JP4777016B2 - Communication circuit holder - Google Patents

Description

  The present invention relates to a communication circuit holder.

  In recent years, for example, a technology related to a non-contact type medium (such as a non-contact type IC card) called RFID (Radio Frequency Identification) has been rapidly advanced, and its use is also various.

  Such an RFID is manufactured by patterning an antenna on a base material and attaching what is called an inlet having an IC chip mounted thereon to another base material. Many of such RFIDs use a paper material or a film as a base material, and it is desired to improve the strength without affecting the IC chip against bending or the like.

  For example, in such an RFID, it is common to form a loop by winding a plurality of antenna patterns for communication in an inlet made of a base material such as a paper material or a film. It is known to mount an IC chip with pattern lines crossing between contacts via an insulating layer. For example, Patent Document 1 discloses a form and a manufacturing method of such an RFID because the strength of the base material is improved because the IC chip is not sufficiently protected against bending or the like. Yes.

  Patent Document 1 discloses an IC card reinforcing structure, in which an IC chip, a circuit sheet having a circuit pattern formed between two oversheets, and a spacer sheet are embedded via an adhesive layer. It is also shown as a structure in which a reinforcing seal is affixed to the portions where the IC chips on the front and back sides of the entire card are located with an adhesive.

However, since the reinforcing structure of the IC card disclosed in Patent Document 1 attaches a reinforcing seal, the manufacturing process and equipment for that amount are required, resulting in high costs and a reduction in throughput, and the reinforcing seal. There is a problem that the cost of the product increases accordingly.
JP 2000-259804 A

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a communication circuit holder that can reduce the influence of an external force on an IC chip and can be manufactured at a low cost and in a large amount at high speed. To do.

The present invention includes a base material having a plurality of connected regions, a spiral circuit disposed in each region of the base material, two conductive portions penetrating the base material, and a linear wiring portion. When the plurality of regions are overlapped by bending the base material, both ends of the circuit and both ends of the wiring portion are electrically connected via the conductive portions, respectively. The communication circuit holder is arranged as described above, wherein the base material has the second region in which the conductive portion is disposed and the wiring portion in the first region in which the circuit is disposed. When the third region is sequentially connected, the wiring portion is provided so as to overlap with the conductor penetrating the third region when the base is Z-folded, and when the base is Z-folded An IC chip electrically connected to the contact of the circuit in the second region; Ri Na by arranging an opening for pay, when the substrate was folded Z, both end portions of the both end portions and the wiring portions of the circuit, the conductor and passing through the second region second providing communication circuit holder that will be electrically connected via a conductor passing through the third region.

  According to such a configuration, the IC chip is arranged in the opening by mounting the IC chip in the first region of the base material and sequentially superimposing the first region, the second region, and the third region. Can be easily formed. Therefore, it is possible to prevent the IC chip mounted in the opening from being damaged due to an external influence. In addition, since the circuit and the wiring part are arranged on one surface of the base material, it is not necessary to provide an insulating film such as a resist film in the third region in order to arrange the wiring part. The thickness does not increase.

  The present invention provides a communication circuit holder having an IC chip electrically connected to the contact and mounted in the opening.

  According to such a configuration, an IC card or IC tag in which an IC chip is built in can be obtained by sequentially superimposing the first area, the second area, and the third area on the communication circuit holder.

  According to the communication circuit holding body of the present invention, a base material having a plurality of connected regions, a spiral circuit disposed in each region of the base material, and two conductions formed through the base material And a linear wiring portion, and when the plurality of regions are overlapped by bending the base material, both ends of the circuit and both ends of the wiring portion are respectively connected to the conductive portion. A communication circuit holder disposed so as to be electrically connected via a first region where the circuit is disposed and a second region where the conductive portion is disposed And the third region where the wiring part is arranged are sequentially connected, and when the base material is Z-folded, an IC chip electrically connected to the contact of the circuit is stored in the second region. For this reason, the communication circuit holder is thick. Rukoto is not. In addition, according to the communication circuit holder of the present invention, it is easy to produce a communication circuit holder having an IC chip built in, and thus the manufacturing cost of the communication circuit holder can be reduced.

  In addition, according to the communication circuit holder of the present invention, the communication circuit holder is overlapped with the first area, the second area, and the third area in order, so that the IC card or IC tag with the built-in IC chip is provided. Can be obtained.

  Hereinafter, a communication circuit holder embodying the present invention and a manufacturing method thereof will be described in detail. The present invention is not limited by the communication circuit holding body and the manufacturing method thereof.

(1) First Embodiment FIG. 1 is a schematic view showing a first embodiment of a communication circuit holding body according to the present invention, where (a) is a plan view and (b) is A of (a). It is sectional drawing which follows the -A line.
In FIG. 1, reference numeral 10 is a communication circuit holder, 11 is a substrate, 11A is a first region, 11B is a second region, 11C is a third region, 12 is a circuit, 12a and 12b are circuit contacts, 12c, 12d represents both ends of the circuit, 13 represents an opening, 14 represents a conducting portion, 15 represents a wiring portion, and 16 and 17 represent broken lines.

  The communication circuit holder 10 includes a base material 11 having a first region 11A, a second region 11B, and a third region 11C that are connected to each other, and a spiral shape that is disposed on one surface 11a of the first region 11A of the base material 11. Circuit 12, disposed on one surface 11 a of the second region 11 </ b> B of the base material 11, two conductive portions 14, 14 penetrating the base material 11, and disposed on the one surface 11 a of the third region 11 </ b> C of the base material 11. And a straight wiring portion 15.

  In this communication circuit holder 10, when the first region 11A, the second region 11B, and the third region 11C are overlapped by bending the base material 11, both ends 12c and 12d of the circuit 12 and the wiring portion The both ends 15a and 15b of 15 are arrange | positioned so that it may electrically connect via each of the conduction | electrical_connection parts 14 and 14. FIG.

  In the communication circuit holder 10, the base material 11 is formed in the first region 11 </ b> A where the circuit 12 is disposed, the second region 11 </ b> B where the conductive portion 14 is disposed, and the third region 11 </ b> C where the wiring portion 15 is disposed. Are sequentially connected, and when the base 11 is Z-folded, an opening 13 for accommodating an IC chip electrically connected to the contacts 12a and 12b of the circuit 12 is provided in the second region 11B. ing.

The opening part 13 is provided so that the base material 11 may be penetrated in the thickness direction. In this embodiment, the shape of the opening 13 is circular when the substrate 11 is viewed from the top surface 11a. However, in the communication circuit holder of the present invention, the shape of the opening is not particularly limited. . In the communication circuit holder of the present invention, the shape of the opening is not particularly limited as long as the IC chip can be accommodated.
The opening 13 has such a size that a slight gap is formed between the inner surface formed by the opening 13 and the IC chip when an IC chip is mounted therein.

  The substrate 11 is not particularly limited, and any substrate can be used. Examples thereof include insulating substrates such as paper materials and resin materials.

  The circuit 12 is a conductor made of a conductive film made of conductive ink, conductive paste, or the like. Examples of the conductive ink and conductive paste forming the conductor forming the circuit 12 include silver powder, gold powder, platinum powder, aluminum powder, palladium, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) The thing which mix | blended the conductive fine particles, such as, with the resin composition is mentioned. Examples of the resin composition that forms the conductive ink and conductive paste include a thermosetting resin composition, a photocurable resin composition, an osmotic drying resin composition, and a solvent volatile resin composition. Further, the thickness of the circuit 12 is not particularly limited, and is appropriately adjusted according to an IC chip connected to the circuit 12.

  Examples of the conductive ink and conductive paste in which the conductive fine particles as described above are blended in the resin composition include, for example, a thermoplastic resin alone or a resin composition in which a thermoplastic resin and a crosslinkable resin are blended (particularly polyester polyol). In addition, 60% by mass or more of conductive fine particles and 10% by mass or more of a polyester resin are blended in a crosslinkable resin and isocyanate, that is, a solvent volatile type or a combined crosslinking / thermoplastic type (however, a thermoplastic type) Is preferably 50% by mass or more).

  Moreover, when the bending resistance is further required in the communication circuit holder 10, a flexibility imparting agent can be blended in the conductive paste. Examples of the flexibility imparting agent include a polyester flexibility imparting agent, an acrylic flexibility imparting agent, a urethane flexibility imparting agent, a polyvinyl acetate flexibility imparting agent, and a thermoplastic elastomer flexibility. Property imparting agent, natural rubber-based flexibility imparting agent, synthetic rubber-based flexibility imparting agent and the like. In the semiconductor device of the present invention, these flexibility imparting agents are used alone or in combination of two or more.

