CN112867267A

CN112867267A - Macro-micro base station high-frequency high-speed PCB for 5G communication and preparation process thereof

Info

Publication number: CN112867267A
Application number: CN202011616198.8A
Authority: CN
Inventors: 郑小红; 张忠庆; 袁丕盛; 易振林; 向良才
Original assignee: Xingda Hongye Pcb Co Of Guangdong Ltd
Current assignee: Xingda Hongye Pcb Co Of Guangdong Ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-05-28
Anticipated expiration: 2040-12-31
Also published as: CN112867267B

Abstract

The invention discloses a macro/micro base station high-frequency high-speed PCB for 5G communication and a preparation process thereof, wherein the preparation process comprises the following steps: s1, cutting, S2, surface roughening treatment, S3, inner layer plate drilling, S4, inner layer pattern making, S5, laminating, S6, drilling, S7, outer layer pattern making, S8 and post-process treatment. The invention aims to overcome the defects in the prior art and provides the macro/micro base station high-frequency high-speed PCB preparation process for the 5G communication, which is simple in process, good in etching uniformity, high in production efficiency and capable of effectively reducing the rejection rate. The invention also aims to provide a macro/micro base station high-frequency high-speed PCB for 5G communication prepared by the preparation method. The macro/micro base station high-frequency high-speed PCB for 5G communication has the advantages of excellent high-speed/high-frequency transmission characteristics, small dielectric loss and the like.

Description

Macro-micro base station high-frequency high-speed PCB for 5G communication and preparation process thereof

Technical Field

The invention relates to the technical field of circuit boards, in particular to a macro/micro base station high-frequency high-speed PCB for 5G communication and a preparation process thereof.

Background

With the comprehensive arrival of the 5G commercial era, each link in the communication field needs to use the PCB, and the number of 5G base stations is expected to be greatly increased. The peak rate of 4G is 100Mbps to 1Gbps, while 5G provides bandwidth with the peak value of more than 10Gbps, 1ms time delay and ultra-high density connection, the mobility reaches 500km/h, and the flow density reaches 10Mbps/m 2. At present, three operators in China enter a 5G construction large acceleration stage, a 5G scale test and an application test are developed, a 5G coverage time table is planned in places and infrastructure construction is accelerated, so that the aim of large-scale commercial use in 2020 is fulfilled. Since 5G requires massive connection, the number of base stations in the 5G era will increase significantly compared to the 4G era. By the end of 2017, the number of 4G macro base stations in China reaches about 360 thousands, the planning of 5G macro base stations of three operators is 1.5 times that of 4G, the total number reaches about 540 thousands, and the peak period of 5G base station construction is about 2019-2023.

The PCB high-frequency board is a special circuit board with higher electromagnetic frequency, is used for the PCB in the fields of high frequency (the frequency is more than 300MHZ or the wavelength is less than 1 meter) and microwave (the frequency is more than 3GHZ or the wavelength is less than 0.1 meter), and is a circuit board produced on a microwave substrate copper-clad plate by utilizing partial procedures of a common rigid circuit board manufacturing method or adopting a special processing method.

The existing macro/micro base station high-frequency high-speed PCB for 5G communication is relatively complex in preparation process, and copper layers are easily etched away in the production process. Resulting in a relatively high product rejection rate.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provides the macro/micro base station high-frequency high-speed PCB preparation process for the 5G communication, which is simple in process, good in etching uniformity, high in production efficiency and capable of effectively reducing the rejection rate.

The invention also aims to provide a macro/micro base station high-frequency high-speed PCB for 5G communication prepared by the preparation method. The macro/micro base station high-frequency high-speed PCB for 5G communication has the advantages of excellent high-speed/high-frequency transmission characteristics, small dielectric loss and the like.

