CN109561594A - High-frequency circuit board and preparation method thereof - Google Patents
High-frequency circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN109561594A CN109561594A CN201811625569.1A CN201811625569A CN109561594A CN 109561594 A CN109561594 A CN 109561594A CN 201811625569 A CN201811625569 A CN 201811625569A CN 109561594 A CN109561594 A CN 109561594A
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- Prior art keywords
- cover film
- ptfe
- core plate
- high frequency
- circuit board
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Abstract
The invention belongs to circuit board technology field more particularly to a kind of high-frequency circuit board and preparation method thereof, production method is the following steps are included: provide core plate and PTFE high frequency cover film；First time drilling is carried out, plated through-hole is drilled out on core plate, drills out gas vent and registration holes in core plate and PTFE high frequency cover film corresponding position；Black holes, plating, outer graphics production and outer layer etching are carried out to core plate；PTFE high frequency cover film is pasted on the two sides of core plate；The core plate for being covered with PTFE high frequency cover film to two sides presses, and substrate is made；Second is carried out to substrate to drill, drill out nonmetallic hole and drill out substrate two sides PTFE high frequency cover film correspond to plated through-hole position window；Substrate after drilling to second carries out sharp processing, and high-frequency circuit board is made.The application can reduce the feed of drilling, and the internal stress of cover film can be effectively reduced, and the pad pasting time is short, while also can guarantee the Aligning degree of cover film and core plate and the quality of product.
Description
Technical field
The invention belongs to circuit board technology fields more particularly to a kind of high-frequency circuit board and preparation method thereof.
Background technique
PCB high frequency plate refers to the higher special type of track plate of electromagnetic frequency, and for high-frequency, (frequency is greater than 300MHZ or wave
It is long less than 1 meter) PCB with microwave (frequency is greater than 3GHZ or wavelength less than 0.1 meter) field, in general, high frequency plate can be determined
Justice is frequency in 1GHz Above Transmission Lines plate.
With the fast development of science and technology, more and more equipment designs are in microwave frequency band (> 1GHZ) or even and milli
Application more than metric wave field (30GHZ), this also means that frequency is higher and higher, the requirement to the material of wiring board is also increasingly
Height, such as the electrical property that membrane material needs to have excellent is covered, good chemical stability, with the increase of power supply signal frequency
It is required in terms of the loss of substrate very small.
Circuit-board industry is when making high frequency plate at present, it is common to use and ink or PI film (Kapton) cover,
The DK (dielectric constant) of ink is high, electric performance stablity is poor, and the DK of rough surface, PI film is low relative to ink, but with transmission speed
The continuous promotion of rate and transmission rate, ink or PI film for protecting high frequency plate outer-layer circuit cannot be met the requirements well.
Therefore, high frequency plate is processed using a kind of new material-PTFE cover film, can be very good the damage for meeting high frequency plate material
Consumption requires, but since PTFE cover film processing technology is complicated, does according to the production method of PCB high frequency plate routine, to practical raw
Production bring very big problem: after PTFE cover film internal stress discharge completely, cover film contraction it is very serious, cause it is rigid-flexible can not be right
Position, pasting epiphragma figure complexity causes operation difficulty big and quite time-consuming, while the turning of lines and pressing during the pressing process
Place cannot fit closely, and glue flowing causes resin empty less than corner, and defect is more, and yield is low, cannot achieve mass production.
Summary of the invention
The purpose of the present invention is to provide a kind of production methods of high-frequency circuit board, it is intended to solve high frequency in the prior art
Circuit board not can solve the problem that material loss is low in high frequency signal transmission and make the lower technical problem of yield.
To achieve the above object, the technical solution adopted by the present invention is that: a kind of production method of high-frequency circuit board, including with
Lower step:
Core plate and PTFE high frequency cover film are provided；
First time drilling is carried out, including drills out on the core plate plated through-hole and in the core plate and the PTFE high frequency
Cover film corresponding position drills out gas vent and registration holes；
Black holes, plating, outer graphics production and outer layer etching are carried out to core plate, to form outer-layer circuit figure；
PTFE high frequency cover film is pasted on the two sides of core plate；
The core plate for being covered with PTFE high frequency cover film to two sides presses, and substrate is made；
Second is carried out to substrate to drill, and is drilled out remaining nonmetallic hole and is drilled out the PTFE high frequency on the substrate two sides
Cover film corresponds to the window of the position of the plated through-hole；
Substrate after drilling to second carries out sharp processing, and high-frequency circuit board is made.
