CN104661450A - Direct hole metallization method based on laser drilling - Google Patents
Direct hole metallization method based on laser drilling Download PDFInfo
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- CN104661450A CN104661450A CN201510084217.XA CN201510084217A CN104661450A CN 104661450 A CN104661450 A CN 104661450A CN 201510084217 A CN201510084217 A CN 201510084217A CN 104661450 A CN104661450 A CN 104661450A
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- hole
- laser
- copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses and provides a direct hole metallization method based on laser drilling. The method is convenient and simple in process, energy-saving and environment-friendly due to the fact that a large number of chemicals are not consumed, and obtained metallized layers are better in adhesion property. The method comprises steps as follows: surface roughening treatment is performed on copper foil; laser drilling is performed, and the copper foil in hole positions is molten to collapse so as to cover hole walls; acid pickling is performed, and whole plate electroplating is performed after hole conditioning, and metallization of holes is finished. The method has the advantages that drilling and hole wall metallization procedures are combined into one step, hole wall metal layers are excellent in connection performance, the process cost is reduced, the production efficiency is improved, and the method is energy-saving and environment-friendly due to the fact that a large number of chemicals are not consumed.
Description
Technical field
The present invention relates to a kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN.
Background technology
What require along with electronic equipment improves constantly, the printed circuit board of carrier is realized also at development as electronic equipment electric function, in market sale proportion according to the report of PCB industry state of development, single sided board and double sided board are less than 10%, and multi-layer sheet is as HDI, multi-layer flexible circuit board etc. then account for over half.
In order to realize the electrical connection of each layer circuit, multilayer circuit board uses hole metallization technique usually.Hole metallization be dielectric material between circuit board Copper Foil as the material such as polyimides, epoxy resin is holed, and plate one deck copper at the hole wall got out, realize the conducting between two-layer or multilayer copper foil circuit.Hole metallization based on chemical plating process is a kind of more traditional hole metallization technique.This technique generally comprises following steps: boring → desmearing → washing → alligatoring → catalysis (activation) → washing → electroless copper → washing → electro-coppering → washing → drying.The advantage of this method is that technique is very ripe, but comparatively complicated, and the use of many cover chemical process, consume a large amount of medicine and cause environmental pollution.
Summary of the invention
Technical problem to be solved by this invention overcomes the deficiencies in the prior art, provides a kind of technique convenient and simple, and without the need to consuming a large amount of chemicals and energy-conserving and environment-protective, the metal layer adhesion property obtained is preferably based on the method for laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN.
The technical solution adopted in the present invention is: the present invention includes following steps:
(1) brown process is carried out to copper-clad plate;
(2) use laser positioning boring, and make it cover hole wall the fusing of hole place Copper Foil;
(3) pickling, carries out electric plating of whole board behind whole hole, increases hole wall copper facing thickness.
Further, described method also comprises
(4) whole hole, carries out the whole hole of plasma to the base material after pickling, the organic detritus brought during removing boring;
(5) electroplate, whole plate plating is carried out to the base material behind whole hole, to meet the requirement of circuit board to copper thickness and hole wall copper layer thickness.
Further, before carrying out step (1), first etching is carried out to described copper-clad plate thinning, after obtaining suitable copper foil thickness, carry out micro-brown process again.
Further, what adopt in described step (2) is CO2 laser process equipment.
Further, in described step (2), before the vaporization of position, hole place organic material, laser power should be increased gradually, and when organic material vaporization, should less laser power gradually after drilling hole position is formed.
Further, in described step (2), laser positioning initial pulse energy of holing controls at 6-10 mJ, focal height 120-130 mm, and laser frequency controls at 5000-6000 Hz; Reach peak power through 15 ms, pulse energy controls at 10 mJ gradually, and focal height controls at 120 mm gradually, and laser frequency controls at 5000 Hz gradually; Drilling cycle end, pulse energy controls at 6 mJ gradually, and focal height controls at 120 mm gradually, and laser frequency controls gradually at 5600 Hz.
Further, what adopt in described step (3) is to the good acids of the oxide removal of copper to elemental copper not damaged.
The invention has the beneficial effects as follows: the present invention utilizes the larger difference of substrate organic material and Copper Foil vapourizing temperature, propose a kind of copper-clad plate boring while metallized new technology is carried out to hole wall, this technique can be avoided using electroless copper, decrease the problem of chemicals cost and environmental pollution, shorten processing step simultaneously, reduce process cost, and the metal layer adhesion property obtained is better.
Accompanying drawing explanation
Fig. 1 is the structural representation covering copper double sided board do not dealt with;
Fig. 2 is structural representation Copper Foil being carried out to brown process;
Fig. 3 is the structural representation of laser drill;
Fig. 4 is the structural representation of position, hole Copper Foil fusing;
Fig. 5 is the structural representation that position, hole Copper Foil sink;
Fig. 6 holes and the structural representation metallized;
Fig. 7 is the structural representation of whole plate plating.
Embodiment
Be described in detail according to embodiment below.Following embodiment just in order to better by clear for the explaination of the technology of the present invention principle, do not represent the present invention and can only limit this embodiment of use.
embodiment one:
The present embodiment utilizes double-sided copper-clad soft board as base material, and realize blind hole metallization, reaches the object of electrical connection, specifically comprise the following steps:
A. as shown in Figure 1, select polyimides double face copper conventional on market as base material, and cut into the size being applicable to processing;
B. as shown in Figure 2, micro-brown process is carried out to polyimides double-sided copper-clad soft board plate, the condition of brown process is: go over brown line by the speed of 0.5 m/min, the thickness of Copper Foil is made to reach 6-7 mm, brown again after the copper-clad plate that Copper Foil is thicker needs etching thinning, the object of brown is to allow Copper Foil can absorb CO2 laser energy;
C. as shown in Figure 3, the copper-clad plate after brown is placed in CO2 laser process equipment, uses laser positioning boring, and control laser drilling parameters, Copper Foil fusing in position, hole is sunk, and position, hole organic media is heated vaporization, and laser action terminates rear hole wall and leaves one deck thin copper layer.Specifically copper-clad plate is placed in laser process equipment, after equipment input laser operations file, laser drill is carried out to copper-clad plate, automatic control and adjustment laser power exports simultaneously, initial pulse energy controls at 10-15 mJ, focal height controls at 120-130 mm, and laser frequency controls at 5000-6000 Hz; Reach peak power through 15 ms, pulse energy controls at 15 mJ gradually, and focal height controls at 120 mm gradually, and laser frequency controls at 5000 Hz gradually; Drilling cycle end, pulse energy controls at 10 mJ gradually, and focal height controls at 120 mm gradually, and laser frequency controls at 5600 Hz gradually;
D. as shown in Figure 4, pickling, removes the oxide layer that micro-brown stays at copper foil surface, and to the good acids of the oxide removal of copper, to guarantee the reliability of hole wall layers of copper, this example selects watery hydrochloric acid to make mordant to elemental copper not damaged to need selection;
E. as shown in Figure 5, whole hole, can bring due to laser action and bore dirt, utilize plasma can clean hole wall, plasma treatment time is 30min;
F. as shown in Figure 6, whole plate plating, is the copper-clad plate that copper thickness is thinner due to what select, or have passed through etching reduction processing, needs the plating of copper-clad plate entirety; The metallization layers of copper of borehole wall also needs to thicken to meet circuit board process requirement;
G., as shown in Figure 7, after having electroplated, washing and drying has entered next process.
embodiment two:
The present embodiment utilizes epoxy resin fiberglass cloth as the double face copper of substrate, and realize blind hole metallization, reaches the object of electrical connection, specifically comprise the following steps:
A. as shown in Figure 1, select FR-4 double face copper conventional on market as base material, and cut into the size being applicable to processing;
B. as shown in Figure 2, micro-brown process is carried out to covering copper hardboard, the condition of brown process is: go over brown line by the speed of 0.5 m/min, the thickness of Copper Foil is made to reach 6-7 mm, brown again after the copper-clad plate that Copper Foil is thicker needs etching thinning, the object of brown is to allow Copper Foil can absorb CO2 laser energy;
C. as shown in Figure 3, copper-clad plate after brown is placed in CO2 laser process equipment, use laser positioning is holed, and control laser drilling parameters, the Copper Foil fusing of position, hole is sunk, position, hole organic media is heated vaporization, laser action terminates rear hole wall and leaves one deck thin copper layer, specifically copper-clad plate is placed in laser process equipment, after equipment input laser operations file, laser drill is carried out to copper-clad plate, automatic control and adjustment laser power exports simultaneously, initial pulse energy controls at 15-20 mJ, focal height controls at 120-130 mm, laser frequency controls at 5000-6000 Hz, reach peak power through 15 ms, pulse energy controls at 20 mJ gradually, and focal height controls at 120 mm gradually, and laser frequency controls at 5000 Hz gradually, drilling cycle end, pulse energy controls at 15 mJ gradually, and focal height controls at 120 mm gradually, and laser frequency controls at 5600 Hz gradually,
D. as shown in Figure 4, pickling, removes the oxide layer that micro-brown stays at copper foil surface, and to the good acids of the oxide removal of copper, to guarantee the reliability of hole wall layers of copper, this example selects watery hydrochloric acid to make mordant to elemental copper not damaged to need selection;
E. as shown in Figure 5, whole hole, can bring due to laser action and bore dirt, utilize plasma can clean hole wall, plasma treatment time is 30min;
F. as shown in Figure 6, whole plate plating, is the copper-clad plate that copper thickness is thinner due to what select, or have passed through etching reduction processing, needs the plating of copper-clad plate entirety; The metallization layers of copper of borehole wall also needs to thicken to meet circuit board process requirement;
G., as shown in Figure 7, after having electroplated, washing and drying has entered next process.
Above-mentioned two examples can be found out, the copper-clad plate kind can applying the inventive method is a lot, includes but not limited to common various soft or hard copper-clad plates.
Above-mentioned two kinds of examples to invention has been detailed description, but do not mean that the present invention is only confined to this two kinds of examples.When not departing from the technology of the present invention principle, making improvements and being out of shape within the claims in the present invention and technology, also should belong to protection scope of the present invention.
Claims (7)
1. based on a method for laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN, it is characterized in that: it comprises the following steps:
(1) brown process is carried out to copper-clad plate;
(2) use laser positioning boring, and make it cover hole wall the fusing of hole place Copper Foil;
(3) pickling, carries out electric plating of whole board behind whole hole, increases hole wall copper facing thickness.
2. a kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN according to claim 1, is characterized in that: described method also comprises
(4) whole hole, carries out the whole hole of plasma to the base material after pickling, the organic detritus brought during removing boring;
(5) electroplate, whole plate plating is carried out to the base material behind whole hole, to meet the requirement of circuit board to copper thickness and hole wall copper layer thickness.
3. a kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN according to claim 1, is characterized in that: before carrying out step (1), first carries out etching to described copper-clad plate thinning, carry out micro-brown process again after obtaining suitable copper foil thickness.
4. a kind of hole metallization method based on laser activation technology according to claim 1, is characterized in that: what adopt in described step (2) is CO2 laser process equipment.
5. a kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN according to claim 1, it is characterized in that: in described step (2), laser power should be increased gradually, and when organic material vaporization before the vaporization of position, hole place organic material, should less laser power gradually after drilling hole position is formed.
6. a kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN according to claim 5, it is characterized in that: in described step (2), laser positioning initial pulse energy of holing controls at 6-10 mJ, focal height 120-130 mm, and laser frequency controls at 5000-6000 Hz; Reach peak power through 15 ms, pulse energy controls at 10 mJ gradually, and focal height controls at 120 mm gradually, and laser frequency controls at 5000 Hz gradually; Drilling cycle end, pulse energy controls at 6 mJ gradually, and focal height controls at 120 mm gradually, and laser frequency controls gradually at 5600 Hz.
7. a kind of hole metallization method based on laser activation technology according to claim 1, is characterized in that: what adopt in described step (3) is to the good acids of the oxide removal of copper to elemental copper not damaged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510084217.XA CN104661450B (en) | 2015-02-16 | 2015-02-16 | A kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510084217.XA CN104661450B (en) | 2015-02-16 | 2015-02-16 | A kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN |
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| CN104661450A true CN104661450A (en) | 2015-05-27 |
| CN104661450B CN104661450B (en) | 2018-05-04 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517374A (en) * | 2015-12-17 | 2016-04-20 | 深圳崇达多层线路板有限公司 | Method for making HDI board with thin core board |
| CN107454760A (en) * | 2017-08-24 | 2017-12-08 | 高德（无锡）电子有限公司 | The radium-shine through-hole approaches of carbon dioxide laser |
| CN108156759A (en) * | 2017-12-28 | 2018-06-12 | 广州兴森快捷电路科技有限公司 | Printed circuit board laser aperture reworking method less than normal |
| CN110278669A (en) * | 2019-07-23 | 2019-09-24 | 信泰电子（西安）有限公司 | The production method of via hole on multi-layer PCB board |
| WO2020124956A1 (en) * | 2018-12-17 | 2020-06-25 | 盐城维信电子有限公司 | Via hole entire-board copper electroplating method for flexible circuit board |
| CN114143970A (en) * | 2021-11-29 | 2022-03-04 | 广东依顿电子科技股份有限公司 | Manufacturing method of single-side copper-based HDI board convenient for heat dissipation |
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| US3562009A (en) * | 1967-02-14 | 1971-02-09 | Western Electric Co | Method of providing electrically conductive substrate through-holes |
| US4341942A (en) * | 1978-10-31 | 1982-07-27 | International Business Machines Corporation | Method of bonding wires to passivated chip microcircuit conductors |
| JP2002261439A (en) * | 2001-02-28 | 2002-09-13 | Kyocera Corp | Insulating sheet, its manufacturing method, wiring board, and its manufacturing method |
| CN101588679A (en) * | 2009-06-25 | 2009-11-25 | 西安交通大学 | Method for manufacturing micropores for electric conduction among copper foil of high-density multilayer circuit boards |
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2015
- 2015-02-16 CN CN201510084217.XA patent/CN104661450B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3562009A (en) * | 1967-02-14 | 1971-02-09 | Western Electric Co | Method of providing electrically conductive substrate through-holes |
| US4341942A (en) * | 1978-10-31 | 1982-07-27 | International Business Machines Corporation | Method of bonding wires to passivated chip microcircuit conductors |
| JP2002261439A (en) * | 2001-02-28 | 2002-09-13 | Kyocera Corp | Insulating sheet, its manufacturing method, wiring board, and its manufacturing method |
| CN101588679A (en) * | 2009-06-25 | 2009-11-25 | 西安交通大学 | Method for manufacturing micropores for electric conduction among copper foil of high-density multilayer circuit boards |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517374A (en) * | 2015-12-17 | 2016-04-20 | 深圳崇达多层线路板有限公司 | Method for making HDI board with thin core board |
| CN105517374B (en) * | 2015-12-17 | 2019-02-05 | 深圳崇达多层线路板有限公司 | A kind of production method of thin core plate HDI plate |
| CN107454760A (en) * | 2017-08-24 | 2017-12-08 | 高德（无锡）电子有限公司 | The radium-shine through-hole approaches of carbon dioxide laser |
| CN108156759A (en) * | 2017-12-28 | 2018-06-12 | 广州兴森快捷电路科技有限公司 | Printed circuit board laser aperture reworking method less than normal |
| CN108156759B (en) * | 2017-12-28 | 2019-12-24 | 广州兴森快捷电路科技有限公司 | Reworking method for printed circuit board with smaller laser aperture |
| WO2020124956A1 (en) * | 2018-12-17 | 2020-06-25 | 盐城维信电子有限公司 | Via hole entire-board copper electroplating method for flexible circuit board |
| CN110278669A (en) * | 2019-07-23 | 2019-09-24 | 信泰电子（西安）有限公司 | The production method of via hole on multi-layer PCB board |
| CN114143970A (en) * | 2021-11-29 | 2022-03-04 | 广东依顿电子科技股份有限公司 | Manufacturing method of single-side copper-based HDI board convenient for heat dissipation |
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| CN104661450B (en) | 2018-05-04 |
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Address after: No.17, Xianggong Road, Hongwan Industrial Zone, Xiangzhou District, Zhuhai City, Guangdong Province, 519000 Patentee after: Zhuhai Zhongjing Yuansheng Electronic Technology Co.,Ltd. Address before: No. 17, Xianggong Road, Hongwan Industrial Zone, Nanping, Xiangzhou District, Zhuhai City, Guangdong Province, 519060 Patentee before: ZHUHAI TOPSUN ELECTRONIC TECHNOLOGY Co.,Ltd. |