Further, the contacts 12a and 12b and both end portions 12c and 12d of the circuit 12 are made of the same material as the circuit 12 and are formed on the same surface as the circuit 12 (one surface 11a of the base material 11).
The conduction part 14 and the wiring part 15 are formed of the same material as the circuit 12.

  In addition, in this embodiment, although the base material 11 which consists of 1st area | region 11A, 2nd area | region 11B, and 3rd area | region 11C was illustrated, the circuit holder for communication of this invention is not limited to this. In the communication circuit holder of the present invention, the base material may be provided with a region of n or more (n is a natural number of 4 or more) connected to each other.

That is, in this embodiment, the communication circuit holding body 10 including the base material 11 in which the second region 11B in which the conductive portion 14 is disposed and the third region 11C in which the wiring portion 15 is disposed is illustrated. The communication circuit holder of the present invention is not limited to this. In the communication circuit holding body of the present invention, a region of n (n is a natural number of 1 or more) connected to the first region and the second region may be provided. Moreover, the area | region more than n (n is a natural number of 1 or more) connected may be provided between the 2nd area | region and the 3rd area | region.
In the communication circuit holder of the present invention, n (n is a natural number of 1 or more) or more in both the first region and the third region, or in either the first region or the third region. These regions may be connected. Further, in the communication circuit holder of the present invention, the base material is a rectangular shape in which the short sides of each region are continuous, and the base material is an L shape in which the short sides or long sides of each region are continuous. It may be.

  In the communication circuit holder of the present invention, for example, as shown in FIG. 2A, the substrate 11 may include a plurality of second regions 11B. Moreover, as shown in FIG.2 (b), the base material 11 may be provided with several 3rd area | region 11C by which the opening part 21 is arrange | positioned. Further, as shown in FIG. 2C, the base 11 may be connected to a region 11D in which any of the opening portion, the conductive portion, and the wiring portion is not arranged. For example, the region 11D can be peeled off. It may be connected to.

  Moreover, in this embodiment, although the antenna was illustrated as the circuit 12, the circuit holder for communication of this invention is not limited to this. In the communication circuit holding body of the present invention, the circuit may be an electric circuit having no communication function. Moreover, although the coil antenna was illustrated as the circuit 12, the circuit holder for communication of this invention is not limited to this. In the communication circuit holder of the present invention, if electromagnetic induction, a microwave radio wave method is adopted, even if a method such as a pole antenna, a bent pole antenna loop antenna, a loop antenna is adopted, If an electromotive force is obtained, there may be a difference in the shape of the antenna.

  In this embodiment, the adhesive member is not shown in FIGS. 1 and 2, but in the communication circuit board of the present invention, both one side and the other side of the base material, or the base material An adhesive member is provided in advance on either one side or the other side.

  Moreover, in this embodiment, although the circuit holder 10 for communication in which the printing information was not provided in the other surface 11b of the base material 11 was illustrated, the circuit holder for communication of this invention is not limited to this. In the communication circuit holder of the present invention, various print information such as characters, patterns or images may be provided on the other surface of the substrate. Thus, if printing information is provided in advance on the base material constituting the communication circuit holder, it is necessary to apply a laminate on the surface of the communication circuit holder in order to provide printing information such as characters, patterns or images. Therefore, the apparatus and process for that purpose can be reduced.

  Furthermore, in the communication circuit holding body of the present invention, n (n is a natural number of 1 or more) or more in both the first region and the third region, or in either the first region or the third region. These regions may be connected. Further, in the communication circuit holder of the present invention, the base material is a rectangular shape in which the short sides of each region are continuous, and the base material is an L shape in which the short sides or long sides of each region are continuous. It may be.

  As described above, according to the communication circuit holder 10, the second region 11B and the third region 11C are connected in accordance with the thickness of the IC chip electrically connected to the circuit 12 provided in the first region 11A. The depth of the opening 13 provided in the second region 11B can be changed by folding the first region 11A, the second region 11B, and the third region 11C by changing the number of regions to be changed. Therefore, it is possible to prevent the IC chip mounted in the opening 13 from being damaged due to an external influence.

  In addition, since the wiring portion 15 of the circuit 12 is provided on the one surface 11a of the third region 11C, it is not necessary to provide an insulating film such as a resist film in order to dispose the wiring portion 15. The thickness of the body 10 does not increase. Moreover, since the wiring part 15 and the circuit 12 can be formed simultaneously, a manufacturing process can be simplified.

