CN207753914U - A kind of printed circuit board - Google Patents
A kind of printed circuit board Download PDFInfo
- Publication number
- CN207753914U CN207753914U CN201820025011.9U CN201820025011U CN207753914U CN 207753914 U CN207753914 U CN 207753914U CN 201820025011 U CN201820025011 U CN 201820025011U CN 207753914 U CN207753914 U CN 207753914U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- side wall
- printed circuit
- wall slot
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model belongs to Manufacturing Technology for PCB field, it is intended to provide a kind of printed circuit board, the printed circuit board includes the multilayer circuit board for offering at least one connection through-hole, in the utility model, side wall slot is offered on the side wall of multilayer circuit board, specifically, side wall slot is process by the perforating cutter customized according to the design shape and designed size of side wall slot along the laminating direction perpendicular to multilayer circuit board, that is, the side wall slot on multilayer circuit board side wall is arranged along the laminating direction of multilayer circuit board.It is to be appreciated that by replacing plain cutter with customization cutter and slotting the side wall opened up perpendicular to the laminating direction of multilayer circuit board is changed into along the laminating direction of multilayer circuit board, the guide tracked installation of the printed circuit board can be realized.In addition, side wall slot and each connection through-hole can metallize to form coat of metal simultaneously, the printed circuit board also has higher security performance and reliability as a result,.
Description
Technical field
The utility model belongs to Manufacturing Technology for PCB field, is to be related to a kind of printed circuit board more specifically.
Background technology
Printed circuit board (Printed Circuit Board, abbreviation pcb board) be it is a kind of support electronic component it is important
Electronic unit and a kind of carrier for realizing the electrical connection of each electronic component.For convenience of each electronic component of connection, tradition
Pcb board it is usually necessary to use various cutters such as gong knife, milling cutter, drill bits, and a variety of slots are opened up in the plate face of pcb board, then
It metallizes to each slot, but its edges of boards is not dealt with generally.
As shown in Figure 1, considering the uncoated coating of side wall of traditional PCB plate 10, it be easy to cause high frequency signal transmission leakage, shadow
The normal work of electronic component is rung, people have the edges of boards realization metallization in pcb board.Furthermore, it is contemplated that will be limited
Pcb board etc. is installed in space, needs electronic component being mounted on the side wall of pcb board by pad, in the prior art, substantially
All be that slot is directly opened up using plain cutter from top to bottom on the side wall of common pcb board, then again to the side wall of pcb board and
Slot thereon metallizes, however, these primary demands for being only capable of meeting user, when the limit because of structure and mounting condition
System, can not be in pcb board side wall because the knife edge part of conventional milling cutters is in the same size when needing to install pcb board in the form of guide rail
On process the slot that can be met the requirements, that is, the structure of existing pcb board cannot be satisfied the demand of guide tracked installation.
Utility model content
The purpose of this utility model is to provide a kind of printed circuit boards, to solve pcb board existing in the prior art
Structure the technical issues of cannot achieve guide tracked installation.
In order to solve the above technical problems, the technical solution adopted in the utility model is：A kind of printed circuit board is provided, the print
Circuit board processed includes the multilayer circuit board for offering at least one connection through-hole；In perpendicular to the lamination side of the multilayer circuit board
Upwards, it offers to metallize together with each connection through-hole on the side wall of the multilayer circuit board and forms coat of metal
Side wall slot, and the side wall slot is by the perforating cutter edge that is customized according to the design shape and designed size of the side wall slot
Laminating direction perpendicular to the multilayer circuit board is process.
Further, the blade of the perforating cutter be in inverted " t " font, the channel design depth W of the side wall slot with
The magnitude relationship of the head extension elongation L of the blade is：W≤a*L, wherein a is cutter limit coefficient；The side wall slot
Channel design width B and the magnitude relationship of the height of head H of the blade be：B≤H.
Further, the tolerance of the channel design depth W of the side wall slot is ± 0.15mm；The digging of the side wall slot
The tolerance that slot designs width B is ± 0.15mm.
Further, the side that the coat of metal of the side wall slot and each connection through-hole passes through heavy copper plate electric
Formula is formed.
