WO2019080914A1

WO2019080914A1 - Method for fabricating single-sided metal-based circuit board used for soldering pin components

Info

Publication number: WO2019080914A1
Application number: PCT/CN2018/111973
Authority: WO
Inventors: 王定锋; 徐文红
Original assignee: 王定锋
Priority date: 2017-10-26
Filing date: 2018-10-25
Publication date: 2019-05-02
Also published as: CN109714906A

Abstract

Provided is a method for fabricating a single-sided metal-based circuit board used for soldering pin components; the back side of a flexible single-sided copper-clad board (2) base material is coated with an adhesive, then is attached to a metal board (4) having a hole (4.1); then, a resin adhesive (5) is printed to the metal board hole (4.1) from the back side; the hole is filled, and after curing, the wiring is etched and a solder resist (1) is printed; the resin adhesive (5) at the metal board hole (4.1) is punched or drilled using a die so as to make a hole (6); the hole (6) is smaller than the metal board hole (4.1), and passes through the resin adhesive (5) and adhesive-coated single-sided copper-clad board (2); this hole (6) is used for plug-welding the pin component (7), i.e. is fabricated into a metal-based circuit board that pin components can be plugged in and soldered. Resin adhesive is printed on the hole of the metal board, then a hole for the pin component to be plugged into and soldered is machined, thus solving the soldering problem of holes for pin components on a metal-based circuit board while also solving the problem of heat dissipation.

Description

Single-sided metal-based circuit board for soldering pin components

This application claims the priority of the Chinese invention patent application "a method for manufacturing a single-sided metal-based circuit board for soldering pin components" (application number: 201711031933.7) whose application date is October 26, 2017, and the applicant is Wang Dingfeng. The entire contents of this Chinese patent application are incorporated herein by reference.

Technical field

The present application relates to the field of circuit boards, and in particular to a method for fabricating a single-sided metal-based circuit board for soldering pin components.

Background technique

The traditional single-sided rigid circuit board is generally divided into a metal-based single-sided rigid circuit board and a non-metal single-sided rigid circuit board. The former has good heat dissipation, but the pins of the pin components are short-circuited with the metal plate holes, and the pins cannot be soldered. The components cause the pin components to use only non-metallic single-sided rigid circuit boards. Non-metallic single-sided rigid circuit boards can weld the pin components, but the heat dissipation is not good.

In order to overcome the above and other defects and deficiencies, the single-sided metal-based circuit board of the present application is filled with resin glue in the hole of the metal substrate, and the pin hole of the pin component is opened on the resin resin, and the pin hole of the pin component is smaller than the metal. The hole on the board, the pin hole of the pin component and the hole on the metal plate are separated by the resin glue, and the problem that the pin of the pin component is short-circuited with the hole of the metal plate is solved, and the conventional pin component can only be used. Non-metallic single-sided rigid circuit boards cause problems with poor heat dissipation.

Summary of the invention

The present application relates to a method for fabricating a single-sided metal-based circuit board for soldering a pin component, in particular, after applying a back side of a flexible single-sided copper clad laminate substrate, attaching it to a perforated metal plate, and then from the back side Printing resin glue into the hole of the metal plate, filling the hole, curing, etching the circuit, printing resistive welding, punching or drilling with the mold on the resin glue at the hole of the metal plate, the hole is smaller than the hole of the metal plate, and the resin glue is punched through and a glued single-sided copper clad plate for inserting a soldering pin component, that is, a metal-based circuit board capable of soldering a pin component, and a single-sided metal-based circuit board for soldering a pin component of the present application is used in The resin plate is filled on the hole of the metal plate, and the hole of the soldering pin component is processed to solve the problem of soldering the socket of the soldering pin component of the metal base circuit board, and at the same time, the heat dissipation problem is solved.

According to the present application, there is provided a method for fabricating a single-sided metal-based circuit board for soldering a pin component, comprising: coating a back side of a flexible single-sided copper clad laminate substrate, attaching it to a perforated metal plate, and then from the back side Printing the resin glue into the hole of the metal plate, filling the hole or nearly filling, solidifying, etching the circuit, printing the resistance welding, punching the hole on the resin glue at the hole of the metal plate or drilling the hole with the drill, the hole is smaller than the hole of the metal plate And through the resin glue and the glued single-sided copper clad plate, the hole is used for inserting the soldering pin component, so that the component is inserted and welded from the back side to the front soldering ring, and the component pin hole is separated from the metal plate hole by the cured resin glue. That is, a metal-based circuit board that can be inserted into the soldering pin component is fabricated.

According to the present application, there is also provided a method for fabricating a single-sided metal-based circuit board for soldering a pin component, comprising: using a flexible single-sided copper-clad board substrate, first etching the finished circuit, or etching the finished circuit to complete the solder resist After that, the back side is glued, attached to the metal plate with holes, and then the resin glue is printed from the back side into the hole of the metal plate, the hole is filled or nearly filled, and after solidification, the resin glue on the hole of the metal plate is punched with a mold. The hole or the drill is drilled, the hole is smaller than the hole of the metal plate, and the resin glue and the glued single-sided copper clad plate are pierced, and the hole is used for inserting the welding pin component, so that the component is inserted and welded from the back side to the front welding ring, and the component pin hole is The metal plate holes are separated by the cured resin glue, which is a metal-based circuit board that can be inserted into the soldering pin components.

According to the present application, there is also provided a single-sided metal-based circuit board for soldering a pin component, comprising: a solder resist layer; a circuit layer; an insulating film layer with a glue; a metal substrate layer with a hole; and being filled in a hole of the metal substrate a resin glue; and a pin hole of a pin member that penetrates the resin glue, the rubber insulating film layer, the circuit layer, and the solder resist layer; wherein the adhesive film is a PET film, or a PI film, or a PEN film Or a fiberglass cloth, the resin glue is an epoxy glue or an acrylic glue, the pin hole of the pin component is smaller than the hole of the metal plate, the resin glue is filled in the large hole of the metal plate, and the pin component The pin hole is in the resin glue, the pin hole of the pin component is separated from the hole of the metal plate by the resin glue, and at least one pin hole or a plurality of pin holes in the resin glue at the same place, the pin hole of the pin component A solder ring is formed on the circuit level to form a single-sided metal-based circuit board for soldering the pin components.

In the following description of the drawings and specific embodiments, details of one or more embodiments of the present application are set forth.

DRAWINGS

The features, objects, and advantages of the present invention will become more apparent from the aspects of the appended claims.

1 is a schematic cross-sectional view of a flexible single-sided copper clad laminate substrate after being glued to a metal plate with holes.

Fig. 2 is a schematic cross-sectional view showing the printing of the resin glue from the back side into the hole of the metal plate to fill the hole.

Fig. 3 is a schematic cross-sectional view showing the etching line after printing solder resist on the circuit surface.

Fig. 4 is a schematic cross-sectional view showing a pin hole of a pin member which is punched by a die on a resin glue at a hole of a metal plate.

Fig. 5 is a schematic cross-sectional view showing only one pin hole in the same resin.

Figure 6 is a schematic cross-sectional view showing two pin holes on the same resin.

Detailed ways

The present application will be described in detail below by taking a preferred embodiment as an example. However, those skilled in the art should understand that the following description is merely illustrative of the preferred embodiments of the invention, and is not limited by the claims.

After the back side of the flexible single-sided copper clad laminate substrate is glued, it is attached to the metal plate 4 with the hole 4.1 (as shown in FIG. 1), wherein the mark 2 in FIG. 1 is the copper foil used to make the circuit, and the mark 3 It is an insulating film with glue, then print the resin glue 5 from the back into the metal plate hole 4.1, fill the metal plate hole 4.1 (as shown in Figure 2), and then bake in a 150 degree oven for 90 minutes, baking After curing, the circuit resist ink is screen printed on the copper surface 2, baked and cured, and then an etching etching film is used to etch the circuit to remove unnecessary copper, and then the solder resist ink is screen printed on the fabricated circuit, and baked and cured. A solder mask 1 is formed on the circuit to expose the front pad 2.1 (shown in FIG. 3), and then the pin element 7 is punched out on the resin glue 5 at the metal plate hole 4.1 by a pre-designed die. The pin hole 6 , the pin hole 6 of the pin element 7 is smaller than the hole 4.1 on the metal plate, the pin hole 6 of the pin element 7 is in the resin glue 5, the pin hole 6 of the pin element 7 and the hole 4.1 on the metal plate 4 are resin The glue 5 is separated, and the front pad 2.1 forms a solder ring, which is fabricated as shown in FIG. 4 for soldering the pin components. Surface of the metal base circuit board.

5 is a view showing a structure of a single-sided metal-based circuit board for soldering a pin component, in which the pin component 7 is soldered to the front surface pad 2.1 of the single-sided metal-based circuit board by solder 7.2, and the pin is clearly seen. The pin 7.1 of the component 7 is separated from the metal plate hole 4.1 by the resin glue 5, and the problem of soldering the pin 7.1 of the pin component 7 to the short circuit of the metal plate hole 4.1 is solved, and the conventional pin component 7 can only be used. A single-sided rigid circuit board of metal causes a problem of poor heat dissipation.

Of course, according to the design requirements, the resin glue 5 in the same place can be designed into a pin hole 6, or can be designed into a plurality of pin holes 6, as shown in Fig. 6, in the same resin glue 5 2 pin holes 6.

A specific embodiment of a method for fabricating a single-sided metal-based circuit board for soldering a pin component is described in detail above with reference to the accompanying drawings. However, those skilled in the art should understand that the foregoing description is only illustrative of the specific embodiments, and the scope of the invention is not limited.

Claims

A method for fabricating a single-sided metal-based circuit board for soldering a pin component, comprising:

After the back side of the flexible single-sided copper clad laminate is glued, it is attached to the metal plate with holes, and then the resin glue is printed from the back side into the hole of the metal plate, the hole is filled or nearly filled, and after curing, the line is etched and printed. Solder mask, punched by a die or drilled by a drill on the resin glue at the hole of the metal plate, the hole is smaller than the hole of the metal plate, and penetrates the resin glue and the glued single-sided copper clad plate for inserting the soldering pin component The component is inserted and soldered from the back side to the front soldering ring, and the component pin hole is separated from the metal plate hole by the cured resin glue, thereby forming a metal-based circuit board capable of soldering the pin component.
A method for fabricating a single-sided metal-based circuit board for soldering a pin component, comprising:

After the flexible single-sided copper-clad board substrate is first etched to complete the line, or after the etching is completed, the back side is glued, adhered to the perforated metal plate, and then printed from the back side to the metal plate hole. Fill the hole or close to fill. After curing, punch the hole on the resin glue at the hole of the metal plate with a die or drill the hole. The hole is smaller than the hole of the metal plate, and the resin glue and the glued single-sided copper-clad plate are pierced. The hole is used to insert the soldering pin component, and the component is inserted and soldered from the back side to the front soldering ring. The component pin hole is separated from the metal plate hole by the cured resin glue, thereby forming a metal-based circuit board capable of soldering the pin component.
A single-sided metal-based circuit board for soldering a pin component, comprising:

Solder mask

Circuit layer

Insulating film layer with glue;

a metal substrate layer with holes;

a resin glue filled in a hole of the metal substrate; and

a pin hole of a pin member penetrating through a resin glue, a rubber insulating film layer, a circuit layer, and a solder resist layer;

Wherein, the adhesive film with a glue is a PET film, or a PI film, or a PEN film, or a fiberglass cloth, the resin glue is an epoxy glue, an acrylic glue, or a phenolic resin glue. The pin hole of the pin component is smaller than the hole of the metal plate, the resin glue is filled in the large hole of the metal plate, the pin hole of the pin component is in the resin glue, the pin hole of the pin component and the hole of the metal plate are resin glue Separated, there is a pin hole or a plurality of pin holes in the same resin glue. The pin holes of the pin element have a solder ring on the circuit level to form a single-sided metal-based circuit board for soldering the pin elements.