CN114071893A - Circuit board and processing method thereof - Google Patents
Circuit board and processing method thereof Download PDFInfo
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- CN114071893A CN114071893A CN202010778959.3A CN202010778959A CN114071893A CN 114071893 A CN114071893 A CN 114071893A CN 202010778959 A CN202010778959 A CN 202010778959A CN 114071893 A CN114071893 A CN 114071893A
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- circuit board
- layer
- conductive film
- board
- processed
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
Abstract
The invention discloses a circuit board and a processing method thereof, which comprises the steps of obtaining a circuit board to be processed, perforating a to-be-conducted area of the circuit board to be processed to form a perforated circuit board, attaching a conductive film to the to-be-conducted area of the perforated circuit board, communicating the conductive film with different graphic layers of the perforated circuit board to form a film-attached circuit board, carrying out vacuum press-fitting treatment on the film-attached circuit board to enable the conductive film to be attached in the hole to form a press-fitted circuit board, and carrying out board drying treatment on the press-fitted circuit board to enable the conductive film to be attached in the hole of the circuit board tightly to manufacture the final circuit board. The circuit board manufactured by the technical scheme has uniform surface thickness, the technical problem that the copper thickness of the electroplated surface of the circuit board is not uniform is solved, and the yield of the circuit board is greatly improved.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a circuit board and a processing method thereof.
Background
The circuit board may also be referred to as a circuit board or PCB (printed circuit board). The circuit board has a soldering surface and an element surface which are arranged oppositely. The soldering surface is used for connecting the electronic device by soldering. The component side, which may also be referred to as the device side, is used for mounting electronic devices. In order to meet the functional requirements of bearing and connecting electronic devices, the circuit board generally needs to be processed by corresponding processes. Particularly, as electronic products are developed to be light, thin, high-density and multifunctional, the density of integrated electronic devices on the circuit board is also increasing, and accordingly, the requirements of the surface processing technology of the circuit board are also becoming stricter and diversified.
The circuit board often includes multilayer pattern layer, and the trompil is between a plurality of pattern layers, then communicates each pattern layer, and it is now commonly used that the method of electroplating makes each pattern layer communicate, and the more the pattern layer is, the more the number of times of electroplating is more, but use the mode of electroplating can finally lead to the circuit board face on the copper thickness homogeneity not good, the circuit board yield is very low.
Disclosure of Invention
The invention mainly solves the technical problems that: the problem that the uniformity of the copper thickness on the surface of the circuit board is poor and the yield of the circuit board is low can be caused by electroplating of the circuit board.
In order to solve the technical problems, the invention adopts a technical scheme that: provided is a circuit board processing method, including: acquiring a circuit board to be processed; forming holes in a to-be-conducted area of the circuit board to be processed to form a hole-formed circuit board; attaching a conductive film to a region to be conducted of the perforated circuit board, wherein the conductive film is communicated with different graphic layers of the perforated circuit board to form a film-attached circuit board; carrying out vacuum pressing treatment on the film-pasted circuit board so as to enable the conductive film to be pasted in the hole and form a pressed circuit board; and drying the laminated circuit board to enable the conductive film to be tightly attached to the opening of the laminated circuit board to form the circuit board.
Further, after the step of forming the circuit board with holes by drilling the to-be-conducted region of the circuit board to be processed, the method further comprises the following steps: carrying out pattern etching on at least one surface of the perforated circuit board to form a circuit board with a pattern layer; coating a protective layer on the outer layer of the circuit board with the pattern layer to prevent the outer layer from being oxidized to form a protective circuit board; forming a character mark on one surface of the protection circuit board to form a mark circuit board; plating the surface of the bonding pad of the identification circuit board to form an electroplating circuit board; attaching a conductive film to a region to be conducted of the perforated circuit board, wherein the conductive film is communicated with different graphic layers of the perforated circuit board to form the film-attached circuit board, and the steps of: and attaching a conductive film to the area to be conducted of the electroplated circuit board, wherein the conductive film is communicated with different pattern layers of the electroplated circuit board to form the film-attached circuit board.
Further, the step of forming the perforated circuit board by perforating the to-be-conducted area of the to-be-processed circuit board comprises the step of performing laser drilling of blind holes in the to-be-conducted area of the to-be-processed circuit board to expose the bottom copper foil layer of the to-be-processed circuit board.
