GB2030007A - Printed circuit board manufacture - Google Patents
Printed circuit board manufacture Download PDFInfo
- Publication number
- GB2030007A GB2030007A GB7922633A GB7922633A GB2030007A GB 2030007 A GB2030007 A GB 2030007A GB 7922633 A GB7922633 A GB 7922633A GB 7922633 A GB7922633 A GB 7922633A GB 2030007 A GB2030007 A GB 2030007A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- holes
- conductive
- pattern
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 24
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 60
- 239000007788 liquid Substances 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 238000007639 printing Methods 0.000 abstract description 3
- 239000000976 ink Substances 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
In the manufacture of a printed circuit board having conductive patterns 3, 4 on the opposed faces with conductors of the patterns being inter-connected via through holes 2, 2A in the board 1, a low pressure is applied to the side of the board which is not in the process of being printed, in the vicinity of the through holes, simultaneously with the printing to draw the material which forms the conductive pattern down into the holes to form a surface-to-surface conductive coating. <IMAGE>
Description
SPECIFICATION
Method of manufacturing a flexible circuit board
The present invention relates to electrical circuitry and particularly to printed circuits. More specifically, this invention is directed to a method for the manufacture of printed circuits having conductive patterns on opposite faces of a substrate and particularly to the fabrication of flexible printed circuits wherein conductors on opposite sides of the substrate are electrically connected via conductive through holes.
While not limited thereto in its utility, the present invention is particularly well suited for use in the manufacture of flexible circuit boards. Techniques for the production of flexible printed circuits, which comprise a substrate with conductive patterns formed on the opposite surfaces thereof, are well known in the art. The known techniques include photo-resist techniques and "positive" methods such as screen printing. These known techniques may, of course, be applied to the manufacture of either flexible or rigid circuit boards. The known printed circuit manufacturing techniques are comparatively complicated processes. Thus, by way of example, the photo-resist techniques require a number of position matching or registration steps.
When interconnection of the circuits on the opposite sides of the boards via through holes is desired, which is the usual situation, the position-matching operations which must be performed are increased.
These position-matching steps are time consuming and limit efforts to increase productivity.
The purpose of the present invention is to overcome the above briefly described deficiencies of the prior art by providing a novel and improved technique for the manufacture of circuit boards having circuit patterns on both surfaces and electrically conductive through-holes.
In accordance with the present invention there is provided a method for the manufacture of an electrical circuit comprising the steps of selecting a nonconductive substrate, providing the substrate with a pattern of holes extending between a pair of opposed surfaces thereof, supporting the substrate on a plate having a hole pattern commensurate with the hole pattern in the substrate, a first surface of the substrate being in face-to-face relationship with a first surface of the support plate and the holes in the plate and substrate being in registration, applying a low pressure to the second surface of the support plate and, via the holes in the plate, to the first surface of the substrate in the vicinity of the holes therein, and forming a conductive pattern on the second surface of the substrate while the low pressure is applied to the second surface of the support plate, the conductors of the pattern being defined by a conductive material in liquid form and the applied low pressure drawing the liquid conductive material into the substrate holes to coat the walls thereof.
The manufacturing process in accordance with the present invention contemplates the serial deposition of conductive material in accordance with the desired circuit pattern on the opposed faces of the circuit board or substrate by screen printing while simultaneously forming the conductive throughholes. The ability to simultaneously form conductive through-holes results from the fact that, during printing, the substrate is positioned on a suction board which is provided with a pattern of holes which matches the desired conductive through-holes pattern of the circuit. A low pressure is applied to the back surface of the substrate in the vicinity of the through-holes while the desired circuit pattern is being applied to the front surface of the substrate.
This results in the drawing of the conductive material, for example electro-conductive ink, onto the inner surfaces of the through-holes. After the circuit pattern has been formed on the first surface, the process is repeated to form a conductive pattern on the second surface of the board and to complete or enhance the conductive coating on the surfaces of the through-holes.
The present invention may be better understood and its numerous objects and advantages will become apparent to those skilled in the art by reference to the accompanying drawing wherein like reference numerals refer to like elements in the several figures in which:
Figure 1 is a partial perspective view, in section, showing a substrate for use in the practice of the present invention;
Figure 2 is a schematic cross-sectional view depicting the practice of the present invention;
Figure 3 is a view, similar to Figure 1, showing the substrate with a circuit pattern and conductive through-holes produced in accordance with the present invention;
Figure 4 is a cross-sectional side elevation view, on an enlarged scale, of one of the conductive through-holes of the partially completed circuit board of Figure 3;;
Figure 5 is a perspective view, similarto Figures 1 and 3, representing the formation of the circuit pattern on the opposite side of the substrate, and
Figure 6 is a cross-sectional, side elevation view, on an enlarged scale, which depicts a portion of a printed circuit having a conductive through-hole produced in accordance with the present invention and subsequently plated to enhance currentcarrying capability.