In order to achieve the above object, the present invention provides a process for manufacturing a macro/micro base station high frequency and high speed PCB board for 5G communication, comprising: the preparation process of the macro/micro base station high-frequency high-speed PCB for 5G communication is characterized by comprising the following steps of:

s1, cutting: cutting the PTFE base material, the rigid base material and the FR4 copper-clad plate according to preset sizes to obtain a PTFE base material core plate, a rigid base material core plate and an FR4 base material core plate;

s2, surface roughening treatment: roughening the surfaces of the PTFE base material core plate, the rigid base material core plate and the FR4 base material core plate after cutting so as to form rough surfaces on the surfaces of the core plates;

s3, drilling an inner plate: drilling holes in a PTFE base material core plate and an FR4 base material core plate, and performing hole metallization and electroplating on the drilled holes;

s4, inner layer graph manufacturing: making inner layer patterns on the PTFE base material core board and the FR4 base material core board in the step S3, and placing the TFE base material core board with the inner layer patterns and the FR4 base material core board into etching equipment for etching to form inner layer circuit patterns;

s5, laminating: sequentially overlapping the outer-layer core plate, the inner-layer core plate and the outer-layer core plate from bottom to top, and putting the core plates into a press, and pressing the core plates together to obtain a multilayer plate;

s6, drilling: drilling the multilayer board in the step S5, drilling a through hole for realizing circuit communication of each layer on the multilayer board, and performing hole metallization and electroplating on the through hole;

s7, outer layer graph making: manufacturing an outer layer pattern on a rigid base material core plate of the multilayer plate, and putting the multilayer plate with the outer layer pattern into etching equipment for etching;

and S8, post-processing treatment, and performing post-processing manufacturing according to a conventional manufacturing method.

As another improvement of the manufacturing process of the macro/micro base station high-frequency high-speed PCB board for 5G communication of the present invention, the surface roughening treatment in step S2 is performed by plate grinding or microetching.

As another improvement of the manufacturing process of the macro/micro base station high-frequency high-speed PCB for 5G communication, the hole metallization is ultrasonic copper deposition and the drilling electroplating is pulse electroplating in step S3.

As another improvement of the preparation process of the macro/micro base station high-frequency high-speed PCB for 5G communication, the pulse plating comprises the following steps: electroplating for 5-15min at a current density of 0.5-1.8ASF,

the positive and negative current ratio is 1:2, and the positive and negative time ratio is 20: 1.

As another improvement of the manufacturing process of the macro/micro base station high-frequency high-speed PCB for G communication, in the steps S4 and S7, the etching equipment comprises a frame, a medicine water tank arranged on the frame and a spraying mechanism, wherein the left side and the right side of the frame are respectively provided with a connecting plate which is connected in a front-back mode, the spraying mechanism comprises a plurality of spraying pipes, two ends of each spraying pipe are rotatably connected between the two connecting plates, a plurality of spraying heads are uniformly distributed on each spraying pipe in the axial direction of each spraying pipe at intervals, the left side and the right side of the frame are provided with hinged seats, two sides of each medicine water tank are rotatably arranged between the two hinged seats to enable the medicine water tank to swing back and forth relative to the frame, elastic components capable of enabling the medicine water tank to be kept in a horizontal parallel state are arranged on the front side and the back side of the frame, and a first transmission mechanism capable of driving the spraying pipes to rotate back and, A second transmission mechanism, a power driving mechanism and a switching mechanism which can drive the liquid medicine box to swing back and forth, the power driving mechanism can respectively and independently drive the first transmission mechanism or the second transmission mechanism to work, the switching mechanism can enable the power driving mechanism to be connected with or separated from the first transmission mechanism or the second transmission mechanism, and also comprises a vacuumizing mechanism which comprises a frame body arranged on one side of the frame, a pump body is arranged on the frame body, the outlet end of the pump body is connected with an ejector, a liquid suction nozzle for sucking liquid medicine in the liquid medicine tank is arranged on the air duct of the ejector, the inlet end of the pump body is communicated with the liquid medicine box, the elastic component comprises supporting plates which are arranged on the front side and the rear side of the rack and are located below the liquid medicine box, and springs are connected between the supporting plates.

