JPH04124897A - Production of thick film printed circuit substrate and apparatus therefor - Google Patents
Production of thick film printed circuit substrate and apparatus thereforInfo
- Publication number
- JPH04124897A JPH04124897A JP24522390A JP24522390A JPH04124897A JP H04124897 A JPH04124897 A JP H04124897A JP 24522390 A JP24522390 A JP 24522390A JP 24522390 A JP24522390 A JP 24522390A JP H04124897 A JPH04124897 A JP H04124897A
- Authority
- JP
- Japan
- Prior art keywords
- holes
- insulating substrate
- substrate
- hot air
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 84
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 238000007639 printing Methods 0.000 claims abstract description 37
- 239000004020 conductor Substances 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000001035 drying Methods 0.000 claims abstract description 13
- 238000007664 blowing Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000006837 decompression Effects 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
本発明は、絶縁基板の表面及び同基板に形成したしたス
ルーホールの内壁に厚膜を印刷する工程を育する厚膜印
刷回路基板の製造方法とその装置に関する。The present invention relates to a method and apparatus for manufacturing a thick film printed circuit board, which includes a step of printing a thick film on the surface of an insulating substrate and the inner wall of a through hole formed in the same substrate.
絶縁性基板の表面に、導体厚膜や抵抗膜等による回路配
線を形成すると共に、同絶縁基板に穿設されたスルーホ
ールの内壁に導体層を形成し、該導体層を介して前記絶
縁性基板の両生面に形成された回路配線を互いに接続す
ることが行なわれている。そして、このようなスルーホ
ールの導体を形成するとき、第４図に示すようなスクリ
ーン印刷装置を用いて、前記絶縁性基板上に形成される
配線パターンと同時に、前記スルーホールの内壁にも導
体ペーストを印刷し、その後これを焼成し、配線パター
ンとスルーホールの導体とを同時に形成することが行な
われている。
第４図により、このような導体を印刷する従来の厚膜印
刷装置を説明する。同図中において、３は、上側に広口
部３２を、下側に狭口部３１を有し、漏斗状に形成され
た減圧室である。この狭口部３１は、図示されないダク
トを介して真空ポンプに接続され、広口部３２には、基
板支持板４が嵌め込まれている。この基板支持板４上に
は、あらかじめマスキングされ、所定の位置にスルーホ
ール１１．１１・・・が穿設されたアルミナ基板等の絶
縁基板１が載置される。前記基板支持板４には、その上
に載置される絶縁基板１上のスルーホール１１、１１・
・・と対応する位置に貫通孔４１．４１・・・が穿設さ
れており、前記減圧室３内部が減圧されるとき、前記絶
縁基板１の表面付近の空気が基板１のスルーホール１１
．１１・・・を通り、さらに前記貫通孔４１゜４１・・
・を通過し、減圧室３の中に吸引される。
前記基板支持板４の上方には、スクリーン２、スクリー
ン２を支持するスクリーン枠２１、スキージ５、及びス
キージ５を駆動する図示しない駆動装置からなるスクリ
ーン印刷機が配置されている。
このような構成を有する厚膜印刷装置の動作を以下に説
明する。まず、絶縁基板ｌが減圧室３の基板支持板４の
上に載置される。さらに、前記スクリーン印刷機によっ
て、該スクリーン２の上に与えられたＡｇ−Ｐｄ等を含
む導体ペーストａが所定の配線パターンに従い、前記基
板１の上に印刷される。これと同時に、基板１のスルー
ホール１１、１１・・・から基板支持板４の貫通孔４Ｌ
４１・・・を通って減圧室３の中に吸引される空気と共
に、絶縁基板ｌに転写された一部の導体ペーストａが基
板１のスルーホール１１の中に引き込まれ、その内壁に
導体ペーストａが付着する。
こうして導体ペーストａが印刷された印刷基板は、熱対
流炉や赤外線加熱炉等の乾燥機に送られ、そこで温度的
１５０℃、約１０分加熱乾燥される。その後温度的８５
０℃でｌＯ分程度焼成され、導体ペーストが焼付けられ
る。
これにより、第５図（ａ）で示すように、絶縁基板１の
片面側の配線パターン１２とスルーホール導体１３の一
部が形成される。
次に、第５図（ｂ）で示すように、絶縁基板ｌの他方の
片面側にも、同様にして導体ペーストを印刷すると共に
、同片面側からスルーホール１１、１１・・・に導体ペ
ーストを引き込み、これらを乾燥し、焼付けて、配線パ
ターン１２′とスルーホール１３の残りの部分を形成す
る。
このような印刷回路基板の製造方法において、前記配線
パターン１２．１２’及びスルーホール導体１３を形成
するための印刷工程を、絶縁基板１の各面について単に
各々−回ずつ行なった場合、第３図に示すように、導体
ペーストの表面張力により、スルーホール１１のエツジ
部分１４での導体膜が丸く収縮して、そこの膜厚が他の
部分に比べ薄（なる。このように、導体膜が薄くなった
スルーホール１１のエツジ部分１４に近い所に導体ラン
ドを形成し、これに部品を実装して半田付けすると、導
体膜に含まれる銀等の導体材料が半田中に拡散し、いわ
ゆる「半田食われ現象」を起こす。そうすると、前記エ
ツジ部分１４の薄い導体膜の導体材料が欠落し、いわゆ
るスルーホールオーブンが生じる。
従来では、これを避けるために、別にスルーホール部の
みを印刷するための別の印刷パターンを用い、スルーホ
ール部分のみに更に１〜２回導体ペーストを印刷し、ス
ルーホール１１のエツジ部１４の導体層の膜厚の増大を
図っていた。On the surface of the insulating substrate, a circuit wiring using a thick conductor film, a resistive film, etc. is formed, and a conductive layer is formed on the inner wall of a through hole drilled in the insulating substrate. Circuit wiring formed on both sides of a substrate is connected to each other. When forming a conductor in such a through hole, a screen printing device as shown in FIG. 4 is used to form a conductor on the inner wall of the through hole at the same time as the wiring pattern is formed on the insulating substrate. It is common practice to print a paste and then bake it to form a wiring pattern and a through-hole conductor at the same time. A conventional thick film printing apparatus for printing such conductors will be explained with reference to FIG. In the figure, 3 is a decompression chamber formed in a funnel shape, having a wide mouth part 32 on the upper side and a narrow mouth part 31 on the lower side. The narrow mouth part 31 is connected to a vacuum pump via a duct (not shown), and the substrate support plate 4 is fitted into the wide mouth part 32. On this substrate support plate 4, an insulating substrate 1 such as an alumina substrate is placed which has been masked in advance and has through holes 11, 11, . . . formed at predetermined positions. The substrate support plate 4 has through holes 11, 11, and 11 on the insulating substrate 1 placed thereon.
Through-holes 41, 41... are bored at positions corresponding to the through-holes 11, 41, .
．． 11..., and further through the through holes 41°41...
・It passes through and is sucked into the decompression chamber 3. A screen printing machine including a screen 2, a screen frame 21 that supports the screen 2, a squeegee 5, and a drive device (not shown) that drives the squeegee 5 is arranged above the substrate support plate 4. The operation of the thick film printing apparatus having such a configuration will be described below. First, the insulating substrate l is placed on the substrate support plate 4 of the decompression chamber 3. Further, the screen printing machine prints the conductive paste a containing Ag--Pd, etc., applied on the screen 2, on the substrate 1 according to a predetermined wiring pattern. At the same time, from the through holes 11, 11... of the substrate 1 to the through holes 4L of the substrate support plate 4.