And further, the step of forming the perforated circuit board by perforating the to-be-conducted area of the circuit board to be processed comprises the steps of firstly mechanically drilling the middle core board layer of the circuit board in the to-be-conducted area of the circuit board to be processed, then laser drilling blind holes, and exposing the bottom copper foil layer of the circuit board to be processed to form the perforated circuit board.
Further, carry out vacuum pressfitting to the pad pasting circuit board and handle to make the conducting film attached downthehole, the step that forms the pressfitting circuit board includes: heating the film-pasted circuit board to 170-190 ℃ under the pressure of 1.5-3Mpa and keeping for 2-4 minutes to make the conductive film be pasted in the hole to form the pressed circuit board.
Further, the step of drying the pressed circuit board to make the conductive film tightly attached in the opening of the pressed circuit board to form the circuit board comprises: and drying the pressed circuit board at the temperature of 160-170 ℃ for 2-2.5 hours to enable the conductive film to be tightly attached to the inside of the opening of the pressed circuit board, thereby forming the circuit board.
Further, the conductive film includes: thin layer, protective layer and conductive adhesive layer, conductive adhesive layer set up at the lower most floor, and conductive adhesive layer's top sets gradually protective layer and thin layer, and conductive adhesive layer has the viscidity.
Further, the circuit board to be processed is a flexible circuit board to be processed.
There is also provided a circuit board including: the upper layer and the lower layer of the core board are respectively provided with a copper foil layer, and an opening is formed in a region to be conducted of the core board; the conducting film, the marginal part of conducting film is attached on the copper foil layer of the upper strata of core board, and other parts are attached in the trompil and the part that lower floor's copper foil layer exposes in the trompil to the upper strata of intercommunication core board and the copper foil layer of lower floor.
Furthermore, the circuit board is a flexible circuit board, the opening is formed in one core board, and the conductive film conducts the copper foil layers on the upper layer and the lower layer of the same core board; or the hole is arranged on the multilayer core board, and the conductive film is communicated with the copper foil layer of the multilayer core board.
The invention has the beneficial effects that: the method comprises the steps of firstly obtaining a circuit board to be processed, perforating a to-be-conducted area of the circuit board to form a perforated circuit board, attaching a conductive film to the to-be-conducted area of the perforated circuit board, communicating the conductive film with different graphic layers of the perforated circuit board to form a film-attached circuit board, carrying out vacuum press-fitting treatment on the film-attached circuit board to enable the conductive film to be attached in the hole to form a press-fitted circuit board, and carrying out plate drying treatment on the press-fitted circuit board to enable the conductive film to be attached in the perforated hole of the circuit board to manufacture the final circuit board. The circuit board manufactured by the technical scheme has uniform surface thickness, the technical problem of uneven copper thickness on the electroplated surface of the circuit board is solved, and the yield of the circuit board is greatly improved.
Drawings
FIG. 1 is a schematic flow chart of a first embodiment of a circuit board processing method according to the present invention;
FIG. 2 is a schematic flow chart between step S02 and step S03 in FIG. 1;
fig. 3 is a schematic structural diagram of a circuit board to be processed formed by laminating the multilayer core boards in step S02 in fig. 1;
FIG. 4 is a schematic structural diagram of a first embodiment of the wiring board of the present invention;
fig. 5 is a schematic structural diagram of a second embodiment of the wiring board of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be noted that the following examples are only illustrative of the present invention, and do not limit the scope of the present invention. Likewise, the following examples are only some but not all examples of the present invention, and all other examples obtained by those skilled in the art without any inventive step are within the scope of the present invention.
The terms "first", "second" and "third" in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. All directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Fig. 1 is a schematic flow chart of a first embodiment of a circuit board processing method according to the present invention.
And step S01, acquiring the circuit board to be processed.
In this embodiment, the circuit board may be a single-layer core board, a circuit board formed by laminating multiple core boards, or a flexible circuit board.
In step S02, holes are formed in the to-be-conducted region of the to-be-processed circuit board to form a perforated circuit board.