As another improvement of the manufacturing process of the macro/micro base station high-frequency high-speed PCB board for G communication of the present invention, the power driving mechanism includes a mounting seat disposed at one side of the rack, a motor is disposed on the mounting seat, a sleeve is movably sleeved on an output shaft of the motor along an axial direction of the output shaft, a guide block is disposed on an outer wall of the output shaft, a sliding slot is disposed on the sleeve, the guide block is slidably disposed in the sliding slot, an incomplete gear is disposed at an outer end of the sleeve, two driving assemblies are spaced at left and right sides of one side of the rack close to the mounting seat, the two driving assemblies have the same structure, and respectively include a moving bar capable of sliding back and forth at one side of the rack, an elliptical ring frame is disposed on the moving bar, and transmission racks capable of meshing with the incomplete gear are disposed on upper and lower wall surfaces of an inner side, first drive mechanism is including setting up shower wherein one serves the gear slide around the connecting plate outside have can with gear engagement's rack, rack and the drive assembly fixed connection on right side, second drive mechanism is including setting up the extension strip of just upwards extending vertical setting in one of them axis of rotation of medicine water tank link up on the extension strip and be equipped with vertical spout, be equipped with the direction cylinder on left drive assembly, the activity of direction cylinder sets up in the vertical spout, switching mechanism is in including setting up push rod motor on the mount pad be equipped with the moving member on push rod motor's the catch bar be equipped with the U-shaped draw-in groove moving member one side be equipped with the tourus on the sleeve, the outer wall setting of tourus is in the U-shaped draw-in groove. As another improvement of the preparation process of the macro/micro base station high-frequency high-speed PCB for 5G communication, etching solution adopted in the etching process in the steps S4 and S7 comprises the following components in parts by weight: 3-8 parts of hydrochloric acid, 6-15 parts of ammonium chloride, 12-24 parts of copper chloride, 0.5-2 parts of thiourea, 0.1-1 part of polyoxyethylene ether and 0.01-0.3 part of corrosion inhibitor; the corrosion inhibitor contains 1-3% of benzimidazole compound by mass percent.

As another improvement of the preparation process of the macro/micro base station high-frequency high-speed PCB for 5G communication, the benzimidazole compound is one of 1-methylbenzimidazole, 2-methylbenzimidazole or 2-phenylbenzimidazole.

As another improvement of the preparation process of the macro/micro base station high-frequency high-speed PCB for 5G communication, the inner layer board is laminated from bottom to top: a PTFE base material core plate, an FR4 base material core plate and a PTFE base material core plate.

In order to achieve the above object, the present invention provides a macro/micro base station high frequency and high speed PCB board for 5G communication, comprising: the manufacturing process of the macro/micro base station high-frequency high-speed PCB for 5G communication is utilized.

In summary, compared with the prior art, the invention has the beneficial effects that: the invention has simple process and convenient manufacture. According to the invention, vacuum etching equipment and a unique etching solution are adopted, so that the line width tolerance precision of the circuit board reaches within + -10%; meanwhile, the minimum line width and the minimum distance reach 3/3mil, the line width tolerance and the electroplating technology adopting the high thickness-diameter ratio: the maximum thickness-diameter ratio of the product is more than or equal to 20: 1; the interlayer alignment capability of the invention is that the whole layer deviation (the distance from the hole to the copper) reaches 6mil, and the interlayer deviation is reduced by establishing a harmomegathus database and optimizing an inner layer pre-placing rule; the number of the product layers reaches 40; the impedance control precision is less than or equal to +/-8 percent, and PIM is less than or equal to-110 dB.

The product of the invention has the advantages of excellent high-speed/high-frequency transmission characteristic, small dielectric loss and the like.

Two ends of the spray pipe in the etching equipment are arranged on the connecting plate of the rack in a rotating mode, and the spray pipe can be driven to swing in a reciprocating mode through the first transmission mechanism, so that the sprayed solution is not fixed at one position, and the solution is sprayed on each part of the surface of the PCB; in addition, the liquid medicine box is arranged in a swinging mode and is driven to swing back and forth through the second transmission mechanism, so that the flow of the liquid medicine solution is accelerated, the etching uniformity is improved, the etching precision can be improved by 60% through double swinging of the spray pipe and the liquid medicine box, and the highest corrosion precision reaches +/-1 filament; in addition, the first transmission mechanism and the second transmission mechanism are driven by the power driving mechanism to work and are switched and connected by the switching mechanism, so that the two mechanisms can be driven to work through one power device, and the purposes of energy conservation and consumption reduction can be achieved.

Drawings

FIG. 1 is a schematic process flow diagram of the present invention.

FIG. 2 is a schematic perspective view of an etching apparatus according to the present invention.

FIG. 3 is a schematic side view of an etching apparatus of the present invention.

Fig. 4 is a partially enlarged view of a portion a of fig. 2.

FIG. 5 is a partially enlarged schematic view of an etching apparatus according to the present invention.

