CN210725563U - Double-sided circuit board lamp strip with two-sided circuit switched on in two modes - Google Patents
Double-sided circuit board lamp strip with two-sided circuit switched on in two modes Download PDFInfo
- Publication number
- CN210725563U CN210725563U CN201920082950.1U CN201920082950U CN210725563U CN 210725563 U CN210725563 U CN 210725563U CN 201920082950 U CN201920082950 U CN 201920082950U CN 210725563 U CN210725563 U CN 210725563U
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- Prior art keywords
- hole
- circuit
- bowl
- sided
- sided circuit
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910000679 solder Inorganic materials 0.000 claims abstract description 22
- 238000005476 soldering Methods 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 239000011324 bead Substances 0.000 claims abstract description 10
- 238000003466 welding Methods 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 239000013039 cover film Substances 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 230000005012 migration Effects 0.000 claims description 2
- 238000013508 migration Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 230000001788 irregular Effects 0.000 claims 1
- 239000002002 slurry Substances 0.000 abstract 3
- 238000007639 printing Methods 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 239000002313 adhesive film Substances 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 206010066054 Dysmorphism Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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Abstract
The utility model relates to a double-sided circuit board lamp belt for conducting two-sided circuits in two ways, which comprises a through hole and/or a bowl-shaped conducting hole, wherein the bottom circuit copper is exposed upwards at the bottom of the hole to form the bottom of a bowl-shaped bowl, or a small hole which is smaller than the bowl-shaped hole is formed on the copper of the bottom circuit, conductive slurry is filled in the bowl-shaped hole and is connected with the bottom metal of the bowl-shaped hole and the surface metal of the hole edge to form the conduction of the two-sided circuit, a part of the conductive slurry or the whole conductive slurry is covered by a solder mask, the positions which need to be conducted at other two sides of the circuit board are used for conducting the two-sided circuit by tin soldering, and the tin is connected with the tin on the side surface of the plate edge and the two-sided pad, so that the two-sided circuit is conducted, or the tin is welded on the bowl-shaped hole to form the conduction of the lamp bead two-, a double-sided circuit board lamp strip with two types of circuits conducted on two sides is formed.
Description
Technical Field
The utility model relates to a circuit board and LED application, concretely relates to double-sided circuit board lamp area with two kinds of modes switch on two-sided circuit.
Background
The conduction mode of the two-sided circuit of the traditional double-sided circuit board is as follows:
1. the circuit on both sides is conducted through the electroplating holes by chemical plating and electroplating holes, which has high cost and pollutes the environment.
2. The hole is filled with the conductive oil or the conductive paste, so that the circuits on the two sides are conducted through the conductive oil or the conductive paste filled in the hole, but the conductive oil and the conductive paste contain non-metallic resin, so that the resistance value is large, the heating is high during large current, and the voltage drop is large.
3. The tin is used for conducting the circuits on the two sides, the diameter of the hole is small and the thickness of the board is not large due to the exclusion effect of the tin on nonmetal, so that the tin is used for the thin board of the FPC and needs to be provided with large holes, the tin at the tin point position of the conducting hole is thick, the circuit board is thickened greatly, a plurality of installation positions are required to be thin, and the board cannot be installed due to the thick board.
In order to solve the conduction of the two-sided circuit, overcome the above defects and many deficiencies, solve the problem that the two sides of the position where large current is needed are conducted without heating, the circuit voltage drop is large due to large hole resistance, the problem that the dense holes of many position circuits cannot be large, the holes occupy large space, the wiring of dense circuits is seriously influenced, and the problem that many position boards cannot be thick and the space cannot be left is solved, statistical analysis and summary find that the circuit which needs large current on the circuit board is generally a wide circuit, the conducting holes on the two sides can also be large, so that the large holes can be used for conducting the two-sided circuit by tin soldering, the high-density circuit is designed to be small, the small current generally passes through, the designed holes are also small, the conducting holes are conducted by conducting paste or conducting ink, and the small holes can meet the requirements, the utility model adopts a mixed two conduction mode to conduct the two-sided circuit of the circuit board, that is, on the same circuit board, a part of the circuit board is conducted with the two-sided circuit by the conductive paste, and the other part of the circuit board is conducted with the two-sided circuit by the solder.
SUMMERY OF THE UTILITY MODEL
The utility model relates to a double-sided circuit board lamp belt which conducts circuits on two sides in two ways, specifically, a hole is drilled after a thermosetting adhesive film is pasted on the back surface of a single-sided copper-clad plate, another copper foil is pasted on the thermosetting adhesive film for pressing, curing and bonding, then a double-sided circuit is manufactured by etching, a double-sided circuit board with a bowl-shaped hole is formed, then the printed conductive paste enters a part of bowl-shaped holes of the circuit board, is heated and solidified, then a covering film is pasted on the double-sided circuit board to cover the conductive paste, the element bonding pad and other bonding pads on two sides which need to be conducted by the circuits on two sides are exposed, tin is applied to the other part of bowl-shaped holes to conduct the two layers of circuits, meanwhile, the LED lamp beads are welded on the exposed welding pads of the circuit board, so that a double-sided circuit board lamp strip with two sides of circuits is manufactured on the same circuit board in two modes that one part of the circuit board is conducted with conductive paste and the other part of the circuit board is conducted with the two sides of circuits through tin soldering.
According to the utility model provides a double-sided circuit board lamp area with two kinds of modes switch on two-sided circuit, include: a bottom layer circuit; an intermediate insulating layer; a top layer circuit; a through hole and/or a bowl-shaped via hole; welding the surfaces of the two sides; LED lamp beads; the LED packaging structure is characterized in that the through hole for conduction is a hole penetrating through the two-sided metal circuit and the middle insulating layer, the bowl-shaped through hole penetrates through the top layer circuit and the middle insulating layer at the through hole without penetrating through the bowl-shaped hole formed by the bottom layer circuit, the bottom layer circuit copper is exposed upwards at the bottom of the hole to form a bowl-shaped bowl bottom, or a small hole smaller than the bowl-shaped hole is formed in the copper of the bottom layer circuit, conductive paste is filled in the bowl-shaped hole and connected with the bowl-shaped hole bottom metal and the hole side surface metal to enable the two-sided circuit to be conducted, a part of the conductive paste or all the conductive paste is covered by a solder mask, an SMT welding LED lamp bead is welded on an element bonding pad exposed from the top layer circuit, meanwhile, positions needing to be conducted on two sides of the circuit board are conducted by soldering, tin is welded on two sides of the hole bonding pad and the tin penetrates through the hole to enable the two-sided circuit to, and tin forms the connection from the side of the board edge and the tin on the two-sided pad, so that the two-sided circuit is conducted, or tin is soldered on the bowl-shaped hole to weld tin, hole bottom metal and hole edge metal together to form the conduction of the two-sided circuit, and the LED lamp bead is soldered on the top layer circuit through tin soldering, so that the two-sided circuit board lamp strip which conducts the two-sided circuit in two modes is formed.
According to a preferred embodiment of the utility model, a two-sided circuit board lamp area that switches on two-sided circuit with two kinds of modes, its characterized in that, the electrically conductive thing in the electrically conductive thick liquid be silver powder, or metal copper powder, or graphite powder, or metal silver powder, metal copper powder, graphite powder wherein arbitrary two kinds or three kinds of mixed powder, or metal alloy powder.
According to the utility model discloses a preferred embodiment, a two-sided circuit board lamp area that switches on two-sided circuit with two kinds of modes, its characterized in that, electrically conductive thick liquid mix by conducting material with viscidity macromolecular material and auxiliary agent and form.
According to the utility model discloses a preferred embodiment, a two-sided circuit board lamp area that switches on two-sided circuit with two kinds of modes, its characterized in that, two-sided circuit board be flexible circuit board, perhaps be rigid circuit board.
According to the utility model discloses a preferred embodiment, a two-sided circuit board lamp area with two kinds of modes switch on two-sided circuit, its characterized in that, the hole be round hole or dysmorphism hole.
According to the utility model discloses a preferred embodiment, a two-sided circuit board lamp area that switches on two-sided circuit with two kinds of modes, its characterized in that, the surface hinder to weld to cover the membrane and hinder and weld or printing ink hinders and welds.
According to the utility model discloses a preferred embodiment, a two-sided circuit board lamp area that switches on two-sided circuit with two kinds of modes, its characterized in that, when acting as the surface with the cover membrane and hindering the solder mask, cover the membrane and firmly cover the silver thick liquid after the solidification, prevent the migration of silver particle.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the reading of the specification in conjunction with the following drawings, a brief description of which follows.
Fig. 1 is a schematic cross-sectional view of a complete double-sided circuit board strip, in which one part of the circuit is connected and conducted between a bottom layer circuit and a top layer circuit through conductive paste in a bowl-shaped via hole, and the other part of the circuit is connected and conducted between the bottom layer circuit and the top layer circuit through tin soldering in the bowl-shaped via hole, and metal copper at the bottom of the bowl-shaped via hole is a complete double-sided circuit board.
Fig. 2 is a schematic cross-sectional view of a complete double-sided circuit board strip, in which one part of the circuit is connected and conducted between the bottom layer circuit and the top layer circuit through the conductive paste in the bowl-shaped via hole, and the other part of the circuit is connected and conducted between the bottom layer circuit and the top layer circuit through the tin soldering in the via hole, and the bowl-shaped via hole bottom metal copper is the complete double-sided circuit board strip.
Fig. 3 is a schematic cross-sectional view of a complete double-sided circuit board strip, in which one part of the circuit board strip is connected and conducted between a bottom circuit and a top circuit through conductive paste in a bowl-shaped via hole, and the other part of the circuit board strip is welded on a metal pad of the bottom circuit and a metal pad of the top circuit at the edge of the board through soldering tin to connect and conduct the bottom circuit and the top circuit.
Fig. 4 is a schematic cross-sectional view of a double-sided circuit board strip, in which a part of the double-sided circuit board strip is connected and conducted with a bottom layer circuit and a top layer circuit through conductive paste in a bowl-shaped via hole, the other part of the double-sided circuit board strip is connected and conducted with the bottom layer circuit and the top layer circuit through soldering in the bowl-shaped via hole, and a small hole is etched in metal at the bottom of the bowl-.
Fig. 5 is a schematic cross-sectional view of a double-sided circuit board strip, in which a bottom circuit and a top circuit are connected and conducted partially through conductive paste in a bowl-shaped via hole, the bottom circuit and the top circuit are connected and conducted partially through soldering in the via hole, and a small hole is etched in metal at the bottom of the bowl-shaped via hole.
Fig. 6 is a schematic cross-sectional view of a double-sided circuit board strip, in which a bottom circuit and a top circuit are connected and conducted by a part of the conductive paste in a bowl-shaped via hole, and the other part of the conductive paste is welded on a metal pad of the bottom circuit and a metal pad of the top circuit on the board edge by soldering tin to connect and conduct the bottom circuit and the top circuit, and a small hole is etched in the bottom metal of the bowl-shaped via hole.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
1. Firstly, sticking a thermosetting adhesive film on the back surface of a single-sided copper-clad plate, then placing the single-sided copper-clad plate on an FPC drilling machine, drilling a required hole according to designed drilling data, sticking another piece of copper foil on the thermosetting adhesive, then pressing the copper foil on a quick press at 180 ℃ under 1200kg, firmly bonding the single-sided copper-clad plate and the copper foil by the thermosetting adhesive film, then placing the copper foil in an oven, baking and curing the copper foil for 60 minutes at 150 ℃, then silk-printing top layer circuit ink on the metal copper on one side of the single-sided copper-clad plate by a silk screen printing machine, baking and curing, then silk-printing bottom layer circuit ink on the copper foil on the other side, baking and curing, then etching on an etching film-removing horizontal production line to manufacture a top layer circuit 2 and a bottom layer circuit 1, wherein a middle insulating layer 3 is arranged between the top layer circuit 2 and the bottom layer circuit 1, and, the copper metal under the hole is complete (as shown in fig. 1, fig. 2 and fig. 3), or a small hole 1.1 is etched in the copper metal under the hole (as shown in fig. 4, fig. 5 and fig. 6).
2. And (2) performing screen printing on a screen printing machine, wherein the bottom metal copper of the hole is complete at a part of the bowl-shaped through hole, printing conductive paste from the front side, printing the conductive paste 4 into the part of the bowl-shaped through hole, simultaneously adhering the conductive paste 4 to the copper surface at the bottom of the hole, namely the bottom circuit 1 and the top circuit 2 at the peripheral edge of the hole, baking and curing, and connecting and conducting the bottom circuit 1 and the top circuit 2 through the conductive paste 4 in the bowl-shaped through hole (as shown in fig. 1, fig. 2 and fig. 3).
Or a small hole 1.1 is etched on the bottom metal copper, the conductive paste is printed from the front side, the conductive paste 4 is sucked from the small hole 1.1 on the back side, in order to make the conductive paste 4 more easily enter the hole, the conductive paste 4 is printed and poured in a part of bowl-shaped via holes, meanwhile, the conductive paste 4 is stuck on the bottom copper surface of the hole, namely the bottom circuit 1, and the top circuit 2 on the peripheral edge of the hole, baking and curing are carried out, and the bottom circuit 1 and the top circuit 2 are connected and conducted through the conductive paste 4 in the bowl-shaped via holes (as shown in fig. 4, fig. 5 and fig. 6).
3. The top cover film 6 with the opened pad window is attached to the top circuit 2 in an aligned mode, conductive silver paste 4 is covered, the bottom cover film 7 is attached to the bottom circuit 1 in an aligned mode, then the top cover film 6, the top circuit 2, the bottom circuit 1 and the bottom cover film 7 are firmly bonded together through pressing at the temperature of 180 ℃ and the pressure of 1200kg on a quick press, then the two-sided circuit board is placed in an oven, baked and cured for 60 minutes at the temperature of 150 ℃, and then the two-sided circuit board is manufactured through traditional manufacturing procedures of circuit boards such as silk-screen character printing, baking and curing, OSP surface treatment and forming (as shown in figures 1, 2, 3, 4, 5 and 6).
4. Adopt traditional SMT paster technology, on the tin cream printing machine with the steel mesh with tin cream seal in another part bowl form conducting hole and on the top layer circuit 2's of hole periphery pad, and on the component pad of welding LED lamp pearl, paste LED lamp pearl 8 again and paste the component pad of having printed tin cream, through reflow soldering welding, tin cream in the bowl form conducting hole forms tin soldering 5, make bottom circuit 1 and top layer circuit 2 connect through tin soldering 5 in the bowl form conducting hole and switch on, LED lamp pearl 8 welds to top layer circuit 2 (as shown in fig. 1, 4).
Or printing solder paste on the other part of the through hole and the pads of the top circuit 2 and the bottom circuit 1 at the periphery of the through hole and the component pads for welding the LED lamp beads by using a steel mesh on a solder paste printer, then attaching the LED lamp beads 8 to the component pads printed with the solder paste, forming solder 5 by using the solder paste in the through hole through reflow welding, and connecting and conducting the bottom circuit 1 and the top circuit 2 through the solder 5 in the through hole (as shown in fig. 2 and 5).
Or printing solder paste on a metal pad of the bottom circuit 1 and a metal pad of the top circuit 2 on the edge of the board and an element pad for welding the LED lamp beads by using a steel mesh on a solder paste printer, then mounting the LED lamp beads 8 on the element pad printed with the solder paste, and performing reflow welding to form solder 5 by using the solder paste on the metal pad of the edge of the board, wherein the solder 5 is welded on the metal pad of the bottom circuit 1 and the metal pad of the top circuit 2 on the edge of the board, and simultaneously wrapping the edge of the board in the solder 5 to connect and conduct the bottom circuit 1 and the top circuit 2 (as shown in figures 3 and 6), so that the double-sided circuit board strip (as shown in figures 1, 2, 3, 4, 5 and 6) conducting the circuits on two sides is manufactured.
The utility model discloses a two-sided circuit board lamp area of two kinds of modes switch on two-sided circuit, partly make bottom circuit and top layer circuit connection switch on through the conductive paste in the bowl form via hole, partly make bottom circuit and top layer circuit connection switch on through the soldering in the bowl form via hole, or partly make bottom circuit and top layer circuit connection switch on through the conductive paste in the bowl form via hole, partly make bottom circuit and top layer circuit connection switch on through the soldering in the via hole, or partly make bottom circuit and top layer circuit connection switch on through the conductive paste in the bowl form via hole, another part welds on the metal pad of bottom circuit of plate edge and the metal pad of top layer circuit through soldering tin, meanwhile, the plate edges are wrapped in tin soldering to enable the bottom layer circuit and the top layer circuit to be connected and conducted, and the requirements that the two sides at a high-current position are conducted and not heated, and the plate at a high-density circuit position is thin and not thick are met.
