CN113643985A - Method for realizing interconnection of front and back patterns of thick film substrate - Google Patents
Method for realizing interconnection of front and back patterns of thick film substrate Download PDFInfo
- Publication number
- CN113643985A CN113643985A CN202110904204.8A CN202110904204A CN113643985A CN 113643985 A CN113643985 A CN 113643985A CN 202110904204 A CN202110904204 A CN 202110904204A CN 113643985 A CN113643985 A CN 113643985A
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- 239000000758 substrate Substances 0.000 title claims abstract description 164
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000007639 printing Methods 0.000 claims description 72
- 239000004020 conductor Substances 0.000 claims description 23
- 238000001465 metallisation Methods 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 7
- 239000002002 slurry Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 239000000919 ceramic Substances 0.000 description 9
- 239000011148 porous material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/34—Printing on other surfaces than ordinary paper on glass or ceramic surfaces
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- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a method for realizing interconnection of patterns on the front and back surfaces of a thick film substrate, which can realize the manufacturing of interconnection through holes by using a common printer, realize the interconnection of the through holes while realizing the pattern on the front and back surfaces of the thick film substrate and improve the production efficiency. Meanwhile, a process platform is built for manufacturing other through hole interconnection substrates, the method can be rapidly and effectively popularized to other products by replacing the supporting die, and the method has good practicability and economic value.
Description
Technical Field
The invention relates to the technical field of high-density hybrid integrated circuits, in particular to a method for realizing interconnection of front and back patterns of a thick film substrate.
Background
With the development of high-density hybrid integrated circuits, the requirements for wiring and interconnection on the front side and the back side of a thick film ceramic substrate are increasingly increased, the requirements are limited by the reliability of interconnection between the front side and the back side at present, the thick film ceramic substrate is extremely difficult to manufacture by using a common thick film printer, so that the side walls of through holes of the thick film ceramic substrate cannot be normally interconnected, the requirement for interconnection between patterns on the front side and the back side of the substrate cannot be met under the condition that the strength of the substrate is not damaged, and the problem can be well solved by the method related to the patent.
Disclosure of Invention
Aiming at the problem that patterns on the front side and the back side of a substrate cannot be interconnected in the process of printing the thick film ceramic substrate in the prior art, the invention provides the interconnection method for realizing the patterns on the front side and the back side of the thick film substrate.
The invention is realized by the following technical scheme:
a method for realizing interconnection of front and back patterns of a thick film substrate comprises the following steps:
arranging a negative pressure cavity on a printing table top of the thick film printing machine, and arranging a plurality of vacuum device through holes in the negative pressure cavity, wherein the vacuum device through holes are connected with a printing machine vacuum device;
placing a supporting mold on the negative pressure cavity, wherein a plurality of negative pressure holes are formed in the supporting mold;
positioning a thick film substrate on a supporting mold, wherein a plurality of substrate through holes of the thick film substrate correspond to a plurality of negative pressure holes on the supporting mold one by one;
starting a printer, setting technological parameters of the printer, adjusting a gap between a screen of the printer and the front surface of the thick film substrate, printing conductor paste on the front surface of the thick film substrate, carrying out negative pressure on a substrate through hole of the thick film substrate through a plurality of negative pressure holes on a supporting mold in vacuum under the action of vacuum negative pressure during printing so that the conductor paste extends along the side wall of the substrate through hole, and drying and sintering the substrate through hole on the front surface of the thick film substrate after printing is finished;
synchronously overturning the thick film substrate and the supporting mold, and positioning, wherein a plurality of substrate through holes of the thick film substrate correspond to a plurality of negative pressure holes on the supporting mold one by one;
and starting the printer, setting technological parameters of the printer, adjusting a gap between a screen of the printer and the back of the thick film substrate, printing conductor paste on the back of the thick film substrate, and carrying out negative pressure on a substrate through hole of the thick film substrate through a plurality of negative pressure holes on a supporting mould in vacuum under the action of vacuum negative pressure during printing so that the conductor paste extends along the side wall of the substrate through hole.
Preferably, the area of the supporting die is larger than that of the negative pressure cavity, and the area of the supporting die is smaller than that of the printing table surface.
Preferably, the thickness of the supporting mold is 0.635 + -0.2 mm.
Preferably, the diameter of the negative pressure hole of the support die is larger than the diameter of the substrate through hole of the thick film substrate.