FIG. 6 is a schematic view of an etching apparatus according to the present invention with a partial gear connected to a drive assembly.

Description of reference numerals: 1. a frame; 2. a medicine water tank; 3. a spraying mechanism; 4. a connecting plate; 5. a shower pipe; 6. a shower head; 7. a hinged seat; 8. an elastic component; 200. a vacuum pumping mechanism; 21. a frame body; 22. a pump body; 23. an outlet end; 24. an ejector; 25. an air duct; 26. a liquid suction nozzle; 27. an inlet end; 31. a mounting seat; 32. a motor; 33. an output shaft; 34. a sleeve; 35. a guide block; 36. a chute; 37. an incomplete gear; 38. a drive assembly; 39. a moving bar; 301 an elliptical ring frame; 302. a drive rack; 41. a gear; 42. a rack; 51. an extension bar; 52. a vertical chute; 61. a push rod motor; 62. a moving member; 63. a U-shaped clamping groove is arranged; 64. a torus; 71. a support plate; 72. a spring.

Detailed Description

The above and further features and advantages of the present invention are described in more detail below with reference to the accompanying drawings.

Preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and do not limit the scope of the present invention.

It should be noted that in the description of the present invention, the terms of direction or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Example 1

A preparation process of a macro/micro base station high-frequency high-speed PCB for 5G communication comprises the following steps:

s2, surface roughening treatment: roughening the surfaces of the PTFE base material core plate, the rigid base material core plate and the FR4 base material core plate after cutting so as to form rough surfaces on the surfaces of the core plates; wherein the surface roughening treatment is carried out by plate grinding or microetching.

S3, drilling an inner plate: drilling holes in a PTFE base material core plate and an FR4 base material core plate, and performing hole metallization and electroplating on the drilled holes; the hole metallization is ultrasonic copper deposition and the drilling plating is pulse plating. The pulse plating: the plate is electroplated for 15min at a current density of 0.5ASF, with a forward-reverse current ratio of 1:2 and a forward-reverse time ratio of 20: 1.

s6, drilling: drilling the multilayer board in the step S5, drilling a through hole for realizing circuit communication of each layer on the multilayer board, and performing hole metallization and electroplating on the through hole; the hole metallization is ultrasonic copper deposition and the drilling plating is pulse plating. The pulse plating: the plate is electroplated for 15min at a current density of 0.5ASF, with a forward-reverse current ratio of 1:2 and a forward-reverse time ratio of 20: 1.

Example 2

A preparation process of a macro/micro base station high-frequency high-speed PCB for 5G communication is characterized by comprising the following steps:

S3, drilling an inner plate: drilling holes in a PTFE base material core plate and an FR4 base material core plate, and performing hole metallization and electroplating on the drilled holes; the hole metallization is ultrasonic copper deposition and the drilling plating is pulse plating. The pulse plating: the plate was electroplated for 5min at a current density of 1.8ASF with a forward to reverse current ratio of 1:2 and a forward to reverse time ratio of 20: 1.

s6, drilling: drilling the multilayer board in the step S5, drilling a through hole for realizing circuit communication of each layer on the multilayer board, and performing hole metallization and electroplating on the through hole; the hole metallization is ultrasonic copper deposition and the drilling plating is pulse plating. The pulse plating: the plate is electroplated for 15min at a current density of 1.8ASF, with a forward-reverse current ratio of 1:2 and a forward-reverse time ratio of 20: 1.

Example 3

S3, drilling an inner plate: drilling holes in a PTFE base material core plate and an FR4 base material core plate, and performing hole metallization and electroplating on the drilled holes; the hole metallization is ultrasonic copper deposition and the drilling plating is pulse plating. The pulse plating: the plate was electroplated for 10min at a current density of 1.0ASF with a forward to reverse current ratio of 1:2 and a forward to reverse time ratio of 20: 1.

s5, laminating: sequentially superposing a rigid substrate core board, a PTFE substrate core board, an FR4 substrate core board, a PTFE substrate core board and a rigid substrate core board from bottom to top in a press, and pressing the core boards together to obtain a multilayer board;

s6, drilling: drilling the multilayer board in the step S5, drilling a through hole for realizing circuit communication of each layer on the multilayer board, and performing hole metallization and electroplating on the through hole; the hole metallization is ultrasonic copper deposition and the drilling plating is pulse plating. The pulse plating: the whole plate is electroplated for 12min at a current density of 0.8ASF, wherein the current ratio of positive and negative is 1:2, and the time ratio of positive and negative is 20: 1.