When the circuit board to be processed consists of a single-layer core board, the shape of the circuit board to be processed is processed to form a specified shape, copper foil layers are formed on the upper layer and the lower layer of the circuit board to be processed, the copper foil layers are etched to form pattern layers, and holes need to be formed in order to connect the patterns of the upper layer and the lower layer of the circuit board to be processed. And laser drilling a blind hole in a region to be conducted of the circuit board to be processed, wherein the region to be conducted is a formation region of the blind hole in the embodiment. At first set up the blind hole tin circle along preset laser blind hole position week, blind hole tin circle width is 3 ~ 4mil (mil is thousandth of an inch, and every mil is 0.0254cm), and the laser bores the blind hole and forms the blind hole that the cross-section is trapezoidal on the circuit board, has switched on two-layer figure layer about the core, has formed the trompil circuit board.
When the circuit board to be processed is a circuit board formed by laminating a plurality of layers of core boards, the circuit board to be processed comprises a plurality of core boards with copper foil layers attached to two surfaces, and each copper foil layer is etched with a pattern layer, so that the plurality of pattern layers of the circuit board to be processed are connected in a circuit mode. In the embodiment, the first layer pattern layer to the fourth layer pattern layer of the circuit board to be processed are selected to be connected in a circuit mode. Before the circuit board to be processed is perforated, the core boards of all the graphic layers are not connected through prepregs. Please refer to fig. 3, which is a schematic structural diagram of a to-be-processed circuit board formed by laminating the multi-layer core boards in step S02 in fig. 1. Firstly, a middle core board 5 of the circuit board to be processed needs to be conducted by mechanically drilling between the first graph layer 1 and the third graph layer 3, namely, the core board 5 between the first graph layer 1 and the third graph layer 3 needs to be conducted by mechanically drilling, then the core board 5 between the third graph layer 3 and the fourth graph layer 4 needs to be conducted by laser drilling blind holes, the step of using the laser drilling blind holes is the same as that of the previous embodiment, and the fourth graph layer 4 of the circuit board to be processed is exposed. And then laminating the core boards 5 among the pattern layers by using prepregs to form the perforated circuit board.
In another embodiment, the circuit board to be processed may also be a flexible circuit board, which is widely used in mobile terminal products, and since the board density is higher and the size is smaller, the flexible circuit board often needs to be designed with some blind embedded holes. In order to realize interconnection among a plurality of graphic layers of the flexible circuit board, electroplating is required to be carried out for a plurality of times. Electroplating eventually results in poor uniformity of copper thickness on the board surface and very low board yield. In order to solve the technical problem, in the embodiment, before the flexible printed circuit board is laminated, the intermediate medium material of the flexible printed circuit board is perforated, that is, the blind hole position of the area to be conducted of the flexible printed circuit board is perforated. If the flexible circuit board only has one layer of core board, the flexible circuit board conducts the graphic layers on the upper surface and the lower surface of the core board in a laser blind hole opening mode, and if the flexible circuit board comprises a plurality of layers of core boards, the flexible circuit board is opened in the same mode as the previous embodiment. The conductive film is used for conducting the pattern layers on the upper surface and the lower surface of the flexible circuit board, so that the technical problem that the plated surface of the flexible circuit board is uneven, and the board surface precision is influenced is solved.
And step S03, attaching a conductive film to the to-be-conducted area of the perforated circuit board, wherein the conductive film is communicated with different graphic layers of the perforated circuit board to form the film-attached circuit board.
And (3) forming holes in the to-be-conducted area of the circuit board to be processed to form a hole-formed circuit board, and attaching a layer of conductive film to the to-be-conducted area of the hole-formed circuit board by using a precision instrument. The conducting film comprises the following components in sequence: thin film layer, protective layer and conductive adhesive layer. The conductive adhesive layer is arranged on the lowest layer, and the protective layer and the thin film layer are sequentially arranged above the conductive adhesive layer. Wherein the thin film layer is a white PET (polyethylene terephthalate) layer with the layer thickness of 57 microns, the protective layer is an organic insulating material layer with the layer thickness of 6 microns, the conductive adhesive layer has viscosity, and the layer thickness is 13 microns. In other embodiments, the conductive film can be attached to each hole, and the area of the conductive film is more than 10 times that of the aperture when the conductive film is attached to each hole.
And step S04, carrying out vacuum pressing treatment on the film-pasted circuit board so as to make the conductive film pasted in the hole and form a pressed circuit board.