(2) Second Embodiment FIG. 3 is a schematic view showing a second embodiment of the communication circuit holder according to the present invention, where (a) is a plan view and (b) is B of (a). It is sectional drawing which follows the -B line.
In FIG. 3, the same components as those of the communication circuit holder 10 shown in FIG.
In FIG. 3, reference numeral 20 denotes an IC chip, and 30 denotes a communication circuit holder.

  The communication circuit holder 30 is electrically connected to the communication circuit holder 10 and the contacts 12a and 12b of the circuit 12, and folds the first region 11A, the second region 11B, and the third region 11C. Thus, the IC chip 20 is roughly configured to be mounted in the opening 13.

The IC chip 20 and the circuit 12 are electrically connected to the contacts 12a and 12b provided on the IC chip 20 and the contacts (not shown) of the IC chip 20 via a conductive material (not shown).
Further, it is desirable that the gap between the inner surface of the opening 13 and the IC chip 20 is as small as possible.

  The IC chip 20 is not particularly limited, and can be a non-contact IC tag, a non-contact IC label, or a non-contact type as long as information can be written and read out in a non-contact state via the circuit 12. Anything applicable to RFID media such as an IC card can be used.

In addition, as a conductive material used for connection between the circuit 12 and the IC chip 20, a conductive paste or solder is used.
Examples of the conductive paste include those similar to the conductive paste forming the conductor forming the circuit 12.
Although it does not specifically limit as a solder, In order to prevent that the IC chip 20 is destroyed by the heat | fever of a solder at the time of both connection, a low melting-point solder is desirable.

  In addition, in order to electrically connect the circuit 12 and the IC chip 20, an ACF (Anisotropic Conductive Film) method, an ACP (Anisotropic Conductive Paste) method, an NCF (Non Conductive Paste) method, A Resin Film (non-conductive particle film) method, an NCP (Non Conductive Resin Paste) method, or the like can also be used.

  As described above, according to the communication circuit holding body 30, the first region 11A, the second region 11B, and the third region 11C are overlapped along the folding lines 16 and 17, and the base material 11 is Z-folded. Thus, an IC card or IC tag in which the IC chip 20 is built can be easily obtained.

(3) Third Embodiment FIG. 4 is a schematic view showing a third embodiment of the communication circuit holding body according to the present invention, where (a) is a plan view and (b) is a diagram C of (a). It is sectional drawing which follows the -C line.
4, the same components as those of the communication circuit holding body 10 shown in FIG. 1 and the communication circuit holding body 30 shown in FIG. 3 are denoted by the same reference numerals, and the description thereof is omitted.
The communication circuit holder 40 of this embodiment is formed by Z-folding the base material 11 of the communication circuit holder 30 described above.

  In the communication circuit holder 40, the IC chip 20 is accommodated in the opening 13. A slight gap is formed between the IC chip 20 and the inner surface of the opening 13. In particular, the gap between the IC chip 20 and the third region 11C may damage the IC chip 20 or impair the function of the IC chip 20 even if an external force is applied to the communication circuit holder 40. The size is such that can be prevented.

  Furthermore, both end portions 12c and 12d of the circuit 12 and both end portions 15a and 15b of the wiring portion 15 are connected to the conduction portion 14 and the through portion 14a penetrating the second region 11B of the substrate 11 in the thickness direction, It is electrically connected via a conductor 41 formed in a through portion formed by communicating a through portion 15c that penetrates the third region 11C of the material 11 in the thickness direction. The conductor 41 is a conductive ink that forms both ends 15a and 15b of the conductive portion 14 and the wiring portion 15 by the pressure applied when the first region 11A, the second region 11B, and the third region 11C are stacked. And a conductive member such as a conductive paste is press-fitted into the through portion 14a and the through portion 15c and integrated.

In order to form the communication circuit holding body 40 by stacking the first area 11A, the second area 11B, and the third area 11C, an adhesive member is provided on each area so as to overlap each other.
As such an adhesive member, one made of a non-peelable pressure-sensitive adhesive that is difficult to peel or cannot be peeled after sticking is used. As such a non-peelable pressure-sensitive adhesive, those conventionally used as conventional pressure-sensitive adhesives are used, and among them, an adhesive having a peeling force of 220 gf / 25 mm or more can be mentioned. Examples of such a non-peelable pressure sensitive adhesive include natural rubber latex obtained by graft copolymerization of styrene and methyl methacrylate with natural rubber. This natural rubber latex is an adhesive suitable for the inlet member of the present invention in terms of blocking resistance, heat resistance, abrasion resistance, and the like.