The etching solution used in the etching process in step S4 and step S7 in embodiments 1-3 of the present invention can be any one of the etching solutions in embodiments 4-7.

Example 4

The etching solution comprises the following components in parts by weight: 3 parts of hydrochloric acid, 6 parts of ammonium chloride, 12 parts of copper chloride, 0.5 part of thiourea, 0.1 part of polyoxyethylene ether and 0.01 part of corrosion inhibitor; the corrosion inhibitor contains 1 percent of 1-methylbenzimidazole by mass.

Example 5

The etching solution comprises the following components in parts by weight: 8 parts of hydrochloric acid, 15 parts of ammonium chloride, 24 parts of copper chloride, 2 parts of thiourea, 1 part of polyoxyethylene ether and 0.3 part of corrosion inhibitor; the corrosion inhibitor contains 3 mass percent of 2-methylbenzimidazole.

Example 6

The etching solution comprises the following components in parts by weight: 5 parts of hydrochloric acid, 10 parts of ammonium chloride, 18 parts of copper chloride, 1 part of thiourea, 0.5 part of polyoxyethylene ether and 0.05 part of corrosion inhibitor; the corrosion inhibitor contains 2 mass percent of 2-phenylbenzimidazole.

Example 7

The etching solution comprises the following components in parts by weight: 8 parts of hydrochloric acid, 15 parts of ammonium chloride, 24 parts of copper chloride, 2 parts of thiourea, 0.1 part of polyoxyethylene ether and 0.01 part of corrosion inhibitor; the corrosion inhibitor contains 1% by mass of one of 1-methylbenzimidazole, 2-methylbenzimidazole or 2-phenylbenzimidazole.

One embodiment of the corrosion inhibitor in the invention comprises 2.5% of benzimidazole compound, 1.5% of benzotriazole, 0.6% of mercaptobenzothiazole, 0.5% of methylbenzotriazole, 2% of sodium hydroxide and the balance of deionized water.

The post-process treatment of the invention comprises the following steps: silk-screen solder resist and characters, chemical tinning, electrical testing, shape processing and packaging.

Referring to fig. 2-6, the etching apparatus of the present invention comprises a frame 1, a chemical tank 2 and a spraying mechanism 3, wherein the chemical tank 2 and the spraying mechanism 3 are arranged on the frame 1, the left and right sides of the frame 1 are respectively provided with a connecting plate 4 connected in a front-back manner, the spraying mechanism 3 comprises a plurality of spraying pipes 5, two ends of each spraying pipe 5 are rotatably connected between the two connecting plates 4, a plurality of spraying heads 6 are uniformly distributed and spaced on the spraying pipes 5 along the axial direction of the spraying pipe 5, the left and right sides of the frame 1 are provided with hinged seats 7, two sides of the chemical tank 2 are rotatably arranged between the two hinged seats 7 so that the chemical tank 2 can swing in a front-back manner relative to the frame 1, the front and back sides of the frame 1 are respectively provided with an elastic component 8 capable of keeping the chemical tank 2 in a horizontal parallel state, and the frame 1 is further provided with a first transmission mechanism capable of driving the spraying, The spraying device comprises a second transmission mechanism, a power driving mechanism and a switching mechanism, wherein the second transmission mechanism can drive the liquid medicine tank 2 to swing in a reciprocating mode, the power driving mechanism can respectively and independently drive the first transmission mechanism or the second transmission mechanism to work, the switching mechanism can enable the power driving mechanism and the first transmission mechanism or the second transmission mechanism to be connected or separated, two ends of a spraying pipe 5 are installed on a connecting plate 4 of the rack 1 in a rotating mode, the spraying pipe 5 can be driven to swing in a reciprocating mode through the first transmission mechanism, sprayed solution is not fixed on one position, and therefore the solution is sprayed on each position of the surface of the PCB; in addition, the liquid medicine box 2 is arranged in a swinging mode, the liquid medicine box 2 is driven to swing back and forth through the second transmission mechanism, so that the liquid medicine solution can flow fast, the etching uniformity is improved, the etching precision can be improved by 60% through double swinging of the spray pipe 5 and the liquid medicine box 2, and the highest corrosion precision reaches +/-1 wire; in addition, the first transmission mechanism and the second transmission mechanism are driven by the power driving mechanism to work and are switched and connected by the switching mechanism, so that the two mechanisms can be driven to work through one power device, and the purposes of energy conservation and consumption reduction can be achieved.

