JP2006172425A - Holding body of circuit for communication - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a holding body of a circuit for communication capable of reducing an effect on an IC chip by an external force and enabling to manufacture at low cost. <P>SOLUTION: This holding body 10 for the circuit for communication comprises a base material 11 with a first region 11A, second region 11B, third region 11C, and fourth region base material 11D sequentially linked, a circuit 12 arranged in each of the regions, a conductive part 15, and a wiring part 16, and is formed so that the circuit 12 and the wiring part 16 are arranged to electrically connect with each other through the conductive part 15 when the regions are respectively superimposed by folding the base material 11. Opening parts 13, 14 for housing the IC chip electrically connected to contact points 12a, 12b of the circuit 12 are arranged in the second region 11B and the third region 11C when the base material 11 is folded in a W-shape. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a communication circuit holder.

  In recent years, for example, a technology related to a non-contact type medium (such as a non-contact type IC card) called RFID (Radio Frequency Identification) has been rapidly advanced, and its use is also various.

  Such an RFID is manufactured by patterning an antenna on a base material and attaching what is called an inlet having an IC chip mounted thereon to another base material. Many of such RFIDs use a paper material or a film as a base material, and it is desired to improve the strength without affecting the IC chip against bending or the like.

  For example, in such an RFID, it is common to form a loop by winding a plurality of antenna patterns for communication in an inlet made of a base material such as a paper material or a film. It is known to mount an IC chip with pattern lines crossing between contacts via an insulating layer. For example, Patent Document 1 discloses a form and a manufacturing method of such an RFID because the strength of the base material is improved because the IC chip is not sufficiently protected against bending or the like. Yes.

  Patent Document 1 discloses an IC card reinforcing structure, in which an IC chip, a circuit sheet having a circuit pattern formed between two oversheets, and a spacer sheet are embedded via an adhesive layer. It is also shown as a structure in which a reinforcing seal is affixed to the portions where the IC chips on the front and back sides of the entire card are located with an adhesive.

However, since the reinforcing structure of the IC card disclosed in Patent Document 1 attaches a reinforcing seal, the manufacturing process and equipment for that amount are required, resulting in high costs and a reduction in throughput, and the reinforcing seal. There is a problem that the cost of the product increases accordingly.
JP 2000-259804 A

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a communication circuit holder that can reduce the influence of an external force on an IC chip and can be manufactured at low cost.

  The present invention relates to a base material having a plurality of connected regions, a spiral circuit disposed in each region of the base material, two conductive portions penetrating the base material, and a linear wiring portion When the plurality of regions are overlapped by bending the base material, the both ends of the circuit and the both ends of the wiring portion are electrically connected via the conductive portions, respectively. The communication circuit holder is arranged so that the base material is arranged in the first area where the circuit is arranged, the second area where the conducting part is arranged, and the wiring part. The third region and the fourth region are sequentially connected to each other, and when the base material is W-folded, the second region and the third region are electrically connected to the circuit contacts, respectively. Communication circuit holding with an opening for housing the chip To provide.

  According to such a configuration, according to the thickness of the IC chip that is electrically connected to the circuit provided in the first region, the number of regions connected to the second region and the third region is changed, and the first region, By folding the second region, the third region, and the fourth region, the depth of the space formed by the communication between the openings provided in the second region and the third region can be changed. Therefore, it is possible to prevent the IC chip mounted in this space from being damaged due to an external influence.

  The communication circuit holding body having the above-described configuration may include an IC chip that is electrically connected to the contact and mounted in the opening.

  According to such a configuration, an IC card or IC tag with an IC chip built-in can be obtained by making the base material W-folded.

  According to the communication circuit holding body of the present invention, a base material having a plurality of connected regions, a spiral circuit disposed in each region of the base material, and two conductions formed through the base material And a linear wiring portion, and when the plurality of regions are overlapped by bending the base material, both ends of the circuit and both ends of the wiring portion are connected to the conductive portion. A communication circuit holding body disposed so as to be electrically connected via each of the base members, wherein the base material is a second region in which the conductive portion is disposed in a first region in which the circuit is disposed. A region, a third region in which the wiring portion is disposed, and a fourth region are connected in order, and when the base material is W-folded, each of the contact points of the circuit is connected to the second region and the third region. An opening for housing the IC chip that is electrically connected to the Therefore, according to the thickness of the IC chip electrically connected to the circuit provided in the first region, the number of the regions connected to the second region and the third region is changed, and the first region, the first region, By folding the second region, the third region, and the fourth region, the depth of the space formed by communicating the openings provided in the second region and the third region can be changed. Therefore, it is possible to prevent the IC chip mounted in this space from being damaged due to an external influence. In addition, according to the communication circuit holder of the present invention, an IC card or IC tag with an IC chip built-in can be obtained by making the base material W-folded. Can be reduced.

  Hereinafter, a communication circuit holder embodying the present invention and a manufacturing method thereof will be described in detail. The present invention is not limited by the communication circuit holding body and the manufacturing method thereof.

(1) First Embodiment FIG. 1 is a schematic view showing a first embodiment of a communication circuit holding body according to the present invention, where (a) is a plan view and (b) is A of (a). It is sectional drawing which follows the -A line.
In FIG. 1, reference numeral 10 is a communication circuit holder, 11 is a base material, 11A is a first area, 11B is a second area, 11C is a third area, 11D is a fourth area, 12 is a circuit, 12a and 12 are Circuit contacts, 12c and 12d are both ends of the circuit, 13 and 14 are openings, 15 is a conductive portion, 16 is a wiring portion, and 17, 18 and 19 are broken lines.

  The communication circuit holder 10 includes a base material 11 having a first region 11A, a second region 11B, a third region 11C, and a fourth region 11D that are connected to each other, and a surface 11a of the first region 11A of the base material 11. Arranged spiral circuit 12, two conductive portions 15, 15 arranged on one surface 11 a of second region 11 </ b> B of base material 11, and penetrating base material 11, and third region 11 </ b> C of base material 11. It is schematically composed of a linear wiring portion 16 arranged on one surface 11a.

  In this communication circuit holding body 10, when the base 11 is bent, the first region 11A, the second region 11B, the third region 11C, and the fourth region 11D are overlapped with each other at both ends 12c of the circuit 12. 12d and both end portions 16a and 16b of the wiring portion 16 are disposed so as to be electrically connected via the conducting portions 15 and 15, respectively.

  Further, in the communication circuit holding body 10, the base material 11 includes a first region 11A in which the circuit 12 is disposed, a second region 11B in which the conductive portion 15 is disposed, and a third region 11C in which the wiring portion 16 is disposed. The fourth region 11D is connected in order, and when the base material 11 is W-folded, the second region has an opening 13 for accommodating an IC chip electrically connected to the contacts 12a and 12b of the circuit 12. The opening 14 is disposed in the third region 11C.

Each of the openings 13 and 14 is provided so as to penetrate the base material 11 in the thickness direction. In this embodiment, the shape of the openings 13 and 14 is circular when the substrate 11 is viewed from the top surface 11a. However, in the communication circuit holder of the present invention, the shape of the opening is particularly It is not limited. In the communication circuit holder of the present invention, the shape of the opening is not particularly limited as long as the IC chip can be accommodated.
Further, when the first region 11A, the second region 11B, the third region 11C, and the fourth region 11D are overlapped, the opening 13 and the opening 14 form a communication space, and the circuit 12 is included in this space. The contacts 12a and 12b are exposed.

  Furthermore, the space formed by communicating the opening 13 and the opening 14 has a slight gap between the IC chip and the inner surface formed by the opening 13 and the opening 14 when the IC chip is mounted in this space. The size that can be.

  The substrate 11 is not particularly limited, and any substrate can be used. Examples thereof include insulating substrates such as paper materials and resin materials.

  The circuit 12 is a conductor made of a conductive film made of conductive ink, conductive paste, or the like. Examples of the conductive ink and conductive paste forming the conductor forming the circuit 12 include silver powder, gold powder, platinum powder, aluminum powder, palladium, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) The thing which mix | blended the conductive fine particles, such as, with the resin composition is mentioned. Examples of the resin composition that forms the conductive ink and conductive paste include a thermosetting resin composition, a photocurable resin composition, an osmotic drying resin composition, and a solvent volatile resin composition. Further, the thickness of the circuit 12 is not particularly limited, and is appropriately adjusted according to an IC chip connected to the circuit 12.

  Examples of the conductive ink and conductive paste in which the conductive fine particles as described above are blended in the resin composition include, for example, a thermoplastic resin alone or a resin composition in which a thermoplastic resin and a crosslinkable resin are blended (particularly polyester polyol). In addition, 60% by mass or more of conductive fine particles and 10% by mass or more of a polyester resin are blended in a crosslinkable resin and isocyanate, that is, a solvent volatile type or a combined crosslinking / thermoplastic type (however, a thermoplastic type) Is preferably 50% by mass or more).

  Moreover, when the bending resistance is further required in the communication circuit holder 10, a flexibility imparting agent can be blended in the conductive paste. Examples of the flexibility imparting agent include a polyester flexibility imparting agent, an acrylic flexibility imparting agent, a urethane flexibility imparting agent, a polyvinyl acetate flexibility imparting agent, and a thermoplastic elastomer flexibility. Property imparting agent, natural rubber-based flexibility imparting agent, synthetic rubber-based flexibility imparting agent and the like. In the semiconductor device of the present invention, these flexibility imparting agents are used alone or in combination of two or more.

Further, the contacts 12a and 12b and both end portions 12c and 12d of the circuit 12 are made of the same material as the circuit 12 and are formed on the same surface as the circuit 12 (one surface 11a of the base material 11).
The conduction part 15 and the wiring part 16 are formed of the same material as that of the circuit 12.

  In addition, in this embodiment, although the base material 11 which consists of 1st area | region 11A, 2nd area | region 11B, 3rd area | region 11C, and 4th area | region 11D was illustrated, the circuit holder for communication of this invention is not limited to this. . In the communication circuit holder of the present invention, the base material may be provided with a region of n or more (n is a natural number of 5 or more) connected to each other.

That is, in this embodiment, the communication circuit holding body 10 including the base material 11 in which the second region 11B in which the conductive portion 15 is disposed and the third region 11C in which the wiring portion 16 is disposed is illustrated. The communication circuit holder of the present invention is not limited to this. In the communication circuit holding body of the present invention, a region of n (n is a natural number of 1 or more) connected to the first region and the second region may be provided. Moreover, the area | region more than n (n is a natural number of 1 or more) connected may be provided between the 2nd area | region and the 3rd area | region.
In the communication circuit holder of the present invention, n (n is a natural number of 1 or more) or more in both the first region and the fourth region, or in either the first region or the fourth region. These regions may be connected. Further, in the communication circuit holder of the present invention, the base material is a rectangular shape in which the short sides of each region are continuous, and the base material is an L shape in which the short sides or long sides of each region are continuous. It may be.

  In the communication circuit holder of the present invention, for example, as shown in FIG. 2A, the substrate 11 may include a plurality of second regions 11B. Moreover, as shown in FIG.2 (b), the base material 11 may be provided with several 3rd area | region 11C. Further, as shown in FIG. 2C, the base material 11 may include a plurality of fourth regions 11D in which the openings 21 are arranged.