  Thus, according to the communication circuit holder 40, the circuit 12 is covered with the first region 11A and the second region 11B of the base material 11 except for the contact points 12a and 12b. The circuit 12 is unlikely to be damaged due to the influence from the above. In addition, since the wiring portion 15 is provided on the surface of the third region 11C opposite to the surface in contact with the second region 11B, in order to place the wiring portion 15, an insulation such as a resist film is provided in the third region 11C. Since it is not necessary to provide a film, the thickness of the communication circuit holder 40 does not increase.

  In this embodiment, when the base material 11 is Z-folded, communication in which print information is not provided on the outer surface of the first region 11A of the base material 11 and the outer surface of the third region 11C. Although the circuit holder 40 for communication was illustrated, the circuit holder for communication of this invention is not limited to this. In the communication circuit holder of the present invention, both the outer surface of the first region of the substrate and the outer surface of the third region, or the outer surface of the first region of the substrate, or The printing information may be provided on any one of the outer surfaces of the third region.

(4) Manufacturing method in 1st, 2nd, and 3rd embodiment Next, with reference to FIGS. 5-11, an example of the manufacturing method of the circuit holding body for communication which concerns on this invention is demonstrated.
5 and 6 are schematic perspective views showing an example of a method for manufacturing a communication circuit holder according to the present invention.
5-11, the same code | symbol is attached | subjected to the component same as the circuit holder 10 for communication shown in FIGS. 1-3, and the description is abbreviate | omitted.

  First, the opening 13 and the through portion 14a penetrating the base material 11 in the thickness direction are formed at predetermined positions of the second region 11B forming the base material 11, and the base material is formed at predetermined positions of the third region 11C. The penetration part 15c which penetrates 11 to the thickness direction is formed (refer Fig.5 (a)).

  In this step, the opening 13 is sufficiently large to accommodate the IC chip in the subsequent step, that is, when the IC chip is mounted in the opening 13, It is formed so as to have a slight gap between the IC chip and the IC chip.

  Next, a circuit 12 having a predetermined thickness and a predetermined pattern is provided on the one surface 11a of the first region 11A, and a conductive portion 14 is provided on the one surface 11a of the second region 11B so as to overlap the through portion 14a. A wiring portion 15 is provided on one surface 11a of the third region 11C so as to overlap the through portion 15c (see FIG. 5B).

  In this step, conductive ink or conductive paste is printed on the one surface 11a of the first region 11A by a screen printing method so as to have a predetermined thickness and a predetermined antenna pattern. The conductive paste is dried and cured to form a circuit 12 having a predetermined thickness and a predetermined pattern. Similarly, a conductive ink or a conductive paste is printed on the one surface 11a of the second region 11B by a screen printing method so as to have a predetermined thickness and a predetermined conductive portion pattern. The conductive paste is dried and cured to form a conductive portion 14 having a predetermined thickness and a predetermined pattern. Further, conductive ink or conductive paste is printed on the one surface 11a of the third region 11C by a screen printing method so as to have a predetermined thickness and a predetermined wiring portion pattern. The paste is dried and cured to form a wiring portion 15 having a predetermined thickness and a predetermined pattern.

  Next, the IC chip 20 is mounted on the contacts 12a and 12b of the circuit 12 via a conductive material made of conductive paste or solder, and the IC chip 20 and the circuit 12 are electrically connected (see FIG. 5C). ).

Next, the base material 11 is Z-folded along the folding lines 16 and 17 (see FIGS. 6A and 6B).
In this step, the substrate 11 is Z-folded so that the IC chip 20 is disposed in the opening 13 and the both ends 12c and 12d of the circuit 12 and the wiring part 15 overlap with each other via the conductive part 14. .

  Next, the first region 11A, the second region 11B, and the third region 11C are pressure-bonded by applying a predetermined pressure to the base material 11 with a pressure roller or the like in a state where the base material 11 is Z-folded, and conductive. The conductor 41 is formed by filling the penetrating part 14a and the penetrating part 15c of the base material 11 with the conductive ink or conductive paste forming the both end parts 15a and 15b of the part 14 and the wiring part 14. Both end portions 12c, 12d and both end portions 15a, 15b of the wiring portion 15 are electrically connected via the conducting portion 14 and the conductor 41, and as shown in FIG. Get 40.