Further, the multilayer circuit board includes core material, insulating bond and conductor layer, the core material
Upper and lower surface has been sequentially laminated the insulating bond and the conductor layer.
Further, the core material is sequentially laminated by the first metal layer, insulating medium layer and second metal layer.
Further, it is etched with inner line figure in the first metal layer and the second metal layer.
Further, the first metal layer and the second metal layer are layers of copper.
Further, the conductor layer is layers of copper, and the insulating bond is epoxy resin and glass fibre blending agent
Layer.
Further, it is etched with outer-layer circuit figure in two conductor layers.
Compared with prior art, the advantageous effect of printed circuit board provided by the utility model is：
The printed circuit board includes the multilayer circuit board for offering at least one connection through-hole, wherein multilayer circuit board
Side wall slot is offered on side wall, specifically, side wall slot is by customizing according to the design shape and designed size of side wall slot
Perforating cutter is process along the laminating direction perpendicular to multilayer circuit board, that is, the sidewall channels on multilayer circuit board side wall
Hole is arranged along the laminating direction of multilayer circuit board.It is to be appreciated that by replacing plain cutter and by edge with customization cutter
The laminating direction for multilayer circuit board changes the side wall fluting opened up perpendicular to the laminating direction of multilayer circuit board into, can realize
The guide tracked installation of the printed circuit board.In addition, side wall slot and each connection through-hole can metallize to form coat of metal simultaneously,
The printed circuit board also has higher security performance and reliability as a result,.
Description of the drawings
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this practicality is new
Some embodiments of type for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the cross-sectional view of printed circuit board in the prior art；
Fig. 2 is the cross-sectional view of the multilayer circuit board after being laminated in the utility model embodiment；
Fig. 3 is the cross-sectional view after multilayer circuit twist drill connection through-hole in Fig. 2；
Fig. 4 is that the side wall of multilayer circuit board in Fig. 3 opens up the cross-sectional view after side wall slot；
Fig. 5 be in Fig. 4 multilayer circuit board side wall slot and it is each connection via metalization formed coat of metal after it is transversal
Face schematic diagram；
Fig. 6 is the cross-sectional view of printed circuit board in the utility model embodiment；
Fig. 7 is the main view of the customization perforating cutter for the side wall slot that printed circuit board is processed in the utility model embodiment
Figure.
Wherein, the label in attached drawing is as follows：
Pcb board traditional 10-；
100- multilayer circuit boards, 110- core materials, 111- the first metal layers, 112- insulating medium layers, the second gold medals of 113-
Belong to layer, 114- inner line figures, 120- insulating bonds, 130- conductor layers, 131- outer-layer circuit figures；
200- connections through-hole, 300- side walls slot, 310- coat of metal, 400- perforating cutters, 410- blades.
Specific implementation mode
To make technical problem to be solved in the utility model, technical solution and advantageous effect be more clearly understood, below
In conjunction with specific drawings and the specific embodiments, further elaborate to the utility model.Wherein, the utility model is embodied
Same or analogous label indicates same or analogous element or element with the same or similar functions in the attached drawing of example.
It should be understood that ground, specific embodiment disclosed below is intended for explaining the utility model, is not used to limit this practicality newly
Type.
It should be noted that when element is referred to as " being fixed on " or " being installed on " or " being set to " or " being connected to " another element
On, it can directly on another element or be connected on another element.For example, when an element is referred to as
On " being connected to " another element, it can be directly to another element or be connected indirectly to another element
On.
It is to be understood that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical", " water
It is flat ", "top", "bottom", "inner", the instructions such as "outside" orientation or positional relationship be to be based on the orientation or positional relationship shown in the drawings,
It is merely for convenience of describing the present invention and simplifying the description, not indicating or implying the indicated device or element must have
Specific orientation, with specific azimuth configuration and operation, therefore, the being given for example only property of term of position relationship described in attached drawing is said
It is bright, it should not be understood as limiting the present invention.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the present invention, the meaning of " plurality " is two or two with
On, unless otherwise specifically defined.In short, for the ordinary skill in the art, it can be as the case may be
Understand the concrete meaning of above-mentioned term.
A kind of realization of printed circuit board provided by the utility model is retouched in detail below in conjunction with attached drawing 2 to Fig. 7
It states.
As shown in Fig. 2, Fig. 3 and Fig. 6, which includes multilayer circuit board 100, in general, the multilayer circuit board 100
For an ordinary circuit board.For the electrically conductive signal channel for forming between circuit layer, offer on the multilayer circuit board 100 at least one
Through-hole 200 is connected, specifically, each through-hole 200 that connects is opened up along the laminating direction of multilayer circuit board 100.
As shown in Figures 4 to 6, to realize the guide tracked installation of the printed circuit board, in perpendicular to multilayer circuit board 100
On laminating direction, side wall slot 300 is offered on the side wall of multilayer circuit board 100.Specifically, side wall slot 300 is by customizing
Perforating cutter 400 is process along the laminating direction perpendicular to multilayer circuit board 100.Wherein, the shape of perforating cutter 400 and big
It is small to be customized respectively according to the design shape of side wall slot 300 and designed size.It should be noted that in the present embodiment, it should
Perforating cutter 400 is a customization milling cutter.
It is to be appreciated that in the present invention, by the common milling cutter of the replacement of perforating cutter 400 with customization, and
It is replaced along multilayer circuit board 100 by this special gong plate mode along the laminating direction perpendicular to multilayer circuit board 100
Laminating direction general gong plate mode come realize multilayer circuit board 100 side wall fluting, it is clear that 300 energy of side wall slot
Conveniently directly by printed circuit board right angle setting to meet the needs of user need to carry out guide tracked installation.
In addition, as shown in figure 5, the side wall slot 300 and each connection through-hole 200 can metallize to form coat of metal together
310, in this way, the coat of metal 310 of the coat of metal 310 of side wall slot 300 and each connection through-hole 200 can prevent high frequency
The leakage of signal transmission reduces signal transmission attenuation as a result, enhances signal shielding ability and improves signal transmission quality.When
So, in practical applications, the metallization of side wall slot 300 and each connection through-hole 200 can be carried out successively.
Further, as a kind of specific implementation mode of printed circuit board provided by the utility model, as shown in fig. 7,
The blade 410 of perforating cutter 400 is in inverted " t " font.It is to be appreciated that in grooving process, perforating cutter 400 can first along
The laminating direction of multilayer circuit board 100 namely the direction of plate thickness are close toward multilayer circuit board 100, to determine side wall slot 300
Slotting position, then edge is close toward multilayer circuit board 100 perpendicular to the laminating direction of multilayer circuit board 100 and cuts, to open up
Side wall slot 300.During actual processing, the making of side wall slot 300 can be completed deeply by numerical control control.
It is to be appreciated that on the laminating direction namely thickness direction of multilayer circuit board 100, side wall slot about 300 two
Depth that the thickness of side is mainly lowered by perforating cutter 400 determines；In the laminating direction perpendicular to multilayer circuit board 100
On, the grooving depth of side wall slot 300 mainly passes through the head extension elongation of the blade 410 of perforating cutter 400 (i.e. T-type milling cutter)
To adjust.Specifically in practical applications, the parameters such as grooving depth of side wall slot 300 should determine according to the requirement of client.
Specifically in the present embodiment, as shown in figs. 4 and 7, the channel design depth W and perforating cutter of side wall slot 300
The magnitude relationship of the head extension elongation L of 400 blade 410 is：W≤a*L, wherein a is cutter limit coefficient.Specifically at this
In embodiment, a 0.9.Accordingly, then as shown in figs. 4 and 7, the channel design width B and perforating cutter of side wall slot 300
The magnitude relationship of the height of head H of 400 blade 410 is：B≤H.
Further, as a kind of specific implementation mode of printed circuit board provided by the utility model, to ensure multilayer
The accuracy of manufacture and reliability of circuit board 100 and energy power limit because of perforating cutter 400, in the present embodiment, side wall slot 300
The tolerance of channel design depth W be ± 0.15mm, similarly, the tolerance of the channel design width B of side wall slot 300 is ±
0.15mm。
Further, as a kind of specific implementation mode of printed circuit board provided by the utility model, such as Fig. 5 and Fig. 6
Shown, to enable side wall slot 300 to metallize, specifically in the present embodiment, the coat of metal 310 of side wall slot 300 passes through
The mode of heavy copper plate electric is formed, meanwhile, each coat of metal 310 for connecting through-hole 200 is also together by way of heavy copper plate electric
It is formed.Certainly, in practical applications, the metallization of side wall slot 300 and each connection through-hole 200 can pass through electroless copper plating, plating
It is realized Deng other metallization modes.
Further, as a kind of specific implementation mode of printed circuit board provided by the utility model, as shown in Fig. 2,
Multilayer circuit board 100 includes core material 110, insulating bond 120 and conductor layer 130.Wherein, core material 110 has upper
Surface (not shown) and lower surface (not shown) go out multilayer circuit board 100, the upper surface of core material 110 for disposal molding
Insulating bond 120 and conductor layer 130 have been sequentially laminated with lower surface.Specifically in the present embodiment, as shown in Fig. 2, internal layer
Core plate 110 is sequentially laminated by the first metal layer 111, insulating medium layer 112 and second metal layer 113.To ensure the internal layer
It is etched with inner line figure 114 in the electric conductivity of core plate 110, the first metal layer 111 and second metal layer 113.Certainly,
In practical applications, inner line figure 114 can be etched only on the first metal layer 111 or second metal layer 113.Preferably,
The first metal layer 111 and second metal layer 113 are layers of copper.Certainly, the first metal layer 111 and second metal layer 113 can be
Other suitable material layers.
Accordingly, to ensure that the printed circuit board has electricity connection function, as shown in Fig. 2, being lost in two conductor layers 130
It is carved with outer-layer circuit figure 131.Preferably, conductor layer 130 is layers of copper.Certainly, in fact, conductor layer 130 can also be other conjunctions
Suitable material layer.It should be noted that in the present embodiment, the material of coat of metal 310 and conductor layer 130 is consistent,
For layers of copper.In addition, to ensure that the high reliability of the printed circuit board, insulating bond 120 are that epoxy resin and glass fibre are mixed
Dielectric layer is closed, certainly, insulating bond 120 can also be other suitable material layers.
From the foregoing, it will be observed that the main manufacturing process of the printed circuit board is as follows：
(1) according to the corresponding common multilayer circuit board of Customer design drawing making；
(2) according to design width B, projected depth W and the sidewall channels of side wall slot 300 shown in Customer design drawing
The parameters such as the design shape in hole 300 customize trepanning milling cutter.Wherein, as shown in fig. 7, the blade 410 of the trepanning milling cutter is in inverted " t "
Font, the head extension elongation L of blade 410 are more than the projected depth W of side wall slot 300, and the height of head H of blade 410 is equal to
The design width B of side channel slot；
(3) head of the blade 410 of trepanning milling cutter is tested at a distance from printed circuit board side wall, and according to Customer design figure
In paper side wall slot 300 to printed circuit board upper surface or lower surface distance, adjustment trepanning milling cutter along printed circuit board layer
Depth is cut on pressure direction, to meet depth requirements of the client to 300 both sides of sidewall channels hole；
(4) along on the direction of printed circuit board, the feed program of the trepanning milling cutter woven according to engineering into
Row controlled depth milling side processes, to process side wall slot 300.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model.For this
For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model
Within, any modification, equivalent replacement, improvement and so on should be included within the right of the utility model.
Claims (10)
1. a kind of printed circuit board, which is characterized in that the printed circuit board include offer it is at least one connection through-hole it is more
Layer circuit board；It can be on the laminating direction perpendicular to the multilayer circuit board, being offered on the side wall of the multilayer circuit board
Each connection through-hole metallizes together forms the side wall slot of coat of metal, and the side wall slot is by according to the side wall
Slot design shape and designed size customization perforating cutter along perpendicular to the multilayer circuit board laminating direction processing and
At.
2. printed circuit board according to claim 1, which is characterized in that the blade of the perforating cutter is in inverted " t " font,
The channel design depth W of the side wall slot and the magnitude relationship of the head extension elongation L of the blade are：W≤a*L, wherein
A is cutter limit coefficient；The channel design width B of the side wall slot and the magnitude relationship of the height of head H of the blade are：
B≤H。
3. printed circuit board according to claim 2, which is characterized in that the channel design depth W's of the side wall slot
Tolerance is ± 0.15mm；The tolerance of the channel design width B of the side wall slot is ± 0.15mm.
4. printed circuit board according to claim 1, which is characterized in that the side wall slot and each connection through-hole
The coat of metal is formed by way of heavy copper plate electric.
5. printed circuit board according to any one of claims 1 to 4, which is characterized in that the multilayer circuit board includes interior
Layer core plate, insulating bond and conductor layer, the upper and lower surface of the core material have been sequentially laminated the insulating sticky
Tie layer and the conductor layer.
6. printed circuit board according to claim 5, which is characterized in that the core material is by the first metal layer, insulation
Dielectric layer and second metal layer are sequentially laminated.
7. printed circuit board according to claim 6, which is characterized in that the first metal layer and the second metal layer
On be etched with inner line figure.
8. printed circuit board according to claim 7, which is characterized in that the first metal layer and the second metal layer
It is layers of copper.
9. printed circuit board according to claim 5, which is characterized in that the conductor layer is layers of copper, the insulation adhesive
Layer is epoxy resin and glass fibre blending agent layer.
10. printed circuit board according to claim 5, which is characterized in that be etched with outer layer line in two conductor layers
Road figure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820025011.9U CN207753914U (en) | 2018-01-05 | 2018-01-05 | A kind of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820025011.9U CN207753914U (en) | 2018-01-05 | 2018-01-05 | A kind of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207753914U true CN207753914U (en) | 2018-08-21 |
Family
ID=63152385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820025011.9U Active CN207753914U (en) | 2018-01-05 | 2018-01-05 | A kind of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207753914U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112449494A (en) * | 2019-08-27 | 2021-03-05 | 深南电路股份有限公司 | Manufacturing method of printed circuit board |
-
2018
- 2018-01-05 CN CN201820025011.9U patent/CN207753914U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112449494A (en) * | 2019-08-27 | 2021-03-05 | 深南电路股份有限公司 | Manufacturing method of printed circuit board |
| CN112449494B (en) * | 2019-08-27 | 2022-04-12 | 深南电路股份有限公司 | Manufacturing method of printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106376172B (en) | A kind of mixed pressure Metal Substrate microwave printed board and design method | |
| CN106961808B (en) | The production method of sunk type high density interconnecting board | |
| CN107613678A (en) | A kind of manufacture craft of thick copper coin | |
| CN105263274A (en) | Manufacture method of high density interconnection board | |
| CN107960019A (en) | A kind of PCB production methods for realizing zero stub and PCB | |
| CN108882566A (en) | A kind of production method of PCB | |
| WO2016134259A1 (en) | Method for producing a printed circuit board | |
| CN101711096A (en) | Micro hole manufacturing process of multilayer HDI circuit board | |
| CN107072067A (en) | A kind of manufacture method of the circuit board of groove at side surface | |
| CN101389191A (en) | Multi-layer circuit board and manufacturing method thereof | |
| CN109168265A (en) | A kind of high-frequency microwave plate high density interconnection board manufacturing method | |
| CN106455291A (en) | Metal copper-based printed board structure with high heat dissipation and preparation method thereof | |
| CN207753914U (en) | A kind of printed circuit board | |
| CN112867286A (en) | Preparation method of embedded large copper plate back plate | |
| CN108124381A (en) | A kind of pcb board and its processing method of special blind hole | |
| CN105163520A (en) | Preparation method of fine-line printed circuit board with mechanical blind holes and buried holes | |
| CN103781283A (en) | Circuit-board manufacturing method | |
| CN109561594A (en) | High-frequency circuit board and preparation method thereof | |
| CN106332461B (en) | Circuit board and preparation method thereof | |
| CN107548244A (en) | The preparation method to be insulated between a kind of two-sided sandwich copper base inside is copper-based | |
| CN209546006U (en) | A kind of outer high multilayer bifurcated eclipsed form rigid-flex combined board | |
| CN106993382A (en) | A kind of preparation method of the circuit board with blind hole | |
| CN105764244A (en) | Circuit board and manufacturing method thereof | |
| CN206674299U (en) | A kind of circuit board with blind hole | |
| CN114126210A (en) | High-performance power control panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |