CN208480046U - A kind of high frequency mixed pressure wiring board of low line loss - Google Patents
A kind of high frequency mixed pressure wiring board of low line loss Download PDFInfo
- Publication number
- CN208480046U CN208480046U CN201821218725.8U CN201821218725U CN208480046U CN 208480046 U CN208480046 U CN 208480046U CN 201821218725 U CN201821218725 U CN 201821218725U CN 208480046 U CN208480046 U CN 208480046U
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- Prior art keywords
- high frequency
- frequency layer
- low
- wiring board
- mixed pressure
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- 239000000463 material Substances 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 230000007704 transition Effects 0.000 claims abstract description 6
- 238000003466 welding Methods 0.000 claims abstract description 4
- 230000000694 effects Effects 0.000 abstract description 7
- 230000009977 dual effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of high frequency mixed pressure wiring boards of low line loss, it is related to radio frequency arts, the high frequency mixed pressure wiring board includes low frequency layer and high frequency layer, high-frequency circuit is laid on high frequency layer, walk radiofrequency signal, remaining circuit is laid on low frequency layer, walks low-frequency control signal and power supply power supply；Low frequency layer covers Copper base material using multilayer FR-4 and is made, and high frequency layer covers Copper base material using high frequency and is made, and high frequency layer is welded on low frequency layer, and welding region is exposed gold-plated, and beats hole in large quantities and realize better earthing effect；When radiofrequency signal cabling to wiring board edge transition to other high-frequency circuit boards, side bound edge at its low frequency layer Transition edges is gold-plated, the better earthing effect between other high frequency circuit boards is realized, to optimize the performances such as the impedance matching of radiofrequency signal, reduce line loss.
Description
Technical field
The utility model relates to radio frequency arts, the high frequency mixed pressure wiring board of especially a kind of low line loss.
Background technique
With electronics, the development of communications industry, high-frequency circuit, RF (Radio Frequency, radio frequency) design are more and more wider
It is general, apply to high frequency plate more and more on PCB (Printed Circuit Board, printed circuit board) to meet signal
The requirement of transmission.But costly due to high frequency plate price, from the point of view of save the cost, it will usually in the knot of PCB
In structure design by the way of mixed pressure, i.e., in addition to necessary signals layer uses high-frequency copper-clad plate material to meet its signal transmission speed
Except rate, signal integrity and impedance matching etc. require, other layers still use conventional FR-4 copper-clad plate material, and FR-4 is covered
Copper sheet material and the mixed pressure of high-frequency copper-clad plate material form, but the frequency of signal is higher, and additional line loss is also higher.
Utility model content
The present inventor regarding to the issue above and technical need, proposes a kind of high frequency mixed pressure wiring board of low line loss,
The high frequency mixed pressure wiring board can optimize the performances such as the impedance matching of radiofrequency signal, reduce line loss.
The technical solution of the utility model is as follows:
A kind of high frequency mixed pressure wiring board of low line loss, high frequency mixed pressure wiring board includes low frequency layer and high frequency layer, high frequency
Circuit is laid on high frequency layer, walks radiofrequency signal；Remaining circuit is laid on low frequency layer, and remaining circuit includes at least low-frequency channel
And power supply circuit；Low frequency layer covers Copper base material using multilayer FR-4 and is made, and high frequency layer covers Copper base material using high frequency and is made, the weldering of high frequency layer
It connects on low frequency layer, welding region is exposed gold-plated, and is equipped with ground hole.
Its further technical solution is the side bound edge plating of the low frequency layer of radiofrequency signal cabling to wiring board edge transition
Gold.
The advantageous effects of the utility model are:
Common high frequency mixed pressure wiring board is that FR-4 is directly covered Copper base material in process by PCB manufacturer and high frequency covers
Copper base material mixed pressure molding, and high frequency mixed pressure wiring board disclosed in the present application is different, additionally plates at required radiofrequency signal cabling
Gold simultaneously beats hole in large quantities, and then high frequency layer is welded on low frequency layer, to realize better earthing effect, while being penetrated to reduce
The insertion loss that frequency signal is generated when different wiring boards are excessive, in the low frequency layer of radiofrequency signal cabling to wiring board edge transition
Side bound edge is gold-plated, so that high frequency mixed pressure wiring board further strengthens the earthing effect with other high frequency circuit boards in assembly,
Using this structure, the performances such as the impedance matching of radiofrequency signal can be optimized, reduce line loss.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the high frequency mixed pressure wiring board of low line loss disclosed in the present application.