With reference now to the drawing, and particu marly to Figure 1, a substrate or base material for a printed circuit is indicated at 1. Substrate 1 may, for example, comprise a flexible film of insulating material. The substrate 1 has been provided with a plurality of through-holes, such as the holes indicated at 2 and 2A, which are positioned commensurate with the location of conductive paths which are to subsequently be formed on the opposite sides of the substrate. The through-holes 2 and 2A may, for example, be formed by boring.
The base material or substrate 1 of Figure 1 is shown in Figure 2 supported on a suction board 5.
The suction board 5 may, for example, be a stainless steel plate which is provided with a pattern of holes as indicated at 6 and 6A. The pattern of holes in board 5 will be identical to that of substrate 1 but the holes 6 and 6A in board 5 will be of larger diameter than the holes 2 and 2A in substrate 1. The supporting board 5 is, in turn, supported on a sealing ring 7, which may be formed of a suitable gasket material, which will form a hermetic seal about the lower periphery of board 5. The ring or support 7, in turn, is supported on the bed 8 of a vacuum suction device.
The bed 8 of the vacuum suction device is provided with a large number of small through-holes 8A. A flange of the vacuum suction device has been indicated at 9 and the direction of gas flow, when the vacuum suction device is operating, has been indicated by arrow F. The positioning of the substrate 1 may be maintained, and the prevention of gas leakage about the periphery of the substrate eliminated, by means of employing a tape 10 to firmly hold the base material 1 on the suction board 5.
With the substrate 1 held on the vacuum suction device as shown in Figure 2 and the vacuum pump operating, the desired circuit pattern, which will include discrete conductive paths such as indicated at 3 and 4 is formed on a first surface of substrate 1 with electro-conductive ink as represented in Figure 3; the conductive material being applied to the surface of the substrate by means of screen printing. As the conductive ink is screened onto the substrate, ink will be sucked through and onto the walls of the holes 2 and 2A thereby forming, as may be seen from Figure 4, a conductive coating 3A on the walls of the through-holes.The ability to form a conductive coating on the walls of the through-holes is affected by factors such as the viscosity, thixothropy, etc. of the electro-conductive ink as well as the screen-printing conditions such as the rate of movement of a squee-gee, printing pressure, etc.
The desired conductive properties ofthethrough- holes are achieved by primarily controlling the size of the holes in the substrate and adjusting the pressure differential across the substrate as a function of hole size.
An additional advantage of the present invention resides in the fact that the line width of the conductive patterns formed on the surfaces of the substrate may be made as thin as possible. In this regard it is to be noted that the conductive inks employed may be the known silver or carbon inks which are commercially available.
After the conductive pattern has been formed on a first surface of substrate 1, in the manner described above, the process is repeated to define a conductive pattern on the opposite side of the substrate. In order to permit the second, serial drawing of the conductive ink into the through-holes, the hole pattern of the suction board 5 must of course register with that of the substrate 1. Accordingly, either the suction board 5 must be turned over or a new suction board substituted therefor.
The results of the repetition of the screening process have been represented in Figure 5 with the circuit patterns being indicated at 3B and 4A on the back or second surface of substrate 1. The practice of the process step which produces the results shown in Figure 5 will insure that the circuit patterns on the two sides of substrate 1 will be electrically connected by means of the conductive through-holes.
While a circuit suitable for use results from practice of the process steps leading to production of the articles shown in Figure 5, if the current-carrying capacity of the circuit pattern is to be enhanced, additional conductive material may be applied over the circuit pattern and conductive through-holes by means of electrolytic plating or non-electrolytic chemical plating. The result of plating is represented in Figure 6 where it may be seen that the conductive coating on the wall of the through-hole 2 is comprised of two thicknesses; the first layer being the conductive ink and the second layer being the material plated thereover. As will be obvious to those skilled in the art, the circuit pattern on one or both sides of substrate 1 may be protected by means of insulating paint, application of a covering film layer, etc.
The present invention has the advantage of enabling the production of flexible printed circuits with conductive through-holes in large quantities with reduced production costs. However, the present invention is also applicable to the production of rigid printed circuits.
Claims (7)
1. A method for the manufacture of an electrical circuit comprising the steps of selecting a nonconductive substrate, providing the substrate with a pattern of holes extending between a pair of opposed surfaces thereof, supporting the substrate on a plate having a hole pattern commensu rate with the hole pattern in the substrate, a first surface of the substrate being in face-to-face relationship with a first surface of the support plate and the holes in the plate and substrate being in registration, applying a low pressure to the second surface of the support plate and, via the holes in the plate, to the first surface of the substrate in the vicinity of the holes therein, and forming a conductive pattern on the second surface of the substrate while the low pressure is applied to the second surface of the support plate, the conductors of the pattern being defined by a conductive material in liquid form and the applied low pressure drawing the liquid conductive material into the substrate holes to coat the walls thereof.
2. A method as claimed in claim 1, further comprising the steps of supporting the substrate with the conductive pattern on the second surface thereof in face-to-face relationship with a surface of a support plate, the support plate having a hole pattern commensurate with the hole pattern in the substrate and the holes in the plate and substrate being in registration, applying a low pressure to the surface of the support plate which faces away from the substrate and via the holes in the plate to the second surface of the substrate in the vicinity of the holes therein, and forming a conductive pattern on the first surface of the substrate while the low pressure is applied to the support plate, the conductors of the pattern being defined by a conductive material in liquid form and the applied low pressure drawing the liquid conductive material into the through-holes to coat the walls thereof.
3. A method as claimed in any one of claims 1 or 2, wherein the substrate is a flexible insulating film.
4. A method as claimed in any one of claims 1 to 3, wherein the applied pressure is selected to be a function of the size of the holes in the substrate.
5. A method as claimed in any one of claims 1 to 4, wherein the step of forming a conductive pattern comprises screen printing on the substrate with a conductive ink.
6. A method as claimed in claim 1, further comprising the step of plating a conductive material over the conductive material which has been drawn into the holes in the substrate.
7. A method for the manufacture of an electrical circuit substantially as hereinbefore described with reference to and as illustrated by the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7895378A JPS556832A (en) | 1978-06-29 | 1978-06-29 | Method of manufacturing flexible circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB2030007A true GB2030007A (en) | 1980-03-26 |
Family
ID=13676244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB7922633A Withdrawn GB2030007A (en) | 1978-06-29 | 1979-06-29 | Printed circuit board manufacture |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS556832A (en) |
| BE (1) | BE877349A (en) |
| DE (1) | DE2926335A1 (en) |
| FR (1) | FR2430168A1 (en) |
| GB (1) | GB2030007A (en) |
| IT (1) | IT1121983B (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2525851A1 (en) * | 1982-04-23 | 1983-10-28 | Italtel Italiana Telecomunica | Making conductive holes in PCB - by using two chambers with volume of one increases as other decreases as ink is forced through |
| FR2547155A1 (en) * | 1983-06-06 | 1984-12-07 | Int Standard Electric Corp | Silk-screen printing device and process; electrical circuit thus obtained |
| GB2142478A (en) * | 1983-07-01 | 1985-01-16 | Welwyn Electronics Ltd | Printed circuit boards |
| EP0147901A2 (en) * | 1983-12-20 | 1985-07-10 | ITALTEL SOCIETA ITALIANA TELECOMUNICAZIONI s.p.a. | Method for coating with ink the walls of through holes in supports for electric circuits, and machine for implementing said method |
| GB2163007A (en) * | 1984-08-08 | 1986-02-12 | Krone Gmbh | Sheet with printed conductors on both sides and method of forming interconnections between the conductors |