Along with the air sucked into the decompression chamber 3 through . a is attached. The printed circuit board on which the conductive paste a is printed in this way is sent to a dryer such as a convection oven or an infrared heating oven, where it is heated and dried at a temperature of 150° C. for about 10 minutes. Then temperature 85
The conductive paste is baked at 0° C. for about 10 minutes. As a result, as shown in FIG. 5(a), the wiring pattern 12 and a portion of the through-hole conductor 13 on one side of the insulating substrate 1 are formed. Next, as shown in FIG. 5(b), a conductive paste is printed on the other side of the insulating substrate l in the same manner, and the conductive paste is applied to the through holes 11, 11, etc. from the same side. are drawn in, dried, and baked to form the remaining portions of the wiring pattern 12' and the through hole 13. In such a method of manufacturing a printed circuit board, if the printing process for forming the wiring patterns 12, 12' and the through-hole conductors 13 is simply performed one time on each side of the insulating substrate 1, the third As shown in the figure, due to the surface tension of the conductor paste, the conductor film at the edge portion 14 of the through hole 11 shrinks into a round shape, and the film thickness there becomes thinner than in other parts. When a conductive land is formed near the edge portion 14 of the through hole 11 where the through hole has become thin, and a component is mounted and soldered on this land, the conductive material such as silver contained in the conductive film diffuses into the solder, resulting in the so-called A "solder eating phenomenon" occurs. When this happens, the conductive material of the thin conductive film at the edge portion 14 is missing, resulting in a so-called through-hole oven. Conventionally, in order to avoid this, only the through-hole section is printed separately. Using a different printing pattern, the conductor paste was printed once or twice more only on the through-hole portion, thereby increasing the thickness of the conductor layer at the edge portion 14 of the through-hole 11.
しかしながら、前記従来の印刷回路基板の製造方法では
、次のような課題を有している。
すなわち、導体層を印刷するための印刷スクリーンのほ
かに、別にスルーホール用の印刷スクリーンを用意しな
げればならない。そして、絶縁基板ｌの片面で最低２回
の印刷をを行なわなければならず、その際印刷スクリー
ンの交換や印刷の位囮合わせが必要である等、製造工程
が複雑となる。
本発明は、スルーホールのエツジ部で十分な厚さの導体
膜が得られ、しかも絶縁基板の片面の導体膜を形成する
のに一回の印刷で済む混成集積回路の製造方法とそれを
実施するための製造装置を提供することを目的とする。However, the conventional printed circuit board manufacturing method has the following problems. That is, in addition to the printing screen for printing the conductor layer, a separate printing screen for through-holes must be prepared. Furthermore, printing must be performed at least twice on one side of the insulating substrate 1, and the manufacturing process becomes complicated, as it is necessary to replace the printing screen and adjust the printing position. The present invention provides a method for manufacturing a hybrid integrated circuit, in which a conductive film of sufficient thickness can be obtained at the edge of a through hole, and which requires only one printing to form a conductive film on one side of an insulating substrate, and its implementation. The purpose is to provide manufacturing equipment for
すなわち本発明では、前記課題を解消するため、予め所
定の位置にスルーホール１１、１１・・・が形成された
絶縁基板１０表面に、導体ペーストａを印刷すると共に
、該導体ペーストａを前記スルーホール１１，１１・・
・の中に吸引する工程と、前記絶縁基板１の表面を加熱
して、導体ペーストを乾燥する工程とを有する厚膜印刷
回路基板の製造方法において、前記導体ペーストを乾燥
する工程の前に、スルーホール１１．１１・・・の中に
導体ペーストを吸引したのと逆方向に、これらスルーホ
ール１１．１１に熱風を吹き込む工程を有することを特
徴とする厚膜印刷回路基板の製造方法を提供する。
また、予め所定の位置にスルーホール１１．１１・・・
が形成された絶縁基板１を保持し、その裏面側を負圧に
維持する基板保持減圧手段と、該基板保持減圧手段に保
持された前記絶縁基板ｌの表面に、導体ペーストａを印
刷するスクリーン印刷機と、絶縁基板１に印刷された導
体ペーストａを乾燥する乾燥機とを備える厚膜印刷回路
基板製造装置において、さらに、絶縁基板１のスルーホ
ール１１，１１・・・の中に熱風を吹き込む熱風供給機
を備えることを特徴とする厚膜印刷回路基板の製造装置
を提供する。That is, in the present invention, in order to solve the above problem, a conductive paste a is printed on the surface of an insulating substrate 10 in which through holes 11, 11, . . . are formed in advance at predetermined positions, and the conductive paste a is Hall 11, 11...