Further, the PTFE high frequency cover film includes PTFE cover film and is compound in the PTFE cover film one side
Thermosetting resin.
Further, before pressing, the PTFE cover film with a thickness of 25~40 μm, the thermosetting resin with a thickness of
10~20 μm.
Further, the PTFE high frequency cover film further includes being covered in the PTFE cover film far from the thermosetting property tree
The release film of rouge side；Before pad pasting, the PTFE high frequency cover film is toasted, is cooled and solidified, it is release to avoid removing
Stress is excessive and PTFE cover film is caused to inside contract after film.
Further, before pad pasting, the step of PTFE high frequency cover film is toasted, cooled and solidified include: by
Cover film takes out cooling after being put into 160 DEG C of high-temperature baking 10-15min of oven.
Further, before plating, the adsorption of the hole wall of plated through-hole forms one layer of graphite charcoal on the core plate
Unlicensed tour guide's electric layer.
Further, the step of core plate for being covered with PTFE high frequency cover film to two sides presses includes: in two face pastes
The two sides for being covered with the core plate of PTFE high frequency cover film stacks buffer layer respectively, and steel plate is stacked outside the buffer layer of two sides, then high
Warm high pressure is pressed, and substrate is obtained, wherein the buffer layer is silica gel buffer layer, and surface hardness is 70 ± 5sh.
Further, when the first time drills, the gas vent is drilled out in the garbage area of the PTFE high frequency cover film.
Further, the window of the PTFE high frequency cover film is 6~12mil bigger than the aperture of the plated through-hole.
Another object of the present invention is to provide a kind of high-frequency circuit boards, utilize the production method system of above-mentioned high-frequency circuit board
?.
Beneficial effects of the present invention: the production method of high-frequency circuit board of the invention, since metal is only bored in first time drilling
Change hole, second of drilling is that the core plate for having PTFE high frequency cover film in two sides pressing drills out remaining non-metallic hole, can be subtracted
The feed to drill less, thus achieve the purpose that reduce internal stress, only needed in pad pasting on core plate by PTFE high frequency cover film with
Each loci alignment on core plate, greatly reduces the operating time of pad pasting, while also ensuring that PTFE high frequency covers
The quality of the Aligning degree and product of film and core plate is suitable for producing in enormous quantities.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment for those of ordinary skill in the art without any creative labor, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is the flow diagram of the production method of high-frequency circuit board provided in an embodiment of the present invention；
Fig. 2 is structural schematic diagram when pressing in the production method of high-frequency circuit board shown in Fig. 1；
Fig. 3 is the PTFE high frequency cover film shape in the production method of high-frequency circuit board shown in Fig. 1 after drilling twice
Structural schematic diagram.
Wherein, each appended drawing reference in figure:
10-core plate 100-plated through-hole, 200-PTFE high frequency cover films
210-PTFE cover film 220-thermosetting resin, 201-windows
202-gas vent 203-registration holes, 300-buffer layers
400-steel plates.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " length ", " width ", "upper", "lower", "front", "rear",
The orientation or positional relationship of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" is based on attached drawing institute
The orientation or positional relationship shown, is merely for convenience of description of the present invention and simplification of the description, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to limit of the invention
System.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
As shown in Figures 1 to 3, the production method of high-frequency circuit board provided in an embodiment of the present invention, comprising the following steps:
Step S100: core plate 100 and PTFE high frequency cover film 200 are provided.
Step S200: carrying out first time drilling, plated through-hole 101, gas vent and registration holes drilled out on core plate 100,
Gas vent 202 and registration holes 203 are drilled out on the gas vent of the corresponding core plate 100 of PTFE high frequency cover film 200, the position of registration holes.
Step S400: core plate 100 is electroplated, outer graphics production and outer layer etching, to form outer-layer circuit figure.
Further include step S300: black holes before plating, forms carbon-coating conductive layer on the hole wall of plated through-hole 101.