Preferably, the substrate through hole of the thick film substrate is coaxially arranged with the negative pressure hole of the supporting mold.
Preferably, the printer process parameters include printing speed and printing pressure.
Further, the printing speed is in the range of 30-35 mm/s.
Further, the printing pressure is in the range of 4.2-5.0 kg.
Preferably, under the action of vacuum negative pressure, the metallization depth of the side wall of the through hole of the substrate on the front surface of the thick film substrate is greater than 2/3 of the depth of the through hole of the whole substrate.
Preferably, the metallization depth of the substrate through hole side wall on the back surface of the thick film substrate is greater than 1/2 of the depth of the whole substrate through hole under the action of vacuum negative pressure.
Compared with the prior art, the invention has the following beneficial technical effects:
the invention provides a method for realizing interconnection of patterns on the front and back surfaces of a thick film substrate, which can realize the manufacturing of interconnection through holes by using a common printer, realize the interconnection of the through holes while realizing the pattern on the front and back surfaces of the thick film substrate and improve the production efficiency. Meanwhile, a process platform is built for manufacturing other through hole interconnection substrates, the method can be rapidly and effectively popularized to other products by replacing the supporting die, and the method has good practicability and economic value.
Drawings
FIG. 1 is a flow chart of the steps of the method for interconnecting front and back patterns of a thick film substrate according to the present invention;
FIG. 2 is a schematic view of a printing table structure according to the present invention;
FIG. 3 is a top view of a thick film substrate and a supporting mold placed on a printing table according to the present invention;
FIG. 4 is a side sectional view of a thick film substrate and a supporting mold placed on a printing table according to the present invention;
FIG. 5 is a schematic view of a thick film substrate of the present invention placed on a supporting mold;
FIG. 6 is a schematic diagram of a structure of the conductor paste printed on a thick film substrate according to the present invention;
FIG. 7 is a schematic illustration of a conductive paste being attached within a substrate via of a thick film substrate in accordance with the present invention;
FIG. 8 is a schematic diagram of the interconnection of the substrate via sidewall metallization positive and negative lines of the thick film substrate of the present invention.
In the figure: 1-printing table top; 2-supporting the mould; 3-a thick film substrate; 4-negative pressure cavity; 5-vacuum device through hole; 6-negative pressure hole; 7-substrate through hole; 8-conductive paste.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The invention is described in further detail below with reference to the accompanying drawings:
the invention provides an interconnection method for realizing patterns on the front and back surfaces of a thick film substrate, which is used for interconnection processing on the side wall of a through hole of a thick film ceramic substrate and meets the requirement of pattern interconnection on the front and back surfaces of the substrate on the premise of not damaging the strength of the substrate.
Specifically, the interconnection method of the front and back patterns of the thick film substrate, referring to fig. 1, comprises the following steps:
a negative pressure cavity 4 is arranged on a printing table top 1 of the thick film printing machine, a plurality of vacuum device through holes 5 are formed in the negative pressure cavity 4, and the vacuum device through holes 5 are connected with a printing machine vacuum device;
placing a supporting mold 2 on a negative pressure cavity 4, wherein a plurality of negative pressure holes 6 are formed in the supporting mold 2;
positioning a thick film substrate 3 on a supporting mold 2, wherein a plurality of substrate through holes 7 of the thick film substrate 3 correspond to a plurality of negative pressure holes 6 on the supporting mold 2 one by one;
starting a printer, setting technological parameters of the printer, adjusting a gap between a screen of the printer and the front surface of the thick film substrate 3, printing conductor paste 8 on the front surface of the thick film substrate 3, performing negative pressure on a substrate through hole 7 of the thick film substrate 3 through a plurality of negative pressure holes 6 on a supporting mold 2 in vacuum under the action of vacuum negative pressure during printing, so that the conductor paste 8 extends along the side wall of the substrate through hole 7, and drying and sintering the substrate through hole 7 on the front surface of the thick film substrate 3 after printing is completed;
synchronously overturning the thick film substrate 3 and the supporting mold 2, and positioning, wherein a plurality of substrate through holes 7 of the thick film substrate 3 correspond to a plurality of negative pressure holes 6 on the supporting mold 2 one by one;
and starting the printer, setting technological parameters of the printer, adjusting a gap between a screen of the printer and the back of the thick film substrate 3, printing conductor paste 8 on the back of the thick film substrate 3, and carrying out negative pressure on a substrate through hole 7 of the thick film substrate 3 through a plurality of negative pressure holes 6 on a supporting mold 2 in vacuum under the action of vacuum negative pressure during printing so that the conductor paste 8 extends along the side wall of the substrate through hole 7, and after printing is finished, drying and sintering the substrate through hole 7 on the back of the thick film substrate 3 to realize interconnection of metallization positive and negative circuits on the side wall of the substrate through hole 7 of the thick film substrate 3.
The finding is based on the thick film printing technology, through the transformation of a common printing machine, the matching of a special supporting mold and printing parameters, the metallization of the side wall of the through hole is realized, and the interconnection of the front side and the back side of the through hole is completed.
Specifically, as shown in fig. 2, 3 and 4, a printing table top 1 of a common thick film printing machine is modified to form a negative pressure cavity 4 on the printing table, and a plurality of vacuum device through holes 5 are formed in the negative pressure cavity 4, and the vacuum device through holes 5 are connected with a vacuum device to provide an adsorption motive power for attaching conductor slurry 8 to the side wall of a substrate through hole 7;
manufacturing a supporting mold 2 according to the size and the position of a substrate through hole 7 of a thick film substrate 3, wherein the supporting mold 2 is a ceramic substrate with the thickness of 0.635 +/-0.2 mm, and the positions of negative pressure holes 6 of the supporting mold 2 correspond to the substrate through holes 7 of the thick film substrate 3 one by one, and the centers of the negative pressure holes coincide, as shown in fig. 5, so as to form a negative pressure channel with the substrate through hole 7 of the thick film substrate 3; during printing, under the action of negative pressure, the paste forms adhesion on the hole wall, as shown in fig. 6 and 7; and printing the front side and the back side of the substrate through hole 7 twice to finally form a complete conductive path, and realizing interconnection of the front side conductor and the back side conductor of the thick film ceramic substrate, as shown in fig. 8.
Examples
the air holes of the ink pad of the common printer can only be used for positioning the substrate in the printing process, the printing table top 1 of the thick film printer is reformed, a negative pressure cavity 4 with the thickness of 50mm multiplied by 2mm is manufactured in the middle area of the printing table top 1, a cavity is formed below the thick film substrate 3, and the cavity structure is shown in figures 1 and 2, so that the air flow of a negative pressure channel is facilitated, and the paste forms adhesion on the side wall of the through hole of the substrate.
fixing a supporting mold 2 corresponding to the thick film substrate 3 above the negative pressure cavity 4, thus completing the manufacture of a cavity absorbed by the substrate through hole 7 of the thick film substrate 3, and simultaneously, using the supporting mold 2 as a bearing platform of the thick film substrate 3;
the requirements for supporting the mould 2 are as follows:
the supporting mold 2 provides mechanical support for the thick film substrate 3, and prevents the thick film substrate 3 from cracking under stress during printing. The thickness of the screen printing plate is too thick, so that the adjustment of the space between printing parameters and the screen printing plate can be influenced; the thickness is too thin to provide effective mechanical support.
The circle center of the negative pressure hole 6 on the supporting die 2 is coincided with the circle center of the substrate through hole 7 of the thick film substrate 3, wherein the diameter of the negative pressure hole 6 is 2 times of that of the substrate through hole 7. The aperture is too small, and slurry accumulation can be formed on the back surface of the substrate when the through hole is manufactured; too large aperture will cause the mechanical strength of the special die to be reduced
The size of the supporting die 2 is smaller than that of the printing table top 1, so that the printing alignment is convenient to adjust on the basis; meanwhile, the size of the thick film substrate 3 is larger than that of the thick film substrate 3, so that the thick film substrate 3 can be well supported on the supporting die 2. According to the requirements, the size of the special die is 70mm multiplied by 0.635 mm.
1. replacing the printing table top 1 of the thick film printing machine;
2. combining the thick film substrate 3 with the supporting mold 2 according to the position of the through hole 5 of the vacuum device and the circle center of the through hole of the thick film substrate 3 and the supporting mold 2;
3. according to the position of the screen exposure pattern, the thick film substrate 3 and the supporting mold 2 are correspondingly combined and arranged above the ink pad cavity for positioning, so that the substrate, the mold and the table top are combined and positioned, and allowance is reserved for the accurate positioning of the through hole pattern corresponding to the screen pattern.
And 4, carrying out through hole printing:
1. tooling and raw materials (conductor paste) required for printing are prepared.
2. And (5) brushing the sample, and adjusting the silk screen to perform accurate alignment.
3. Setting technological parameters of a printing machine, printing a front pattern at a printing speed of 35mm/s, a gap between a screen plate and a substrate of 2.4mm, a printing pressure of 5.0kg, and a stamp pad withdrawing delay of 2 s. The printing process, through the negative pressure effect, conductor thick liquids 8 form continuous effectual adhering to on the pore wall, and the ink pad time delay is for the conductor thick liquids 8 that will flow into the pore wall, under the effect of vacuum negative pressure, continues to extend to the pore side wall, forms the effective adhering to of the pore wall degree of depth more than 2/3, and the time delay setting should not be overlength, otherwise can cause conductor thick liquids to pile up around back hole edge, leads to the back figure to warp, along with the waste of raw and other materials, and the processing degree of difficulty is great.
4. And drying and sintering the through hole substrate with the front printed, wherein the process is no different from the traditional process and is not repeated.
5. According to the steps, the technological parameters of the printing machine are set, the printing speed is 30mm/s, the gap between the screen plate and the substrate is 2mm, the printing pressure is 4.2kg, and the ink pad withdrawing delay is 1 s. The printing of the back side graph and the through hole conductor paste adhesion are finished in the same way, the depth of the through hole wall is greater than 1/2, and the through hole conductor paste adhesion and the front side adsorption through hole side wall form effective interconnection;
6. drying and sintering are completed, so that the metallization of the side wall of the through hole realizes the interconnection of the front and back circuits as shown in figure 8.
The invention relates to a process for realizing wiring and interconnection structures on the front side and the back side of a thick film ceramic substrate, in particular to a method for realizing interconnection of conductors on the front side and the back side of thick film substrates of various types on a ceramic substrate by using a common thick film printer based on a printing process of the thick film substrate of a hybrid integrated circuit, and provides process support for the development of a high-density hybrid integrated circuit.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting the same, and although the present invention is described in detail with reference to the above embodiments, those of ordinary skill in the art should understand that: modifications and equivalents may be made to the embodiments of the invention without departing from the spirit and scope of the invention, which is to be covered by the claims.
Claims (10)
1. A method for realizing interconnection of front and back patterns of a thick film substrate is characterized by comprising the following steps:
a negative pressure cavity (4) is arranged on a printing table top (1) of the thick film printing machine, a plurality of vacuum device through holes (5) are formed in the negative pressure cavity (4), and the vacuum device through holes (5) are connected with a printing machine vacuum device;
placing a supporting mold (2) on a negative pressure cavity (4), wherein a plurality of negative pressure holes (6) are formed in the supporting mold (2);
the thick film substrate (3) is positioned and placed on the supporting mold (2), and a plurality of substrate through holes (7) of the thick film substrate (3) correspond to a plurality of negative pressure holes (6) on the supporting mold (2) one by one;
starting a printer, setting technological parameters of the printer, adjusting a gap between a screen of the printer and the front surface of a thick film substrate (3), printing conductor slurry (8) on the front surface of the thick film substrate (3), and carrying out negative pressure on a substrate through hole (7) of the thick film substrate (3) through a plurality of negative pressure holes (6) on a supporting mold (2) in vacuum under the action of vacuum negative pressure during printing so that the conductor slurry (8) extends along the side wall of the substrate through hole (7), and drying and sintering the substrate through hole (7) on the front surface of the thick film substrate (3) after printing is finished;
synchronously overturning the thick film substrate (3) and the supporting mold (2) for positioning, wherein a plurality of substrate through holes (7) of the thick film substrate (3) correspond to a plurality of negative pressure holes (6) on the supporting mold (2) one by one;
and starting the printer, setting technological parameters of the printer, adjusting a gap between a screen of the printer and the back of the thick film substrate (3), printing conductor slurry (8) on the back of the thick film substrate (3), and carrying out negative pressure on a substrate through hole (7) of the thick film substrate (3) through a plurality of negative pressure holes (6) on a supporting mold (2) in vacuum under the action of vacuum negative pressure during printing so that the conductor slurry (8) extends along the side wall of the substrate through hole (7), and drying and sintering the substrate through hole (7) on the back of the thick film substrate (3) after printing is finished, thereby realizing interconnection of metallization positive and negative circuits on the side wall of the substrate through hole (7) of the thick film substrate (3).
2. The interconnection method for realizing the patterns on the front and back sides of the thick film substrate is characterized in that the area of the supporting mold (2) is larger than that of the negative pressure cavity (4), and the area of the supporting mold (2) is smaller than that of the printing table top (1).
3. The interconnection method for realizing the front and back patterns of the thick film substrate as claimed in claim 1, wherein the thickness of the supporting mold (2) is 0.635 ± 0.2 mm.
4. An interconnection method for realizing patterns on the front and back sides of a thick film substrate according to claim 1, wherein the diameter of the negative pressure hole (6) of the supported die (2) is larger than the diameter of the substrate through hole (7) of the thick film substrate (3).
5. The interconnection method for realizing the patterns on the front and back sides of the thick film substrate is characterized in that the substrate through hole (7) of the thick film substrate (3) is coaxially arranged with the negative pressure hole (6) of the supporting mold (2).
6. The interconnection method for realizing the patterns on the front and back sides of the thick film substrate as claimed in claim 1, wherein the printing press process parameters comprise printing speed and printing pressure.
7. The interconnection method for realizing patterns on the front and back sides of the thick film substrate as claimed in claim 6, wherein the printing speed is in the range of 30-35 mm/s.
8. The interconnection method for realizing patterns on the front and back sides of the thick film substrate as claimed in claim 6, wherein the printing pressure is in the range of 4.2-5.0 kg.
9. The method for realizing the front-back pattern interconnection of the thick film substrate according to claim 1, wherein the metallization depth of the side wall of the front substrate through hole (7) of the thick film substrate (3) is larger than 2/3 of the depth of the whole substrate through hole (7) under the action of vacuum negative pressure.
10. The method for realizing the front-back pattern interconnection of the thick film substrate as claimed in claim 1, wherein under the action of vacuum negative pressure, the metallization depth of the side wall of the substrate through hole (7) on the back side of the thick film substrate is greater than 1/2 of the depth of the whole substrate through hole (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110904204.8A CN113643985A (en) | 2021-08-06 | 2021-08-06 | Method for realizing interconnection of front and back patterns of thick film substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110904204.8A CN113643985A (en) | 2021-08-06 | 2021-08-06 | Method for realizing interconnection of front and back patterns of thick film substrate |
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| CN113643985A true CN113643985A (en) | 2021-11-12 |
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| CN202110904204.8A Pending CN113643985A (en) | 2021-08-06 | 2021-08-06 | Method for realizing interconnection of front and back patterns of thick film substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115635765B (en) * | 2022-12-26 | 2023-03-07 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Ceramic packaging tube shell pore wall metallization die and screen printing equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2030007A (en) * | 1978-06-29 | 1980-03-26 | Rogers Corp | Printed circuit board manufacture |
| EP0197595A1 (en) * | 1985-04-05 | 1986-10-15 | Trt Telecommunications Radioelectriques Et Telephoniques | Metallization process for through holes used as thick-film links between the faces of a substrate during serigraphic printing |
| JPH04124897A (en) * | 1990-09-14 | 1992-04-24 | Taiyo Yuden Co Ltd | Production of thick film printed circuit substrate and apparatus therefor |
| CN102637627A (en) * | 2011-02-09 | 2012-08-15 | 上海旌纬微电子科技有限公司 | Manufacture process of hole metallization of thick-film mixed integrated circuit |
-
2021
- 2021-08-06 CN CN202110904204.8A patent/CN113643985A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2030007A (en) * | 1978-06-29 | 1980-03-26 | Rogers Corp | Printed circuit board manufacture |
| EP0197595A1 (en) * | 1985-04-05 | 1986-10-15 | Trt Telecommunications Radioelectriques Et Telephoniques | Metallization process for through holes used as thick-film links between the faces of a substrate during serigraphic printing |
| JPH04124897A (en) * | 1990-09-14 | 1992-04-24 | Taiyo Yuden Co Ltd | Production of thick film printed circuit substrate and apparatus therefor |
| CN102637627A (en) * | 2011-02-09 | 2012-08-15 | 上海旌纬微电子科技有限公司 | Manufacture process of hole metallization of thick-film mixed integrated circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115635765B (en) * | 2022-12-26 | 2023-03-07 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Ceramic packaging tube shell pore wall metallization die and screen printing equipment |
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