After the conductive film is attached, vacuum pressing treatment needs to be carried out on the film-attached circuit board to form a pressed circuit board. In a preferred embodiment, the film-attached circuit board is heated to 170-190 ℃ under a pressure of 1.5-3MPa for 2-4 minutes, so that the conductive film is attached to the inner wall of the hole. After the conductive adhesive layer is pressed at high temperature, the conductive layer is compressed to 10 microns from the original 13 microns thickness, and the overall thickness of the formed circuit board is further reduced.
And step S05, performing baking treatment on the pressed circuit board to make the conductive film tightly attached in the open hole of the circuit board to form the circuit board.
And drying the laminated circuit board at the temperature of 160-170 ℃ for 2-2.5 hours to ensure that the conductive film of the laminated circuit board is completely attached to the circuit board. After the drying plate of the pressed circuit board is processed, the electric test processing can be carried out, wherein the electric test processing is used for detecting the conductive condition, the voltage condition and whether the circuit board is short-circuited of the pattern layer on the circuit board. The yield of the circuit board is ensured, and whether the components on the circuit board meet the specification or not and whether the welding is good or not are detected.
In the embodiment, the to-be-conducted area of the to-be-processed circuit board is perforated to form the perforated circuit board, then the to-be-conducted area of the perforated circuit board is attached with the conductive film, the conductive film is communicated with different graphic layers of the perforated circuit board to form the film-attached circuit board, and then the film-attached circuit board is subjected to vacuum press-fitting treatment to form the press-fit circuit board, so that the conductive film is attached in the hole. And finally, carrying out board drying treatment on the pressed circuit board so that the conductive film is attached to the inner wall of the hole. The technical scheme has the advantages that the surface thickness of the manufactured circuit board is uniform, the technical problem of uneven copper thickness of the electroplated surface of the circuit board is solved, and the yield of the circuit board is greatly improved.
In the process of manufacturing the circuit board, other processing steps are often included, and these processing steps determine performance parameters of the circuit board, please refer to fig. 2, which is a schematic flow diagram between step S02 and step S03 in fig. 1.
Step S11, pattern etching is carried out on at least one surface of the perforated circuit board to form a circuit board with a pattern layer.
The outermost pattern layer is formed by etching on the upper surface or the lower surface of the perforated circuit board, specifically, a photosensitive dry film is coated on the surface of the perforated circuit board, and in other embodiments, other photosensitive materials such as photosensitive ink can be coated. And then exposure is carried out, the printing ink or the dry film at the photosensitive part of the perforated circuit board is subjected to polymerization reaction during exposure, finally, the printing ink or the dry film which is photosensitive on the perforated circuit board is not dissolved by the developing solution through a developing machine, and the printing ink or the dry film which is not photosensitive is dissolved and removed in the developing solution, so that the outermost pattern layer is finally formed. In the method of film etching used in this embodiment, other etching methods may be used in other embodiments.
And step S12, coating a protective layer on the outer layer of the circuit board with the pattern layer to prevent the outer layer from being oxidized, and forming the protective circuit board.
And arranging a protective layer on the outer layer of the circuit board with the graphic layer in a coating mode to form a protective circuit board, wherein the protective layer is a green oil layer or a nickel or tin layer in the embodiment, and the protective layer can be other stable protective layers in other embodiments.
And step S13, forming character marks on one surface of the protective circuit board to form a marked circuit board.
The circuit board generally needs to be added with identification characters for identifying the model, performance parameters and manufacturer name of the circuit board, wherein the identification can be performed by etching copper characters, silk-screen printing green oil characters or white oil characters.
And step S14, performing plating treatment on the surface of the bonding pad of the identification circuit board to form the electroplated circuit board.
The circuit board is required to be arranged on the tray after being processed, the circuit board and the tray are welded through the welding disc, wherein the surface of the welding disc is required to be plated, and the plating treatment comprises the step of carrying out tin plating treatment on the surface of the welding disc or coating a layer of anti-oxidation film on the surface of the welding disc.
Can be at the outmost etching figure layer of trompil circuit board through this embodiment, the coating inoxidizing coating and then the protection circuit board, character sign is convenient for trace back of circuit board in the etching, and this embodiment makes the structure of circuit board more complete for the working life of circuit board obtains guaranteeing.
Fig. 4 is a schematic structural diagram of a circuit board according to a first embodiment of the invention.
