CN216134640U - High-density interconnected high-rise printed board product structure - Google Patents

Abstract

The utility model provides a high-density interconnected high-rise printed board product structure, which relates to the field of high-density interconnected circuit boards and comprises a mother board and a daughter board, wherein the mother board comprises an L1 layer and an L16 layer, the daughter board comprises a first core board, a second core board, a third core board, a fourth core board, a fifth core board, a sixth core board, an L2 layer and an L15 layer, a high-resin-content 106 prepreg, 1080 prepreg and 2116 prepreg combination and CAF-resistant core board combination structure is adopted, the interlayer glue filling amount is increased, the resin is fully flowed and solidified, the heat resistance and the insulativity of a HDI high-rise circuit board are improved, the interlayer compensation is adopted before lamination, 6 pieces of hot melting positioning holes need to take an average value for distance targeting, and the lamination and riveting high-stability positioning process is adopted, the interlayer deviation between the core boards is greatly reduced, and the interlayer alignment precision of the product is improved.

Description

High-density interconnected high-rise printed board product structure

Technical Field

The utility model relates to the field of high-density interconnected circuit boards, in particular to a high-density interconnected high-rise printed board product structure.

Background

With the development of electronic products toward high density, multi-functionalization and high performance, higher requirements are put on the design and manufacturing process of a Printed Circuit Board (PCB), and the products are also developed from the conventional multilayer PCB to high-end PCB products such as high-rise PCBs, HDI (high density interconnect), heat-dissipating substrates, and the like. The high precision of the alignment between the high-layer HDI plate layers, the expansion and shrinkage of the core plate, the insulativity, the heat resistance and the reliability are the key technical problems faced by manufacturers. The core plates and the prepregs are overlapped, so that the defects of sliding plates, cracks, layering and the like are easily caused during pressing production; influence factors such as dislocation superposition and interlayer positioning process caused by the expansion and shrinkage of different core plates and circuit layers, and the problems of overproof interlayer deviation, failure of product reliability and the like of a high-rise circuit board after multiple blind hole/filled hole electroplating processing. Based on this, provide the product structure that product quality of HDI high-rise circuit board is stable, the reliability is high.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a high-density interconnection high-rise printed board product structure.

In order to achieve the purpose, the utility model adopts the following technical scheme: a high-density interconnection high-rise printed board product structure comprises a mother board and a daughter board, wherein the mother board comprises an L1 layer and an L16 layer, and the daughter board comprises a first core board, a second core board, a third core board, a fourth core board, a fifth core board, a sixth core board, an L2 layer and an L15 layer.

Preferably, the first core plate comprises an L3 layer and an L4 layer, the thickness of the L3 layer and the thickness of the L4 copper layer are 30 μm, and the thickness of the first core plate is 0.10-0.15 mm.

Preferably, the second core board comprises L5 layers and L6 layers, the thickness of the L5 layer and the thickness of the L6 copper layer are 30 μm, and the thickness of the second core board is 0.10-0.15 mm.

Preferably, the third core plate comprises an L7 layer and an L8 layer, the thickness of the L7 layer and the thickness of the L8 copper layer are 15 μm, and the thickness of the third core plate is 0.10-0.15 mm.

Preferably, the fourth core board comprises an L9 layer and an L10 layer, the thickness of the L9 layer and the thickness of the L10 copper layer are 15 μm, and the thickness of the fourth core board is 0.10-0.15 mm.

Preferably, the fifth core plate comprises an L11 layer and an L12 layer, the thickness of the L11 layer and the thickness of the L12 layer copper layer are 30 μm, and the thickness of the fifth core plate is 0.10-0.15 mm.

Preferably, the sixth core plate comprises an L13 layer and an L14 layer, the thickness of the L13 layer and the thickness of the L14 layer copper layer are 30 μm, and the thickness of the sixth core plate is 0.10-0.15 mm.

Preferably, 106 prepregs and first 1080 prepregs are arranged between the first core plate and the second core plate, and between the fifth core plate and the sixth core plate.

Preferably, first 2116 prepregs are arranged between the second core plate and the third core plate, between the third core plate and the fourth core plate, and between the fourth core plate and the fifth core plate.

Preferably, second 2116 prepregs are arranged between the L2 layer and the L3 layer and between the L14 layer and the L15 layer, second 1080 prepregs are arranged between the L1 layer and the L2 layer and between the L15 layer and the L16 layer, and the thicknesses of the outer copper foils of the L12 layer and the L16 layer are 42 microns.

Advantageous effects

The combined structure of the 106 prepregs, 1080 prepregs, 2116 prepregs and the CAF-resistant core board with high resin content improves the interlaminar glue filling amount, enables resin to flow and solidify fully, improves the heat resistance and the insulativity of the HDI high-rise circuit board, adopts inner layer layering compensation before lamination, requires 6 core boards to be subjected to average value distance targeting at hot melting positioning holes, and adopts a high-stability positioning process of lamination hot melting and riveting, thereby greatly reducing the interlaminar deviation between the core boards, improving the interlaminar alignment precision of products, solving the problems of multiple layers of HDI high-rise circuit boards, superposition of multiple core boards and prepregs, sliding plates, cracks, layering and the like after lamination, and solving the reliability failure problems of uneven thickness, low insulativity and the like of an insulating layer of the HDI high-rise circuit board.

Drawings

FIG. 1 is a cross-sectional view of a high-level, high-density interconnect printed board structure;

FIG. 2 is a cross-sectional view of a daughter board;

FIG. 3 is a cross-sectional view of the precursor, daughter, and prepreg;

fig. 4 is a sectional view of the sub-body and the prepreg.

Illustration of the drawings:

1. a motherboard; 101. a layer of L1; 102. a layer of L16; 2. a daughter board; 201. a first core board; 20101. a layer of L3; 20102. a layer of L4; 202. a second core board; 20201. a layer of L5; 20202. a layer of L6; 203. a third core board; 20301. a layer of L7; 20302. a layer of L8; 204. a fourth core board; 20401. a layer of L9; 20402. a layer of L10; 205. a fifth core board; 20501. a layer of L11; 20502. a layer of L12; 206. a sixth core board; 20601. a layer of L13; 20602. a layer of L14; 207. a layer of L2; 208. a layer of L15; 3. 106 a prepreg sheet; 4. a first 1080 prepreg sheet; 5. a first 2116 prepreg; 6. a second 2116 prepreg; 7. a second 1080 prepreg.

Detailed Description

In order to make the technical means, the original characteristics, the achieved purposes and the effects of the utility model easily understood, the utility model is further described below with reference to the specific embodiments and the attached drawings, but the following embodiments are only the preferred embodiments of the utility model, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention.

Specific embodiments of the present invention are described below with reference to the accompanying drawings.

The specific embodiment is as follows:

referring to fig. 1 to 4, a high-density interconnect high-level printed board product structure includes a mother board 1, a daughter board 2, the mother board 1 including an L1 layer 101 and an L16 layer 102, the daughter board 2 including a first core board 201, a second core board 202, a third core board 203, a fourth core board 204, a fifth core board 205, a sixth core board 206, an L2 layer 207 and an L15 layer 208, the first core board 201 including an L3 layer 20101 and an L4 layer 20102, the L3 layer 20101, the L4 layer 20102 thickness 30 μm, the first core board 201 having a thickness of 0.10 mm to 0.15 mm, the second core board 202 including an L5 layer 20201 and an L6 layer 20202, the L5 layer 20201, the L2 layer 20202 thickness 30 μm, the second core board 202 having a thickness of 0.10 mm to 2030.15 mm, the third core board 203 including an L7 layer 20202 and an L8 layer 20202, the L7 layer 20201, the L2048 layer 20202 thickness of 30 μm, the L2040 μm, the second core board layer 9 thickness of 0.10 mm to 2030.15 μm, the third core board 203 including a core board layer 2043 and the L2043 layer 2043, the thickness of the fourth core plate 204 is 0.10-0.15 mm, the fifth core plate 205 comprises an L11 layer 20501 and an L12 layer 20502, the thickness of the L11 layer 20501 and the L12 layer 20502 copper layers is 30 μm, the thickness of the fifth core plate 205 is 0.10-0.15 mm, the sixth core plate 206 comprises an L13 layer 20601 and an L14 layer 20602, the thickness of the L13 layer 20601 and the thickness of the L14 layer 20602 copper layers is 30 μm, and the thickness of the sixth core plate 206 is 0.10-0.15 mm.