Step S600: PTFE high frequency cover film 200 is pasted on the two sides of core plate 100.
Step S700: the core plate 100 for being covered with PTFE high frequency cover film 200 to two sides presses, and substrate is made.
Step S800: carrying out second to substrate and drill, and drills out remaining nonmetallic hole (not shown) and drills out described
The window 201 of the position of the corresponding plated through-hole 101 of the PTFE high frequency cover film 200 on substrate two sides.
Step S900: the substrate after drilling to second carries out sharp processing, and high-frequency circuit board is made.
The production method of high-frequency circuit board provided in this embodiment only bores plated through-hole 101 since first time drills, and second
Secondary drilling is that the core plate 100 for having PTFE high frequency cover film 200 in two sides pressing drills out remaining non-metallic hole, it is possible to reduce is bored
The feed in hole is only needed in pad pasting on core plate 100 to achieve the purpose that reduce internal stress by PTFE high frequency cover film 200
It is aligned with each loci on core plate 100, greatly reduces the operating time of pad pasting, while also ensuring PTFE high frequency
Cover film 200 and the Aligning degree of core plate 100 and the quality of product are suitable for producing in enormous quantities.
In the step s 100, small using the frictional resistance and PTFE with excellent electrical properties of PTFE high frequency cover film 200 covers
Epiphragma, dielectric constant is low, and fissipation factor is small.In one embodiment, PTFE high frequency cover film 200 includes PTFE cover film
210 and it is compound in the thermosetting resin 220 of 210 one side of PTFE cover film, PTFE cover film 210 is far from thermosetting resin 220
Side be covered with release film (not shown), release film plays a protective role to PTFE, tears after pad pasting.
It is understood that first default ruler can be pressed to core plate 100 and PTFE high frequency cover film 200 before first time drills
The cutting of little progress row, processes the core plate 100 for meeting preset shape and size and PTFE high frequency cover film 200.
In step s 200, the gas vent 202 that is drilled out on PTFE high frequency cover film 200, registration holes 203 respectively with core plate
Gas vent, registration holes on 100 correspond.The aperture of the gas vent 202 drilled out on PTFE high frequency cover film 200 may be configured as
Greater than the aperture of the gas vent on core plate 100, such as big 4-6mil；Registration holes on core plate 100 are arranged in neighboring area, such as along length
The region at the both ends in direction is spent, the aperture of the registration holes 203 drilled out on PTFE high frequency cover film 200 may be configured as being greater than core plate
The aperture of registration holes on 100, such as big 3-6mil.
In step S300: forming one layer of graphitic carbon black in the adsorption of the hole wall of the plated through-hole 101 of core plate 100 and lead
Electric layer, to prepare for subsequent electroplating process.
Further include step S500 between step S400 and step S600: PTFE high frequency cover film 200 is toasted, it is cold
But solidify, in this way, it is excessive and PTFE cover film 210 is caused to inside contract to can avoid removing stress after release film.
Before step S700, i.e., before pressing lamination, increase by one between steel plate 400 and PTFE high frequency cover film 200
Layer buffer layer 300, the surface hardness of buffer layer 300 are 70 ± 5sh, can be made after pressing on core plate 100 by adding buffer layer 300
Each junction of route and core plate 100 fit closely.Pressing when, successively stack from top to bottom steel plate 400, buffer layer 300,
PTFE high frequency cover film 200, core plate 100, buffer layer 300, steel plate 400.
In step S700, in pressing, pressure F may be configured as 450psi, and temperature is 180 DEG C, and pressing time is 3~
6min, in this way, the mobility of resin is provided by increasing pressing pressure, to solve core plate 100 and PTFE high frequency cover film
There is the phenomenon in resin cavity after 200 pressings.
In step S900, the aperture of the window 201 of high frequency cover film may be configured as bigger than the aperture of plated through-hole 101 by 6
~12mil.
It is right in conjunction with shown in Fig. 2, Fig. 3 below by taking the use of PTFE high frequency cover film 200 includes PTFE cover film 210 as an example
The production method of high-frequency circuit board illustrates, production method specifically includes the following steps:
Step 1: selecting frictional resistance small and possess the PTFE high frequency cover film 200 of excellent electrical properties, which covers
Epiphragma 200 is made of PTFE cover film 210 and single side thermosetting resin 220,25-40 μm of PTFE thickness, resin thickness 10-20 μ
m。
Step 2: engineering design, including jigsaw design, line build-out, gerber are carried out to PTFE cover film 210 and pcb board
Output etc..In engineering design, removes original shape windowing figure and non-metallic hole on PTFE high frequency cover film 200 and open
Window, only stays the registration holes 203 of a small amount of gas vent 202 and plated through-hole 101 and 200 4 jiaos of PTFE high frequency cover film, such as opens up
The gas vent 202 of two-row spacing.
Step 3: sawing sheet cuts pcb board and PTFE cover film 210 according to jigsaw pre-set dimension.
Step 4: drilling for the first time, the plated through-hole 101 on frequency PCB plate is only drilled out on core plate 100.Non-metallic hole
It is drilled out when drilling for second, the two is avoided once to drill out, needed at windowing in the fitting of subsequent PTFE high frequency cover film 200
Reason, and PTFE high frequency cover film 200 opens a window and is excessively easy to produce internal stress in fitting, therefore drills out respectively before and after the two.
Step 5: melanism, by physisorption, the hole wall surface on hole-drilled core plate 100 adsorbs one layer
Even graphitic carbon unlicensed tour guide's electric layer is prepared for subsequent electroplating process.
Step 6: 101 hole wall of plated through-hole is electroplated to 20 μm of copper thickness or more, face copper 35 after 100 black holes of core plate by plating
μm or more.
Step 7: outer graphics production being carried out to pcb board and outer layer etches, makes the outer-layer circuit figure of PCB core plate 100.
Step 8: brownification could be made that the PCB core plate 100 of outer-layer circuit figure carries out brownification processing, be PTFE cover film 210
Fitting is prepared.Brownification processing be the surface of PCB core plate 100 is roughened so that 100 surface of core plate formed it is coarse
Surface.
Step 9: laser mills PTFE high frequency cover film 200, by only milling plated through-hole window (i.e. window 201), gas vent 202
With the mode of registration holes 203, PTFE high frequency cover film 200 is milled out, obtains the PTFE high frequency cover film 200 of pre- fitting.Only mill
Plated through-hole window, gas vent 202 and registration holes 203, the mode that other outer shaped positions do not mill reduce PTFE high frequency cover film 200
Fitting it is possible that stress inside contract.Therefore plated through-hole 101, gas vent 202 and registration holes 203 are only bored, so not needing
Cover film windowing to non-metallic hole site.
The garbage area of PTFE cover film 210 is arranged in gas vent 202 therein, and effect is that PTFE high frequency cover film 200 pastes
Exhaust when conjunction, gas vent window are the windowings bigger than the gas vent aperture on core plate 100, are opened a window 3-6mil bigger than gas vent.
Alignment operation when registration holes 203 are bonded for subsequent PTFE high frequency cover film 200, registration holes are only distributed in plate face
Surrounding, registration holes window is the windowing bigger than the registration holes on core plate 100, open a window it is 4-6mil bigger than registration holes.
Wherein plated through-hole window is the windowing bigger than plated through-hole 101, is opened a window 6-12mil bigger than plated through-hole 101.
Step 10: pcb board and PTFE cover film 210 being bonded, before pad pasting, are first put into PTFE cover film 210
In oven, cooling is taken out after 160 DEG C of high-temperature baking 10-15min, obtains the resin on PTFE cover film 210 further solid
Change, to achieve the purpose that reduce resin viscosity, to reduce the internal stress of product when tearing release paper, avoids answering after removing release paper
Power is excessive and cover film is caused to inside contract, and influences the contraposition of PTFE cover film 210 Yu PCB core plate 100.
Step 11: to pcb board and PTFE cover film 210 by pressing mode, the two securely being sticked together.
Pressing therein is all covered with PTFE high frequency cover film 200 in pcb board tow sides place on line, is realized
Protection to outer-layer circuit.Pressure is set as 450psi when pressing, and temperature setting is 180 DEG C, pressing time 3-6min, pressing
Laminated construction is successively covered according to steel plate 400, the silica gel padded coaming of 2.0mm thickness, PTFE cover film 210, pcb board, PTFE
Film 210, the silica gel padded coaming of 2.0mm thickness, steel plate 400.The compression method can solve cover film pressing resin cavity
Problem.Wherein, padded coaming uses the cushion with layer of silica gel, and surface hardness is 70 ± 5sh.