  In this step, as shown in FIG. 7, the conductive ink and conductive paste forming both ends 15a and 15b of the conductive portion 14 and the wiring portion 15 are hardened. Ink and conductive paste are press-fitted into each of the penetrating part 14a and the penetrating part 15c.

  Furthermore, as shown in FIG. 8, the conductive ink which makes the conduction | electrical_connection part 14 and the wiring part 15 so that the penetration part 14a may be covered in the surface on the opposite side to the surface in which the conduction | electrical_connection part 14 of the 2nd area | region 11B is provided. If the conductive material 43 is provided by applying or dripping the conductive paste, the conductive material 43 flows into the through portion 14a and the through portion 15c by applying pressure by the pressure roller. The electrical connection between 12c and 12d and both end portions 15a and 15b of the wiring portion 15 can be made more reliable.

  In the present invention, the following method can also be applied as a method of electrically connecting the circuit 12 and the wiring portion 15.

  For example, as shown in FIG. 9, the second region 11 </ b> B of the base material 11 provided with the conduction portion 14 is placed on the fixed base 100. At this time, the second region 11B is placed on the fixed base 100 so that the penetrating portion 14a is superimposed on the penetrating portion 100a that is along the thickness direction of the fixing base 100 and has a larger inner diameter than the penetrating portion 14a of the second region 11B. Place.

Then, the inside of the penetrating part 14a is sucked by a vacuum pump or the like through the penetrating part 100a, and the conductive ink or conductive paste forming the conducting part 14 is drawn into the penetrating part 14a. The conductive paste is filled in the through portion 14a. This method can be applied before or after the conductive ink or conductive paste is cured, but the conductive ink or conductive paste is likely to flow into the through-hole 14a. It is desirable to apply before the conductive ink or conductive paste is cured.
Further, the present invention can also be applied to the case where the penetrating portion 15c is filled with conductive ink or conductive paste forming the wiring portion 15.

  Further, as shown in FIG. 10, the cross-sectional shape of the penetrating portion 14a of the second region 11B may be a tapered shape in which the inner diameter gradually decreases from the one surface 11a toward the opposite surface. In this way, when pressure is applied by the pressure roller, the conductive ink or conductive paste forming the conductive portion 14 easily flows into the through portion 14a.

  Further, as shown in FIG. 11, if the inner diameter of the penetrating portion 14a of the second region 11B is made larger than the inner diameter of the penetrating portion 15c of the third region 11C, the second region 11B and the third region 11C are overlapped. In the combined state, when pressure is applied by the pressure roller, the conductive ink or conductive paste forming the conductive portion 14 easily flows into the through portion 14a. In the present invention, the inner diameter of the penetrating portion in the third region may be larger than the inner diameter of the penetrating portion in the second region.

  In this embodiment, after the circuit 12, the opening portion 13, the conduction portion 14, the wiring portion 15, and the like are provided on the base material 11, an adhesive member is provided on each surface of the base material 11 so as to overlap each other. Although the manufacturing method for forming the communication circuit holder 40 is illustrated, the method for manufacturing the communication circuit holder of the present invention is not limited to this. In the method for manufacturing a communication circuit holder according to the present invention, a circuit, an opening, a conduction part, a wiring part, and the like may be formed on a base material provided with an adhesive member on one surface in advance. In this way, an adhesive member is provided in advance on one surface of the base material, the base material is stored, and the base material can be supplied as necessary, so that waste can be saved. In addition, since it is possible to form the circuit, the opening, the conductive portion, the wiring portion, and the like at high speed, as a result, the manufacturing of the communication circuit holder can be speeded up and the manufacturing efficiency can be improved.

  As described above, according to the method for manufacturing a communication circuit holder of this embodiment, the conventional manufacturing process can be reduced easily by using a combination of conventional devices without using a device having a complicated mechanism. In addition, the communication circuit holder can be manufactured at low cost.

  In the first, second, and third embodiments, the communication circuit holder in which the circuit 12 is arranged on the one surface 11a of the base material 11 and the IC chip 20 is mounted on the one surface 11a of the base material 11 is used. Although illustrated, the communication circuit holder of the present invention is not limited to this. In the present invention, the circuit contacts are arranged on the other surface of the base material, the IC chip is mounted on the other surface of the base material, and the other surface of the first region and the other surface of the second region of the base material. The substrate may be Z-folded so that the IC chip is in contact with each other to form a communication circuit holding body containing an IC chip.