The daughter board 2 is formed by six core boards through PE punching, browning pretreatment, board stacking and vacuum pressing, the outer layer of the daughter board 2 is formed through hole drilling and burying, hole burying electroplating, resin hole plugging and burying, secondary outer layer circuit and browning, the buried hole is drilled out of the daughter board 2 through a mechanical drilling machine, the aperture is 25 mu m, buried hole electroplating is carried out after the buried hole is drilled out, the buried hole copper meets more than 18 mu m, VCP electroplating line is used for fully plating the buried hole to meet the hole copper requirement, the resin hole plugging and burying uses a printer to fill insulating resin into the buried hole, the resin hole plugging and curing are carried out, and then grinding the resin into a plate, wherein the resin in the buried hole is fully required, the secondary outer layer circuit is completed by performing front layer treatment, dry film pasting, exposure, development and etching on the copper layer circuit on the surface of the daughter board 2, and the browning is performed by performing browning chemical treatment after the daughter board 2 circuit is processed, so that the copper surface achieves the effect before lamination.

The thickness of the secondary outer layer copper foil of the daughter board 2 is 0.5 ounce, namely the thickness of the L2 layer 207 secondary outer layer copper foil is 0.5 ounce, the thickness of the L15 layer 208 secondary outer layer copper foil is 0.5 ounce, and the secondary outer layer of the daughter board 2 is manufactured by secondary outer layer pressing, buried hole drilling, buried hole electroplating, resin buried hole plugging, secondary outer layer circuit, AOI and browning.

Six core boards are manufactured by cutting, curing, inner layer pre-processing, inner layer coating, inner layer exposure, inner layer development and etching, AOI-punching and browning, six core boards are cured for 160-4 hours after cutting, inner layer layering compensation is adopted before secondary outer layer lamination, hot melting positioning holes need 6 core boards to be subjected to average distance targeting, a positioning process of laminating, hot melting and riveting is adopted, concentric circles are checked by using X-RAY, layer deviation is controlled within 75 mu m, secondary outer layer lamination is adopted for targeting and hot melting positioning of six core boards, an L15 layer 208 and an L16 layer 102, symmetric typesetting and up and down brand new 20 kraft papers are adopted, a vacuum lamination process is adopted for mother board 1 lamination, process edge fusion positioning blocks of daughter boards 2 are etched through inner layer graphs, then the daughter boards are stacked according to the stacking sequence of the mother board 1, prepreg is placed between the daughter boards 2 and outer copper foils, and then the mother board 1 is positioned and positioned, The manufacturing method comprises the steps of symmetrical plate arrangement and vacuum pressing, wherein the outer layer of a mother plate 1 is manufactured through the processes of mother plate 1 pressing, copper reduction, laser drilling, mechanical drilling, outer layer buried hole electroplating, resin hole plugging, resin plate grinding and post-processing.

106 prepregs 3 and 4 are arranged between the first core plate 201 and the second core plate 202, and 106 prepregs 3 and 4 are arranged between the fifth core plate 205 and the sixth core plate 206, the resin content of 106 prepregs 3 is 78%, the resin content of first 1080 prepregs 4 is 63%, the first 2116 prepregs 5 are arranged between the second core plate 202 and the third core plate 203, between the third core plate 203 and the fourth core plate 204, between the fourth core plate 204 and the fifth core plate 205, the resin content of the first prepregs is 52%, the second core plate 2116 prepregs 6 are arranged between the L2 layer 207 and the L3 layer 20101, and between the L14 layer 20602 and the L15 layer 208, the resin content of the second 2116 prepregs 6 is 60%, and the prepregs arranged between the six prepregs are pressed under the vacuum conditions of high temperature and high pressure, and serve as bonding layers, insulating layers and have the functions of glue filling and insulation.

A first 2116 prepreg 5 is arranged between an L1 layer 101 and an L2 layer 207, and between an L15 layer 208 and an L16 layer 102, the L1 layer 101 is an outer copper foil, the resin content of a second 1080 prepreg 7 is 71%, and a high-resin-content 106 prepreg 3, a first 1080 prepreg 4, a first 2116 prepreg 5, a second 2116 prepreg 6 and a CAF-resistant core board combined structure improves the interlayer glue filling amount, enables the resin to fully flow and solidify, and improves the heat resistance and the insulation property of the HDI high-rise circuit board.

Six inner-layer core boards of an L12 layer 20502 and an L16 layer 102, such as an outer copper foil thickness 42 μm, an L3 layer 20101/L4 layer 20102, an L5 layer 20202/L6 layer 20202, an L7 layer 20302/L8 layer 20302, an L9 layer 20402/L10 layer 20402, an L10 layer 20402/L11 layer 20501, an L12 layer 20502/L13 layer 01, an L15 layer 208/L16 layer 102, are all epoxy resin substrates FR4, a material TG value is 150 degrees, and an inner-layer core board thickness (without copper) is 75-110 μm, a mother board 2061 is formed by using CAF-resistant plates and using fusion positioning according to the lamination sequence of the mother board 2061, and the mother board 1 is manufactured after cutting, targeting and edge milling. The method comprises the steps of processing a blind hole in a mother board 1, drilling a through hole on the outer layer, filling hole electroplating and resin hole plugging to finally form a HDI high-rise circuit board product structure, wherein the aperture of the blind hole is 75 micrometers, drilling the mother board 1 through a laser drilling machine, and then performing the filling hole electroplating after the blind hole is drilled to complete the blind hole processing, so that the electrical performance is realized, drilling the through hole on the outer layer, wherein the aperture is 0.2mm at the minimum, filling hole electroplating, filling the blind hole by using a VCP filling line to fill up the blind hole, and meeting the hole copper requirement.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (4)

1. The utility model provides a high-rise printed board product structure of high-density interconnection, includes motherboard (1), daughter board (2), its characterized in that: the motherboard (1) comprising L1 layers (101) and L16 layers (102), the daughterboard (2) comprising a first core board (201), a second core board (202), a third core board (203), a fourth core board (204), a fifth core board (205), a sixth core board (206), L2 layers (207) and L15 layers (208), the first core board (201) comprising L3 layers (20101) and L4 layers (20102), the first core board (201) having a thickness of 0.10-0.15 mm, the second core board (202) comprising L5 layers (20201) and L6 layers (20202), the second core board (202) having a thickness of 0.10-0.15 mm, the third core board (203) comprising L7 layers (20301) and L8 layers (20302), the third core board (203) having a thickness of 0.10-0.15 mm, the fourth core board (204) comprising L9 layers (68501) and L8 layers (2043), the fourth core board (204) comprising L463) and L15 layers (733) and L6 layers (20102), the fifth core plate (205) has a thickness of 0.10-0.15 mm, the sixth core plate (206) includes L13 layers (20601) and L14 layers (20602), and the sixth core plate (206) has a thickness of 0.10-0.15 mm.

2. The high-density interconnected high-rise printed board product structure as claimed in claim 1, wherein: 106 prepregs (3) and first 1080 prepregs (4) are arranged between the first core board (201) and the second core board (202) and between the fifth core board (205) and the sixth core board (206).

3. The high-density interconnected high-rise printed board product structure as claimed in claim 1, wherein: and first 2116 prepregs (5) are arranged between the second core plate (202) and the third core plate (203), between the third core plate (203) and the fourth core plate (204), and between the fourth core plate (204) and the fifth core plate (205).

4. The high-density interconnected high-rise printed board product structure as claimed in claim 1, wherein: second 2116 prepregs (6) are arranged between the L2 layer (207) and the L3 layer (20101) and between the L14 layer (20602) and the L15 layer (208), second 1080 prepregs (7) are arranged between the L1 layer (101) and the L2 layer (207) and between the L15 layer (208) and the L16 layer (102), and the thicknesses of the outer copper foils of the L12 layer (20502) and the L16 layer (102) are 42 mu m.

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