| EP0194247A2 (en) * | 1985-03-05 | 1986-09-10 | Svecia Silkscreen Maskiner AB | A screen printer adapted for providing a layer of material on the inner surface of a hole passing through a plate |
| FR2580135A1 (en) * | 1985-04-05 | 1986-10-10 | Trt Telecom Radio Electr | |
| EP0200398A2 (en) * | 1985-04-11 | 1986-11-05 | Olin Hunt Sub Iii Corp. | Process for preparing a non-conductive substrate for electroplating |
| EP0281704A2 (en) * | 1987-02-09 | 1988-09-14 | Sheldahl, Inc. | Method and apparatus for preparing conductive screened through holes employing metalli-plated polymer thick films |
| GB2227124A (en) * | 1988-12-09 | 1990-07-18 | Hitachi Chemical Co Ltd | Circuit board and process for producing the same |
| GB2235825A (en) * | 1989-08-09 | 1991-03-13 | Tokyo International Component | Double-sided composite printed circuit board |
| EP0426583A1 (en) * | 1989-11-03 | 1991-05-08 | HORLOGERIE PHOTOGRAPHIQUE FRANCAISE (société anonyme) | Double face printed circuit board and method of making it |
| US7645943B2 (en) | 2007-07-11 | 2010-01-12 | Delphi Technologies, Inc. | Configurable printed circuit board |
| US7815785B2 (en) | 2006-06-22 | 2010-10-19 | Enthone Inc. | Direct metallization of electrically non-conductive polyimide substrate surfaces |
| CN113380630A (en) * | 2020-03-09 | 2021-09-10 | 重庆川仪微电路有限责任公司 | Method for metallizing thick film circuit hole and method for printing thick film circuit |
| CN113643985A (en) * | 2021-08-06 | 2021-11-12 | 西安微电子技术研究所 | Method for realizing interconnection of front and back patterns of thick film substrate |
| IT202200009725A1 (en) * | 2022-05-11 | 2023-11-11 | Tastitalia S R L | Flexible printed circuit obtained with a semi-additive process |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5877291A (en) * | 1981-11-02 | 1983-05-10 | 松下電器産業株式会社 | Method of producing printed circuit board |
| DE3245458A1 (en) * | 1982-12-08 | 1984-06-14 | Siemens AG, 1000 Berlin und 8000 München | Method for producing through-plated contacts in thick-film technology |
| JPS6017991A (en) * | 1983-07-12 | 1985-01-29 | 株式会社東芝 | Method of producing through hole substrate |
| DE3509627A1 (en) * | 1985-03-16 | 1986-09-18 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Device for making through-contact in the case of holes in thick-film circuit boards |
| DE3545258A1 (en) * | 1985-12-20 | 1987-06-25 | Licentia Gmbh | Method for producing circuits using thin-film technology |
| JPS62183197A (en) * | 1986-02-06 | 1987-08-11 | 凸版印刷株式会社 | Flexible through-hole circuit substrate and manufacture of the same |
| IT1203535B (en) * | 1986-02-10 | 1989-02-15 | Marelli Autronica | PROCEDURE FOR THE REALIZATION OF THE MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO BODIES IN PARTICULAR BETWEEN THE MEMBRANE AND THE SUPPORT OF A THICK FILM PRESSURE SENSOR AND DEVICES REALIZED WITH SUCH PROCEDURE |
| JPS62209894A (en) * | 1986-03-10 | 1987-09-16 | 凸版印刷株式会社 | Manufacture of flexible through-hole circuit board |
| DE3806884C1 (en) * | 1988-03-03 | 1989-09-21 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | Through-plated contact printed circuit and method for fabricating it |
| DE3909185A1 (en) * | 1989-03-21 | 1990-09-27 | Endress Hauser Gmbh Co | CAPACITIVE PRESSURE SENSOR AND METHOD FOR THE PRODUCTION THEREOF |
| JP2797475B2 (en) * | 1989-07-11 | 1998-09-17 | 松下電器産業株式会社 | Screen printing machine for through-hole printing |
| DE19724366A1 (en) * | 1997-06-10 | 1998-12-17 | Thomson Brandt Gmbh | Process for the through-connection of printed circuit boards |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4939932A (en) * | 1972-08-26 | 1974-04-15 |
-
1978
- 1978-06-29 JP JP7895378A patent/JPS556832A/en active Pending
-
1979
- 1979-06-28 BE BE0/196027A patent/BE877349A/en unknown
- 1979-06-28 FR FR7916747A patent/FR2430168A1/en not_active Withdrawn
- 1979-06-29 GB GB7922633A patent/GB2030007A/en not_active Withdrawn
- 1979-06-29 DE DE19792926335 patent/DE2926335A1/en not_active Withdrawn
- 1979-06-29 IT IT24023/79A patent/IT1121983B/en active
Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2525851A1 (en) * | 1982-04-23 | 1983-10-28 | Italtel Italiana Telecomunica | Making conductive holes in PCB - by using two chambers with volume of one increases as other decreases as ink is forced through |
| US4959246A (en) * | 1983-06-06 | 1990-09-25 | International Standard Electric Corporation | Screen printing process and apparatus and electrical printed circuits obtained therewith |