The present invention has been described in detail with reference to the accompanying drawings, in which the present invention is embodied in a double-sided circuit board strip that is capable of conducting a double-sided circuit in two ways. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and not limiting as to the scope of the invention, and particularly the scope of the claims.
Claims (5)
1. The utility model provides a switch on two-sided circuit board lamp area of two-sided circuit with two kinds of modes, includes:
a bottom layer circuit;
an intermediate insulating layer;
a top layer circuit;
a through hole and/or a bowl-shaped via hole;
welding the surfaces of the two sides;
LED lamp beads;
the conductive through hole is a hole penetrating through the two-sided metal circuit and the middle insulating layer, the bowl-shaped via hole is a hole penetrating through the top layer circuit and the middle insulating layer at the via hole without penetrating through the bowl-shaped hole formed by the bottom layer circuit, the bottom layer circuit copper is exposed upwards at the bottom of the hole to form the bowl-shaped bowl bottom, or a small hole smaller than the bowl-shaped hole is formed on the copper of the bottom layer circuit, the conductive paste is filled in the bowl-shaped hole and connected with the bowl-shaped hole bottom metal and the hole edge surface metal to form conduction of the two-sided circuit, a part of the conductive paste or all the conductive paste is covered by the solder mask, the two-sided circuit is conducted by tin soldering at the other two sides of the circuit board, the tin is soldered on the pads at the two sides of the hole and penetrates through the hole to form connection of the two-sided circuit or soldered on the pads at the two sides of the board, and the tin is connected from the side surface of, make two-sided circuit form switch on, perhaps tin soldering makes tin and hole bottom metal and hole limit metal weld together on bowl form hole and has formed switching on of two-sided circuit, LED lamp pearl passes through the soldering to weld to the top layer circuit on, forms the double-sided circuit board lamp area that switches on two-sided circuit with two kinds of modes.
2. The double-sided circuit board strip conducting two-way circuits according to claim 1, wherein the double-sided circuit board is a flexible circuit board or a rigid circuit board.
3. A double-sided circuit board strip for conducting two-sided circuits in two ways according to claim 1, wherein the through hole and/or the bowl-shaped via hole are circular holes or irregular holes.
4. The double-sided circuit board strip capable of conducting a double-sided circuit in two ways according to claim 1, wherein the surface solder mask is a cover film solder mask or an ink solder mask.
5. The double-sided circuit board strip conducting a double-sided circuit in two ways according to claim 4, wherein the cover film firmly covers the cured silver paste to prevent migration of silver particles when the cover film is used as surface solder resist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920082950.1U CN210725563U (en) | 2019-01-10 | 2019-01-10 | Double-sided circuit board lamp strip with two-sided circuit switched on in two modes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920082950.1U CN210725563U (en) | 2019-01-10 | 2019-01-10 | Double-sided circuit board lamp strip with two-sided circuit switched on in two modes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210725563U true CN210725563U (en) | 2020-06-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920082950.1U Expired - Fee Related CN210725563U (en) | 2019-01-10 | 2019-01-10 | Double-sided circuit board lamp strip with two-sided circuit switched on in two modes |
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| Country | Link |
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| CN (1) | CN210725563U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113840470A (en) * | 2020-06-24 | 2021-12-24 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method thereof |
| US11696393B2 (en) | 2020-06-24 | 2023-07-04 | Qing Ding Precision Electronics (Huaian) Co., Ltd | Method for manufacturing circuit board with high light reflectivity |
-
2019
- 2019-01-10 CN CN201920082950.1U patent/CN210725563U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113840470A (en) * | 2020-06-24 | 2021-12-24 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method thereof |
| US11696393B2 (en) | 2020-06-24 | 2023-07-04 | Qing Ding Precision Electronics (Huaian) Co., Ltd | Method for manufacturing circuit board with high light reflectivity |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20200609 |