CN112055463A - Novel bowl hole of bowl hole double-sided circuit board and manufacturing method - Google Patents
Novel bowl hole of bowl hole double-sided circuit board and manufacturing method Download PDFInfo
- Publication number
- CN112055463A CN112055463A CN201910524774.7A CN201910524774A CN112055463A CN 112055463 A CN112055463 A CN 112055463A CN 201910524774 A CN201910524774 A CN 201910524774A CN 112055463 A CN112055463 A CN 112055463A
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- Prior art keywords
- hole
- bowl hole
- bowl
- circuit
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a new bowl hole of a bowl hole double-sided circuit board and a manufacturing method, in particular to a bowl hole double-sided circuit board and a manufacturing method, wherein a single-sided copper-clad plate is etched to manufacture a front-side circuit, a solder mask is manufactured, then an intermediate adhesive layer is coated on the back side to form the intermediate adhesive layer, a die is used for punching a hole at the position where the bowl hole needs to be arranged, the hole simultaneously penetrates through the front-side solder mask layer, the front-side circuit layer, the intermediate insulating layer and the intermediate adhesive layer, the other single-sided circuit board is a back-side circuit, the back-side circuit board is aligned and pasted to the gluing surface of the front-side circuit board with the hole, the bottom of the hole is a back-side circuit layer, the hole wall is the front-side solder mask layer, the front-side circuit layer, the intermediate insulating layer and the gluing layer to form the bowl hole, the front-side circuit layer, and poor soldering due to disturbed flow of tin during soldering.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a novel bowl hole of a bowl hole double-sided circuit board and a manufacturing method thereof.
Background
The invention relates to a bowl-hole double-sided circuit board series patent, for example: patent numbers: 200920260552.0, patent name: double-sided circuit board, patent No.: 200920215983.5, patent name: double-sided circuit board with component, patent No.: 201020514646.9, patent name: double-sided circuit board and combination pad etc. are all that the front single-sided board is doing and is hindering before welding, behind the position processing hole that needs to switch on at double-sided circuit, the front of doing again hinders and welds, lead to front solder mask and intermediate insulation layer uneven in pore wall department, the front hinders and welds and form a plurality of steps with front copper and intermediate insulation layer and bowl hole bottom, lead to the outward appearance bad, high-end product can not be done, front copper has been exposed from overlooking at bowl hole department simultaneously, hole bottom copper and front copper cause the tin to flow the confusion because of the surface tension after the tin melts during soldering tin, make soldering tin connect badly.
In order to overcome the defects and the shortcomings, the invention covers the front copper at the bowl hole by the front solder resist, coats the back with glue, simultaneously punches or drills holes together, then pastes and presses the back circuits together through a glue layer, the bowl-shaped bottom of the formed bowl hole is the back copper, the front copper is not exposed from a top view, and the problems of poor appearance of a plurality of steps at the bowl hole and poor soldering tin formed by tin robbing of the front circuit copper and the back circuit copper during soldering are solved.
Disclosure of Invention
The invention relates to a new bowl hole of a bowl hole double-sided circuit board and a manufacturing method, in particular to a bowl hole double-sided circuit board and a manufacturing method, wherein a single-sided copper-clad plate is etched to manufacture a front-side circuit, a solder mask is manufactured, then an intermediate adhesive layer is coated on the back side to form the intermediate adhesive layer, a die is used for punching a hole at the position where the bowl hole needs to be arranged, the hole simultaneously penetrates through the front-side solder mask layer, the front-side circuit layer, the intermediate insulating layer and the intermediate adhesive layer, the other single-sided circuit board is a back-side circuit, the back-side circuit board is aligned and pasted to the gluing surface of the front-side circuit board with the hole, the hole bottom is the back-side circuit layer, the hole wall is the front-side solder mask layer, the front-side circuit layer, the intermediate insulating layer and the gluing layer to form the bowl hole, the front-side circuit layer, and poor soldering due to disturbed flow of tin during soldering.
According to the invention, a new bowl hole of a bowl hole double-sided circuit board is provided, specifically, a single-sided copper clad plate is etched to manufacture a front-side circuit, front-side solder mask is manufactured, a solder pad is exposed, a position where a bowl hole needs to be manufactured is covered with the solder mask, then back-side glue is coated to form an intermediate glue layer, a hole is carved by laser, or a hole is drilled by a drilling machine, or a die is used for punching, the hole simultaneously penetrates through the front-side solder mask, the front-side circuit layer, the intermediate insulating layer and the intermediate glue layer, according to the design, another single-sided circuit board is manufactured to be a back-side circuit, the back-side circuit board is aligned and pasted to the glue coating surface of the front-side circuit board with the hole, back-side circuit metal faces to the glue surface, the intermediate glue layer overflows to the bottom of the bowl hole after pressing, the overflow amount is more than 0, the back circuit that exposes at the bottom of the bowl hole forms bowl hole pad, welds and is the parallel and level with intermediate insulation layer in the front of pore wall, and front circuit is in bowl hole department, and is not exposed from the angle of depression, and there is back circuit metal to expose at the bottom of the bowl hole from the front angle of depression, and the bowl hole bottom has the glue film to spill over on the hole bottom metal from the front angle of depression, and the outflow is more than 0mm, is less than or equal to 0.8 mm.
According to the present invention, there is also provided a new bowl hole of a bowl hole double-sided circuit board, comprising: the front solder mask is arranged at the bowl hole; a front side circuit layer; an intermediate insulating layer of the hole wall; the middle glue layer at the bottom of the hole; a back circuit layer at the bottom of the hole; a back side insulating layer at the bottom of the hole; the bowl hole is characterized in that the front side of the bowl hole edge is welded in a welding mode, front side circuit metal covers the bowl hole, the bottom of the bowl hole is a back side circuit layer, a back side circuit is exposed from the front side when the bowl bottom is overlooked from the front side to form a bowl hole welding pad, the front side circuit is not exposed when the bowl bottom is overlooked from the front side, the front side circuit metal is exposed or partially exposed or completely unexposed when the front side circuit metal is seen towards the cross section of the hole wall, an intermediate glue layer overflows from the bottom of the bowl hole to the back side circuit layer, the overflowing amount is larger than 0mm and smaller than or equal to 0.8mm, and the front side welding resistance.
According to a preferred embodiment of the present invention, the new bowl hole of the bowl-hole double-sided circuit board is characterized in that the bowl hole is recessed from the back side of the circuit board in the back circuit layer and the back insulating layer, the back circuit in the bowl hole is raised from the front side of the circuit board, the pad formed by the back circuit in the bowl hole is close to the pad of the front circuit on a plane, the surface of the pad formed by the front circuit in the bowl hole is used as a reference plane of the plane, and the up-down range of the surface of the pad formed by the back circuit in the bowl hole and the reference plane is lower than the reference plane by 0.5mm and higher than the reference plane by 0.5 mm.
According to a preferred embodiment of the present invention, the new bowl hole of the bowl-hole double-sided circuit board is characterized in that the front solder mask layer is an ink solder mask layer or a cover film solder mask layer.
According to a preferred embodiment of the present invention, the new bowl hole of the bowl-hole double-sided circuit board is characterized in that the cover film solder mask is a PI film or a PET film.
According to a preferred embodiment of the present invention, the new bowl hole of the bowl-hole double-sided circuit board is characterized in that the bowl-hole bonding pad is a bonding pad of a welding element, a bonding pad of a connecting plate and a bonding pad of a welding power line.
According to a preferred embodiment of the invention, the new bowl hole of the bowl-hole double-sided circuit board is characterized in that on a bonding pad of a welding element provided with the bowl hole, part of welding feet of the element are welded on a back circuit through the bowl hole, the other part of welding feet are welded on a front circuit, and the front circuit and the back circuit are conducted through the element.
According to a preferred embodiment of the invention, the novel bowl hole of the bowl-hole double-sided circuit board is characterized in that the power line is welded on the back side circuit through the bowl hole on the welding power line welding plate provided with the bowl hole.
According to a preferred embodiment of the invention, the novel bowl hole of the bowl-hole double-sided circuit board is characterized in that when a plurality of circuit boards are welded and connected with each other on the connecting plate welding pad provided with the bowl hole, the circuit boards are welded on the back side circuit through the bowl hole to be communicated.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
FIG. 1 is a schematic plan view of a front circuit manufactured by etching a single-sided flexible copper-clad plate.
Fig. 2 is a schematic plan view of the circuit on the front side after printing front side solder mask.
Fig. 3 is a schematic plan view of a single-sided circuit board with a front side circuit having holes punched therein.
FIG. 4 is a schematic cross-sectional view at 1.3a of "FIG. 3".
Fig. 5 is a schematic plan view of the back side circuit.
Fig. 6 is a schematic plan view of a new bowl hole of a bowl hole double-sided circuit board.
Fig. 7 is a schematic cross-sectional view of a new bowl hole of a bowl-hole double-sided circuit board at the position of the bowl hole 1.3 a.
Fig. 8 is a schematic cross-sectional view of a new bowl hole of a bowl-hole double-sided circuit board at the position of the bowl hole 1.3 b.
Fig. 9 is a schematic cross-sectional view of the back side circuit layer and the back side insulating layer protruding upward at the bowl hole 1.3 a.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
The method comprises the steps of manufacturing a front circuit 1 (shown in figure 1) by adopting a traditional circuit board manufacturing process and carrying out silk-screen printing of circuit anti-corrosion ink, baking, curing, etching and film stripping on a single-sided flexible copper-clad plate, then carrying out silk-screen printing of solder resist 2 on the front circuit 1 to expose a pad 1.1 of a soldering element, then carrying out silk-screen character printing to manufacture a single-sided circuit board (shown in figure 2), then coating glue on the back of the single-sided circuit board, namely an intermediate insulating layer 3 to form an intermediate glue layer 4, and then punching holes 1.3a and 1.3b, wherein the holes penetrate through the front circuit 2, the front circuit 1, the intermediate insulating layer 3 and the intermediate glue layer 4 (shown in figures 3 and 4) at positions of a double-layer circuit where bowl holes need to be arranged.
Adopting the traditional circuit board manufacturing process, the single-sided flexible copper-clad plate is processed by the procedures of silk-screen printing circuit anti-corrosion printing ink, baking solidification, etching and film stripping to manufacture a back circuit 5 (as shown in figure 5)
The metal surface of the back circuit 5 and the middle glue layer 4 of the punched single-sided circuit board are attached together in an aligned mode and pressed, bowl holes are formed in the positions of the holes 1.3a and 1.3b, the bottom of each bowl hole is the back circuit 5, the bowl bottom is overlooked from the front, the metal of the back circuit is exposed from the front, and at the bottom of each bowl hole, glue overflowing from the middle glue layer 4 due to pressing is coated on the back circuit 5, and the overflowing amount is larger than 0-0.8 mm (shown in figure 6, figure 7 and figure 8).
At the bowl hole 1.3a, the hole wall is the front-side solder resist 2, the front-side circuit 1, the intermediate insulating layer 3 and the intermediate glue layer 4 when viewed in cross section, and the front-side solder resist 2 is flush with the front-side circuit 1 and the intermediate insulating layer 3 at the hole wall (as shown in fig. 7).
At the bowl hole 1.3b, the hole wall is the front solder resist 2, the intermediate insulation layer 3 and the intermediate glue layer 4 when viewed in cross section, and the front solder resist 2 and the intermediate insulation layer 3 are flush with each other at the hole wall (as shown in fig. 8).
And then, a new bowl hole of the bowl-hole double-sided circuit board is manufactured through the processes of baking and curing, OSP anti-oxidation surface treatment, molding, FQC and the like (as shown in figures 6, 7 and 8).
As shown in fig. 9, the back surface circuit 5 and the back surface insulating layer 6 protrude toward the front surface circuit 1 at the position of the bowl hole 1.3a, and the back surface circuit 5 in the bowl hole 1.3a forms a pad, and the pad on the front surface circuit is used as a reference surface of a plane, that is, the position of the reference line 7.1, and the upper and lower ranges of the plane position of the pad of the back surface circuit opened toward the front surface are lower than the reference surface, not lower than the reference surface by 0.5mm, that is, the position of the reference line 7.3, and higher than the reference surface, not higher than the reference surface by 0.5mm, that is, the position of the reference line 7.2.
According to the invention, the front side is welded on the bowl hole to cover the front side copper, the back side is coated with glue, the front side and the back side are simultaneously punched or drilled, then the back side circuit is adhered and pressed together through the glue layer, the bowl-shaped bottom of the formed bowl hole is the back side copper, the front side copper is not exposed from a top view, the problem of poor appearance of a plurality of steps at the bowl hole is solved, and the poor soldering tin formed by the front side circuit copper and the back side circuit copper in tin grabbing during soldering is solved.
The invention has been described in detail with reference to the accompanying drawings, which illustrate specific embodiments of a novel bowl hole and a method for manufacturing a bowl hole double-sided circuit board. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (9)
1. A method for making new bowl hole on double-sided circuit board of bowl hole includes such steps as etching single-sided copper-clad plate to obtain front circuit, making front solder mask, exposing soldering pad, covering solder mask layer, coating adhesive on back surface to form intermediate adhesive layer, laser carving hole, drilling hole by drilling machine, or punching hole by die, making another single-sided circuit board as back circuit, sticking the back circuit board to the adhesive surface of front circuit board with hole, sticking the back circuit board to adhesive surface with metal facing adhesive surface, pressing the intermediate adhesive layer to the bottom of bowl hole, heating to solidify the adhesive, making new bowl hole on the back circuit of bowl hole, and making bowl hole on the back circuit, weld at the front of pore wall and hinder and the intermediate insulation layer is the parallel and level, and the front circuit is in bowl hole department, sees from the angle of depression and does not expose, and there is back circuit metal to expose at the bottom of the bowl hole from the front angle of depression, and there is the glue film to spill over on hole bottom metal at the bottom of the bowl hole from the front angle of depression, and the volume of spilling is greater than 0mm, is less than or equal to 0.8 mm.
2. A new bowl hole of a bowl hole double-sided circuit board, comprising:
the front solder mask is arranged at the bowl hole;
a front side circuit layer;
an intermediate insulating layer of the hole wall;
the middle glue layer at the bottom of the hole;
a back circuit layer at the bottom of the hole;
a back side insulating layer at the bottom of the hole;
the bowl hole is characterized in that the front side of the bowl hole edge is welded in a welding mode, front side circuit metal covers the bowl hole, the bottom of the bowl hole is a back side circuit layer, a back side circuit is exposed from the front side when the bowl bottom is overlooked from the front side to form a bowl hole welding pad, the front side circuit is not exposed when the bowl bottom is overlooked from the front side, the front side circuit metal is exposed or partially exposed or completely unexposed when the front side circuit metal is seen towards the cross section of the hole wall, an intermediate glue layer overflows from the bottom of the bowl hole to the back side circuit layer, the overflowing amount is larger than 0mm and smaller than or equal to 0.8mm, and the front side welding resistance.
3. A novel bowl hole of a bowl hole double-sided circuit board as claimed in claim 2, characterized in that the back side circuit layer and the back side insulating layer are recessed as viewed from the back side of the circuit board at the position where the bowl hole is formed, the back side circuit in the bowl hole is raised as viewed from the front side of the circuit board, the pad formed by the back side circuit in the bowl hole is upwardly close to the pad of the front side circuit on a plane, the pad surface on the front side circuit is used as a reference plane of the plane, and the up and down range of the pad formed by the back side circuit in the bowl hole and the reference plane is downward lower than the reference plane and is not lower than the reference plane by 0.5mm and upward higher than the reference plane and is not higher than the reference plane by 0.5 mm.
4. A new bowl hole of a bowl hole double-sided circuit board according to claim 1 or 2, characterized in that the front solder mask is an ink solder mask or a cover film solder mask.
5. A new bowl hole of a bowl hole double-sided circuit board according to claim 4, characterized in that the cover film solder mask is PI film or PET film.
6. A new bowl hole of a bowl hole double sided circuit board according to claim 1 or 2, characterized in that said bowl hole pads are pads of soldering elements, tab pads, soldering power line pads.
7. A new bowl hole of a bowl hole double-sided circuit board according to claim 6, wherein on the pad of the soldering component provided with the bowl hole, a part of the leg of the component is soldered to the back side circuit through the bowl hole, and another part of the leg is soldered to the front side circuit, and the front side circuit and the back side circuit are conducted through the component.
8. A new bowl hole of a bowl hole double-sided circuit board according to claim 6, wherein the power line is soldered to the back side circuit through the bowl hole on the soldering power line pad provided with the bowl hole.
9. A novel bowl hole of a bowl hole double-sided circuit board as claimed in claim 6, wherein when the plurality of circuit boards are soldered to each other on the land of the land plate provided with the bowl hole, they are soldered to the back side circuit through the bowl hole to communicate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910524774.7A CN112055463A (en) | 2019-06-07 | 2019-06-07 | Novel bowl hole of bowl hole double-sided circuit board and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910524774.7A CN112055463A (en) | 2019-06-07 | 2019-06-07 | Novel bowl hole of bowl hole double-sided circuit board and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112055463A true CN112055463A (en) | 2020-12-08 |
Family
ID=73609778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910524774.7A Pending CN112055463A (en) | 2019-06-07 | 2019-06-07 | Novel bowl hole of bowl hole double-sided circuit board and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112055463A (en) |
-
2019
- 2019-06-07 CN CN201910524774.7A patent/CN112055463A/en active Pending
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