Referring to fig. 2-3, the portable liquid medicine dispenser further comprises a vacuumizing mechanism 200, the vacuumizing mechanism 200 comprises a frame body 21 arranged on one side of the frame 1, a pump body 22 is arranged on the frame body 21, an outlet end 23 of the pump body 22 is connected with an ejector 24, a liquid suction nozzle 26 for sucking liquid medicine in the liquid medicine tank 2 is arranged on an air duct 25 of the ejector 24, an inlet end 27 of the pump body 22 is communicated with the liquid medicine tank 2 through a hose, when the portable liquid medicine dispenser works, the liquid medicine is drawn out of the liquid medicine tank 2 by the pump body 22, vacuum is formed in a gas mixing chamber inside the ejector 24 when high-speed flowing liquid medicine passes through the ejector 24, negative pressure is formed between the gas mixing chamber of the ejector 24 and the outside, the liquid medicine on an external PCB is sucked into the air duct 25 through the liquid suction nozzle 26, the optimal water suction effect is achieved, and the principle.

Referring to fig. 3-4 and 6, the power driving mechanism includes a mounting base 31 disposed at one side of the frame 1, a motor 32 is disposed on the mounting base 31, the motor 32 is a servo motor, a sleeve 34 is movably sleeved on an output shaft 33 of the motor 32 along an axial direction of the output shaft 33, a guide block 35 is disposed on an outer wall of the output shaft 33, a sliding slot 36 is disposed on the sleeve 34, the guide block 35 is slidably disposed in the sliding slot 36, an incomplete gear 37 is disposed at an outer end of the sleeve 34, two driving assemblies 38 are spaced at left and right sides of one side of the frame 1 close to the mounting base 31, the two driving assemblies 38 have the same structure and respectively include a moving bar 39 capable of sliding back and forth at one side of the frame 1, an elliptical ring frame 301 is disposed on the moving bar 39, and driving racks 302 capable of meshing with the incomplete gear 37 are disposed on upper and lower wall surfaces of an inner side of the elliptical ring frame 301, the incomplete gear 37 is sequentially engaged with the driving racks 302 at the upper and lower sides, so that the moving bar 39 and the elliptical ring frame 301 can be driven to slide back and forth.

Referring to fig. 3, the first transmission mechanism includes a gear 41 disposed at one end of the shower pipe 5, a rack 42 capable of engaging with the gear 41 slides back and forth outside the connecting plate 4, the rack 42 is fixedly connected to the right driving assembly 38, and the left driving assembly 38 drives the rack 42 to reciprocate back and forth, so that the shower pipe 5 swings back and forth through the gear 41.

Referring to fig. 5, the second transmission mechanism includes an extending bar 51 which is disposed on one of the rotation shafts of the liquid medicine tank 2 and vertically extends upward, a vertical sliding groove 52 is disposed on the extending bar 51 in a penetrating manner, a guiding cylinder 53 is disposed on the left driving assembly 38, the guiding cylinder 53 is movably disposed in the vertical sliding groove 52, the right driving assembly 38 drives the guiding cylinder 53 to reciprocate back and forth, and then the rotation shaft of the liquid medicine tank 2 reciprocates through the vertical sliding groove 52 on the extending bar 51, so as to realize the back and forth reciprocating swing of the liquid medicine tank 2.

Referring to fig. 4 and 6, the switching mechanism includes a push rod motor 61 disposed on the mounting base 31, a moving member 62 is disposed on a push rod of the push rod motor 61, a U-shaped slot 63 is disposed on one side of the moving member 62, a circular ring 64 is disposed on the sleeve 34, an outer wall surface of the circular ring 64 is disposed in the U-shaped slot 63, when switching is required, the push rod motor 61 drives the moving member 62 to move, the circular ring 64 on the sleeve 34 is disposed in the U-shaped slot 63, and then moves together with the circular ring 64, the sleeve 34 and the incomplete gear 37, so that the incomplete gear 37 moves from the left driving assembly 38 to the right driving assembly 38, thereby achieving switching.

Referring to fig. 3, the elastic assembly 8 includes support plates 71 disposed at the front and rear sides of the frame 1 and located below the liquid medicine tank 2, a spring 72 is connected between the support plates 71, and when the spray pipe 5 swings to spray, the liquid medicine tank 2 can be in a horizontal parallel state, so that the liquid medicine in the liquid medicine tank 2 can better soak the PCB plates.

The specific working principle of the invention is as follows:

placing a PCB to be etched into the liquid medicine box 2, enabling the motor 32 to work, enabling the incomplete gear 37 to be connected with the driving component 38 on the left side, enabling the incomplete gear 37 to be sequentially meshed with the transmission gears 302 on the upper side and the lower side, enabling the oval ring frame 301, the moving strip 39 and the rack 42 to move back and forth in a reciprocating mode, enabling the rack 42 to be meshed with the gear 41, and driving the spray pipe 5 to swing back and forth to spray; then, the push rod motor 61 works, the circular ring body 64, the sleeve 34 and the incomplete gear 37 are driven to move rightwards through the U-shaped clamping groove 63 on the moving piece 62, the incomplete gear 37 is separated from the left driving component 38 before and is connected with the right driving component 38, when the motor 32 drives the incomplete gear 37 to rotate, the right driving component 38 drives the guide cylinder 53 to reciprocate forwards and backwards, the rotating shaft of the medicine water tank 2 swings in a reciprocating manner through the vertical sliding groove 52 on the extension strip 51, the medicine water tank 2 swings forwards and backwards in a reciprocating manner, through the double swinging of the spray pipe 5 and the medicine water tank 2, the etching precision can be improved by 60%, and the highest corrosion precision reaches +/-1 wire; after the PCB is etched, the vacuumizing mechanism 200 works, the pump body 22 pumps the liquid medicine out of the liquid medicine tank 2, the liquid medicine flowing at a high speed can form vacuum in the air mixing chamber inside the ejector 24 when passing through the ejector 24, negative pressure is formed between the air mixing chamber of the ejector 24 and the outside, and the liquid medicine on the external PCB is sucked into the air guide pipe 25 through the liquid suction nozzle 26, so that the optimal water suction effect is achieved.

The foregoing shows and describes the general principles and features of the present invention, together with the advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A preparation process of a macro/micro base station high-frequency high-speed PCB for 5G communication is characterized by comprising the following steps:

2. The process for preparing a macro/micro base station high-frequency high-speed PCB board for 5G communication according to claim 1, wherein the surface roughening treatment in step S2 is plate grinding or micro etching.

3. The process for preparing a PCB for macro/micro base station high frequency and high speed in 5G communication according to claim 1, wherein the hole metallization is ultrasonic copper deposition and the drilling plating is pulse plating in step S3.

4. The manufacturing process of the macro/micro base station high-frequency high-speed PCB board for 5G communication according to claim 3, wherein the pulse plating comprises the following steps: electroplating for 5-15min at a current density of 0.5-1.8ASF,

5. The manufacturing process of the macro/micro base station high-frequency high-speed PCB board for 5G communication according to claim 1, wherein the etching device comprises a frame (1), a liquid medicine tank (2) arranged on the frame (1) and a spraying mechanism (3) in the steps S4 and S7, the left side and the right side of the frame (1) are respectively provided with a connecting plate (4) which is connected in a front-back manner, the spraying mechanism (3) comprises a plurality of spraying pipes (5), two ends of each spraying pipe (5) are rotatably connected between the two connecting plates (4), a plurality of spraying heads (6) are uniformly distributed on the spraying pipes (5) at intervals along the axial direction of the spraying pipes (5), hinged seats (7) are arranged on the left side and the right side of the frame (1), two sides of the liquid medicine tank (2) are rotatably arranged between the two hinged seats (7) to enable the liquid medicine tank (2) to swing back and forth relative to the frame (1), the automatic medicine spraying machine is characterized in that elastic components (8) capable of enabling the medicine water tank (2) to be kept in a horizontal parallel state are arranged on the front side and the rear side of the rack (1), a first transmission mechanism capable of driving the spray pipe (5) to rotate in a reciprocating mode, a second transmission mechanism capable of driving the medicine water tank (2) to swing in a reciprocating mode, a power driving mechanism and a switching mechanism are further arranged on the rack (1), the power driving mechanism can respectively drive the first transmission mechanism or the second transmission mechanism to work independently, the switching mechanism can enable the power driving mechanism to be connected with or separated from the first transmission mechanism or the second transmission mechanism, the automatic medicine spraying machine further comprises a vacuumizing mechanism (200), the vacuumizing mechanism (200) comprises a rack body (21) arranged on one side of the rack (1), a pump body (22) is arranged on the rack body (21), and an outlet end (23) of the pump body (22) is connected with an ejector (24), be equipped with on air duct (25) of ejector (24) and be used for inhaling the imbibition mouth (26) of the liquid medicine in medicine water tank (2) entrance point (27) of the pump body (22) with medicine water tank (2) are linked together, elastic component (8) are in including setting up both sides just are located around frame (1) backup pad (71) of medicine water tank (2) below be connected with spring (72) between backup pad (71).

6. The manufacturing process of the macro/micro base station high-frequency high-speed PCB board for 5G communication according to claim 5, wherein the power driving mechanism comprises a mounting seat (31) arranged on one side of the rack (1), a motor (32) is arranged on the mounting seat (31), a sleeve (34) is movably sleeved on an output shaft (33) of the motor (32) along the axial direction of the output shaft (33), a guide block (35) is arranged on the outer wall of the output shaft (33), a sliding groove (36) is arranged on the sleeve (34), the guide block (35) is slidably arranged in the sliding groove (36), an incomplete gear (37) is arranged at the outer end of the sleeve (34), two driving assemblies (38) are arranged on the left side and the right side of the rack (1) close to the mounting seat (31) at intervals, and the two driving assemblies (38) have the same structure, the spraying device is characterized by comprising a moving strip (39) capable of sliding forwards and backwards on one side of a rack (1), wherein an oval ring frame (301) is arranged on the moving strip (39), the upper wall surface and the lower wall surface of the inner side of the oval ring frame (301) are respectively provided with a transmission rack (302) capable of being meshed with an incomplete gear (37), a first transmission mechanism comprises a gear (41) arranged at one end of a spraying pipe (5), a rack (42) capable of being meshed with the gear (41) is arranged on the outer side of a connecting plate (4) in a front-back sliding mode, the rack (42) is fixedly connected with a driving component (38) on the right side, a second transmission mechanism comprises an extending strip (51) which is arranged on one rotating shaft of the liquid medicine tank (2) and vertically extends upwards, a vertical sliding groove (52) is arranged on the extending strip (51) in a penetrating mode, and a guide cylinder (53) is arranged on the driving component (38), the utility model discloses a quick-witted, including the mount pad (31), guide cylinder (53) activity sets up in vertical spout (52), switching mechanism is including setting up push rod motor (61) on mount pad (31) be equipped with moving member (62) on the catch bar of push rod motor (61) moving member (62) one side is equipped with U-shaped draw-in groove (63) be equipped with tourus (64) on sleeve (34), the outer wall setting of tourus (64) is in U-shaped draw-in groove (63).

7. The process for preparing the macro/micro base station high-frequency and high-speed PCB board for 5G communication according to claim 1, wherein the etching solution adopted in the etching process in the steps S4 and S7 comprises the following components in parts by weight: 3-8 parts of hydrochloric acid, 6-15 parts of ammonium chloride, 12-24 parts of copper chloride, 0.5-2 parts of thiourea, 0.1-1 part of polyoxyethylene ether and 0.01-0.3 part of corrosion inhibitor; the corrosion inhibitor contains 1-3% of benzimidazole compound by mass percent.

8. The process for preparing the macro/micro base station high-frequency and high-speed PCB for the 5G communication according to claim 7, wherein the benzimidazole compound is one of 1-methylbenzimidazole, 2-methylbenzimidazole or 2-phenylbenzimidazole.

9. The process for preparing the macro/micro base station high-frequency high-speed PCB for the 5G communication according to claim 1, wherein the inner layer board is laminated from bottom to top: a PTFE base material core plate, an FR4 base material core plate and a PTFE base material core plate.

10. A macro/micro base station high-frequency high-speed PCB board for 5G communication, which is characterized by being prepared by the preparation process of the macro/micro base station high-frequency high-speed PCB board for 5G communication according to any one of claims 1 to 9.