| FR2547155A1 (en) * | 1983-06-06 | 1984-12-07 | Int Standard Electric Corp | Silk-screen printing device and process; electrical circuit thus obtained |
| GB2143473A (en) * | 1983-06-06 | 1985-02-13 | Int Standard Electric Corp | Screen printing process and apparatus and electrical printed circuits obtained therewith |
| GB2142478A (en) * | 1983-07-01 | 1985-01-16 | Welwyn Electronics Ltd | Printed circuit boards |
| EP0147901A3 (en) * | 1983-12-20 | 1986-07-16 | Italtel Societa Italiana Telecomunicazioni S.P.A. | Method for coating with ink the walls of through holes in supports for electric circuits, and machine for implementing said method |
| EP0147901A2 (en) * | 1983-12-20 | 1985-07-10 | ITALTEL SOCIETA ITALIANA TELECOMUNICAZIONI s.p.a. | Method for coating with ink the walls of through holes in supports for electric circuits, and machine for implementing said method |
| GB2163007A (en) * | 1984-08-08 | 1986-02-12 | Krone Gmbh | Sheet with printed conductors on both sides and method of forming interconnections between the conductors |
| EP0194247A2 (en) * | 1985-03-05 | 1986-09-10 | Svecia Silkscreen Maskiner AB | A screen printer adapted for providing a layer of material on the inner surface of a hole passing through a plate |
| EP0194247A3 (en) * | 1985-03-05 | 1989-03-22 | Svecia Silkscreen Maskiner AB | A screen printer adapted for providing a layer of material on the inner surface of a hole passing through a plate |
| FR2580135A1 (en) * | 1985-04-05 | 1986-10-10 | Trt Telecom Radio Electr | |
| EP0197595A1 (en) * | 1985-04-05 | 1986-10-15 | Trt Telecommunications Radioelectriques Et Telephoniques | Metallization process for through holes used as thick-film links between the faces of a substrate during serigraphic printing |
| EP0200398A2 (en) * | 1985-04-11 | 1986-11-05 | Olin Hunt Sub Iii Corp. | Process for preparing a non-conductive substrate for electroplating |
| EP0200398A3 (en) * | 1985-04-11 | 1988-04-27 | Olin Hunt Special Prod Inc | Process for preparing a non-conductive substrate for electroplating |
| EP0281704A2 (en) * | 1987-02-09 | 1988-09-14 | Sheldahl, Inc. | Method and apparatus for preparing conductive screened through holes employing metalli-plated polymer thick films |
| EP0281704A3 (en) * | 1987-02-09 | 1989-11-29 | Sheldahl, Inc. | Method and apparatus for preparing conductive screened through holes employing metalli-plated polymer thick films |
| GB2227124A (en) * | 1988-12-09 | 1990-07-18 | Hitachi Chemical Co Ltd | Circuit board and process for producing the same |
| GB2227124B (en) * | 1988-12-09 | 1993-05-26 | Hitachi Chemical Co Ltd | Wiring board and process for producing the same |
| US5243144A (en) * | 1988-12-09 | 1993-09-07 | Hitachi Chemical Company, Ltd. | Wiring board and process for producing the same |
| GB2235825A (en) * | 1989-08-09 | 1991-03-13 | Tokyo International Component | Double-sided composite printed circuit board |
| EP0426583A1 (en) * | 1989-11-03 | 1991-05-08 | HORLOGERIE PHOTOGRAPHIQUE FRANCAISE (société anonyme) | Double face printed circuit board and method of making it |
| FR2654296A1 (en) * | 1989-11-03 | 1991-05-10 | Horlogerie Photograph Fse | TWO - SIDED PRINTED CIRCUIT, AND METHOD FOR THE PRODUCTION THEREOF. |
| US7815785B2 (en) | 2006-06-22 | 2010-10-19 | Enthone Inc. | Direct metallization of electrically non-conductive polyimide substrate surfaces |
| US7645943B2 (en) | 2007-07-11 | 2010-01-12 | Delphi Technologies, Inc. | Configurable printed circuit board |
| CN113380630A (en) * | 2020-03-09 | 2021-09-10 | 重庆川仪微电路有限责任公司 | Method for metallizing thick film circuit hole and method for printing thick film circuit |
| CN113643985A (en) * | 2021-08-06 | 2021-11-12 | 西安微电子技术研究所 | Method for realizing interconnection of front and back patterns of thick film substrate |
| IT202200009725A1 (en) * | 2022-05-11 | 2023-11-11 | Tastitalia S R L | Flexible printed circuit obtained with a semi-additive process |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2926335A1 (en) | 1980-01-10 |
| IT1121983B (en) | 1986-04-23 |
| IT7924023A0 (en) | 1979-06-29 |
| JPS556832A (en) | 1980-01-18 |
| BE877349A (en) | 1979-12-28 |
| FR2430168A1 (en) | 1980-01-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |