesive film |
| JP5907301B1 (en) * | 2015-05-15 | 2016-04-26 | 住友金属鉱山株式会社 | Silver-coated copper powder, copper paste using the same, conductive paint, conductive sheet, and method for producing silver-coated copper powder |
| CN107426957B (en) * | 2017-08-16 | 2020-08-28 | 苏州城邦达益材料科技有限公司 | Conductive adhesive film layer, preparation method and electromagnetic shielding film |
| CN207391333U (en) * | 2017-10-11 | 2018-05-22 | 广东正业科技股份有限公司 | A kind of epoxide resin conductive adhesive film |
| JP6968041B2 (en) * | 2018-07-11 | 2021-11-17 | タツタ電線株式会社 | Conductive adhesive |
| JP7256618B2 (en) * | 2018-08-29 | 2023-04-12 | タツタ電線株式会社 | Electromagnetic wave shielding film with transfer film, method for producing electromagnetic wave shielding film with transfer film, and method for producing shield printed wiring board |
| CN211152613U (en) * | 2019-11-26 | 2020-07-31 | 苏州城邦达益材料科技有限公司 | Electromagnetic shielding film capable of being bent for use |
| CN112574686A (en) * | 2020-12-24 | 2021-03-30 | 苏州城邦达益材料科技有限公司 | Conductive adhesive film and preparation method and application thereof |
-
2021
- 2021-07-15 CN CN202110799705.4A patent/CN113539549B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03166284A (en) * | 1989-11-24 | 1991-07-18 | Matsushita Electric Ind Co Ltd | Electrically conductive adhesive |
| JP2009230952A (en) * | 2008-03-21 | 2009-10-08 | Fukuda Metal Foil & Powder Co Ltd | Conductive paste composition, electronic circuit, and electronic parts |
| JP2016138301A (en) * | 2015-01-26 | 2016-08-04 | 住友金属鉱山株式会社 | Manufacturing method of dendritic copper powder, and conductive copper paste, conductive coating and conductive sheet using the same |
| CN108300345A (en) * | 2017-10-11 | 2018-07-20 | 广东正业科技股份有限公司 | A kind of epoxide resin conductive adhesive film and preparation method |
| CN110951369A (en) * | 2019-12-12 | 2020-04-03 | 深圳市利红金科技有限公司 | Coating for electromagnetic shielding, preparation method and use method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113539549A (en) | 2021-10-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103265791B (en) | Thermosetting resin composition for integrated circuit as well as prepreg and laminated board both fabricated by using composition | |
| EP3162561A1 (en) | Thermoset resin sandwiched pre-preg body, manufacturing method and copper clad plate | |
| CN106280247B (en) | Resin composition for electromagnetic wave absorbing material | |
| CN103897346B (en) | A kind of compositions of thermosetting resin | |
| JP5260400B2 (en) | Multilayer board for producing multilayer printed wiring boards | |
| JP2009227992A (en) | Film and printed circuit board | |
| KR101987310B1 (en) | Insulating resin composition for printed circuit board and products manufactured by using the same | |
| CN104559888A (en) | Copper-clad plate applicable to production of high multi-layer PCB (printed circuit board) and preparation method of copper-clad plate | |
| TW201412864A (en) | Thermosetting resin compositions, resin films in B-stage, metal foils, copper clad boards and multi-layer build-up boards | |
| CN104559068A (en) | Thermosetting resin composition as well as preparation method and application thereof | |
| TW201842047A (en) | Resin material, laminated film, and multilayer printed circuit board | |
| KR20150026557A (en) | Insulating resin composition for printed circuit board and products having the same | |
| CN113539549B (en) | Thermosetting conductive adhesive film and preparation method and application thereof | |
| US10081728B2 (en) | Resin composition and uses of the same | |
| KR20130031240A (en) | Composition for film, and adhesive film and cover lay film formed therefrom | |
| US20140367147A1 (en) | Insulating resin composition for printed circuit board, insulating film, prepreg and printed circuit board | |
| CN106751711B (en) | Fluorine-substituted vinyl polymer resin composition, prepreg and laminate | |
| CN103665864A (en) | Glue solution for copper-clad laminate and preparation method thereof | |
| TW202041562A (en) | Resin composition, prepreg,film with resin, metal foil with resin, metal-clad laminate, and printed wirining board | |
| TWI764902B (en) | Resin composition for printed wiring board and resin sheet for printed wiring board using the same | |
| JP2012019240A (en) | Resin composite, insulation sheet with substrate and multilayer printed wiring board | |
| KR20190098471A (en) | Adhesive composition for flexible printed circuit board excellent in adhesion and heat radiation | |
| JP2000349440A (en) | Manufacture of multilayer copper clad circuit board containing inner layer circuit | |
| CN116552074B (en) | High-heat-dissipation low-dielectric copper-clad plate and preparation method thereof | |
| KR101420542B1 (en) | Epoxy resin composition for insulating film, insulating film for printed circuit board and manufacturing method thereof and printed circuit board having the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |