以下，詳細地說明本發明。 本發明之樹脂材料包含環氧化合物、硬化劑及二氧化矽。於本發明之樹脂材料中，上述硬化劑包含氰酸酯化合物及碳化二亞胺化合物。 於本發明中，由於具備上述構成，故而能夠抑制泡狀體之產生。例如，即便樹脂膜(樹脂材料)或樹脂材料之硬化物吸濕，亦難以產生水泡。 進而，於本發明中，由於具備上述構成，故而可提高保存穩定性。本發明之樹脂材料即便保管一定時間後，亦能夠使樹脂材料良好地埋入至孔或凹凸表面。例如，於多層印刷佈線板中，於佈線上形成絕緣層。由於在形成絕緣層之表面有佈線，故而存在凹凸。藉由使用本發明之樹脂材料，能夠於佈線上良好地埋入絕緣層，能夠抑制孔隙之產生。 進而，於本發明中，由於具備上述構成，故而亦能夠提高硬化物(絕緣層等)與金屬層之密接性。例如，能夠提高金屬層對硬化物之剝離強度。 進而，於本發明中，由於具備上述構成，故而於保管一定時間後使樹脂組合物膜化時，能夠提高膜之均勻性，又，使樹脂材料硬化時，亦能夠提高硬化物之均勻性。 本發明之樹脂材料可為樹脂組合物，亦可為樹脂膜。上述樹脂組合物具有流動性。上述樹脂組合物可為糊狀。上述糊狀包括液狀。就操作性優異而言，本發明之樹脂材料較佳為樹脂膜。又，於本發明中，即便樹脂材料為樹脂膜，亦能夠使樹脂膜良好地埋入至孔或凹凸表面。 本發明之樹脂材料由於上述性質優異，故而適用於在多層印刷佈線板形成絕緣層。本發明之樹脂材料由於上述性質優異，故而較佳為多層印刷佈線板用樹脂材料，更佳為用於多層印刷佈線板之層間絕緣用樹脂材料。 於上述多層印刷佈線板中，藉由上述樹脂材料而形成之絕緣層之厚度(每1層之厚度)較佳為形成電路之導體層(金屬層)之厚度以上。上述絕緣層之厚度(每1層之厚度)較佳為5 μm以上，較佳為200 μm以下。 本發明之樹脂材料適用於獲得供進行粗化處理之硬化物。 以下，說明用於本發明之樹脂材料之各成分之詳情、及本發明之樹脂材料之用途等。 [環氧化合物] 上述樹脂材料所包含之環氧化合物未特別限定。作為該環氧化合物，可使用先前公知之環氧化合物。該環氧化合物係指至少具有1個環氧基之有機化合物。上述環氧化合物可僅使用1種，亦可併用2種以上。 作為上述環氧化合物，可列舉：雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、苯酚酚醛清漆型環氧樹脂、聯苯型環氧樹脂、聯苯酚醛清漆型環氧樹脂、聯苯酚型環氧樹脂、萘型環氧樹脂、茀型環氧樹脂、苯酚芳烷基型環氧樹脂、萘酚芳烷基型環氧樹脂、二環戊二烯型環氧樹脂、蒽型環氧樹脂、具有金剛烷骨架之環氧樹脂、具有三環癸烷骨架之環氧樹脂、及於骨架具有三核之環氧樹脂等。 就更加有效地發揮提高保存穩定性、抑制泡狀體之產生、及提高硬化物與金屬層之密接性之效果之觀點而言，上述環氧化合物較佳為具有芳香族骨架，較佳為具有聯苯骨架，較佳為聯苯型環氧化合物。又，藉由使上述環氧化合物具有聯苯骨架，硬化物與金屬層之接著強度更加提高。 上述環氧化合物之分子量更佳為1000以下。於該情形時，即便樹脂材料中除溶劑以外之成分100重量%中之二氧化矽之含量為30重量%以上，進而即便二氧化矽之含量為60重量%以上，亦能夠獲得流動性較高之樹脂組合物。因此，於樹脂材料配置於基板上之情形時，可使二氧化矽均勻存在。 關於環氧化合物之分子量、及後述之硬化劑之分子量，於環氧化合物或硬化劑不為聚合物之情形、及能夠特定環氧化合物或硬化劑之結構式之情形時，係指可由該結構式計算出之分子量。又，於環氧化合物或硬化劑為聚合物之情形時，係指重量平均分子量。 上述環氧化合物及後述之硬化劑(氰酸酯化合物及碳化二亞胺化合物)之重量平均分子量表示藉由凝膠滲透層析法(GPC)而測定之聚苯乙烯換算之重量平均分子量。 [硬化劑] 上述樹脂材料包含氰酸酯化合物及碳化二亞胺化合物作為硬化劑。 作為用於使環氧化合物硬化之硬化劑，存在各種硬化劑。作為用於使環氧化合物硬化之硬化劑，可列舉：氰酸酯化合物(氰酸酯硬化劑)、酚化合物(酚硬化劑)、胺化合物(胺硬化劑)、硫醇化合物(硫醇硬化劑)、咪唑化合物、膦化合物、酸酐、活性酯化合物、雙氰胺及碳化二亞胺化合物(碳化二亞胺硬化劑)等。於本發明中，作為硬化劑，至少使用氰酸酯化合物及碳化二亞胺化合物這2種。 作為上述氰酸酯化合物，可列舉：酚醛清漆型氰酸酯樹脂、雙酚型氰酸酯樹脂、以及該等一部分經三聚化而成之預聚物等。作為上述酚醛清漆型氰酸酯樹脂，可列舉：苯酚酚醛清漆型氰酸酯樹脂及烷基苯酚型氰酸酯樹脂等。作為上述雙酚型氰酸酯樹脂，可列舉：雙酚A型氰酸酯樹脂、雙酚E型氰酸酯樹脂及四甲基雙酚F型氰酸酯樹脂等。上述氰酸酯化合物可僅使用1種，亦可併用2種以上。 作為上述氰酸酯化合物之市售品，可列舉：苯酚酚醛清漆型氰酸酯樹脂(Lonza Japan公司製造之「PT-30」及「PT-60」)、及雙酚型氰酸酯樹脂經三聚化而成之預聚物(Lonza Japan公司製造之「BA-230S」、「BA-3000S」、「BTP-1000S」及「BTP-6020S」)等。 就更加有效地發揮提高保存穩定性、抑制泡狀體之產生、及提高硬化物與金屬層之密接性之效果之觀點而言，上述氰酸酯化合物之分子量較佳為200以上，更佳為300以上，較佳為4000以下，更佳為2000以下。 上述碳化二亞胺化合物具有下述式(1)所表示之結構單元。於下述式(1)中，右端部及左端部係與其他基之鍵結部位。上述碳化二亞胺化合物可僅使用1種，亦可併用2種以上。 [化1]上述式(1)中，X表示伸烷基、於伸烷基鍵結取代基而成之基、伸環烷基、於伸環烷基鍵結取代基而成之基、伸芳基、或於伸芳基鍵結取代基而成之基，p表示1～5之整數。於存在複數個X之情形時，複數個X可相同，亦可不同。 於X為伸烷基或於伸烷基鍵結取代基而成之基之情形時，該伸烷基之碳原子數較佳為1以上，較佳為20以下，更佳為10以下，進而較佳為6以下，特佳為4以下，最佳為3以下。作為該伸烷基之較佳之例，可列舉：亞甲基、伸乙基、伸丙基、及伸丁基。 於X為伸環烷基或於伸環烷基鍵結取代基而成之基之情形時，該伸環烷基之碳原子數較佳為3以上，較佳為20以下，更佳為12以下，進而較佳為6以下。作為該伸環烷基之較佳之例，可列舉：伸環丙基、伸環丁基、伸環戊基、及伸環己基。 於X為伸芳基或於伸芳基鍵結取代基而成之基之情形時，該伸芳基係自芳香族烴去除2個芳香環上之氫原子而成之基。該伸芳基之碳原子數較佳為6以上，較佳為24以下，更佳為18以下，進而較佳為14以下，特佳為10以下。作為該伸芳基之較佳之例，可列舉：伸苯基、伸萘基、及伸蒽基。 存在X為於伸烷基鍵結取代基而成之基、於伸環烷基鍵結取代基而成之基或於伸芳基鍵結取代基而成之基之情況。於該情形時，作為該取代基，未特別限定，例如可列舉：鹵素原子、烷基、烷氧基、環烷基、環烷氧基、芳基、芳氧基、醯基及醯氧基。作為用作取代基之鹵素原子，例如可列舉：氟原子、氯原子、溴原子及碘原子。作為取代基之烷基及烷氧基可為直鏈狀、支鏈狀之任一者。作為取代基之烷基及烷氧基之碳原子數較佳為1以上，較佳為20以下，更佳為10以下，進而較佳為6以下，特佳為4以下，最佳為3以下。作為取代基之環烷基及環烷氧基之碳原子數較佳為3以上，較佳為20以下，更佳為12以下，進而較佳為6以下。作為取代基之芳基係自芳香族烴去除1個芳香環上之氫原子而成之基。作為取代基之芳基之碳原子數較佳為6以上，較佳為24以下，更佳為18以下，進而較佳為14以下，特佳為10以下。作為取代基之芳氧基之碳原子數較佳為6以上，較佳為24以下，更佳為18以下，進而較佳為14以下，特佳為10以下。作為取代基之醯基係式：-C(=O)-R1所表示之基，該式中，R1表示烷基或芳基。R1所表示之烷基可為直鏈狀、支鏈狀之任一者。R1所表示之烷基之碳原子數較佳為1以上，較佳為20以下，更佳為10以下，進而較佳為6以下，特佳為4以下，最佳為3以下。R1所表示之芳基之碳原子數較佳為6以上，較佳為24以下，更佳為18以下，進而較佳為14以下，特佳為10以下。作為取代基之醯氧基係式：-O-C(=O)-R1所表示之基，該式中，R1表示與醯基之R1相同之含義。作為取代基，較佳為烷基、烷氧基、或醯氧基，更佳為烷基。 於較佳之一個形態中，至少1個X為伸烷基、於伸烷基鍵結取代基而成之基、伸環烷基、或於伸環烷基鍵結取代基而成之基。 於較佳之一個形態中，於將碳化二亞胺化合物之分子整體之重量設為100重量%時，碳化二亞胺化合物較佳為以50重量%以上、更佳為60重量%以上、進而較佳為70重量%以上、特佳為80重量%以上、最佳為90重量%以上具有式(1)所表示之結構單元。即，碳化二亞胺化合物較佳為以滿足上述含量之下限之方式包含式(1)所表示之結構單元。碳化二亞胺化合物亦可除末端結構以外之結構實質上為式(1)所表示之結構單元。作為碳化二亞胺化合物之末端結構，未特別限定，例如可列舉：烷基、於烷基鍵結取代基而成之基、環烷基、於環烷基鍵結取代基而成之基、芳基、及於芳基鍵結取代基而成之基。將作為末端結構之於烷基鍵結取代基而成之基、於環烷基鍵結取代基而成之基、及於芳基鍵結取代基而成之基中之取代基設為取代基A。作為該取代基A，可列舉：作為上述式(1)中之X為於伸烷基鍵結取代基而成之基、於伸環烷基鍵結取代基而成之基或於伸芳基鍵結取代基而成之基中之取代基而列舉之取代基。又，取代基A可與上述式(1)中之X為於伸烷基鍵結取代基而成之基、於伸環烷基鍵結取代基而成之基或於伸芳基鍵結取代基而成之基中之取代基相同，亦可不同。 再者，碳化二亞胺化合物有因其製造方法而具有異氰酸基(-N=C=O)之情況。就更加提高樹脂材料之保存穩定性之觀點、及實現顯示更加良好之特性之絕緣層之觀點而言，碳化二亞胺化合物中之異氰酸基之含量(亦稱為「NCO含量」)較佳為5重量%以下，更佳為4重量%以下，進一步較佳為3重量%以下，進而較佳為2重量%以下，特佳為1重量%以下，最佳為0.5重量%以下。碳化二亞胺化合物中之異氰酸基之含量亦可為0重量%(未含有)。 就更加有效地發揮提高保存穩定性、抑制泡狀體之產生、及提高硬化物與金屬層之密接性之效果之觀點而言，上述碳化二亞胺化合物較佳為具有脂環式骨架。特別是藉由使上述碳化二亞胺化合物具有脂環式骨架，保存穩定性更加提高。進而，藉由使上述碳化二亞胺化合物不具有芳香族骨架且具有脂環式骨架，保存穩定性變得非常高。 作為上述碳化二亞胺化合物之市售品，可列舉：Nisshinbo Chemical公司製造之Carbodilite(註冊商標)V-02B、V-03、V-04K、V-07、V-09、10M-SP、及10M-SP(改)、以及Rhein Chemie公司製造之Stabaxol(註冊商標)P、P400、及Hycasyl 510。 就更加有效地發揮提高保存穩定性、抑制泡狀體之產生、及提高硬化物與金屬層之密接性之效果之觀點而言，上述碳化二亞胺化合物之分子量較佳為500以上，更佳為1000以上，較佳為5000以下，更佳為3000以下。 將上述氰酸酯化合物之含量相對於上述碳化二亞胺化合物之含量之比記載為比(氰酸酯化合物之含量/碳化二亞胺化合物之含量)。就更加有效地發揮提高保存穩定性、抑制泡狀體之產生、及提高硬化物與金屬層之密接性之效果之觀點而言，上述比(氰酸酯化合物之含量/碳化二亞胺化合物之含量)以重量比計較佳為0.2以上，更佳為0.3以上，較佳為4.0以下，更佳為3.8以下。 將上述環氧化合物之含量相對於上述硬化劑之含量之比記載為比(環氧化合物之含量/硬化劑之含量)。就更加有效地發揮提高保存穩定性、抑制泡狀體之產生、及提高硬化物與金屬層之密接性之效果之觀點而言，上述比(環氧化合物之含量/硬化劑之含量)以重量比計較佳為1.0以上，更佳為1.2以上，較佳為3.0以下，更佳為2.8以下。上述硬化劑之含量係氰酸酯化合物之含量、碳化二亞胺化合物之含量、及調配其他硬化劑之情形時之其他硬化劑之合計含量。 上述樹脂材料中除上述二氧化矽及溶劑以外之成分100重量%中，上述環氧化合物與上述硬化劑之合計含量較佳為65重量%以上，更佳為70重量%以上，較佳為99重量%以下，更佳為97重量%以下。若上述環氧化合物與上述硬化劑之合計含量為上述下限以上及上述上限以下，則可獲得更加良好之硬化物，可更加抑制絕緣層之由熱所導致之尺寸變化。上述環氧化合物與上述硬化劑之含量比以環氧化合物進行硬化之方式適當地選擇。 [熱塑性樹脂] 上述樹脂材料亦可包含熱塑性樹脂。 作為上述熱塑性樹脂，可列舉：聚醯亞胺樹脂、聚乙烯醇縮醛樹脂及苯氧樹脂等。上述熱塑性樹脂可僅使用1種，亦可併用2種以上。 就不論硬化環境如何均有效地降低介電正切，且有效地提高金屬佈線之密接性之觀點而言，上述熱塑性樹脂較佳為苯氧樹脂。藉由使用苯氧樹脂，能夠抑制樹脂材料對電路基板之孔或凹凸之埋入性之變差及二氧化矽之不均勻化。又，藉由使用苯氧樹脂，能夠調整熔融黏度，故而二氧化矽之分散性變良好，且於硬化過程，樹脂材料難以濕潤擴散至未意圖之區域。上述苯氧樹脂未特別限定。作為上述苯氧樹脂，可使用先前公知之苯氧樹脂。上述苯氧樹脂可僅使用1種，亦可併用2種以上。 作為上述苯氧樹脂，例如可列舉：具有雙酚A型之骨架、雙酚F型之骨架、雙酚S型之骨架、聯苯骨架、酚醛清漆骨架、萘骨架及醯亞胺骨架等骨架之苯氧樹脂等。 作為上述苯氧樹脂之市售品，例如可列舉：新日鐵住金化學公司製造之「YP50」、「YP55」及「YP70」、以及三菱化學公司製造之「1256B40」、「4250」、「4256H40」、「4275」、「YX6954BH30」及「YX8100BH30」等。 就更加提高保存穩定性之觀點而言，上述熱塑性樹脂之重量平均分子量較佳為5000以上，更佳為10000以上，較佳為100000以下，更佳為50000以下。 上述熱塑性樹脂之上述重量平均分子量表示藉由凝膠滲透層析法(GPC)而測定之聚苯乙烯換算之重量平均分子量。 上述熱塑性樹脂之含量未特別限定。上述樹脂材料中除上述二氧化矽及溶劑以外之成分100重量%中，上述熱塑性樹脂之含量(於熱塑性樹脂為苯氧樹脂之情形時為苯氧樹脂之含量)較佳為2重量%以上，更佳為4重量%以上，較佳為15重量%以下，更佳為10重量%以下。若上述熱塑性樹脂之含量為上述下限以上及上述上限以下，則樹脂材料對電路基板之孔或凹凸之埋入性變良好。若上述熱塑性樹脂之含量為上述下限以上，則樹脂組合物之膜化更加容易，可獲得更加良好之絕緣層。若上述熱塑性樹脂之含量為上述上限以下，則硬化物之熱膨脹率更加降低。又，絕緣層之表面之表面粗糙度更加減小，絕緣層與金屬層之接著強度更加提高。 [二氧化矽] 上述樹脂材料包含二氧化矽作為無機填充材。藉由使用二氧化矽，硬化物之由熱所導致之尺寸變化更加減小。又，硬化物之介電正切更加減小。進而，與其他無機填充材相比，亦能夠更加提高硬化物與金屬層之接著強度。 就減小絕緣層之表面之表面粗糙度，更加提高絕緣層與金屬層之接著強度，且於硬化物之表面形成更加微細之佈線，且對硬化物賦予更加良好之絕緣可靠性之觀點而言，上述二氧化矽進而較佳為熔融二氧化矽。二氧化矽之形狀較佳為球狀。 上述二氧化矽之平均粒徑較佳為10 nm以上，更佳為50 nm以上，進而較佳為150 nm以上，較佳為20 μm以下，更佳為10 μm以下，進而較佳為5 μm以下，特佳為1 μm以下。若上述二氧化矽之平均粒徑為上述下限以上及上述上限以下，則藉由粗化處理等形成之孔之大小變微細，孔之數量變多。結果，硬化物與金屬層之接著強度更加提高。 作為上述二氧化矽之平均粒徑，採用成為50%之中值徑(d50)之值。上述平均粒徑可使用雷射繞射散射方式之粒度分佈測定裝置而測定。 上述二氧化矽較佳為球狀，更佳為球狀二氧化矽。於該情形時，硬化物之表面之表面粗糙度有效減小，進而硬化物與金屬層之接著強度有效提高。於上述二氧化矽為球狀之情形時，上述二氧化矽之縱橫比較佳為2以下，更佳為1.5以下。 上述二氧化矽較佳為經表面處理，更佳為利用偶合劑所得之表面處理物，進而較佳為利用矽烷偶合劑所得之表面處理物。藉此，硬化物之表面之表面粗糙度更加減小，硬化物與金屬層之接著強度更加提高，且能夠於硬化物之表面形成更加微細之佈線，且能夠對硬化物賦予更加良好之佈線間絕緣可靠性及層間絕緣可靠性。 作為上述偶合劑，可列舉：矽烷偶合劑、鈦偶合劑及鋁偶合劑等。作為上述矽烷偶合劑，可列舉：甲基丙烯醯基矽烷、丙烯醯基矽烷、胺基矽烷、咪唑矽烷、乙烯基矽烷及環氧矽烷等。 上述樹脂材料中除溶劑以外之成分100重量%中，上述二氧化矽之含量較佳為30重量%以上，更佳為40重量%以上，進而較佳為50重量%以上，特佳為60重量%以上，較佳為90重量%以下，更佳為85重量%以下，進而較佳為80重量%以下，特佳為75重量%以下。若上述二氧化矽之含量為上述下限以上，則硬化物之由熱所導致之尺寸變化更加減小。又，若上述二氧化矽之含量為上述下限以上及上述上限以下，則硬化物與金屬層之接著強度更加提高，且於硬化物之表面形成更加微細之佈線。 [硬化促進劑] 上述樹脂材料較佳為包含硬化促進劑。藉由使用上述硬化促進劑，硬化速度更加提高。藉由使樹脂材料快速硬化，未反應之官能基數量減少，結果交聯密度提高。上述硬化促進劑未特別限定，可使用先前公知之硬化促進劑。上述硬化促進劑可僅使用1種，亦可併用2種以上。 作為上述硬化促進劑，例如可列舉：咪唑化合物、磷化合物、胺化合物及有機金屬化合物等。 作為上述咪唑化合物，可列舉：2-十一烷基咪唑、2-十七烷基咪唑、2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、1-苄基-2-甲基咪唑、1-苄基-2-苯基咪唑、1,2-二甲基咪唑、1-氰基乙基-2-甲基咪唑、1-氰基乙基-2-乙基-4-甲基咪唑、1-氰基乙基-2-十一烷基咪唑、1-氰基乙基-2-苯基咪唑、1-氰基乙基-2-十一烷基咪唑鎓偏苯三酸鹽、1-氰基乙基-2-苯基咪唑鎓偏苯三酸鹽、2,4-二胺基-6-[2'-甲基咪唑基-(1')]-乙基-s-三、2,4-二胺基-6-[2'-十一烷基咪唑基-(1')]-乙基-s-三、2,4-二胺基-6-[2'-乙基-4'-甲基咪唑基-(1')]-乙基-s-三、2,4-二胺基-6-[2'-甲基咪唑基-(1')]-乙基-s-三異氰尿酸加成物、2-苯基咪唑異氰尿酸加成物、2-甲基咪唑異氰尿酸加成物、2-苯基-4,5-二羥基甲基咪唑及2-苯基-4-甲基-5-二羥基甲基咪唑等。 作為上述磷化合物，可列舉：三苯膦等。 作為上述胺化合物，可列舉：二乙胺、三乙胺、二伸乙基四胺、三伸乙基四胺及4,4-二甲基胺基吡啶等。 作為上述有機金屬化合物，可列舉：環烷酸鋅、環烷酸鈷、辛酸錫、辛酸鈷、雙乙醯丙酮鈷(II)及三乙醯丙酮鈷(III)等。 上述硬化促進劑之含量未特別限定。上述樹脂材料中除上述二氧化矽及溶劑以外之成分100重量%中，上述硬化促進劑之含量較佳為0.01重量%以上，更佳為0.9重量%以上，較佳為5.0重量%以下，更佳為3.0重量%以下。若上述硬化促進劑之含量為上述下限以上及上述上限以下，則樹脂材料有效率地硬化。若上述硬化促進劑之含量為更佳之範圍，則樹脂材料之保存穩定性更加提高，且可獲得更加良好之硬化物。 [溶劑] 上述樹脂材料不含或包含溶劑。藉由使用上述溶劑，能夠將樹脂材料之黏度控制於較佳之範圍，於樹脂材料為樹脂組合物之情形時能夠提高樹脂組合物之塗佈性。又，上述溶劑可用於獲得包含上述二氧化矽之漿料。上述溶劑可僅使用1種，亦可併用2種以上。 作為上述溶劑，可列舉：丙酮、甲醇、乙醇、丁醇、2-丙醇、2-甲氧基乙醇、2-乙氧基乙醇、1-甲氧基-2-丙醇、2-乙醯氧基-1-甲氧基丙烷、甲苯、二甲苯、甲基乙基酮、N,N-二甲基甲醯胺、甲基異丁基酮、N-甲基-吡咯啶酮、正己烷、環己烷、環己酮及作為混合物之石腦油等。 於樹脂材料為樹脂組合物之情形時，上述溶劑之大部分較佳為於將上述樹脂組合物成形為膜狀時被去除。因此，上述溶劑之沸點較佳為200℃以下，更佳為180℃以下。上述樹脂材料中之上述溶劑之含量未特別限定。於樹脂材料為樹脂組合物之情形時，能夠考慮上述樹脂材料之塗佈性等而適當變更上述溶劑之含量。 [其他成分] 亦可以改善耐衝擊性、耐熱性、樹脂之相溶性及作業性等為目的而於上述樹脂材料中添加調平劑、阻燃劑、偶合劑、著色劑、抗氧化劑、抗紫外線劣化劑、消泡劑、增黏劑、觸變性賦予劑及除環氧化合物以外之其他熱硬化性樹脂等。 作為上述偶合劑，可列舉：矽烷偶合劑、鈦偶合劑及鋁偶合劑等。作為上述矽烷偶合劑，可列舉：乙烯基矽烷、胺基矽烷、咪唑矽烷及環氧矽烷等。 作為上述其他熱硬化性樹脂，可列舉：聚苯醚樹脂、二乙烯基苄基醚樹脂、聚芳酯樹脂、鄰苯二甲酸二烯丙酯樹脂、聚醯亞胺、苯并㗁樹脂、苯并㗁唑樹脂、雙馬來醯亞胺樹脂及丙烯酸酯樹脂等。 (樹脂膜(B階段膜)及積層膜) 上述樹脂材料較佳為樹脂膜。藉由將樹脂組合物成形為膜狀，能夠獲得樹脂膜(B階段膜)。樹脂膜較佳為B階段膜。 就將樹脂膜之硬化度控制得更加均勻之觀點而言，上述樹脂膜之厚度較佳為5 μm以上，較佳為200 μm以下。 作為將上述樹脂組合物成形為膜狀之方法，例如可列舉：使用擠出機將樹脂材料進行熔融混練並擠出後，藉由T型模頭或圓形模頭等成形為膜狀之擠出成形法；澆鑄包含溶劑之樹脂材料而成形為膜狀之澆鑄成形法；以及先前公知之其他膜成形法等。就可應對薄型化而言，較佳為擠出成形法或澆鑄成形法。膜包括片。 藉由將上述樹脂組合物成形為膜狀，並加熱乾燥至不過度進行利用熱之硬化之程度，例如於50～150℃下加熱乾燥1～10分鐘，能夠獲得作為B階段膜之樹脂膜。 將能夠藉由如上所述之乾燥步驟獲得之膜狀樹脂材料稱為B階段膜。上述B階段膜係處於半硬化狀態之膜狀樹脂材料。半硬化物未完全硬化，可進一步進行硬化。 上述樹脂膜可不為預浸體。於上述樹脂膜不為預浸體之情形時，不會沿玻璃布等發生遷移。又，對樹脂膜進行層壓或預固化時，表面不會產生由玻璃布所導致之凹凸。上述樹脂材料能夠以具備基材、及積層於該基材之表面上之樹脂膜之積層膜之形態良好地使用。上述積層膜中之上述樹脂膜係藉由上述樹脂組合物而形成。 作為上述積層膜之上述基材，可列舉：金屬箔、聚對苯二甲酸乙二酯膜及聚對苯二甲酸丁二酯膜等聚酯樹脂膜、聚乙烯膜及聚丙烯膜等烯烴樹脂膜、及聚醯亞胺膜等。上述基材之表面視需要可進行脫模處理。上述基材可為金屬箔，亦可為樹脂膜。上述金屬箔較佳為銅箔。 (多層印刷佈線板) 本發明之多層印刷佈線板具備電路基板、配置於上述電路基板上之複數層絕緣層、及配置於複數層上述絕緣層間之金屬層。上述絕緣層內之至少1層為上述樹脂材料之硬化物。與上述電路基板接觸之絕緣層可為上述樹脂材料之硬化物。配置於2層絕緣層之間之絕緣層可為上述樹脂材料之硬化物。距上述電路基板最遠之絕緣層可為上述樹脂材料之硬化物。可於複數層上述絕緣層中之距上述電路基板最遠之絕緣層之外側之表面上配置金屬層。 上述多層印刷佈線板例如可藉由對上述樹脂膜進行加熱加壓成形而獲得。 可於上述樹脂膜之單面或雙面積層金屬箔。將上述樹脂膜與金屬箔積層之方法未特別限定，可使用公知之方法。例如，能夠使用平行平板壓機或滾筒貼合機等裝置，一面加熱或不加熱，一面加壓，一面將上述樹脂膜積層於金屬箔。 又，多層印刷佈線板之絕緣層可使用積層膜，藉由上述積層膜之上述樹脂膜而形成。上述絕緣層較佳為積層於電路基板之設有電路之表面上。上述絕緣層之一部分較佳為埋入至上述電路間。 於上述多層印刷佈線板中，較佳為上述絕緣層之與積層有上述電路基板之表面為相反側之表面經粗化處理。 粗化處理方法能夠使用先前公知之粗化處理方法，未特別限定。上述絕緣層之表面可於粗化處理之前經膨潤處理。 圖1係模式性地表示使用本發明之一實施形態之樹脂材料之多層印刷佈線板之剖視圖。 於圖1所示之多層印刷佈線板11中，於電路基板12之上表面12a積層有複數層絕緣層13～16。絕緣層13～16係硬化物層。於電路基板12之上表面12a之一部分之區域形成有金屬層17。於複數層絕緣層13～16中之除位於與電路基板12側相反之外側之表面的絕緣層16以外之絕緣層13～15中，於上表面之一部分之區域形成有金屬層17。金屬層17係電路。於電路基板12與絕緣層13之間、及積層之絕緣層13～16之各層間分別配置有金屬層17。下方之金屬層17與上方之金屬層17係藉由未圖示之導通孔連接及通孔連接中之至少一種而相互連接。 於多層印刷佈線板11中，絕緣層13～16係藉由上述樹脂材料而形成。於本實施形態中，絕緣層13～16之表面經粗化處理，故而於絕緣層13～16之表面形成有未圖示之微細之孔。又，金屬層17到達至微細之孔之內部。又，於多層印刷佈線板11中，能夠減小金屬層17之寬度方向尺寸(L)、及未形成金屬層17之部分之寬度方向尺寸(S)。又，於多層印刷佈線板11中，對未利用未圖示之導通孔連接及通孔連接而連接之上方之金屬層與下方之金屬層之間賦予有良好之絕緣可靠性。 (粗化處理及膨潤處理) 上述樹脂材料較佳為用於獲得供進行粗化處理或除膠渣處理之硬化物。上述硬化物亦包括能夠進一步硬化之預硬化物。 為了於藉由使上述樹脂材料預硬化而獲得之硬化物之表面形成微細之凹凸，硬化物較佳為進行粗化處理。粗化處理之前，硬化物較佳為進行膨潤處理。硬化物較佳為於預硬化之後且進行粗化處理之前進行膨潤處理，且進而於粗化處理之後進行硬化。但硬化物亦可未必進行膨潤處理。 作為上述膨潤處理之方法，例如，可使用藉由以乙二醇等為主成分之化合物之水溶液或有機溶劑分散溶液等處理硬化物之方法。用於膨潤處理之膨潤液一般係作為pH調整劑等，且包含鹼。膨潤液較佳為包含氫氧化鈉。具體而言，例如，上述膨潤處理係藉由使用40重量%乙二醇水溶液等，於處理溫度30～85℃下對硬化物處理1～30分鐘而進行。上述膨潤處理之溫度較佳為50～85℃之範圍內。若上述膨潤處理之溫度過低，則膨潤處理需要較長時間，進而有絕緣層與金屬層之接著強度降低之傾向。 於上述粗化處理中，例如，可使用錳化合物、鉻化合物或過硫酸化合物等化學氧化劑等。該等化學氧化劑添加水或有機溶劑後，作為水溶液或有機溶劑分散溶液使用。用於粗化處理之粗化液一般係作為pH值調整劑等，且包含鹼。粗化液較佳為包含氫氧化鈉。 作為上述錳化合物，可列舉：過錳酸鉀及過錳酸鈉等。作為上述鉻化合物，可列舉：重鉻酸鉀及無水鉻酸鉀等。作為上述過硫酸化合物，可列舉：過硫酸鈉、過硫酸鉀及過硫酸銨等。 上述粗化處理之方法未特別限定。作為上述粗化處理之方法，例如，較佳為使用30～90 g/L過錳酸或過錳酸鹽溶液及30～90 g/L氫氧化鈉溶液，於處理溫度30～85℃及1～30分鐘之條件下處理硬化物之方法。上述粗化處理之溫度較佳為50～85℃之範圍內。上述粗化處理之次數較佳為1次或2次。 硬化物之表面之算術平均粗糙度Ra較佳為10 nm以上，較佳為未達200 nm，更佳為未達100 nm，進而較佳為未達50 nm。若算術平均粗糙度Ra為上述下限以上及未達上述上限，則能夠有效抑制電氣訊號之導體損耗，能夠較大地抑制傳輸損耗。進而，能夠於絕緣層之表面形成更加微細之佈線。上述算術平均粗糙度Ra係依據JIS B0601(1994)進行測定。 (除膠渣處理) 存在於藉由使上述樹脂材料預硬化而獲得之硬化物形成貫通孔之情況。於上述多層基板等中，形成導通孔或通孔等作為貫通孔。例如，導通孔可藉由CO2
雷射等雷射之照射而形成。導通孔之直徑未特別限定，為60～80 μm左右。多數情況下會因上述貫通孔之形成而於導通孔內之底部形成源自硬化物所包含之樹脂成分之樹脂之殘渣即膠渣。 為了去除上述膠渣，硬化物之表面較佳為進行除膠渣處理。除膠渣處理亦有兼作粗化處理之情況。 於上述除膠渣處理中，與上述粗化處理同樣地例如使用錳化合物、鉻化合物或過硫酸化合物等化學氧化劑等。該等化學氧化劑添加水或有機溶劑後，作為水溶液或有機溶劑分散溶液使用。用於除膠渣處理之除膠渣處理液一般包含鹼。除膠渣處理液較佳為包含氫氧化鈉。 上述除膠渣處理之方法未特別限定。作為上述除膠渣處理之方法，例如，較佳為使用30～90 g/L過錳酸或過錳酸鹽溶液及30～90 g/L氫氧化鈉溶液，於處理溫度30～85℃及1～30分鐘之條件下，處理硬化物1次或2次之方法。上述除膠渣處理之溫度較佳為50～85℃之範圍內。 藉由使用上述樹脂材料，經除膠渣處理之絕緣層之表面之表面粗糙度充分減小。 以下，藉由列舉實施例及比較例而具體地說明本發明。本發明並不限定於以下之實施例。 (環氧化合物) 雙酚A型環氧樹脂(DIC公司製造之「850-S」) 萘型環氧樹脂(DIC公司製造之「HP-4032D」) 聯苯酚醛清漆型環氧樹脂(日本化藥公司製造之「NC-3000」) 雙酚F型環氧樹脂(DIC公司製造之「830-S」) 聯苯型環氧樹脂(三菱化學公司製造之「YX-4000H」) 二環戊二烯型環氧樹脂(日本化藥公司製造之「XD-1000」) (硬化劑) 含碳化二亞胺樹脂之液體(Nisshinbo Chemical公司製造之「V-03」，固形物成分50重量%) 碳化二亞胺樹脂(Nisshinbo Chemical公司製造之「10M-SP(改)」) 酚醛清漆型酚樹脂(明和化成公司製造之「H-4」) 含氰酸酯樹脂之液體(Lonza Japan公司製造之「BA-3000S」，固形物成分75重量%) 氰酸酯樹脂(Lonza Japan公司製造之「PT-30」) (硬化促進劑) 咪唑化合物(2-苯基-4-甲基咪唑、四國化成工業公司製造之「2P4MZ」) (二氧化矽) 含二氧化矽之漿料(二氧化矽70重量%，Admatechs公司製造之「SC-2050-HNK」，平均粒徑0.5 μm，胺基矽烷處理，環己酮30重量%) (氧化鋁) 含氧化鋁之漿料(氧化鋁70重量%，Admatechs公司製造之「AC-2050-MOE」，平均粒徑0.6 μm，胺基矽烷處理，甲基乙基酮25重量%) (熱塑性樹脂) 含苯氧樹脂之液體(三菱化學公司製造之「YX6954BH30」，固形物成分30重量%) (實施例1～11及比較例1～4) 以下述表1、2所示之調配量調配下述表1、2所示之成分，使用攪拌機以1200 rpm攪拌4小時，獲得樹脂組合物清漆。 使用敷料器，於聚對苯二甲酸乙二酯(PET)膜(東麗公司製造之「XG284」，厚度25 μm)之脫模處理面上塗佈所獲得之樹脂材料(樹脂組合物清漆)後，於100℃之吉爾烘箱內乾燥3分鐘，使溶劑揮發。如此，獲得具有PET膜及該PET膜上之厚度為40 μm、溶劑之殘餘量為1.0重量%以上且3.0重量%以下之樹脂膜(B階段膜)之積層膜。 其後，將積層膜以190℃加熱90分鐘，製作樹脂膜硬化之硬化物。 (評價) (1)剝離強度(90°剝離強度) 將藉由蝕刻而形成有內層電路之100 mm見方之CCL(copper clad laminate，包銅層板)基板(日立化成工業公司製造之「E679FG」)之雙面浸漬於銅表面粗化劑(MEC公司製造之「MECetchBOND CZ-8101」)，對銅表面進行粗化處理。將所獲得之積層膜自樹脂膜側安放於上述CCL基板之雙面，獲得積層體。對該積層體，使用真空加壓式貼合機(名機製作所公司製造之「MVLP-500」)，減壓20秒而將氣壓設為13 hPa以下，其後，於層壓壓力0.4 MPa及層壓溫度100℃下層壓20秒，進而於壓製壓力1.0 MPa及壓製溫度100℃下壓製40秒。 其次，於180℃及30分鐘之硬化條件下使樹脂膜硬化。其後，自樹脂膜剝離PET膜，獲得硬化積層樣品。 於60℃之膨潤液(由Atotech Japan公司製造之「Swelling Dip Securiganth P」及和光純藥工業公司製造之「氫氧化鈉」製備之水溶液)中放入上述硬化積層樣品，於膨潤溫度60℃下搖動10分鐘。其後，以純水洗淨。 於80℃之過錳酸鈉粗化水溶液(Atotech Japan公司製造之「Concentrate Compact CP」、和光純藥工業公司製造之「氫氧化鈉」)中放入經膨潤處理之上述硬化積層樣品，於粗化溫度80℃下搖動20分鐘。其後，藉由25℃之洗淨液(Atotech Japan公司製造之「Reduction Securiganth P」、和光純藥工業公司製造之「硫酸」)洗淨2分鐘後，以純水進一步洗淨。如此，於藉由蝕刻而形成有內層電路之CCL基板上形成經粗化處理之硬化物。 對上述經粗化處理之硬化物之表面以60℃之鹼清潔液(Atotech Japan公司製造之「Cleaner Securiganth 902」)處理5分鐘，進行脫脂洗淨。洗淨後，對上述硬化物以25℃之預浸液(Atotech Japan公司製造之「Pre-Dip Neoganth B」)處理2分鐘。其後，對上述硬化物以40℃之觸媒液(Atotech Japan公司製造之「Activator Neoganth 834」)處理5分鐘，賦予鈀觸媒。其次，藉由30℃之還原液(Atotech Japan公司製造之「Reducer Neoganth WA」)對硬化物處理5分鐘。 其次，將上述硬化物放入至化學銅液(均為Atotech Japan公司製造，「Basic Printganth MSK-DK」、「Copper Printganth MSK」、「Stabilizer Printganth MSK」、「Reducer Cu」)，實施無電解鍍覆至鍍層厚度成為0.5 μm左右。無電解鍍覆後，為了去除殘留之氫氣，於120℃之溫度下退火30分鐘。至無電解鍍覆之步驟之所有步驟係以實驗室規模(beaker scale)將處理液設為2 L，一面搖動硬化物一面實施。 其次，對經無電解鍍覆處理之硬化物實施電解鍍覆至鍍層厚度成為25 μm。作為電解鍍銅，使用硫酸銅溶液(和光純藥工業公司製造之「硫酸銅五水合物」、和光純藥工業公司製造之「硫酸」、Atotech Japan公司製造之「Basic Leveler Cupracid HL」、Atotech Japan公司製造之「Correcting Agent Cupracid GS」)，通入0.6 A/cm2
之電流，實施電解鍍覆至鍍層厚度成為25 μm左右。鍍銅處理後，將硬化物以190℃加熱90分鐘，使硬化物進一步硬化。如此，獲得於上表面積層有鍍銅層之硬化物。 於所獲得之積層有鍍銅層之硬化物中，對鍍銅層之表面切入10 mm寬之切口。其後，使用拉伸試驗機(島津製作所公司製造之「AG-5000B」)，於十字頭速度5 mm/分鐘之條件下，測定硬化物(絕緣層)與金屬層(鍍銅層)之剝離強度(90°剝離強度)。 [剝離強度之判定基準] ○：剝離強度為0.5 kgf/cm以上 △：剝離強度為0.4 kgf/cm以上且未達0.5 kgf/cm ×：剝離強度未達0.4 kgf/cm (2)樹脂材料之保存穩定性 將所獲得之積層膜於25℃下分別保管3天及5天。 準備覆銅積層板(厚度150 μm之玻璃環氧基板與厚度35 μm之銅箔之積層體)。對銅箔進行蝕刻處理，製作26條L/S為50 μm/50 μm及長度為1 cm之銅圖案，獲得凹凸基板。將保管後之積層膜自樹脂膜側與上述凹凸基板之凹凸表面重疊而安放於雙面，獲得積層體。對該積層體使用真空加壓式貼合機(名機製作所公司製造之「MVLP-500」)減壓20秒而將氣壓設為13 hPa以下，其後，於層壓壓力0.4 MPa及層壓溫度100℃下層壓20秒，進而於壓製壓力1.0 MPa及壓製溫度100℃下壓製40秒。如此，獲得於凹凸基板上積層有樹脂膜之積層體A。於積層體A之狀態下，使用VEECO公司製造之「WYKO」，測定積層體A中之樹脂膜之上表面之凹凸值。具體而言，將凹凸之相鄰之凹部部分與凸部部分之高低差之最大值用作凹凸值。如此，評價層壓試驗中凹凸之狀態之有無。以下述基準判定樹脂材料之保存穩定性。 [樹脂材料之保存穩定性之判定基準] ○：於3天後及5天後之樹脂膜中，樹脂填充於銅圖案內，凹凸值為0.5 μm以下 △：於3天後之樹脂膜中，樹脂填充於銅圖案內，凹凸值為0.5 μm以下，但於5天後之樹脂膜中，樹脂未填充於銅圖案內，或凹凸值超過0.5 μm ×：於3天後及5天後之樹脂膜中，樹脂未填充於銅圖案內，或凹凸值超過0.5 μm (3)泡狀體之抑制性 使用積層有鍍銅層之100 mm見方之硬化物，依據JEDEC(Joint Electron Device Engineering Council，聯合電子設備工程協會)之LEVEL3，進行上述基板之吸濕(溫度60℃及濕度60 RH%下40小時)。其後，進行上述基板之氮氣回流焊處理(峰頂溫度260℃)。再者，回流焊係反覆進行30次。以目視確認回流焊後有無泡狀體產生。 [泡狀體之抑制性之判定基準] ○：於30次之回流焊中無泡狀體產生 △：於20次之回流焊中無泡狀體產生，於21～29次之回流焊中產生泡狀體 ×：於20次以下之回流焊中產生泡狀體 (4)平均線膨脹係數(CTE) 將所獲得之硬化物(使用厚度40 μm之樹脂膜)裁剪為3 mm×25 mm之大小。使用熱機械分析裝置(SII NanoTechnology公司製造之「EXSTARTMA/SS6100」)，於拉伸負荷33 mN及升溫速度5℃/分鐘之條件下，計算出所裁剪之硬化物之25℃～150℃之平均線膨脹係數(ppm/℃)。 將組成及結果示於下述表1、2。 [表1]
[表2] Hereinafter, the present invention will be described in detail. The resin material of the present invention includes an epoxy compound, a hardener, and silicon dioxide. In the resin material of the present invention, the hardener includes a cyanate compound and a carbodiimide compound. In this invention, since it has the said structure, generation | occurrence | production of a bubble can be suppressed. For example, even if the resin film (resin material) or the hardened material of the resin material absorbs moisture, it is difficult to generate blisters. Furthermore, in this invention, since it has the said structure, storage stability can be improved. Even if the resin material of the present invention is stored for a certain period of time, the resin material can be satisfactorily embedded in holes or uneven surfaces. For example, in a multilayer printed wiring board, an insulating layer is formed on the wiring. Since there are wirings on the surface where the insulating layer is formed, there are irregularities. By using the resin material of the present invention, an insulating layer can be buried well in a wiring, and generation of voids can be suppressed. Furthermore, in this invention, since it has the said structure, the adhesiveness of a hardened | cured material (insulation layer etc.) and a metal layer can also be improved. For example, the peeling strength of a metal layer to a hardened | cured material can be improved. Furthermore, in the present invention, since the above-mentioned structure is provided, when the resin composition is formed into a film after storage for a certain period of time, the uniformity of the film can be improved, and when the resin material is cured, the uniformity of the cured product can be improved. The resin material of the present invention may be a resin composition or a resin film. The resin composition has fluidity. The resin composition may be in a paste form. The above paste includes a liquid state. In terms of excellent workability, the resin material of the present invention is preferably a resin film. Further, in the present invention, even if the resin material is a resin film, the resin film can be satisfactorily embedded in a hole or an uneven surface. The resin material of the present invention is suitable for forming an insulating layer on a multilayer printed wiring board because of its excellent properties. Since the resin material of the present invention is excellent in the aforementioned properties, it is preferably a resin material for a multilayer printed wiring board, and more preferably a resin material for interlayer insulation of a multilayer printed wiring board. In the multilayer printed wiring board described above, the thickness (thickness of each layer) of the insulating layer formed of the resin material is preferably equal to or greater than the thickness of the conductor layer (metal layer) forming the circuit. The thickness (thickness of each layer) of the insulating layer is preferably 5 μm or more, and more preferably 200 μm or less. The resin material of the present invention is suitable for obtaining a hardened material for roughening treatment. Hereinafter, details of each component used in the resin material of the present invention, and applications of the resin material of the present invention will be described. [Epoxy Compound] The epoxy compound contained in the resin material is not particularly limited. As the epoxy compound, a conventionally known epoxy compound can be used. The epoxy compound refers to an organic compound having at least one epoxy group. These epoxy compounds may be used alone or in combination of two or more. Examples of the epoxy compound include bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin, biphenyl epoxy resin, and biphenol. Novolac epoxy resin, biphenol epoxy resin, naphthalene epoxy resin, fluorene epoxy resin, phenol aralkyl epoxy resin, naphthol aralkyl epoxy resin, dicyclopentadiene Type epoxy resin, anthracene type epoxy resin, epoxy resin having an adamantane skeleton, epoxy resin having a tricyclodecane skeleton, and epoxy resin having a trinuclear skeleton. From the viewpoint of more effectively exerting the effects of improving storage stability, suppressing the generation of vesicles, and improving the adhesion between the hardened material and the metal layer, the epoxy compound preferably has an aromatic skeleton, and more preferably has an aromatic skeleton. The biphenyl skeleton is preferably a biphenyl type epoxy compound. In addition, when the epoxy compound has a biphenyl skeleton, the bonding strength between the cured product and the metal layer is further improved. The molecular weight of the epoxy compound is more preferably 1,000 or less. In this case, even if the content of silicon dioxide in 100% by weight of components other than the solvent in the resin material is 30% by weight or more, and even if the content of silicon dioxide is 60% by weight or more, high fluidity can be obtained Resin composition. Therefore, when the resin material is disposed on the substrate, silicon dioxide can be uniformly present. As for the molecular weight of the epoxy compound and the molecular weight of the hardener described later, when the epoxy compound or hardener is not a polymer, and when the structural formula of the epoxy compound or hardener can be specified, it means that the structure The molecular weight calculated by the formula. When the epoxy compound or the hardener is a polymer, it means a weight average molecular weight. The weight average molecular weight of the said epoxy compound and the hardening | curing agent (cyanate ester compound and carbodiimide compound mentioned later) shows the weight average molecular weight of polystyrene conversion measured by gel permeation chromatography (GPC). [Hardener] The resin material contains a cyanate compound and a carbodiimide compound as a hardener. As a hardener for hardening an epoxy compound, various hardeners exist. Examples of the hardening agent for hardening the epoxy compound include a cyanate compound (cyanate hardener), a phenol compound (phenol hardener), an amine compound (amine hardener), and a thiol compound (thiol hardening). Agents), imidazole compounds, phosphine compounds, acid anhydrides, active ester compounds, dicyandiamide and carbodiimide compounds (carbodiimide hardeners) and the like. In the present invention, as the curing agent, at least two kinds of cyanate ester compounds and carbodiimide compounds are used. Examples of the cyanate ester compound include a novolac-type cyanate resin, a bisphenol-type cyanate resin, and a prepolymer obtained by trimering a part of these. Examples of the novolac-type cyanate resin include a phenol novolac-type cyanate resin and an alkylphenol-type cyanate resin. Examples of the bisphenol type cyanate resin include a bisphenol A type cyanate resin, a bisphenol E type cyanate resin, and a tetramethylbisphenol F type cyanate resin. These cyanate ester compounds may be used alone or in combination of two or more. Examples of commercially available products of the cyanate ester compounds include phenol novolac type cyanate resins ("PT-30" and "PT-60" manufactured by Lonza Japan) and bisphenol type cyanate resins. Prepolymers obtained by trimerization ("BA-230S", "BA-3000S", "BTP-1000S", "BTP-6020S", etc., manufactured by Lonza Japan). From the viewpoint of more effectively exerting the effects of improving storage stability, suppressing the generation of vesicles, and improving the adhesion between the hardened material and the metal layer, the molecular weight of the cyanate ester compound is preferably 200 or more, more preferably 300 or more, preferably 4000 or less, and more preferably 2000 or less. The carbodiimide compound has a structural unit represented by the following formula (1). In the following formula (1), the right end portion and the left end portion are bonded portions with other bases. These carbodiimide compounds may be used alone or in combination of two or more. [Chemical 1] In the above formula (1), X represents an alkylene group, a group obtained by bonding a substituent to an alkylene group, a cycloalkyl group, a group obtained by bonding a substituent to a cycloalkylene group, an aromatic group, or A group in which a substituent is bonded to an arylene group, and p represents an integer of 1 to 5. When there are a plurality of Xs, the plurality of Xs may be the same or different. When X is an alkylene group or a group obtained by bonding a substituent to an alkylene group, the carbon number of the alkylene group is preferably 1 or more, preferably 20 or less, more preferably 10 or less, and furthermore, It is preferably 6 or less, particularly preferably 4 or less, and most preferably 3 or less. Preferable examples of the alkylene group include methylene, ethylene, propyl, and butylene. In the case where X is a cycloalkyl group or a group obtained by bonding a substituent to a cycloalkyl group, the carbon number of the cycloalkyl group is preferably 3 or more, preferably 20 or less, and more preferably 12 Hereinafter, it is more preferably 6 or less. Preferred examples of the cycloalkyl group include cyclopropyl, cyclobutyl, cyclopentyl, and cyclohexyl. When X is an arylene group or a group obtained by bonding a substituent to an arylene group, the arylene group is a group obtained by removing hydrogen atoms on two aromatic rings from an aromatic hydrocarbon. The number of carbon atoms of the arylene group is preferably 6 or more, preferably 24 or less, more preferably 18 or less, even more preferably 14 or less, and particularly preferably 10 or less. Preferred examples of the arylene group include a phenylene group, a naphthyl group, and an anthracenyl group. In some cases, X is a group obtained by bonding a substituent to an alkylene group, a group obtained by bonding a substituent by a cycloalkyl group, or a group obtained by bonding a substituent by an alkylene group. In this case, the substituent is not particularly limited, and examples thereof include a halogen atom, an alkyl group, an alkoxy group, a cycloalkyl group, a cycloalkoxy group, an aryl group, an aryloxy group, a fluorenyl group, and a fluorenyl group. . Examples of the halogen atom used as a substituent include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. The alkyl group and the alkoxy group as a substituent may be either linear or branched. The number of carbon atoms of the alkyl group and alkoxy group as a substituent is preferably 1 or more, preferably 20 or less, more preferably 10 or less, even more preferably 6 or less, particularly preferably 4 or less, and most preferably 3 or less. . The number of carbon atoms of the cycloalkyl group and the cycloalkoxy group as a substituent is preferably 3 or more, preferably 20 or less, more preferably 12 or less, and even more preferably 6 or less. The aryl group as a substituent is a group obtained by removing a hydrogen atom on an aromatic ring from an aromatic hydrocarbon. The number of carbon atoms of the aryl group as a substituent is preferably 6 or more, preferably 24 or less, more preferably 18 or less, even more preferably 14 or less, and particularly preferably 10 or less. The number of carbon atoms of the aryloxy group as a substituent is preferably 6 or more, preferably 24 or less, more preferably 18 or less, even more preferably 14 or less, and particularly preferably 10 or less. The fluorenyl group as a substituent is a group represented by -C (= O) -R1, where R1 represents an alkyl group or an aryl group. The alkyl group represented by R1 may be either linear or branched. The number of carbon atoms of the alkyl group represented by R1 is preferably 1 or more, preferably 20 or less, more preferably 10 or less, even more preferably 6 or less, particularly preferably 4 or less, and most preferably 3 or less. The number of carbon atoms of the aryl group represented by R1 is preferably 6 or more, preferably 24 or less, more preferably 18 or less, even more preferably 14 or less, and particularly preferably 10 or less. The alkoxy group formula as a substituent: a group represented by -OC (= O) -R1. In this formula, R1 has the same meaning as R1 of a fluorenyl group. As a substituent, an alkyl group, an alkoxy group, or a fluorenyl group is preferable, and an alkyl group is more preferable. In a preferred form, at least one X is an alkylene group, a group bonded to a alkylene group, a cycloalkyl group, or a group bonded to a cycloalkylene group. In a preferred form, when the entire molecular weight of the carbodiimide compound is 100% by weight, the carbodiimide compound is preferably 50% by weight or more, more preferably 60% by weight or more, and more preferably It is preferably 70% by weight or more, particularly preferably 80% by weight or more, and most preferably 90% by weight or more, and has a structural unit represented by the formula (1). That is, the carbodiimide compound preferably contains a structural unit represented by the formula (1) so as to satisfy the lower limit of the content. The carbodiimide compound may have a structure other than the terminal structure as a structural unit represented by formula (1). The terminal structure of the carbodiimide compound is not particularly limited, and examples thereof include an alkyl group, a group in which a substituent is bonded to an alkyl group, a cycloalkyl group, a group in which a substituent is bonded to a cycloalkyl group, An aryl group and a group in which a substituent is bonded to an aryl group. As the terminal structure, the group consisting of a substituent bonded to an alkyl group, a substituent bonded to a cycloalkyl group, and a substituent bonded to a substituent of an aryl group are defined as substituents. A. Examples of the substituent A include a group in which X in the formula (1) is a substituent bonded to an alkylene group, a group bonded to a substituent in a cycloalkylene group, or a group in which the aromatic group is an alkylene group. Examples of the substituents in the group in which the substituents are bonded. Furthermore, the substituent A may be substituted with X in the formula (1) by a substituent bonded to an alkylene group, a substituent bonded by a cycloalkylene group, or a substituent substituted by an alkylene group. The substituents in the base group are the same or different. Moreover, the carbodiimide compound may have an isocyanate group (-N = C = O) depending on the manufacturing method. From the viewpoint of further improving the storage stability of the resin material and the viewpoint of realizing an insulating layer exhibiting better characteristics, the content of the isocyanate group in the carbodiimide compound (also referred to as "NCO content") is smaller than It is preferably 5 wt% or less, more preferably 4 wt% or less, still more preferably 3 wt% or less, still more preferably 2 wt% or less, particularly preferably 1 wt% or less, and most preferably 0.5 wt% or less. The content of the isocyanate group in the carbodiimide compound may be 0% by weight (not contained). From the viewpoint of more effectively exerting the effects of improving storage stability, suppressing the generation of vesicles, and improving the adhesion between the hardened material and the metal layer, the carbodiimide compound preferably has an alicyclic skeleton. In particular, when the carbodiimide compound has an alicyclic skeleton, storage stability is further improved. Furthermore, by making the carbodiimide compound not have an aromatic skeleton and an alicyclic skeleton, the storage stability becomes very high. Examples of commercially available products of the carbodiimide compound include Carbodilite (registered trademark) V-02B, V-03, V-04K, V-07, V-09, 10M-SP, and Nisshinbo Chemical Company. 10M-SP (modified), and Stabaxol (registered trademark) P, P400, and Hycasyl 510 manufactured by Rhein Chemie. From the viewpoint of more effectively exerting the effects of improving storage stability, suppressing the generation of vesicles, and improving the adhesion between the hardened material and the metal layer, the molecular weight of the carbodiimide compound is preferably 500 or more, more preferably It is 1,000 or more, preferably 5,000 or less, and more preferably 3,000 or less. The ratio of the content of the cyanate compound to the content of the carbodiimide compound is described as a ratio (content of the cyanate compound / content of the carbodiimide compound). From the viewpoint of more effectively exerting the effects of improving storage stability, suppressing the generation of vesicles, and improving the adhesion between the hardened material and the metal layer, the above ratio (content of cyanate compound / carbodiimide compound The content) is preferably 0.2 or more, more preferably 0.3 or more, more preferably 4.0 or less, and still more preferably 3.8 or less by weight ratio. The ratio of the content of the epoxy compound to the content of the hardener is described as a ratio (content of the epoxy compound / content of the hardener). From the viewpoint of more effectively exerting the effects of improving storage stability, suppressing the generation of vesicles, and improving the adhesion between the hardened material and the metal layer, the above ratio (content of the epoxy compound / content of the hardener) is based on weight The ratio is preferably 1.0 or more, more preferably 1.2 or more, more preferably 3.0 or less, and even more preferably 2.8 or less. The content of the above-mentioned hardener is the total content of the cyanate compound, the content of the carbodiimide compound, and other hardeners when other hardeners are blended. In the resin material, the total content of the epoxy compound and the hardener is preferably 65% by weight or more, more preferably 70% by weight or more, and 100% by weight of the components other than the silica and the solvent. It is not more than 97% by weight, more preferably not more than 97% by weight. If the total content of the above-mentioned epoxy compound and the above-mentioned hardener is above the above-mentioned lower limit and below the above-mentioned upper limit, a better hardened material can be obtained, and the dimensional change caused by heat of the insulating layer can be more suppressed. The content ratio of the said epoxy compound and the said hardening | curing agent is suitably selected so that an epoxy compound may harden. [Thermoplastic resin] The resin material may include a thermoplastic resin. Examples of the thermoplastic resin include polyimide resin, polyvinyl acetal resin, and phenoxy resin. These thermoplastic resins may be used alone or in combination of two or more. From the viewpoint of effectively reducing the dielectric tangent regardless of the hardening environment and effectively improving the adhesion of the metal wiring, the thermoplastic resin is preferably a phenoxy resin. By using a phenoxy resin, it is possible to suppress deterioration of the embedding property of the resin material into the holes or irregularities of the circuit board and unevenness of the silicon dioxide. In addition, by using a phenoxy resin, the melt viscosity can be adjusted, so the dispersibility of silicon dioxide becomes good, and during the hardening process, the resin material is difficult to wet and spread to unintended areas. The phenoxy resin is not particularly limited. As the phenoxy resin, a conventionally known phenoxy resin can be used. The phenoxy resin may be used alone or in combination of two or more. Examples of the phenoxy resin include a bisphenol A-type skeleton, a bisphenol F-type skeleton, a bisphenol S-type skeleton, a biphenyl skeleton, a novolac skeleton, a naphthalene skeleton, and a pyrimide skeleton. Phenoxy resin, etc. Examples of commercially available phenoxy resins include "YP50", "YP55" and "YP70" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., and "1256B40", "4250", "4256H40" manufactured by Mitsubishi Chemical Co., Ltd. "," 4275 "," YX6954BH30 ", and" YX8100BH30 ". From the viewpoint of further improving storage stability, the weight average molecular weight of the thermoplastic resin is preferably 5,000 or more, more preferably 10,000 or more, more preferably 100,000 or less, and even more preferably 50,000 or less. The said weight average molecular weight of the said thermoplastic resin shows the weight average molecular weight of polystyrene conversion measured by gel permeation chromatography (GPC). The content of the thermoplastic resin is not particularly limited. The content of the thermoplastic resin (the content of the phenoxy resin in the case where the thermoplastic resin is a phenoxy resin) in 100% by weight of the components other than the silica and the solvent in the resin material is preferably 2% by weight or more. It is more preferably 4% by weight or more, more preferably 15% by weight or less, and even more preferably 10% by weight or less. When the content of the thermoplastic resin is greater than or equal to the above lower limit and less than or equal to the above upper limit, the embedding property of the resin material into the holes or irregularities of the circuit board becomes good. If the content of the thermoplastic resin is greater than or equal to the above lower limit, the film formation of the resin composition will be easier, and a more favorable insulating layer can be obtained. When the content of the thermoplastic resin is equal to or less than the above upper limit, the thermal expansion coefficient of the cured product is further reduced. In addition, the surface roughness of the surface of the insulating layer is further reduced, and the bonding strength between the insulating layer and the metal layer is further improved. [Silicon Dioxide] The resin material includes silicon dioxide as an inorganic filler. By using silicon dioxide, the dimensional change of the hardened material caused by heat is further reduced. In addition, the dielectric tangent of the hardened material is further reduced. Furthermore, compared with other inorganic fillers, the bonding strength between the hardened material and the metal layer can be further improved. From the viewpoint of reducing the surface roughness of the surface of the insulating layer, further improving the bonding strength between the insulating layer and the metal layer, forming finer wiring on the surface of the hardened material, and imparting better insulation reliability to the hardened material The above-mentioned silicon dioxide is more preferably fused silicon dioxide. The shape of the silicon dioxide is preferably spherical. The average particle diameter of the silicon dioxide is preferably 10 nm or more, more preferably 50 nm or more, still more preferably 150 nm or more, preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm. Hereinafter, it is particularly preferred that it is 1 μm or less. When the average particle diameter of the silicon dioxide is equal to or greater than the lower limit and equal to or lower than the upper limit, the size of the pores formed by the roughening treatment and the like becomes fine, and the number of the pores increases. As a result, the bonding strength between the hardened material and the metal layer is further improved. As the average particle diameter of the silicon dioxide, a value having a median diameter (d50) of 50% is adopted. The average particle diameter can be measured using a particle size distribution measuring device of a laser diffraction scattering method. The above-mentioned silicon dioxide is preferably spherical, and more preferably spherical silica. In this case, the surface roughness of the surface of the hardened object is effectively reduced, and the bonding strength between the hardened object and the metal layer is effectively improved. When the above-mentioned silicon dioxide is spherical, the aspect ratio of the above-mentioned silicon dioxide is preferably 2 or less, and more preferably 1.5 or less. The above silicon dioxide is preferably surface-treated, more preferably a surface-treated product obtained using a coupling agent, and still more preferably a surface-treated product obtained using a silane coupling agent. Thereby, the surface roughness of the surface of the hardened object is further reduced, the bonding strength between the hardened object and the metal layer is further improved, and finer wiring can be formed on the surface of the hardened object, and a better wiring space can be provided to the hardened object Insulation reliability and interlayer insulation reliability. Examples of the coupling agent include a silane coupling agent, a titanium coupling agent, and an aluminum coupling agent. Examples of the silane coupling agent include methacrylfluorenylsilane, acrylfluorenylsilane, aminosilane, imidazolesilane, vinylsilane, and epoxysilane. In 100% by weight of the components other than the solvent in the resin material, the content of the silicon dioxide is preferably 30% by weight or more, more preferably 40% by weight or more, still more preferably 50% by weight or more, and particularly preferably 60% by weight. % Or more, preferably 90% by weight or less, more preferably 85% by weight or less, still more preferably 80% by weight or less, and particularly preferably 75% by weight or less. If the content of the above-mentioned silicon dioxide is equal to or more than the above-mentioned lower limit, the dimensional change of the hardened material due to heat is further reduced. When the content of the silicon dioxide is equal to or more than the lower limit and equal to or lower than the upper limit, the bonding strength between the hardened material and the metal layer is further improved, and finer wiring is formed on the surface of the hardened material. [Hardening Accelerator] The resin material preferably contains a hardening accelerator. By using the above-mentioned hardening accelerator, the hardening speed is further increased. By rapidly curing the resin material, the number of unreacted functional groups is reduced, and as a result, the crosslinking density is increased. The hardening accelerator is not particularly limited, and a conventionally known hardening accelerator can be used. These hardening accelerators may be used alone or in combination of two or more. Examples of the hardening accelerator include an imidazole compound, a phosphorus compound, an amine compound, and an organic metal compound. Examples of the imidazole compound include 2-undecylimidazole, 2-heptadecylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, and 2-benzene 4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methyl Imidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1- Cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2 '-Methylimidazolyl- (1')]-ethyl-s-tri, 2,4-diamino-6- [2'-undecylimidazolyl- (1 ')]-ethyl- s-tri, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1 ')]-ethyl-s-tri, 2,4-diamino- 6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triisocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct Adducts, 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-dihydroxymethylimidazole. Examples of the phosphorus compound include triphenylphosphine and the like. Examples of the amine compound include diethylamine, triethylamine, diethylenetetramine, triethylenetetraamine, and 4,4-dimethylaminopyridine. Examples of the organometallic compound include zinc naphthenate, cobalt naphthenate, tin octoate, cobalt octoate, cobalt (II) acetoacetone, cobalt (III) acetoacetate, and the like. The content of the hardening accelerator is not particularly limited. The content of the hardening accelerator in 100% by weight of the components other than the silica and the solvent in the resin material is preferably 0.01% by weight or more, more preferably 0.9% by weight or more, and preferably 5.0% by weight or less, more It is preferably 3.0% by weight or less. When the content of the hardening accelerator is at least the above lower limit and at most the above upper limit, the resin material is hardened efficiently. When the content of the hardening accelerator is in a more preferable range, the storage stability of the resin material is further improved, and a more favorable hardened material can be obtained. [Solvent] The above resin material does not contain or contain a solvent. By using the above-mentioned solvent, the viscosity of the resin material can be controlled to a preferable range, and the coating property of the resin composition can be improved when the resin material is a resin composition. The solvent can be used to obtain a slurry containing the silicon dioxide. These solvents may be used alone or in combination of two or more. Examples of the solvent include acetone, methanol, ethanol, butanol, 2-propanol, 2-methoxyethanol, 2-ethoxyethanol, 1-methoxy-2-propanol, and 2-acetamidine. Oxy-1-methoxypropane, toluene, xylene, methyl ethyl ketone, N, N-dimethylformamide, methyl isobutyl ketone, N-methyl-pyrrolidone, n-hexane , Cyclohexane, cyclohexanone and naphtha as a mixture. When the resin material is a resin composition, most of the solvent is preferably removed when the resin composition is formed into a film. Therefore, the boiling point of the solvent is preferably 200 ° C or lower, and more preferably 180 ° C or lower. The content of the solvent in the resin material is not particularly limited. When the resin material is a resin composition, the content of the solvent can be appropriately changed in consideration of the applicability of the resin material and the like. [Other components] Leveling agents, flame retardants, coupling agents, colorants, antioxidants, and UV resistance can also be added to the resin materials for the purpose of improving impact resistance, heat resistance, resin compatibility, and workability. Degradants, defoamers, tackifiers, thixotropy imparting agents, and other thermosetting resins other than epoxy compounds. Examples of the coupling agent include a silane coupling agent, a titanium coupling agent, and an aluminum coupling agent. Examples of the silane coupling agent include vinyl silane, amine silane, imidazole silane, and epoxy silane. Examples of the other thermosetting resin include polyphenylene ether resin, divinyl benzyl ether resin, polyarylate resin, diallyl phthalate resin, polyimide, benzofluorene resin, and benzene. Pyridazole resin, bismaleimide resin, acrylate resin, etc. (Resin film (B-stage film) and laminated film) The resin material is preferably a resin film. By molding the resin composition into a film shape, a resin film (B-stage film) can be obtained. The resin film is preferably a B-stage film. From the viewpoint of controlling the hardening degree of the resin film to be more uniform, the thickness of the resin film is preferably 5 μm or more, and more preferably 200 μm or less. As a method for forming the resin composition into a film, for example, the resin material is melt-kneaded with an extruder and extruded, and then extruded into a film with a T-die or a round die. Extrusion molding method; casting molding method in which a resin material containing a solvent is cast and formed into a film shape; and other known film forming methods. From the standpoint of reduction in thickness, an extrusion molding method or a casting molding method is preferred. The film includes a sheet. The resin composition as a B-stage film can be obtained by forming the resin composition into a film shape and heating and drying it to such an extent that hardening by heat is not excessively performed, for example, heating and drying at 50 to 150 ° C for 1 to 10 minutes. The film-like resin material that can be obtained by the drying step as described above is referred to as a B-stage film. The B-stage film is a film-like resin material in a semi-hardened state. The semi-hardened material is not completely hardened and can be further hardened. The resin film may not be a prepreg. When the resin film is not a prepreg, migration does not occur along glass cloth or the like. In addition, when the resin film is laminated or pre-cured, the surface does not have unevenness caused by the glass cloth. The said resin material can be used favorably in the form of a laminated film provided with a base material and the resin film laminated | stacked on the surface of this base material. The resin film in the laminated film is formed by the resin composition. Examples of the base material of the laminated film include polyester resin films such as metal foil, polyethylene terephthalate film, and polybutylene terephthalate film, and olefin resins such as polyethylene film and polypropylene film. Film, and polyimide film. The surface of the substrate may be subjected to a demolding treatment if necessary. The substrate may be a metal foil or a resin film. The metal foil is preferably a copper foil. (Multilayer Printed Wiring Board) The multilayer printed wiring board of the present invention includes a circuit board, a plurality of insulating layers disposed on the circuit board, and a metal layer disposed between the plurality of insulating layers. At least one layer in the insulating layer is a cured product of the resin material. The insulating layer in contact with the circuit board may be a hardened material of the resin material. The insulating layer disposed between the two insulating layers may be a hardened product of the above-mentioned resin material. The insulation layer furthest from the circuit board may be a hardened material of the resin material. A metal layer may be disposed on a surface on the outer side of the insulating layer farthest from the circuit board among the plurality of insulating layers. The multilayer printed wiring board can be obtained, for example, by heating and pressing the resin film. Metal foil can be laminated on one or both sides of the resin film. The method for laminating the resin film and the metal foil is not particularly limited, and a known method can be used. For example, a device such as a parallel plate press or a roll laminator can be used to laminate the resin film on a metal foil while applying pressure while heating or not heating. In addition, as the insulating layer of the multilayer printed wiring board, a laminate film can be used, and the laminate film can be formed from the resin film of the laminate film. The above-mentioned insulating layer is preferably laminated on the surface of the circuit substrate on which the circuit is provided. A part of the insulating layer is preferably buried between the circuits. In the multilayer printed wiring board, it is preferable that the surface of the insulating layer opposite to the surface on which the circuit substrate is laminated is roughened. The roughening processing method can use a conventionally well-known roughening processing method, and is not specifically limited. The surface of the insulating layer may be swelled before the roughening treatment. FIG. 1 is a cross-sectional view schematically showing a multilayer printed wiring board using a resin material according to an embodiment of the present invention. In the multilayer printed wiring board 11 shown in FIG. 1, a plurality of insulating layers 13 to 16 are laminated on the upper surface 12 a of the circuit substrate 12. The insulating layers 13 to 16 are hardened layers. A metal layer 17 is formed on a part of the upper surface 12 a of the circuit substrate 12. A metal layer 17 is formed in an area of a part of the upper surface of the insulating layers 13 to 15 of the plurality of insulating layers 13 to 16 other than the insulating layer 16 on the surface opposite to the circuit substrate 12 side. The metal layer 17 is a circuit. A metal layer 17 is disposed between the circuit substrate 12 and the insulating layer 13 and between the layers of the laminated insulating layers 13 to 16, respectively. The lower metal layer 17 and the upper metal layer 17 are connected to each other by at least one of via connection and via connection (not shown). In the multilayer printed wiring board 11, the insulating layers 13 to 16 are formed of the resin material described above. In this embodiment, the surfaces of the insulating layers 13 to 16 are roughened, so fine holes (not shown) are formed on the surfaces of the insulating layers 13 to 16. The metal layer 17 reaches the inside of the fine holes. Further, in the multilayer printed wiring board 11, the widthwise dimension (L) of the metal layer 17 and the widthwise dimension (S) of a portion where the metal layer 17 is not formed can be reduced. Moreover, in the multilayer printed wiring board 11, good insulation reliability is provided between the upper metal layer and the lower metal layer that are not connected by via connections and via connections (not shown). (Roughening Treatment and Swelling Treatment) The resin material is preferably used to obtain a hardened product to be subjected to a roughening treatment or a slag removal treatment. The hardened material also includes a prehardened material that can be further hardened. In order to form fine unevenness on the surface of the hardened material obtained by pre-hardening the resin material, the hardened material is preferably roughened. Prior to the roughening treatment, the cured product is preferably subjected to a swelling treatment. The hardened material is preferably subjected to a swelling treatment after the pre-hardening and before the roughening treatment, and is further hardened after the roughening treatment. However, the hardened material may not necessarily be swelled. As a method of the said swelling process, the method of processing hardened | cured material, for example, the aqueous solution of an compound which has ethylene glycol etc. as a main component, an organic solvent dispersion solution, etc. can be used. The swelling liquid used for swelling processing is generally used as a pH adjuster, etc., and contains an alkali. The swelling liquid preferably contains sodium hydroxide. Specifically, for example, the swelling treatment is performed by using a 40% by weight ethylene glycol aqueous solution or the like to treat the cured product at a treatment temperature of 30 to 85 ° C. for 1 to 30 minutes. The temperature of the swelling treatment is preferably within a range of 50 to 85 ° C. If the temperature of the above-mentioned swelling treatment is too low, the swelling treatment takes a long time, and the bonding strength between the insulating layer and the metal layer tends to decrease. In the roughening treatment, for example, a chemical oxidant such as a manganese compound, a chromium compound, or a persulfate compound can be used. These chemical oxidants are used as an aqueous solution or an organic solvent dispersion solution after adding water or an organic solvent. The roughening solution used for the roughening treatment is generally used as a pH adjuster and the like, and contains an alkali. The roughening solution preferably contains sodium hydroxide. Examples of the manganese compound include potassium permanganate and sodium permanganate. Examples of the chromium compound include potassium dichromate and anhydrous potassium chromate. Examples of the persulfate compound include sodium persulfate, potassium persulfate, and ammonium persulfate. The method of the said roughening process is not specifically limited. As the method for the above roughening treatment, for example, it is preferable to use a 30 to 90 g / L permanganic acid or permanganate solution and a 30 to 90 g / L sodium hydroxide solution at a processing temperature of 30 to 85 ° C and 1 Method for processing hardened material under ～ 30 minutes. It is preferable that the temperature of the said roughening process exists in the range of 50-85 degreeC. The number of times of the roughening treatment is preferably one or two times. The arithmetic average roughness Ra of the surface of the hardened material is preferably 10 nm or more, preferably less than 200 nm, more preferably less than 100 nm, and still more preferably less than 50 nm. If the arithmetic average roughness Ra is above the lower limit and does not reach the upper limit, the conductor loss of the electrical signal can be effectively suppressed, and the transmission loss can be greatly suppressed. Furthermore, finer wiring can be formed on the surface of the insulating layer. The arithmetic mean roughness Ra is measured in accordance with JIS B0601 (1994). (Slag Removal Treatment) In some cases, a hardened material obtained by pre-hardening the resin material may form a through hole. In the above-mentioned multilayer substrate and the like, via holes or via holes are formed as through holes. For example, vias 2 It is formed by the irradiation of a laser, such as a laser. The diameter of the via hole is not particularly limited, but is about 60 to 80 μm. In many cases, the residue of the resin derived from the resin component contained in the hardened material, that is, the rubber residue, is formed on the bottom of the via hole due to the formation of the through hole. In order to remove the dross, the surface of the hardened material is preferably subjected to a dross removal treatment. There is also a case where the slag removal treatment is also used as a roughening treatment. In the desmearing treatment, a chemical oxidizing agent such as a manganese compound, a chromium compound, or a persulfate compound is used in the same manner as the roughening treatment. These chemical oxidants are used as an aqueous solution or an organic solvent dispersion solution after adding water or an organic solvent. The deslagging treatment liquid used for deslagging treatment generally contains an alkali. The desmearing treatment liquid preferably contains sodium hydroxide. The method for removing the dregs is not particularly limited. As the method for removing the dregs, for example, it is preferable to use 30 to 90 g / L permanganic acid or permanganate solution and 30 to 90 g / L sodium hydroxide solution at a processing temperature of 30 to 85 ° C and The method of treating the hardened material once or twice under the condition of 1 to 30 minutes. The temperature of the above-mentioned desmearing treatment is preferably within a range of 50 to 85 ° C. By using the above-mentioned resin material, the surface roughness of the surface of the insulating layer treated with the deslagging treatment is sufficiently reduced. Hereinafter, the present invention will be specifically described with examples and comparative examples. The present invention is not limited to the following examples. (Epoxy Compound) Bisphenol A epoxy resin ("850-S" manufactured by DIC Corporation) Naphthalene epoxy resin ("HP-4032D" manufactured by DIC Corporation) Biphenol novolac epoxy resin (Japanese version "NC-3000" manufactured by Pharmaceutical Co., Ltd.) Bisphenol F epoxy resin ("830-S" manufactured by DIC Corporation) Biphenyl epoxy resin ("YX-4000H" manufactured by Mitsubishi Chemical Corporation) Dicyclopentadiene Ethylene type epoxy resin ("XD-1000" manufactured by Nippon Kayaku Co., Ltd.) (hardener) carbodiimide resin-containing liquid ("V-03" manufactured by Nisshinbo Chemical Co., solid content 50% by weight) carbonization Diimide resin ("10M-SP (modified)" manufactured by Nisshinbo Chemical Co., Ltd. Novolac-type phenol resin ("H-4" manufactured by Meiwa Chemical Co., Ltd.) Liquid containing cyanate resin ("Lonza Japan""BA-3000S", solid content 75% by weight) Cyanate resin ("PT-30" manufactured by Lonza Japan) (hardening accelerator) Imidazole compound (2-phenyl-4-methylimidazole, Shikoku Chemical Co., Ltd. "2P4MZ" (Silicon Dioxide) manufactured by Industrial Co., Ltd. Silicon dioxide-containing slurry (70% by weight of silicon dioxide, "SC- "2050-HNK", average particle size 0.5 μm, amine silane treatment, 30% by weight of cyclohexanone) (alumina) slurry containing alumina (70% by weight of alumina, "AC-2050-MOE" manufactured by Admatechs ", Average particle diameter 0.6 μm, amine silane treatment, methyl ethyl ketone 25% by weight) (thermoplastic resin) phenoxy resin-containing liquid (" YX6954BH30 "manufactured by Mitsubishi Chemical Corporation, solid content 30% by weight) ( Examples 1 to 11 and Comparative Examples 1 to 4) The ingredients shown in Tables 1 and 2 were blended at the blending amounts shown in Tables 1 and 2 below, and stirred at 1200 rpm for 4 hours using a blender to obtain a resin composition varnish. Using an applicator, the obtained resin material (resin composition varnish) was coated on a release-treated surface of a polyethylene terephthalate (PET) film ("XG284" manufactured by Toray Co., Ltd., thickness 25 μm). After that, it was dried in a Gil oven at 100 ° C for 3 minutes to evaporate the solvent. In this way, a laminated film having a PET film and a resin film (B-stage film) having a thickness of 40 μm on the PET film and a residual amount of the solvent of 1.0% to 3.0% by weight is obtained. Thereafter, the laminated film was heated at 190 ° C. for 90 minutes to produce a cured product of a cured resin film. (Evaluation) (1) Peeling strength (90 ° peeling strength) A 100 mm square CCL (copper clad laminate) substrate (a copper clad laminate) manufactured by Hitachi Chemical Industry Co., Ltd. will be formed by etching to form an inner layer circuit. ") Are immersed on both sides of a copper surface roughening agent (" MECetchBOND CZ-8101 "manufactured by MEC Corporation) to roughen the copper surface. The obtained laminated film was placed on both sides of the CCL substrate from the resin film side to obtain a laminated body. A vacuum pressure type laminator ("MVLP-500" manufactured by Meiki Seisakusho Co., Ltd.) was used for this laminated body, the pressure was reduced for 20 seconds, and the air pressure was set to 13 hPa or less. Thereafter, the lamination pressure was 0.4 MPa and Lamination was performed at a lamination temperature of 100 ° C for 20 seconds, and then at a pressing pressure of 1.0 MPa and a pressing temperature of 100 ° C for 40 seconds. Next, the resin film was hardened at 180 ° C and a hardening condition of 30 minutes. Thereafter, the PET film was peeled from the resin film to obtain a cured laminated sample. The above-mentioned hardened layered samples were placed in a 60 ° C swelling liquid (aqueous solution prepared by "Swelling Dip Securiganth P" manufactured by Atotech Japan and "Sodium Hydroxide" manufactured by Wako Pure Chemical Industries, Ltd. at a swelling temperature of 60 ° C. Shake for 10 minutes. Thereafter, it was washed with pure water. The above-mentioned hardened layered sample subjected to swelling treatment was placed in a crude aqueous solution of sodium permanganate ("Concentrate Compact CP" manufactured by Atotech Japan Co., Ltd. and "Sodium Hydroxide" manufactured by Wako Pure Chemical Industries, Ltd.) at 80 ° C. Shake at 80 ° C for 20 minutes. Thereafter, it was washed with a washing solution ("Reduction Securiganth P" manufactured by Atotech Japan Co., Ltd., and "sulfuric acid" manufactured by Wako Pure Chemical Industries, Ltd.) at 25 ° C for 2 minutes, and then further washed with pure water. In this way, a roughened hardened body is formed on a CCL substrate having an inner layer circuit formed by etching. The surface of the roughened hardened product was treated with an alkaline cleaning solution ("Cleaner Securiganth 902" manufactured by Atotech Japan Co., Ltd.) at 60 ° C for 5 minutes, and then degreased and washed. After washing, the cured product was treated with a prepreg at 25 ° C ("Pre-Dip Neoganth B" manufactured by Atotech Japan) for 2 minutes. Then, the hardened | cured material was processed with 40 degreeC catalyst liquid ("Activator Neoganth 834" by Atotech Japan) for 5 minutes, and a palladium catalyst was provided. Next, the cured product was treated with a reducing solution at 30 ° C. (“Reducer Neoganth WA” manufactured by Atotech Japan) for 5 minutes. Next, the above-mentioned hardened materials were put into a chemical copper solution (all manufactured by Atotech Japan, "Basic Printganth MSK-DK", "Copper Printganth MSK", "Stabilizer Printganth MSK", "Reducer Cu"), and electroless plating was performed. The coating thickness is about 0.5 μm. After electroless plating, in order to remove residual hydrogen, annealing was performed at a temperature of 120 ° C for 30 minutes. All steps up to the step of electroless plating are performed at a laboratory scale (beaker scale) of 2 L of the treatment liquid while shaking the hardened material. Next, the hardened material subjected to the electroless plating treatment was subjected to electrolytic plating until the thickness of the plating layer became 25 μm. For electrolytic copper plating, copper sulfate solution ("copper sulfate pentahydrate" manufactured by Wako Pure Chemical Industries, "sulfuric acid" manufactured by Wako Pure Chemical Industries, "Basic Leveler Cupracid HL" manufactured by Atotech Japan, and Atotech Japan "Correcting Agent Cupracid GS" manufactured by the company), access 0.6 A / cm 2 The current was electrolytically plated to a thickness of about 25 μm. After the copper plating treatment, the cured product was heated at 190 ° C for 90 minutes to further harden the cured product. In this way, a hardened product having a copper plating layer on the upper surface area was obtained. A 10 mm wide cut was made into the surface of the copper-plated layer in the obtained hardened body having a copper-plated layer. Thereafter, using a tensile tester ("AG-5000B" manufactured by Shimadzu Corporation), the peeling of the hardened material (insulating layer) and the metal layer (copper plating layer) was measured at a crosshead speed of 5 mm / min. Strength (90 ° peel strength). [Judging criteria for peel strength] ○: Peel strength is 0.5 kgf / cm or more △: Peel strength is 0.4 kgf / cm or more and less than 0.5 kgf / cm ×: Peel strength is less than 0.4 kgf / cm (2) of resin material Storage stability The obtained laminated film was stored at 25 ° C. for 3 days and 5 days, respectively. A copper-clad laminated board (a laminated body of a glass epoxy substrate having a thickness of 150 μm and a copper foil having a thickness of 35 μm) was prepared. The copper foil was etched, and 26 copper patterns with an L / S of 50 μm / 50 μm and a length of 1 cm were produced to obtain a concave-convex substrate. The laminated film after storage was superposed on the uneven surface of the uneven substrate from the resin film side and placed on both sides to obtain a laminated body. This laminated body was decompressed for 20 seconds using a vacuum pressure type laminating machine ("MVLP-500" manufactured by Meiji Seisakusho Co., Ltd.) to set the air pressure to 13 hPa or less. Thereafter, the lamination pressure was 0.4 MPa and lamination was performed. The laminate was laminated at a temperature of 100 ° C for 20 seconds, and then pressed at a pressing pressure of 1.0 MPa and a pressing temperature of 100 ° C for 40 seconds. In this way, a laminated body A having a resin film laminated on the uneven substrate was obtained. In the state of the laminated body A, "WYKO" manufactured by VEECO was used to measure the unevenness value on the upper surface of the resin film in the laminated body A. Specifically, the maximum value of the difference in height between the adjacent concave portion and convex portion of the unevenness is used as the unevenness value. In this way, the presence or absence of the state of unevenness in the lamination test was evaluated. The storage stability of the resin material was judged by the following criteria. [Criteria for judging the storage stability of resin materials] ○: In the resin film after 3 days and 5 days, the resin is filled in the copper pattern, and the uneven value is 0.5 μm or less. △: In the resin film after 3 days, The resin is filled in the copper pattern with an unevenness value of 0.5 μm or less, but in the resin film after 5 days, the resin is not filled in the copper pattern or the unevenness value exceeds 0.5 μm ×: Resin after 3 days and 5 days In the film, the resin is not filled in the copper pattern, or the uneven value exceeds 0.5 μm. (3) The inhibition of the foam is to use a 100 mm square hardened layer with copper plating. According to JEDEC (Joint Electron Device Engineering Council, Joint Electronic Equipment Engineering Association) LEVEL3, the substrate was subjected to moisture absorption (at a temperature of 60 ° C and a humidity of 60 RH% for 40 hours). Thereafter, the substrate was subjected to a nitrogen reflow process (peak temperature: 260 ° C). In addition, the reflow soldering was performed 30 times repeatedly. The presence or absence of blister formation after reflow was visually confirmed. [Judgment criteria for the suppression of blister bodies] ○: No blister bodies were generated during 30 reflow soldering △: No blister bodies were generated during 20 reflow soldering, and 21 to 29 reflow soldering Bubbles ×: Bulbs (4) average linear expansion coefficient (CTE) generated in reflow soldering less than 20 times. The obtained hardened product (using a resin film with a thickness of 40 μm) was cut to 3 mm × 25 mm. size. Using a thermo-mechanical analysis device ("EXSTARTMA / SS6100" manufactured by SII NanoTechnology), the average line of 25 ° C to 150 ° C of the cut hardened material was calculated under the conditions of a tensile load of 33 mN and a heating rate of 5 ° C / min. Coefficient of expansion (ppm / ° C). The composition and results are shown in Tables 1 and 2 below. [Table 1] [Table 2]