Fig. 2 is the punching schematic diagram of the low frequency layer of conventional high frequency mixed pressure wiring board.
Fig. 3 is the punching schematic diagram of the low frequency layer of high frequency mixed pressure wiring board disclosed in the present application.
Fig. 4 is high frequency mixed pressure wiring board and dual platen interconnection schematic diagram.
Specific embodiment
Specific embodiments of the utility model will be further explained with reference to the accompanying drawing.
This application discloses a kind of high frequency mixed pressure wiring boards of low line loss, referring to FIG. 1, the high frequency mixed pressure wiring board
Low frequency layer 20 and high frequency layer 30, the high frequency mixed pressure wiring board are welded on ground 10.High-frequency circuit is laid on high frequency layer 30, walks to penetrate
Frequency signal, remaining circuit are laid on low frequency layer 20, and remaining circuit here includes at least low-frequency channel and power supply circuit etc., are walked
Low-frequency control signal and power supply power supply.Wherein, low frequency layer 20 covers Copper base material using multilayer FR-4 and is made；High frequency layer 30 uses high frequency
It covers Copper base material to be made, such as using more common RO4003 and RO5880 etc..Low frequency layer 20 is welded on ground 10, conventional height
The punching schematic diagram of the low frequency layer 20 of the radiofrequency signal cabling of frequency mixed pressure wiring board referring to FIG. 2, it is round indicate to beat hole,
It can only can not be beaten immediately below radiofrequency signal cabling air-ground in two side perforating of radiofrequency signal cabling.The application on this basis,
Ground hole is beaten at the low frequency layer 20 of the underface of radiofrequency signal cabling, at radiofrequency signal cabling namely welding region, referring to FIG. 3,
Dash area is to indicate at the cabling of radiofrequency signal, and the low frequency layer 20 at radiofrequency signal cabling offers a large amount of ground holes,
Particular number is determine according to actual needs.Finally, high frequency layer 30 is welded on low frequency layer 20.In addition, radiofrequency signal cabling extremely
The side bound edge of the low frequency layer 20 at wiring board edge is gold-plated.
Theoretical according to microstrip line field distribution, field strength most strength is to please refer to shown in Fig. 1 dotted portion immediately below microstrip line
Grounding requirement highest immediately below the field strength distribution schematic diagram namely microstrip line of the high frequency mixed pressure wiring board, therefore the application passes through
A large amount of ground holes are opened up at signal lead makes the high frequency mixed pressure wiring board more preferable compared to earthing effect for ordinary construction,
The performances such as the impedance matching of radiofrequency signal can be made to be optimized, reduce line loss.And measured result similarly demonstrates this
Conclusion: in X-band, loss of signal caused by high frequency mixed pressure wiring board disclosed in the present application and conventional high frequency mixed pressure wiring board
It is almost the same, differ less than 0.2dB；But when signal frequency is more than 15GHz, for the signal wire of 1 wavelength, conventional high frequency mixed pressure
Insertion Loss caused by wiring board is more than 4dB, and high frequency mixed pressure wiring board disclosed in the present application is then less than 0.5dB, hence it is evident that finds out this Shen
Please disclosed high frequency mixed pressure wiring board can reduce line loss.
In addition, usually will appear and the interconnection of other high frequency circuit boards in the application process of high frequency mixed pressure wiring board
Situation, this high frequency circuit board are generally dual platen, referring to FIG. 4, surrounding dash area indicates dual platen, it is intermediate shadeless
Part indicates high frequency mixed pressure wiring board.When radiofrequency signal is transitioned into the dual platen that high frequency covers Copper base material from high frequency mixed pressure wiring board
When, it can be obtained by emulation, high frequency mixed pressure wiring board and dual platen transition position most critical are dotted line frame mark in edge
Ground hole, for the ground hole closer to boundary, impedance matching is better, and line loss is smaller, and far from boundary hole to ground connection shadow
It rings and little, high frequency mixed pressure wiring board disclosed in the present application is by doing the gold-plated processing of bound edge at radiofrequency signal edge, so that assembly
When can reinforce earthing effect with the metal case of side dual platen lower part, to optimize impedance matching, reduce line loss.
And simulation result similarly demonstrates this conclusion, and according to simulation result: for conventional high frequency mixed pressure wiring board, side
When gap filling object between metal case under to dual platen is air, in Ku wave band, route Insertion Loss is more than 10dB；And for this
Apply for disclosed high frequency mixed pressure wiring board, side bound edge is gold-plated, therefore between the metal case under its side to dual platen
Gap filling object be gold when, at this time caused by route Insertion Loss be less than 0.8dB.
Above-described is only the preferred embodiment of the application, and the utility model is not limited to above embodiments.It can manage
Solution, those skilled in the art do not depart from the utility model spirit and design under the premise of directly export or associate other
Improvements and changes are considered as being included within the scope of protection of this utility model.
Claims (2)
1. a kind of high frequency mixed pressure wiring board of low line loss, which is characterized in that the high frequency mixed pressure wiring board includes low frequency layer
With high frequency layer, high-frequency circuit is laid on the high frequency layer, walks radiofrequency signal；Remaining circuit is laid on low frequency layer, it is described its
Remaining circuit includes at least low-frequency channel and power supply circuit；The low frequency layer covers Copper base material using multilayer FR-4 and is made, the high frequency
Layer covers Copper base material using high frequency and is made, and the high frequency layer is welded on the low frequency layer, and welding region is exposed gold-plated, and is equipped with ground
Hole.
2. high frequency mixed pressure wiring board according to claim 1, which is characterized in that the radiofrequency signal cabling to route edges of boards
The side bound edge of the low frequency layer of edge transition is gold-plated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821218725.8U CN208480046U (en) | 2018-07-30 | 2018-07-30 | A kind of high frequency mixed pressure wiring board of low line loss |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821218725.8U CN208480046U (en) | 2018-07-30 | 2018-07-30 | A kind of high frequency mixed pressure wiring board of low line loss |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208480046U true CN208480046U (en) | 2019-02-05 |
Family
ID=65208993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821218725.8U Expired - Fee Related CN208480046U (en) | 2018-07-30 | 2018-07-30 | A kind of high frequency mixed pressure wiring board of low line loss |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208480046U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109561575A (en) * | 2018-12-28 | 2019-04-02 | 无锡市同步电子科技有限公司 | A kind of high frequency mixed pressure backboard and its processing technology |
| CN109922597A (en) * | 2019-03-21 | 2019-06-21 | 中国电子科技集团公司第二十九研究所 | A kind of highly reliable band horizontal transition structure |
| CN112230471A (en) * | 2020-10-20 | 2021-01-15 | 厦门天马微电子有限公司 | LED module and display device |
-
2018
- 2018-07-30 CN CN201821218725.8U patent/CN208480046U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109561575A (en) * | 2018-12-28 | 2019-04-02 | 无锡市同步电子科技有限公司 | A kind of high frequency mixed pressure backboard and its processing technology |
| CN109922597A (en) * | 2019-03-21 | 2019-06-21 | 中国电子科技集团公司第二十九研究所 | A kind of highly reliable band horizontal transition structure |
| CN109922597B (en) * | 2019-03-21 | 2020-03-27 | 中国电子科技集团公司第二十九研究所 | High-reliability broadband horizontal transition structure |
| CN112230471A (en) * | 2020-10-20 | 2021-01-15 | 厦门天马微电子有限公司 | LED module and display device |
| CN112230471B (en) * | 2020-10-20 | 2022-07-01 | 厦门天马微电子有限公司 | LED module and display device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190205 |