  Moreover, in this embodiment, although the antenna was illustrated as the circuit 12, the circuit holder for communication of this invention is not limited to this. In the communication circuit holding body of the present invention, the circuit may be an electric circuit having no communication function. Moreover, although the coil antenna was illustrated as the circuit 12, the circuit holder for communication of this invention is not limited to this. In the communication circuit holder of the present invention, if electromagnetic induction, a microwave radio wave method is adopted, even if a method such as a pole antenna, a bent pole antenna loop antenna, a loop antenna is adopted, If an electromotive force is obtained, there may be a difference in the shape of the antenna.

  In this embodiment, the adhesive member is not shown in FIGS. 1 and 2, but in the communication circuit board of the present invention, both one side and the other side of the base material, or the base material An adhesive member is provided in advance on either one side or the other side.

  Moreover, in this embodiment, although the circuit holder 10 for communication in which the printing information was not provided in the other surface 11b of the base material 11 was illustrated, the circuit holder for communication of this invention is not limited to this. In the communication circuit holder of the present invention, various print information such as characters, patterns or images may be provided on the other surface of the substrate. Thus, if printing information is provided in advance on the base material constituting the communication circuit holder, it is necessary to apply a laminate on the surface of the communication circuit holder in order to provide printing information such as characters, patterns or images. Therefore, the apparatus and process for that purpose can be reduced.

  Furthermore, in the communication circuit holding body of the present invention, n (n is a natural number of 1 or more) or more in both the first region and the fourth region, or in either the first region or the fourth region. These regions may be connected.

  As described above, according to the communication circuit holder 10, the second region 11B and the third region 11C are connected in accordance with the thickness of the IC chip electrically connected to the circuit 12 provided in the first region 11A. The opening portions 13 and 14 provided in the second region 11B and the third region 11C by folding the first region 11A, the second region 11B, the third region 11C, and the fourth region 11D are changed. You can change the depth of the space that communicates. Therefore, it is possible to prevent the IC chip mounted in this space from being damaged due to an external influence.

  In addition, since the wiring portion 16 of the circuit 12 is provided on the one surface 11a of the third region 11C, it is not necessary to provide an insulating film such as a resist film in order to dispose the wiring portion 16, so that the circuit for communication is held. The thickness of the body 10 does not increase. Moreover, since the wiring part 16 and the circuit 12 can be formed simultaneously, the manufacturing process can be simplified.

(2) Second Embodiment FIG. 3 is a schematic view showing a second embodiment of the communication circuit holder according to the present invention, where (a) is a plan view and (b) is B of (a). It is sectional drawing which follows the -B line.
In FIG. 3, the same components as those of the communication circuit holder 10 shown in FIG.
In FIG. 3, reference numeral 20 denotes an IC chip, and 30 denotes a communication circuit holder.

  The communication circuit holder 30 is electrically connected to the communication circuit holder 10 and the contacts 12a and 12b of the circuit 12, and the first area 11A, the second area 11B, the third area 11C, and the fourth area 11D. Is formed from an IC chip 20 mounted in a space where the opening 13 and the opening 14 communicate with each other.

The IC chip 20 and the circuit 12 are electrically connected to the contacts 12a and 12b provided on the IC chip 20 and the contacts (not shown) of the IC chip 20 via a conductive material (not shown).
Further, it is desirable that the gap between the inner surface of the space formed by the communication between the opening 13 and the opening 14 and the IC chip 20 is as small as possible.

  The IC chip 20 is not particularly limited, and can be a non-contact IC tag, a non-contact IC label, or a non-contact type as long as information can be written and read out in a non-contact state via the circuit 12. Anything applicable to RFID media such as an IC card can be used.

In addition, as a conductive material used for connection between the circuit 12 and the IC chip 20, a conductive paste or solder is used.
Examples of the conductive paste include those similar to the conductive paste that forms the conductor forming the circuit 12.
Although it does not specifically limit as a solder, In order to prevent that the IC chip 20 is destroyed by the heat | fever of a solder at the time of both connection, a low melting-point solder is desirable.

  In addition, in order to electrically connect the circuit 12 and the IC chip 20, an ACF (Anisotropic Conductive Film) method, an ACP (Anisotropic Conductive Paste) method, an NCF (Non Conductive Paste) method, and an NCF (Non Conductive Paste) method are used. A Resin Film (non-conductive particle film) method, an NCP (Non Conductive Resin Paste) method, or the like can also be used.

  As described above, according to the communication circuit holding body 30, the first region 11A, the second region 11B, the third region 11C, and the fourth region 11D are overlapped along the fold lines 19, 20, 21 to form the base material. By making 11 a W-fold, it is possible to easily obtain an IC card or IC tag in which the IC chip 20 is built.

(3) Third Embodiment FIG. 4 is a schematic view showing a third embodiment of the communication circuit holding body according to the present invention, where (a) is a plan view and (b) is a diagram C of (a). It is sectional drawing which follows the -C line.
4, the same components as those of the communication circuit holding body 10 shown in FIG. 1 and the communication circuit holding body 30 shown in FIG. 3 are denoted by the same reference numerals, and the description thereof is omitted.
The communication circuit holder 40 of this embodiment is formed by W-folding the base material 11 of the communication circuit holder 30 described above.

  In the communication circuit holder 40, the opening 13 and the opening 14 communicate with each other to form one space, and the IC chip 20 is accommodated in this space. There is a slight gap between the IC chip 20 and the space formed by the opening 13 and the opening 14. In particular, the gap between the IC chip 20 and the fourth region 11D causes the IC chip 20 to be damaged or the function of the IC chip 20 to be impaired even if an external force is applied to the communication circuit holder 40. The size is such that can be prevented.

  Furthermore, both end portions 12c and 12d of the circuit 12 and both end portions 16a and 16b of the wiring portion 16 are connected to the conduction portion 15 and the through portion 15a penetrating the second region 11B of the substrate 11 in the thickness direction, and the base. They are electrically connected via a conductor 41 formed in a through portion formed by communicating a through portion 16c that penetrates the third region 11C of the material 11 in the thickness direction. Note that the conductor 41 has both the end portions 16a and 16b of the conductive portion 15 and the wiring portion 16 due to the pressure applied when the first region 11A, the second region 11B, the third region 11C, and the fourth region 11D are stacked. A conductive member such as a conductive ink or conductive paste is press-fitted into the penetrating portion 15a and the penetrating portion 16c and is integrally formed.

In order to form the communication circuit holder 40 by stacking the first region 11A, the second region 11B, the third region 11C, and the fourth region 11D, an adhesive member is provided on each surface to be overlapped with each other. Is provided.
As such an adhesive member, one made of a non-peelable pressure-sensitive adhesive that is difficult to peel or cannot be peeled after sticking is used. As such a non-peelable pressure-sensitive adhesive, those conventionally used as conventional pressure-sensitive adhesives are used, and among them, an adhesive having a peeling force of 220 gf / 25 mm or more can be mentioned. Examples of such a non-peelable pressure sensitive adhesive include natural rubber latex obtained by graft copolymerization of styrene and methyl methacrylate with natural rubber. This natural rubber latex is an adhesive suitable for the inlet member of the present invention in terms of blocking resistance, heat resistance, abrasion resistance, and the like.

  Thus, according to the communication circuit holder 40, the circuit 12 is covered with the first region 11A and the second region 11B of the base material 11 except for the contact points 12a and 12b. The circuit 12 is unlikely to be damaged due to the influence from the above. Further, since the wiring portion 16 is provided on the surface of the third region 11C that is in contact with the second region 11B, it is necessary to provide an insulating film such as a resist film in the third region 11C in order to arrange the wiring portion 16. Therefore, the communication circuit holder 40 does not increase in thickness.

  In this embodiment, when the base material 11 is W-folded, communication in which print information is not provided on the outer surface of the first region 11A of the base material 11 and the outer surface of the fourth region 11D. Although the circuit holder 40 for communication was illustrated, the circuit holder for communication of this invention is not limited to this. In the communication circuit holder of the present invention, both the outer surface of the first region of the substrate and the outer surface of the fourth region, or the outer surface of the first region of the substrate, or The printing information may be provided on any one of the outer surfaces of the fourth region.