Step 12: pcb board is carried out second and drilled by second of drilling after the pressing of PTFE high frequency cover film 200, brill
Remaining non-metallic hole out.
Step 13: shape and groove milling mill scrap area extra in pcb board according to the shape Data Design of pcb board
It removes, the final finished product production for realizing pcb board.
Step 14: electrical measurement, finished product inspection and shipment carry out electric performance test according to normal flow, and carry out appearance inspection
It looks into, until the shipment of product qualification.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of production method of high-frequency circuit board, it is characterised in that: the following steps are included:
Core plate and PTFE high frequency cover film are provided；
First time drilling is carried out, including drills out plated through-hole on the core plate and is covered in the core plate and the PTFE high frequency
Film corresponding position drills out gas vent and registration holes；
Black holes, plating, outer graphics production and outer layer etching are carried out to core plate, to form outer-layer circuit figure；
PTFE high frequency cover film is pasted on the two sides of core plate；
The core plate for being covered with PTFE high frequency cover film to two sides presses, and substrate is made；
Second is carried out to substrate to drill, and drills out remaining nonmetallic hole and drills out the PTFE high frequency covering on the substrate two sides
Film corresponds to the window of the position of the plated through-hole；
Substrate after drilling to second carries out sharp processing, and high-frequency circuit board is made.
2. the production method of high-frequency circuit board according to claim 1, it is characterised in that: the PTFE high frequency cover film packet
Include PTFE cover film and the thermosetting resin for being compound in the PTFE cover film one side.
3. the production method of high-frequency circuit board according to claim 2, it is characterised in that: before pressing, the PTFE covering
Film with a thickness of 25~40 μm, the thermosetting resin with a thickness of 10~20 μm.
4. the production method of high-frequency circuit board according to claim 2, it is characterised in that: the PTFE high frequency cover film is also
Including being covered in release film of the PTFE cover film far from the thermosetting resin side；Before pad pasting, to the PTFE high
Frequency cover film is toasted, cooling and solidifying, excessive and PTFE cover film is caused to inside contract to avoid stress after release film is removed.
5. the production method of high-frequency circuit board according to claim 4, it is characterised in that: before pad pasting, to the PTFE
The step of high frequency cover film is toasted, cooled and solidified includes: after cover film is put into 160 DEG C of high-temperature baking 10-15min of oven
Take out cooling.
6. the production method of described in any item high-frequency circuit boards according to claim 1~5, it is characterised in that: before plating,
The adsorption of the hole wall of plated through-hole forms one layer of graphitic carbon black conductive layer on the core plate.
7. the production method of described in any item high-frequency circuit boards according to claim 1~5, it is characterised in that: pasted to two sides
Having the step of core plate of PTFE high frequency cover film is pressed includes: to be covered with the two of the core plate of PTFE high frequency cover film on two sides
Face stacks buffer layer respectively, and steel plate is stacked outside the buffer layer of two sides, and then high temperature and pressure is pressed, and obtains substrate, wherein
The buffer layer is silica gel buffer layer, and surface hardness is 70 ± 5sh.
8. the production method of described in any item high-frequency circuit boards according to claim 1~5, it is characterised in that: the first time
When drilling, the gas vent is drilled out in the garbage area of the PTFE high frequency cover film.
9. the production method of described in any item high-frequency circuit boards according to claim 1~5, it is characterised in that: the PTFE high
The window of frequency cover film is 6~12mil bigger than the aperture of the plated through-hole.