In this embodiment, the structure of the circuit board is a single-layer core board 8 structure, copper foil layers are attached to the upper surface and the lower surface of the core board 8, the first graphic layer 7 and the second graphic layer 9 are formed on the copper foil layers of the upper surface and the lower surface of the circuit board respectively through etching, in order to enable conduction between the first graphic layer 7 and the second graphic layer 9, a laser drill blind hole is used in a region to be conducted of the circuit board to enable conduction between the first graphic layer 7 and the second graphic layer 9, namely, the core board 8 is drilled through, then a conductive film 6 is attached to the region to be conducted, the edge portion of the conductive film 6 is attached to the first graphic layer 7 of the circuit board, the other portion of the conductive film 6 is attached to the inner wall of the blind hole, and the conductive film 6 connects the first graphic layer 7 and the second graphic layer 9 of the circuit board. The conductive film 6 is tightly attached to the inner wall of the blind hole through high-temperature and high-pressure pressing, and is heated to 170 ℃ for 3 minutes under the pressure of 3Mpa in the embodiment, so that the conductive film 6 is attached to the inner wall of the blind hole, and then the circuit board is dried, and the processing of the circuit board is completed.
Fig. 5 is a schematic structural diagram of a circuit board according to a second embodiment of the invention.
In this embodiment, the circuit board is a four-layer core board structure, and in order to connect the first graphic layer 11 to the fourth graphic layer 17 of the circuit board, the technical scheme adopted in this embodiment is as follows: firstly, drilling holes in to-be-conducted areas of the first core plate 12 and the second core plate 14 by using a mechanical drilling method, attaching copper to the upper surface and the lower surface of the first core plate 12 and the second core plate 14, then drilling blind holes in to-be-conducted areas of the third core plate 16 through the third core plate 16 by using laser drilling to form blind holes, but not drilling copper foil layers on the lower surface of the third core plate 16, and not processing the fourth core plate 18. Then, the copper foil layers on the upper surface and the lower surface of the first core plate 12 are respectively etched to form a first pattern layer 11 and a second pattern layer 13, the second core plate 14 is subjected to copper foil layer removal treatment, the upper surface and the lower surface of the third core plate 16 are respectively etched to form a third pattern layer 15 and a fourth pattern layer 17, the copper foil layer on the upper surface of the fourth core plate 18 is removed, only the copper foil layer on the lower surface of the fourth core plate 18 is etched, and a fifth pattern layer 19 is formed by etching. And then, laminating the first core plate 12, the second core plate 14, the third core plate 16 and the fourth core plate 18 by using prepregs to form a circuit board, wherein the drilled holes of the first core plate 12 and the second core plate 14 correspond to the blind holes of the third core plate 16 up and down, and forming open holes on the circuit board. A layer of conductive film 10 is attached to a region to be conducted of the circuit board, the edge portion of the conductive film 10 is attached to a first graphic layer 11 of the circuit board, the other portion of the conductive film 10 is attached to the inner wall of the opening, and the first graphic layer 11, a second graphic layer 13, a third graphic layer 15 and a fourth graphic layer 17 of the circuit board are connected through the conductive film 10. The conductive film 10 is tightly attached to the inner wall of the opening through high-temperature high-pressure pressing, and in this embodiment, the conductive film 10 is selected to be heated to 170 ℃ under 2Mpa pressure for 3 minutes, so that the conductive film is attached to the inner wall of the opening, and then the circuit board is dried, and the processing of the circuit board is completed.
According to the circuit board provided by the invention, in order to connect the circuits between the target pattern layers of the to-be-conducted area of the circuit board, the middle core board layer is conducted by using a mechanical drilling method, then the last layer of core board is conducted by using a laser drilling method, all the core boards are pressed to form the circuit board, the conductive film is attached to the to-be-conducted area of the circuit board, and the circuits between the target pattern layers are connected.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A circuit board processing method is characterized by comprising the following steps:
acquiring a circuit board to be processed;
forming holes in a to-be-conducted area of the circuit board to be processed to form a hole-formed circuit board;
attaching a conductive film to the region to be conducted of the perforated circuit board, wherein the conductive film is communicated with different graphic layers of the perforated circuit board to form a film-attached circuit board;
carrying out vacuum pressing treatment on the film-pasted circuit board so as to enable the conductive film to be pasted in the hole and form a pressed circuit board;
and carrying out board drying treatment on the pressed circuit board so as to enable the conductive film to be tightly attached to the inside of the opening of the pressed circuit board to form the circuit board.
2. The method for processing a circuit board according to claim 1, wherein the step of forming the hole on the region to be conducted of the circuit board to be processed further comprises:
carrying out pattern etching on at least one surface of the perforated circuit board to form a circuit board with a pattern layer;
coating a protective layer on the outer layer of the circuit board with the pattern layer to prevent the outer layer from being oxidized to form a protective circuit board;
forming a character mark on one surface of the protection circuit board to form a mark circuit board;
plating the surface of the bonding pad of the identification circuit board to form an electroplating circuit board;
attaching a conductive film to the region to be conducted of the perforated circuit board, wherein the conductive film is communicated with different graphic layers of the perforated circuit board to form the film-attached circuit board, and the steps are as follows: and attaching a conductive film to the region to be conducted of the electroplated circuit board, wherein the conductive film is communicated with different graphic layers of the electroplated circuit board to form the film-attached circuit board.
3. The method for processing the circuit board according to claim 1, wherein the step of forming the hole on the region to be conducted of the circuit board to be processed to form the hole-opened circuit board comprises:
and laser drilling blind holes in the area to be conducted of the circuit board to be processed to expose the bottom copper foil layer of the circuit board to be processed.
4. The method for processing the circuit board according to claim 1, wherein the step of forming the hole on the region to be conducted of the circuit board to be processed to form the hole-opened circuit board comprises:
and mechanically drilling a middle core board layer of the circuit board in the to-be-conducted area of the circuit board to be processed, and then laser drilling a blind hole to expose the bottom copper foil layer of the circuit board to be processed so as to form the perforated circuit board.
5. The method for processing a circuit board according to claim 1, wherein the step of performing vacuum lamination processing on the film-attached circuit board to attach the conductive film in the hole to form a laminated circuit board comprises: and heating the film-pasted circuit board to the temperature of 190 ℃ under the pressure of 1.5-3Mpa and keeping the temperature for 2-4 minutes to enable the conductive film to be pasted in the hole to form the pressed circuit board.
6. The method for processing a circuit board according to claim 1, wherein the step of performing baking treatment on the laminated circuit board to make the conductive film tightly attached to the opening of the laminated circuit board to form the circuit board comprises: and drying the pressed circuit board at the temperature of 160-170 ℃ for 2-2.5 hours to enable the conductive film to be tightly attached to the inside of the opening of the pressed circuit board, thereby forming the circuit board.
7. The wiring board processing method according to claim 1, wherein the conductive film comprises: thin layer, protective layer and conductive adhesive layer, conductive adhesive layer sets up at the lower most floor, conductive adhesive layer's top sets gradually the protective layer with the thin layer, conductive adhesive layer has the viscidity.
8. A wiring board processing method according to claims 1 to 7, characterized in that: the circuit board to be processed is a flexible circuit board to be processed.
9. A circuit board, comprising:
the upper layer and the lower layer of the core board are respectively provided with a copper foil layer, and an opening is formed in a region to be conducted of the core board;
and the edge part of the conductive film is attached to the copper foil layer on the upper layer of the core plate, and other parts of the conductive film are attached to the part inside the opening and the part of the lower layer of the copper foil layer exposed in the opening so as to communicate the upper layer of the core plate with the lower layer of the copper foil layer.
10. The wiring board of claim 9, wherein the wiring board is a flexible wiring board, the opening is disposed on a layer of the core board, and the conductive film conducts the copper foil layers on the upper layer and the lower layer of the same core board; or the opening is arranged on the multilayer core board, and the conductive film is communicated with the copper foil layers of the multilayer core board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010778959.3A CN114071893A (en) | 2020-08-05 | 2020-08-05 | Circuit board and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010778959.3A CN114071893A (en) | 2020-08-05 | 2020-08-05 | Circuit board and processing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114071893A true CN114071893A (en) | 2022-02-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010778959.3A Pending CN114071893A (en) | 2020-08-05 | 2020-08-05 | Circuit board and processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114071893A (en) |
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2020
- 2020-08-05 CN CN202010778959.3A patent/CN114071893A/en active Pending
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