In the method for manufacturing a thick film printed circuit board, the method includes a step of suctioning the conductive paste into the insulating substrate 1, and a step of drying the conductive paste by heating the surface of the insulating substrate 1, before the step of drying the conductive paste, Provided is a method for manufacturing a thick film printed circuit board, which comprises the step of blowing hot air into the through holes 11.11 in the opposite direction to the direction in which the conductive paste was sucked into the through holes 11.11. do. In addition, through holes 11, 11...
a substrate holding and decompressing means for holding the insulating substrate 1 on which is formed and maintaining a negative pressure on the back side thereof, and a screen for printing conductive paste a on the surface of the insulating substrate l held by the substrate holding and depressurizing means. In the thick film printed circuit board manufacturing apparatus that includes a printing machine and a dryer that dries the conductive paste a printed on the insulating substrate 1, hot air is further introduced into the through holes 11, 11, . . . of the insulating substrate 1. Provided is a thick film printed circuit board manufacturing apparatus characterized by being equipped with a blowing hot air supply machine.
前記本発明による厚膜印刷回路の製造方法では、絶縁基
板１の表面とスルーホール１１の壁面に印刷された導体
ペーストを印刷する工程と、この導体ペーストを乾燥す
る工程との間に、スルーホール１１、１１に熱風を吹き
込む工程を有するため、印刷工程においてスルーホール
１１の中に導入された導体ペーストの温度が上昇し、該
ペーストの粘度が低くなって流動性が増す。そして熱風
は、スルーホール１１．１．１・・・の中に導体ペース
トを吸引したのと逆方向に吹き込まれるため、流動性を
増したペーストがスルーホール１１の開口部、つまりエ
ツジ部１４へ流動し、該エツジ部に集まる。その後、こ
の導体ペーストを乾燥させる工程を行なうと、スルーホ
ール１１のエツジ部１４の膜厚の厚い導体層が得られる
。
さらに、本発明による厚膜印刷回路基板の製造装置を用
いて前記方法を実施するには、まず、基板を保持し、そ
の背面側を減圧する基板保持減圧手段と、印刷機を用い
て絶縁基板ｌの片面とスルーホール１１に導体ペースト
を印刷する工程が行なわれる。その後、絶縁基板１のス
ルーホール１１，１１・・・の中に熱風を吹き込む熱風
供給機により、スルーホール１１に熱風を吹き込んで、
前記乾燥工程を行なうことができる。
その後、乾燥機を用いてその導電ペーストを乾燥させる
。In the method for manufacturing a thick film printed circuit according to the present invention, between the step of printing the conductive paste printed on the surface of the insulating substrate 1 and the wall surface of the through hole 11 and the step of drying the conductive paste, the through hole is Since there is a step of blowing hot air into 11, 11, the temperature of the conductive paste introduced into the through holes 11 increases during the printing process, the viscosity of the paste decreases, and the fluidity increases. Then, the hot air is blown into the through holes 11.1.1 in the opposite direction to the direction in which the conductive paste was sucked, so that the paste with increased fluidity flows into the opening of the through hole 11, that is, the edge portion 14. It flows and collects at the edge. Thereafter, by performing a step of drying this conductor paste, a thick conductor layer at the edge portion 14 of the through hole 11 is obtained. Furthermore, in order to carry out the method using the thick film printed circuit board manufacturing apparatus according to the present invention, first, a substrate holding and depressurizing means for holding the substrate and depressurizing the back side thereof, and an insulating substrate using a printing machine are used. A process of printing a conductive paste on one side of the through hole 11 and on one side of the through hole 11 is performed. After that, hot air is blown into the through holes 11 by a hot air supply machine that blows hot air into the through holes 11, 11... of the insulating substrate 1,
The drying step described above can be performed. Thereafter, the conductive paste is dried using a dryer.