As described above, when a plurality of base materials are provided to overlap with each other through an adhesive member so that two or more adhesive surfaces are generated, the following three methods are exemplified.
1. Each adhesive member is made of a different adhesive material. When it is difficult or impossible to peel, an adhesive material that can be strongly bonded is used.
When re-peeling is possible, an adhesive material that can be weakly bonded is used.
2. Each adhesive member is formed of the same adhesive material and has a different thickness.
When peeling is difficult or impossible, the adhesive material is formed thick.
When re-peeling is possible, a thin adhesive material is formed.
3. Each adhesive member is formed of the same adhesive material, and the pressing force at the time of sticking is made different.
If it is difficult to peel or cannot be peeled off, the pressure is increased when sticking.
When making it possible to peel again, the pressing force at the time of sticking is weakened and sticking.

In particular, each adhesive member is made of the same adhesive material, and by changing the pressing force at the time of sticking, an adhesive member that is difficult or impossible to peel after sticking and an adhesive member that can be peeled off again after sticking are formed If you want to
(1) First, the same adhesive member is formed with the same thickness.
(2) Next, the adhesive members that can be re-peeled after bonding are pressed together with a strong pressing force and bonded together.
(3) Then, the adhesive members that can be re-peeled after bonding are pressed together with a weak pressing force and bonded together.
By this procedure, for example, when three base materials A, B, and C are sequentially stacked, the base material A and the base material B can be re-peeled, and the base material B and the base material C are difficult to peel or cannot be peeled. can do.

  The communication circuit holder of the present invention is mainly used as an inlet built in a card or the like, but if it is formed in the same shape as the card and printed on its surface, it is a non-contact type IC card as it is. Can be used as

It is the schematic which shows 1st embodiment of the circuit holding body for communication which concerns on this invention, (a) is a top view, (b) is sectional drawing which follows the AA line of (a). It is a schematic plan view which shows other embodiment of the circuit holder for communication which concerns on this invention. It is the schematic which shows 2nd embodiment of the circuit holding body for communication which concerns on this invention, (a) is a top view, (b) is sectional drawing which follows the BB line of (a). It is the schematic which shows 3rd embodiment of the circuit holder for communication which concerns on this invention, (a) is a top view, (b) is sectional drawing which follows the CC line of (a). It is a schematic perspective view which shows an example of the manufacturing method of the circuit holder for communication which concerns on this invention. It is a schematic perspective view which shows an example of the manufacturing method of the circuit holder for communication which concerns on this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the circuit holding body for communication which concerns on this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the circuit holding body for communication which concerns on this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the circuit holding body for communication which concerns on this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the circuit holding body for communication which concerns on this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the circuit holding body for communication which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,30,40 ... Communication circuit holding body, 11 ... Base material, 11A ... 1st area | region, 11B ... 2nd area | region, 11C ... 3rd area | region, 12 ... Circuit 12a, 12b ... contacts, 12c, 12d ... both ends, 13 ... opening, 14 ... conducting part, 15 ... wiring part, 16, 17 ... fold line, 20 ...・ IC chip.

Claims (2)

A base material having a plurality of regions connected to each other, a spiral circuit disposed in each region of the base material, two conductive portions penetrating the base material, and a linear wiring portion, By bending the base material, when the plurality of regions are overlapped, both ends of the circuit and both ends of the wiring portion are disposed so as to be electrically connected via each of the conductive portions. A communication circuit holding body,
The base material is formed by sequentially connecting a second region in which the conductive portion is disposed and a third region in which the wiring portion is disposed in the first region in which the circuit is disposed,
The wiring portion is provided so as to overlap with a conductor penetrating the third region when the base material is Z-folded,
When the substrate was folded Z, to the second region, Ri name by arranging an opening for accommodating the IC chip electrically connected to the contacts of the circuit,
When the base material is Z-folded, both ends of the circuit and both ends of the wiring portion are electrically connected via a conductor that penetrates the second region and a conductor that penetrates the third region. communication circuit holder, wherein Rukoto is.  2. The communication circuit holder according to claim 1, further comprising an IC chip electrically connected to the contact and mounted in the opening.

Images