(4) Manufacturing method in 1st, 2nd, and 3rd embodiment Next, FIGS.
An example of a method for manufacturing a communication circuit holder according to the present invention will be described with reference to FIG.
5 and 6 are schematic perspective views showing an example of a method for manufacturing a communication circuit holder according to the present invention.
5-11, the same code | symbol is attached | subjected to the component same as the circuit holder 10 for communication shown in FIGS. 1-4, and the description is abbreviate | omitted.

  First, the opening 13 and the through portion 15a penetrating the base material 11 in the thickness direction are formed at predetermined positions of the second region 11B forming the base material 11, and the base material is formed at predetermined positions of the third region 11C. 11 and the penetration part 16c which penetrate through 11 in the thickness direction are formed (refer Fig.5 (a)).

  In this step, the opening 13 and the opening 14 are large enough to accommodate the IC chip in the subsequent step, that is, in one space formed by communicating the opening 13 and the opening 14. When an IC chip is mounted on the IC chip, the gap is formed so as to have a slight gap between the space and the IC chip.

  Next, the circuit 12 having a predetermined thickness and a predetermined pattern is provided on the one surface 11a of the first region 11A, and the conductive portion 15 is provided on the one surface 11a of the second region 11B so as to overlap the through portion 15a. The wiring portion 16 is provided on the one surface 11a of the third region 11C so as to overlap the through portion 16c (see FIG. 5B).

  In this step, conductive ink or conductive paste is printed on the one surface 11a of the first region 11A by a screen printing method so as to have a predetermined thickness and a predetermined antenna pattern. The conductive paste is dried and cured to form a circuit 12 having a predetermined thickness and a predetermined pattern. Similarly, a conductive ink or a conductive paste is printed on the one surface 11a of the second region 11B by a screen printing method so as to have a predetermined thickness and a predetermined conductive portion pattern. The conductive paste is dried and cured to form a conductive portion 15 having a predetermined thickness and a predetermined pattern. Further, conductive ink or conductive paste is printed on the one surface 11a of the third region 11C by a screen printing method so as to have a predetermined thickness and a predetermined wiring portion pattern. The paste is dried and cured to form a wiring portion 16 having a predetermined thickness and a predetermined pattern.

  Next, the IC chip 20 is mounted on the contacts 12a and 12b of the circuit 12 via a conductive material made of conductive paste or solder, and the IC chip 20 and the circuit 12 are electrically connected (see FIG. 5C). ).

Subsequently, in each area | region of the base material 11, an adhesive member is provided in the surface to mutually overlap.
Preferably, a pressure sensitive adhesive,
Subsequently, the base material 11 is W-folded along the fold lines 17, 18, and 19 (see FIGS. 6A and 6B).
In this step, the opening 13 and the opening 14 overlap and communicate with each other to form one space, the IC chip 20 is disposed in this space, and both ends 12c and 12d of the circuit 12 and the wiring portion 16 are The base material 11 is W-folded so as to overlap with each other via the conductive portion 15.

  Next, as shown in FIG. 7, in a state where the base material 11 is W-folded, a predetermined pressure is applied to the base material 11 with a pressure roller or the like, whereby the first region 11 </ b> A, the second region 11 </ b> B, and the third region 11 </ b> C. In addition, the fourth region 11D is crimped, and the through-hole 15a and the through-hole 16c of the base material 11 are filled with the conductive ink and the conductive paste forming the both ends 16a and 16b of the conductive portion 15 and the wiring portion 16. Thus, the conductor 42 is formed, the both ends 12c and 12d of the circuit 12 and the both ends 16a and 16b of the wiring portion 16 are electrically connected via the conducting portion 15 and the conductor 42, and the communication circuit A holding body 40 is obtained.

In this step, the conductive ink and conductive paste forming the both ends 16a and 16b of the conductive portion 15 and the wiring portion 16 are cured, but this conductive ink and conductive paste are applied by a pressure roller or the like. It press-fits in each of the penetration part 15a and the penetration part 16c.
Bonding and joining at the same time,
Although omitted, the entire surface of the substrate, at least the surface facing it, is all completed in one step.

  Furthermore, as shown in FIG. 8, the conductive ink which makes the conduction | electrical_connection part 15 and the wiring part 16 so that the penetration part 15a may be covered on the surface on the opposite side to the surface in which the conduction | electrical_connection part 15 of the 2nd area | region 11B is provided. If the conductive material 43 is provided by applying or dripping the conductive paste, the conductive material 43 flows into the through portion 15a and the through portion 16c by applying pressure by the pressure roller. The electrical connection between 12c and 12d and both end portions 16a and 16b of the wiring portion 16 can be made more reliable.

  In the present invention, the following method can also be applied as a method of electrically connecting the circuit 12 and the wiring portion 16.

  For example, as shown in FIG. 9, the second region 11 </ b> B of the base material 11 provided with the conduction portion 15 is placed on the fixed base 100. At this time, the second region 11B is placed on the fixed base 100 so that the penetration portion 15a is overlapped with the penetration portion 100a that is along the thickness direction of the fixation base 100 and has a larger inner diameter than the penetration portion 15a of the second region 11B. Place.

Then, the inside of the penetrating part 15a is sucked by the vacuum pump or the like through the penetrating part 100a, and the conductive ink or conductive paste forming the conducting part 15 is drawn into the penetrating part 15a. The conductive paste is filled in the through portion 15a. This method can be applied before or after the conductive ink or conductive paste is cured, but the conductive ink or conductive paste is likely to flow into the through portion 15a. It is desirable to apply before the conductive ink or conductive paste is cured.
Further, the present invention can be applied to the case where the penetrating portion 16c is filled with conductive ink or conductive paste forming the wiring portion 16.

  Further, as shown in FIG. 10, the cross-sectional shape of the through portion 15a of the second region 11B may be a tapered shape in which the inner diameter gradually decreases from the one surface 11a toward the opposite surface. In this way, when pressure is applied by the pressure roller, the conductive ink or conductive paste forming the conductive portion 15 easily flows into the through portion 15a.

  Further, as shown in FIG. 11, if the inner diameter of the penetrating portion 15a of the second region 11B is made larger than the inner diameter of the penetrating portion 16c of the third region 11C, the second region 11B and the third region 11C are overlapped. In the combined state, when pressure is applied by the pressure roller, the conductive ink or conductive paste forming the conductive portion 15 easily flows into the through portion 15a. In the present invention, the inner diameter of the penetrating portion in the third region may be larger than the inner diameter of the penetrating portion in the second region.

  In this embodiment, after the circuit 12, the opening 13, the conduction part 15, the wiring part 16, etc. are provided on the base material 11, an adhesive member is provided on the surface of the base material 11 that overlaps each other. Although the manufacturing method for forming the communication circuit holder 40 is illustrated, the method for manufacturing the communication circuit holder of the present invention is not limited to this. In the method for manufacturing a communication circuit holder according to the present invention, a circuit, an opening, a conduction part, a wiring part, and the like may be formed on a base material provided with an adhesive member on one surface in advance. In this way, an adhesive member is provided in advance on one surface of the base material, the base material is stored, and the base material can be supplied as necessary, so that waste can be saved. In addition, since it is possible to form the circuit, the opening, the conductive portion, the wiring portion, and the like at high speed, as a result, the manufacturing of the communication circuit holder can be speeded up and the manufacturing efficiency can be improved.

  As described above, according to the method for manufacturing a communication circuit holder of this embodiment, the conventional manufacturing process can be reduced easily by using a combination of conventional devices without using a device having a complicated mechanism. In addition, the communication circuit holder can be manufactured at low cost.