以下、図面を参照しながら、本発明の実施例を以下に説
明する。
第４図は、厚膜印刷装置の要部の断面図である。同図中
において、３は、上側に広口部３２を、下側に狭口部３
１を有し、漏斗状に形成された減圧室である。この狭口
部３１は、図示されないダクトを介して真空ポンプに接
続され、広口部３２には、基板支持板４が嵌め込まれて
いる。この基板支持板４上には、あらがしめマスキング
され、所定の位置にスルーホール１１．１１・・・が穿
設されたアルミナ基板等の基板１が載置される。前記基
板支持板４には、その上に載置される基板１上のスルー
ホール１１．１１・・・と対応する位置に貫通孔４１，
４１・・・が穿設されており、前記減圧室３内部が減圧
されるとき、前記基板ｌの表面付近の空気が基板ｌのス
ルーホール１１．１１・・・を通り、さらに前記貫通孔
４Ｌ４１・・・を通過し、減圧室３の中に吸引される。
前記基板支持板４の上方には、スクリーン２、スクリー
ン２を支持するスクリーン枠２１． スキージ５、及
びスキージ５を駆動する図示しない駆動装置からなら該
スクリーン印刷機が配置されている。
以上のような構成の厚膜印刷装置を用いて、絶縁基板１
０表面に導電ペーストａを印刷すると共に、同基板１の
スルーホール１１の中に導電ペーストａを引き込み、そ
の内壁に導体ペーストを付着させる。
第２図に、この印刷工程が完了した絶縁基板１のスルー
ホール１１、１１・・・に熱風を吹き込む熱風供給機と
、同絶縁基板１を加熱し、前記導電ペーストを乾燥する
乾燥機とが示されている。前者の熱風供給機は、熱風ブ
ロア２３に接続された加圧室２０を備えており、この加
圧室２０の上側開口部に絶縁基板ｌを載せて保持する支
持板５が設けられ、そこに導体ペーストが印刷された絶
縁基板１が載せられる。さらに、乾燥機として、この絶
縁基板１の上に乾燥用の加熱ヒータ２２が配置されてい
る。
この装置では、印刷した側を上にして印刷工程が完了し
た絶縁基板１を支持板５の上に載せて保持すると共に、
熱風ブロア２３から熱風を加圧室２０側に供給し、この
熱風りを絶縁基板１のスルーホール１１を通して絶縁基
板１の上面側に吹き上げる。これにより、スルーホール
１１．１１・・・の中に充填された導体ペーストがスル
ーホール１１、１１・・・の上部開口部側へ吹き上げら
れ、そのエツジ部分１４に集まる。
その後、ヒータ２２で絶縁基板ｌの上面を加熱する。こ
れにより、絶縁基板１に印刷された導体ペーストが加熱
、乾燥される。さらに、前記導電ペーストが絶縁基板１
に焼付けられ、第１図で示すように、絶縁基板１０片側
分の配線パターン１２とスルーホール導体１３の一部が
形成される。
本発明による方法と装置で作られた厚膜印刷回路基板で
は、第１図に示すように、スルーホール１１のエツジ部
１４の導体膜の膜厚が厚くなっている。これは、前述の
ようにして、スルーホール１１．１１・・・の中に充填
された導体ペーストがスルーホール１１．１１・・・の
上部開口部側へ吹き上げられ、そのエツジ部分１４に集
まり、その後、これが乾燥工程で乾燥され、さらに焼付
けられたことによる。
次に、絶縁基板の他方の片側にも、同様にして導体ペー
ストを印刷すると共に、同片面側からスルーホール１１
．１１・・・に導体ペーストを引き込み、さらに、スル
ーホール１１、１１・−・に熱風を吹き上げた後、これ
らを乾燥し、焼付けて、配線パターン１２′とスルーホ
ール１３の残りの部分を形成する。これにより、厚ＨＥ
ｒＪ刷回路基板が完成する。
次に、本発明の具体例を以下に示すと、直径０．５鴎の
スルーホール１１．１１・・・を設けた厚さ０．６３５
ｍｍのアルミナからなる絶縁基板１を、そのスルーホー
ル１１．１１・・・の位置に対応した直径２酊の貫通孔
４１．４１・・・が穿設された基板支持板４の上に載せ
て、第４図で示すような印刷機にセットした。そして、
減圧室３を負圧にし、図において上から下へとスルーホ
ール１１．１１、・・・を通して空気を吸引しながら、
スクリーン２により導体ペーストａを絶縁基板１の上面
に印刷した。
次に、このアルミナ基板を第２図に示すような熱風供給
機にセットし、熱風ブロア２３側から供給される８０℃
の熱風りを、スルーホール１１．１１・・・に図におい
て下から上に５分間通した。さらにｐ！＃４ｆｆｉ乾燥
炉で１５０℃、１０分間乾燥し、乾燥の終わった絶縁基
板を８５０℃、１０分間焼成して、その一方の面の配線
パターン１２とスルーホール導体１３の一部を形成した
。
次に、絶縁基板１の他方の面側にも、前記と同様の方法
で配線パターン１２′とスルーホール導体１３の一部を
形成し、厚膜印刷回路用基板を完成した。
こうして製造された厚膜印刷回路用基板のスルーホール
１１のエツジ部１４の導体膜の膜厚を測定したところ、
約１０μｍであった。この厚さは半田食われが発生して
も部品実装上は問題のない厚さである。
他方、比較例として、スルーホール１１．１１・・・に
熱風りを通す工程を省略した以外は、同じ手順で厚膜印
刷回路基板を製作した。この基板のスルーホールのエツ
ジ部の導体層膜厚を測定したところ、約４μｍであった
。この厚さでは、電子部品の半田付時に起こるいわゆる
半田食わ現象により、スルーホールオーブンが生じる恐
れが大きい。Embodiments of the present invention will be described below with reference to the drawings. FIG. 4 is a sectional view of the main parts of the thick film printing apparatus. In the figure, 3 has a wide mouth part 32 on the upper side and a narrow mouth part 3 on the lower side.
1, which is a funnel-shaped vacuum chamber. The narrow mouth part 31 is connected to a vacuum pump via a duct (not shown), and the substrate support plate 4 is fitted into the wide mouth part 32. On this substrate support plate 4, a substrate 1 such as an alumina substrate is placed which has been roughened and masked and has through holes 11, 11, . . . formed at predetermined positions. The substrate support plate 4 has through holes 41 at positions corresponding to the through holes 11, 11, . . . on the substrate 1 placed thereon.
41... are bored, and when the inside of the decompression chamber 3 is depressurized, air near the surface of the substrate l passes through the through holes 11, 11... of the substrate l, and further through the through holes 4L41. ... and is sucked into the decompression chamber 3. Above the substrate support plate 4 are a screen 2 and a screen frame 21 that supports the screen 2. The screen printing machine is comprised of a squeegee 5 and a drive device (not shown) that drives the squeegee 5. Using the thick film printing apparatus configured as described above, the insulating substrate 1
At the same time as printing the conductive paste a on the surface of the substrate 1, the conductive paste a is drawn into the through hole 11 of the same substrate 1, and the conductive paste is adhered to the inner wall thereof. FIG. 2 shows a hot air supply machine that blows hot air into the through holes 11, 11, etc. of the insulating substrate 1 after the printing process has been completed, and a dryer that heats the insulating substrate 1 and dries the conductive paste. It is shown. The former hot air supply device is equipped with a pressurizing chamber 20 connected to a hot air blower 23, and a support plate 5 is provided on the upper opening of the pressurizing chamber 20 to place and hold an insulating substrate l. An insulating substrate 1 on which conductive paste is printed is mounted. Further, as a dryer, a drying heater 22 is arranged on the insulating substrate 1. In this device, the insulating substrate 1 that has undergone the printing process is placed and held on the support plate 5 with the printed side facing up, and
Hot air is supplied from a hot air blower 23 to the pressurizing chamber 20 side, and the hot air is blown up to the upper surface side of the insulating substrate 1 through the through hole 11 of the insulating substrate 1. As a result, the conductive paste filled in the through holes 11, 11, . . . is blown up toward the upper openings of the through holes 11, 11, . Thereafter, the upper surface of the insulating substrate l is heated by the heater 22. As a result, the conductive paste printed on the insulating substrate 1 is heated and dried. Further, the conductive paste is applied to the insulating substrate 1.
As shown in FIG. 1, the wiring pattern 12 and part of the through-hole conductor 13 on one side of the insulating substrate 10 are formed. In the thick film printed circuit board manufactured by the method and apparatus according to the present invention, the thickness of the conductor film at the edge portion 14 of the through hole 11 is increased, as shown in FIG. This is because, as described above, the conductive paste filled in the through holes 11.11... is blown up towards the upper opening side of the through holes 11.11... and collects at the edge portion 14. This was then dried in a drying process and then baked. Next, conductive paste is printed on the other side of the insulating board in the same way, and the through holes 11 are printed from the same side.
．． The conductive paste is drawn into the through holes 11, 11, and so on, and then hot air is blown up into the through holes 11, 11, and so on, and then these are dried and baked to form the wiring pattern 12' and the remaining parts of the through holes 13. . As a result, the thickness HE
The rJ printing circuit board is completed. Next, a specific example of the present invention is shown below.Thickness 0.635 mm with through holes 11.11... having a diameter of 0.5 mm
An insulating substrate 1 made of alumina with a diameter of 2 mm is placed on a substrate support plate 4 in which through holes 41, 41, . , and set it on a printing machine as shown in FIG. and,
Make the decompression chamber 3 negative pressure, and while sucking air through the through holes 11, 11, etc. from top to bottom in the figure,
The conductive paste a was printed on the upper surface of the insulating substrate 1 using the screen 2. Next, this alumina substrate is set in a hot air supply machine as shown in FIG.
Hot air was passed through the through holes 11, 11... from bottom to top in the figure for 5 minutes. More p! It was dried in a #4ffi drying oven at 150° C. for 10 minutes, and the dried insulating substrate was baked at 850° C. for 10 minutes to form a portion of the wiring pattern 12 and through-hole conductor 13 on one side. Next, a wiring pattern 12' and a portion of the through-hole conductor 13 were formed on the other side of the insulating substrate 1 in the same manner as described above, thereby completing a thick film printed circuit board. When the film thickness of the conductor film at the edge portion 14 of the through hole 11 of the thick film printed circuit board manufactured in this way was measured, it was found that:
It was about 10 μm. This thickness is such that even if solder erosion occurs, there will be no problem in terms of component mounting. On the other hand, as a comparative example, a thick film printed circuit board was manufactured using the same procedure except that the step of passing hot air through the through holes 11, 11, etc. was omitted. The thickness of the conductor layer at the edge of the through hole of this substrate was measured and found to be approximately 4 μm. With this thickness, there is a high risk that through-hole ovens will occur due to the so-called solder erosion phenomenon that occurs when electronic components are soldered.
以上の説明から明らかな通り、本発明の厚膜印刷回路基
板の製造方法と製造装置によれば、配線パターンの印刷
スクリーンの他に、スルーホール用の印刷スクリーンを
別に用意する必要がなく、片面につき１回の印刷で配線
パターンとスルーホール導体が形成できるので、工程が
簡略化できる。また、印刷回数が減るので、印刷から焼
成にかけての総所要時間が短縮され、製品の製造サイク
ルタイムが短くなる。そのうえ、−回の印刷でスルーホ
ールのエツジ部の導体膜の膜厚を厚くすることができる
ので、導体ペーストの使用量も少な（なる。これらの理
由から、厚膜印刷回路基板の製造コストを低減すること
ができる。As is clear from the above explanation, according to the thick film printed circuit board manufacturing method and manufacturing apparatus of the present invention, there is no need to separately prepare a printing screen for through holes in addition to the wiring pattern printing screen, and one-sided Since the wiring pattern and through-hole conductor can be formed in one printing process, the process can be simplified. Furthermore, since the number of times of printing is reduced, the total time required from printing to firing is shortened, and the manufacturing cycle time of the product is shortened. In addition, the thickness of the conductor film at the edge of the through hole can be increased by printing twice, so the amount of conductor paste used can be reduced.For these reasons, the manufacturing cost of thick film printed circuit boards can be reduced. can be reduced.
第１図は、本発明の方法により製造された厚膜印刷回路
基板の例の半完成状態の要部縦断面図、第２図は、本発
明の実施例による厚膜印刷回路基板の製造装置のうち、
熱風供給機部分を示す要部縦断側面図、第３図は、従来
の方法により製造された厚膜印刷回路基板の例の半完成
状態の要部縦断面図、第４図は、厚膜印刷回路基板の製
造装置のうち、印刷機部分を示す要部縦断側面図、第５
図は、厚膜印刷回路基板の製造手順を示すその要部縦断
面図である。
１・・・絶縁基板 ２・・・スクリーン １１・・・ス
ルーホール ２０・・・加圧室 ２３・・・熱風ブロア
２２・・・乾燥用ヒーターFIG. 1 is a vertical cross-sectional view of a semi-finished main part of an example of a thick film printed circuit board manufactured by the method of the present invention, and FIG. 2 is a thick film printed circuit board manufacturing apparatus according to an embodiment of the present invention. Of these,
FIG. 3 is a vertical cross-sectional view of the main part of a semi-finished state of an example of a thick film printed circuit board manufactured by a conventional method, and FIG. 4 is a longitudinal cross-sectional view of the main part showing the hot air supply device. 5th longitudinal sectional side view of the main part showing the printing machine part of the circuit board manufacturing equipment
The figure is a vertical cross-sectional view of the main part showing the manufacturing procedure of the thick film printed circuit board. 1... Insulating substrate 2... Screen 11... Through hole 20... Pressurizing chamber 23... Hot air blower 22... Drying heater
Claims (2)
が形成された絶縁基板１の表面に、導体ペーストａを印
刷すると共に、該導体ペーストａを前記スルーホール１
１、１１・・・の中に吸引する工程と、 前記絶縁基板１の表面を加熱して、導体ペーストを乾燥
する工程とを有する厚膜印刷回路基板の製造方法におい
て、 前記導体ペーストを乾燥する工程の前に、スルーホール
１１、１１・・・の中に導体ペーストを吸引したのと逆
方向に、これらスルーホール１１、１１に熱風を吹き込
む工程を有することを特徴とする厚膜印刷回路基板の製
造方法。(1) Through holes 11, 11... are placed in predetermined positions in advance.
A conductive paste a is printed on the surface of the insulating substrate 1 on which is formed, and the conductive paste a is inserted into the through hole 1.
1, 11..., and a step of drying the conductor paste by heating the surface of the insulating substrate 1, the method comprises: drying the conductor paste. A thick film printed circuit board characterized by having a step of blowing hot air into the through holes 11, 11 in the opposite direction to the direction in which the conductive paste was sucked into the through holes 11, 11, before the step. manufacturing method.
が形成された絶縁基板１を保持し、その裏面側を負圧に
維持する基板保持減圧手段と、 該基板保持減圧手段に保持された前記絶縁基板１の表面
に、導体ペーストａを印刷するスクリーン印刷機と、 絶縁基板１に印刷された導体ペーストａを乾燥する乾燥
機とを備える厚膜印刷回路基板製造装置において、 さらに、絶縁基板１のスルーホール１１、１１・・・の
中に熱風を吹き込む熱風供給機を備えることを特徴とす
る厚膜印刷回路基板の製造装置。(2) Through holes 11, 11... are placed in predetermined positions in advance.
a substrate holding and depressurizing means for holding the insulating substrate 1 on which the insulating substrate 1 is formed and maintaining a negative pressure on the back side thereof; and a screen for printing conductive paste a on the surface of the insulating substrate 1 held by the substrate holding and decompressing means. In a thick film printed circuit board manufacturing apparatus equipped with a printing machine and a dryer for drying the conductive paste a printed on the insulating substrate 1, hot air is further introduced into the through holes 11, 11, . . . of the insulating substrate 1. A thick film printed circuit board manufacturing device characterized by being equipped with a blowing hot air supply machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24522390A JP2778817B2 (en) | 1990-09-14 | 1990-09-14 | Method and apparatus for manufacturing thick film printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24522390A JP2778817B2 (en) | 1990-09-14 | 1990-09-14 | Method and apparatus for manufacturing thick film printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04124897A true JPH04124897A (en) | 1992-04-24 |
| JP2778817B2 JP2778817B2 (en) | 1998-07-23 |
Family
ID=17130478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24522390A Expired - Lifetime JP2778817B2 (en) | 1990-09-14 | 1990-09-14 | Method and apparatus for manufacturing thick film printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2778817B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113643985A (en) * | 2021-08-06 | 2021-11-12 | 西安微电子技术研究所 | Method for realizing interconnection of front and back patterns of thick film substrate |
-
1990
- 1990-09-14 JP JP24522390A patent/JP2778817B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113643985A (en) * | 2021-08-06 | 2021-11-12 | 西安微电子技术研究所 | Method for realizing interconnection of front and back patterns of thick film substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2778817B2 (en) | 1998-07-23 |
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