10. a kind of high-frequency circuit board, it is characterised in that: utilize the production of according to any one of claims 1 to 99 described in any item high-frequency circuit boards
Method is made.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811625569.1A CN109561594B (en) | 2018-12-28 | 2018-12-28 | High-frequency circuit board and manufacturing method thereof |
| PCT/CN2019/126512 WO2020135204A1 (en) | 2018-12-28 | 2019-12-19 | High-frequency circuit board and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811625569.1A CN109561594B (en) | 2018-12-28 | 2018-12-28 | High-frequency circuit board and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN109561594A true CN109561594A (en) | 2019-04-02 |
| CN109561594B CN109561594B (en) | 2020-01-17 |
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| WO (1) | WO2020135204A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020135204A1 (en) * | 2018-12-28 | 2020-07-02 | 深圳市景旺电子股份有限公司 | High-frequency circuit board and manufacturing method therefor |
| CN114007331A (en) * | 2021-10-15 | 2022-02-01 | 珠海杰赛科技有限公司 | Coil plate and processing method thereof |
| CN114554698A (en) * | 2022-03-31 | 2022-05-27 | 深圳市大族数控科技股份有限公司 | PCB processing method, PCB and PCB drilling method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4640866A (en) * | 1984-04-10 | 1987-02-03 | Junkosha Company Ltd. | Printed circuit board |
| CN102065651A (en) * | 2011-01-12 | 2011-05-18 | 广州兴森快捷电路科技有限公司 | Production method of high-density laminated printed circuit board of high-frequency material |
| CN203243600U (en) * | 2013-05-24 | 2013-10-16 | 浙江万正电子科技有限公司 | Hole-metallization polytetrafluoroethylene multilayer circuit board |
| CN106132081A (en) * | 2016-06-30 | 2016-11-16 | 广州兴森快捷电路科技有限公司 | A kind of high-frequency high-speed PCB and preparation method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103096645A (en) * | 2011-10-27 | 2013-05-08 | 深南电路有限公司 | Lamination positioning method of multilayer circuit board |
| CN102781173B (en) * | 2012-07-24 | 2015-07-22 | 深圳市景旺电子股份有限公司 | Method for machining and molding printed circuit board (PCB) made of polytetrafluoroethylene (PTFE) material |
| CN105530768B (en) * | 2014-09-28 | 2019-02-05 | 深南电路有限公司 | A kind of production method and circuit board of circuit board |
| CN204994073U (en) * | 2015-09-30 | 2016-01-20 | 深圳市昶东鑫线路板有限公司 | PCB circuit board is thoughtlessly pressed to PTFE high frequency |
| CN105491809B (en) * | 2015-12-22 | 2019-06-14 | 广东生益科技股份有限公司 | PCB production technology and PCB |
| CN109561594B (en) * | 2018-12-28 | 2020-01-17 | 深圳市景旺电子股份有限公司 | High-frequency circuit board and manufacturing method thereof |
-
2018
- 2018-12-28 CN CN201811625569.1A patent/CN109561594B/en active Active
-
2019
- 2019-12-19 WO PCT/CN2019/126512 patent/WO2020135204A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4640866A (en) * | 1984-04-10 | 1987-02-03 | Junkosha Company Ltd. | Printed circuit board |
| CN102065651A (en) * | 2011-01-12 | 2011-05-18 | 广州兴森快捷电路科技有限公司 | Production method of high-density laminated printed circuit board of high-frequency material |
| CN203243600U (en) * | 2013-05-24 | 2013-10-16 | 浙江万正电子科技有限公司 | Hole-metallization polytetrafluoroethylene multilayer circuit board |
| CN106132081A (en) * | 2016-06-30 | 2016-11-16 | 广州兴森快捷电路科技有限公司 | A kind of high-frequency high-speed PCB and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020135204A1 (en) * | 2018-12-28 | 2020-07-02 | 深圳市景旺电子股份有限公司 | High-frequency circuit board and manufacturing method therefor |
| CN114007331A (en) * | 2021-10-15 | 2022-02-01 | 珠海杰赛科技有限公司 | Coil plate and processing method thereof |
| CN114554698A (en) * | 2022-03-31 | 2022-05-27 | 深圳市大族数控科技股份有限公司 | PCB processing method, PCB and PCB drilling method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109561594B (en) | 2020-01-17 |
| WO2020135204A1 (en) | 2020-07-02 |
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Inventor after: Wang Jun Inventor after: Zhang Xia Inventor after: Chen Xiaoqing Inventor before: Tian Xiaoyan Inventor before: Zhang Xia Inventor before: Wang Jun Inventor before: Chen Xiaoqing Inventor before: Kang Guoqing |