As described above, when a plurality of base materials are provided so as to overlap each other through an adhesive member so as to generate two or more adhesive surfaces, the following three methods are exemplified.
1. Each adhesive member is made of a different adhesive material. When it is difficult or impossible to peel, an adhesive material that can be strongly bonded is used.
When re-peeling is possible, an adhesive material that can be weakly bonded is used.
2. Each adhesive member is formed of the same adhesive material and has a different thickness.
When peeling is difficult or impossible, the adhesive material is formed thick.
When re-peeling is possible, a thin adhesive material is formed.
3. Each adhesive member is formed of the same adhesive material, and the pressing force at the time of sticking is made different.
If it is difficult to peel or cannot be peeled off, the pressure is increased when sticking.
When making it possible to peel again, the pressing force at the time of sticking is weakened and sticking.

In particular, each adhesive member is made of the same adhesive material, and by changing the pressing force at the time of sticking, an adhesive member that is difficult or impossible to peel after sticking and an adhesive member that can be peeled off again after sticking are formed If you want to
(1) First, the same adhesive member is formed with the same thickness.
(2) Next, the adhesive members that can be re-peeled after bonding are pressed together with a strong pressing force and bonded together.
(3) Then, the adhesive members that can be re-peeled after bonding are pressed together with a weak pressing force and bonded together.
By this procedure, for example, when three base materials A, B, and C are sequentially stacked, the base material A and the base material B can be re-peeled, and the base material B and the base material C are difficult to peel or cannot be peeled. can do.

  The communication circuit holder of the present invention is mainly used as an inlet or the like built in a card or the like, but if it is formed in the same shape as the card and printed on its surface, it is a non-contact type as it is It can be used as an IC card.

It is the schematic which shows 1st embodiment of the circuit holding body for communication which concerns on this invention, (a) is a top view, (b) is sectional drawing which follows the AA line of (a). It is a schematic plan view which shows other embodiment of the circuit holder for communication which concerns on this invention. It is the schematic which shows 2nd embodiment of the circuit holding body for communication which concerns on this invention, (a) is a top view, (b) is sectional drawing which follows the BB line of (a). It is the schematic which shows 3rd embodiment of the circuit holder for communication which concerns on this invention, (a) is a top view, (b) is sectional drawing which follows the CC line of (a). It is a schematic perspective view which shows an example of the manufacturing method of the circuit holder for communication which concerns on this invention. It is a schematic perspective view which shows an example of the manufacturing method of the circuit holder for communication which concerns on this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the circuit holding body for communication which concerns on this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the circuit holding body for communication which concerns on this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the circuit holding body for communication which concerns on this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the circuit holding body for communication which concerns on this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the circuit holding body for communication which concerns on this invention.

Explanation of symbols

10, 30, 40 ... circuit holder for communication, 11 ... base material, 11A ... first region, 11B ... second region, 11C ... third region, 11D ... first Four regions, 12 ... circuit, 12a, 12b ... contact, 12c, 12d ... both ends, 13, 14 ... opening, 15 ... conducting part, 16 ... wiring part, 17 , 18, 19 ... broken line, 20 ... IC chip.

Claims (2)

A base material having a plurality of connected regions, a spiral circuit disposed in each region of the base material, two conductive portions penetrating the base material, and a linear wiring portion, By bending the base material, when the plurality of regions are overlapped, both ends of the circuit and both ends of the wiring portion are arranged so as to be electrically connected via each of the conductive portions. A communication circuit holding body provided,
In the base material, the first region where the circuit is arranged, the second region where the conductive portion is arranged, the third region where the wiring portion is arranged, and the fourth region are connected in order,
When the substrate is W-folded, the second region and the third region are provided with openings for accommodating IC chips that are electrically connected to the contact points of the circuit, respectively. A circuit holding body for communication characterized. 2. The communication circuit holder according to claim 1, further comprising an IC chip electrically connected to the contact and mounted in the opening.

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