JP4899277B2 - Contactless communication card - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a contactless communication card such as a contactless IC card that communicates with an external reader / writer (hereinafter referred to as “R / W”).
[0002]
[Prior art]
5A and 5B are diagrams showing an example of a non-contact IC card using an electrostatic coupling method, in which FIG. 5A is a rear view of the non-contact IC card, and FIG. 5B is PP ′ of FIG. Cross-sectional views and FIGS. 5C and 5D are circuit diagrams illustrating communication with the R / W.
As shown in FIGS. 5A and 5B, the non-contact IC card 10-5 includes an IC chip 111, first and second antenna units 121-5 and 122-5 (hereinafter collectively referred to as “antenna unit 12”). -5 "), a paper material 114, two conductive plates 112 and 113, an adhesive layer 115 made of a non-conductive adhesive, a card base 13-5, and the like. The antenna unit 12-5 is provided by applying conductive carbon ink to the card base 13-5 by a screen machine, gravure printing or the like.
[0003]
As shown in FIGS. 5B and 5C, the first and second antenna portions 121-5 and 122-5 and the two conductive plates 112 and 113 are connected to two capacitors 112C and 113C via an adhesive layer 115. (Hereinafter, the IC chip 111, the paper material 114, the two conductive plates 112 and 113, and the adhesive layer 115 are referred to as "interposer 11").
[0004]
As shown in FIG. 5D, the non-contact IC card 10-5 is gripped by directly touching one antenna part (second antenna part 122-5) with a finger or through a protective film or the like. The other antenna portion (first antenna portion 121-5) is grounded via a capacitor or the like, and functions as a capacitor plate with respect to the external R / W, and forms a circuit with the R / W. Communication is performed by a coupling method (a method in which capacitive plates are arranged to face each other and communicate by electrostatic induction). For example, Motorola's “BISTATIX” (trade name) communicates in this manner.
[0005]
FIG. 6 is a diagram illustrating an example of a method for manufacturing a non-contact IC card by an electromagnetic induction method.
In FIG. 6, reference numeral 1 denotes a component film in which circuits for nine cards composed of electronic components are mounted on a substrate 1a. 1b is an IC chip, and 1c is an antenna circuit. Reference numerals 2 a and 2 b denote adhesive layers for laminating laminated films 3 a and 3 b for laminating for protecting the card surface on the front and back of the component film 1.
In this non-contact type IC card manufacturing method, an antenna circuit 1c, an IC chip 1b, and electronic components such as a capacitor are connected to produce a component film 1, and then the adhesive film 2a, 2b is applied to the component film 1. The laminated films 3a and 3b were laminated through the card and cut into a card shape.
[0006]
[Problems to be solved by the invention]
As shown in FIG. 5, the conventional non-contact IC card described above can be manufactured by simply attaching the interposer 11 to the card base 13-5 on which the antenna portion 12-5 is printed. Was planned.
However, since the interposer 11 and the antenna unit 12-5 are exposed, the design of the external appearance is restricted, and when the mobile phone is carried, external force is applied directly to the interposer 11 and it is peeled off or becomes wet and shorts. There was a possibility.
[0007]
The electromagnetic induction non-contact IC card shown in FIG. 6 solves the above problem, but does not achieve the original purpose of cost reduction.
[0008]
An object of the present invention is to provide a contactless communication card that prevents damage to electronic components and water wetting, has a high degree of freedom in external design, and can be manufactured at low cost.
[0015]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the invention of claim 1 is characterized in that a first base part, and at least a non-contact IC chip disposed on one surface of the first base part, and the non-contact IC chip. A non-contact communication unit that communicates with an external reader / writer in a non-contact manner, and a first base member that is disposed on both surfaces of the first base member. 1 adhesive layer, 2nd adhesive layer, 2nd base material part joined to one side of the 1st base material part by the 1st adhesive layer, and the 2nd A third base part joined to the other surface of the first base part by an adhesive layer, and the first base part absorbs the thickness of the non-contact IC chip. And a through-hole provided as a chip mounting portion larger than the non-contact IC chip, and the non-contact I A chip is disposed in the through hole, and is a surface of the third base material portion on the first base material portion side, at a position corresponding to the noncontact IC chip, from the noncontact IC chip. Is a non-contact communication card characterized in that a first recess that is slightly larger is formed .
[0016]
According to a second aspect of the present invention, in the non-contact communication card according to the first aspect, the non-contact communication unit includes the non-contact IC chip stacked on one side of a sheet-like member, and the first base material portion. An antenna unit having a first antenna unit and a second antenna unit printed with ink containing a conductive material and mediating communication by electrostatic coupling between the non-contact IC chip and an external reader / writer. And the antenna unit is disposed between the first base material part and the second base material part .
[0017]
According to a third aspect of the present invention, in the non-contact communication card according to the second aspect, the non-contact IC chip is inserted into the through hole from the second base material portion side, and the second base material portion A second recess that is slightly larger than the sheet-like member is formed at a position corresponding to the non-contact IC chip on the surface of the first base material side. It is a contactless communication card.
According to a fourth aspect of the present invention, in the contactless communication card according to any one of the first to third aspects, the second base portion and the third base portion are the first base portion. It is a non-contact communication card characterized by being connected to both sides of a base material part via a bending line.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, with reference to the drawings, embodiments of the present invention, further details rather bright-theory.
(First embodiment)
1 and 2 are process diagrams showing a first embodiment of a method for manufacturing a contactless communication card according to the present invention, and FIG. 3 is a cross-sectional view showing the first embodiment of the contactless communication card according to the present invention.
As shown in FIG. 1, the manufacturing method of the contactless communication card of this embodiment includes a processing / printing step # 101, an antenna printing step # 102, an interposer attaching step # 103, a sealing processing step # 104, a mold, This is comprised of the extraction step # 105 and the like.
[0019]
The processing / printing step # 101 is a step of performing processing such as folding sewing processing, perforating processing, embossing processing, and printing of necessary items and external design on the base material 20, as shown in FIG.
As the base material 20, high-quality paper, synthetic paper, a resin sheet, or the like can be used, and the second base material part 22 and the third base material part 23 are connected to both sides of the first base material part 21. In this embodiment, inexpensive high-quality paper is used.
The folding perforation is a process of forming perforations (bending lines) 24 and 25 at the boundary between the first base material portion 21, the second base material portion 22, and the third base material portion 23. .
[0020]
The punching process is a process of making a punch hole 26 that is slightly larger in the first base material portion 21 in a portion corresponding to the IC chip 111 of the interposer 11.
Embossing is a process of forming a recess 27 that is slightly larger than the paper material 114 of the interposer 11 on the surface of the second base material portion 22, and the back surface of the third base material portion 23. Processing for forming a recess 28 that is slightly larger than the IC chip 111 corresponding to the interposer 11 is performed.
The punch hole 26, the concave portion 27, the concave portion 28, and the like function to absorb the thickness after the IC chip 111 and the paper material 114 of the interposer 11 are inserted and sealed.
[0021]
The antenna printing step # 102 is a step of printing the antennas 121 and 122 on the first base member 21 with carbon ink or the like.
As the printing method, screen printing, offset printing, gravure printing, flexographic printing, and the like can be applied. In this embodiment, flexographic printing is performed in order to ensure thickness and to print at low cost.
[0022]
The interposer attaching step # 103 is a step of attaching the interposer 11 so that the IC chip 111 enters the portion of the punch hole 26 of the first base member 21 as shown in FIG. The interposer 11 has the layer configuration shown in FIG.
[0023]
In the sealing process # 104, as shown in FIG. 2 (c), the base material 20 is folded in three as indicated by an arrow A from the fold perforations 24 and 25, and thermocompression bonded with the adhesive sheet 30 interposed therebetween. It is.
The adhesive sheet 30 is a sheet in which a heat-sealable adhesive 32 is applied to both surfaces of a sheet substrate 31 such as PET or PP (see FIG. 3).
[0024]
The die cutting step # 105 is a step of punching the base material sealed in the sealing processing step # 104 into a card shape.
[0025]
As shown in FIG. 3, the manufactured non-contact communication card 10 includes a central first base material portion 21, and first and second antenna portions 121 and 122 printed on the first base material portion 21. The interposer 11 attached so that the IC chip 111 enters the portion of the punch hole 26 of the first base member 21 and is electrically connected to the first and second antenna portions 121 and 122; An adhesive sheet 30 disposed on both sides of the base material portion 21, and second and third base material portions 22, 23, etc., which are bonded to the first base material portion 21 via the adhesive sheet 30. Yes.
[0026]
As described above, in this embodiment, the non-contact communication card 10 has the following various effects.
(1) Since the antenna part 12 is printed on the paper base material and the interposer 11 is affixed, it can be manufactured at low cost.
(2) Since the paper base is folded in three and the interposer 11 and the antenna part 12 are covered with the second and third base parts 22 and 23, there is no damage due to external force.
(3) Since the interposer 11 and the antenna unit 12 are covered with the adhesive sheet 30, the waterproof property is good.
[0027]
(4) Since the recesses 27 and 28 by the punch hole 26 and the embossing are provided, the thickness of the interposer 11 is absorbed after sealing, and the card is smooth and has a good appearance.
(5) The front and back surfaces of the non-contact communication card 10 can be smooth and freely designed over the entire surface.
(6) Regarding manufacturing, since the production and maintenance of the tri-fold mail form can be used as it is, the equipment can be used effectively and the manufacturing cost can be reduced.
[0028]
(Second Embodiment)
FIG. 4 is an explanatory view for explaining a second embodiment of the contactless communication card and the manufacturing method thereof according to the present invention.
FIG. 4A is an explanatory diagram showing the inlet 100 of the contactless communication card according to the present embodiment.
The inlet 100 is an intermediate base sheet in which an antenna coil 112 and an IC chip mounting portion 113 are provided on the inlet sheet 111. The inlet 100 uses a 25-micron-thick polyimide film as the inlet sheet 111, a copper foil is pasted on the surface of the inlet sheet 111, and the antenna coil 112 and the IC chip mounting portion 113 are formed by an etching method.
[0029]
The antenna coil 112 exchanges data without contact with an external reader / writer, and is connected to the IC mounting portion 113 at a part of the outer peripheral portion.
The antenna coil 112 is formed on the surface of the inlet sheet 111 by an etching method (copper, aluminum, etc.), a conductive printing method, a wire winding method, a transfer method, a silk screen printing method, a vapor deposition method or the like.
When forming on the inlet sheet 111 by a silk screen printing method, a silver paste containing 70 to 80% of silver powder using a conductive ink such as a thermoplastic resin or a thermosetting resin as a binder on the inlet sheet 111. Print with ink etc.
[0030]
The IC chip mounting portion 113 connects the antenna coil 112 and the IC chip 116. Like the antenna coil 112, an etching method (copper, aluminum, etc.), a conductive printing method, a transfer method, a silk screen printing method, It is formed on the surface of the inlet sheet 111 by vapor deposition or the like.
[0031]
As shown in FIG. 4B, the non-contact communication card 10-2 of the present embodiment has the inlet 100 disposed on the first base material portion 21 provided with the punch holes 26 (base material processing) ( (Unit mounting), the second and third substrate portions 122 and 238 are laminated on both surfaces of the two layers via the adhesive layers 30 and 30 (sealing process), and are cut out into a predetermined card shape (at the cutting position C) ( (One-sided cutting).
[0032]
According to the second embodiment, an effect similar to that of the first embodiment can be obtained even in an electromagnetic induction type non-contact IC card.
[0033]
(Deformation)
The present invention is not limited to the embodiment described above, and various modifications and changes are possible, and these are also within the equivalent scope of the present invention.
(1) Although the example of the adhesive sheet 30 has been described in the first embodiment, the adhesive may be applied directly. In particular, when the base material is plastic, sufficient waterproofness can be obtained.
(2) Also in the second embodiment, the antenna coil may be printed on the base member.
(3) In 2nd Embodiment, if the antenna coil 112 is provided as the inlet 100 and it has a capacitor | condenser component, it can be set as the resonance tag which resonates with an external reader / writer.
[0034]
(4) Although an example in which one card is manufactured has been described, it may be manufactured by attaching two surfaces on the top and bottom of the base material 20. Further, if a mail form manufacturing facility is not used, it may be manufactured with multiple faces as shown in FIG.
(5) It is good also as a card sending medium which produces in the state of FIG.2 (c) (same size as a postcard), mails, and isolate | separates a card | curd by the perforation etc. which were put in the card-shaped external shape.
(6) Although the example in which the base material is Z-folded has been described, roll folding may be employed in which the second and third base material portions are respectively located inside. Moreover, although demonstrated in the example which folds a base material in three, it may be folded in half. Two or three sheet base materials may be laminated.
[0035]
【Effect of the invention】
As described above in detail, according to the present invention, there is an effect that electronic components can be prevented from being damaged or wetted, and the degree of freedom in external design is high and can be manufactured at low cost.
[Brief description of the drawings]
FIG. 1 is a process diagram showing a first embodiment of a method of manufacturing a contactless communication card according to the present invention.
FIG. 2 is a process chart schematically showing a first embodiment of a method of manufacturing a contactless communication card according to the present invention.
FIG. 3 is a cross-sectional view showing a first embodiment of a contactless communication card according to the present invention.
FIG. 4 is an explanatory view for explaining a second embodiment of the contactless communication card and the manufacturing method thereof according to the present invention.
FIG. 5 is a diagram illustrating an example of a non-contact IC card using an electrostatic coupling method.
FIG. 6 is a diagram showing an example of a method for manufacturing a non-contact IC card by an electromagnetic induction method.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Non-contact communication card 11 Interposer 12 Antenna part 121 1st antenna part 122 2nd antenna part 20 Base material 21 1st base material part 22 2nd base material part 23 3rd base material parts 24 and 25 Fold perforation 26 Punch holes 27, 28 Recess 30 Adhesive sheet # 101 Processing / printing process # 102 Antenna printing process # 103 Interposer sticking process # 104 Sealing process # 105 Die cutting process

Claims (4)

A first substrate portion;
It is disposed on one surface of the first base part, and includes at least a non-contact IC chip and an antenna unit that mediates communication between the non-contact IC chip and an external reader / writer. A contactless communication unit that communicates with other reader / writers,
A first adhesive layer and a second adhesive layer disposed on both surfaces of the first base material portion;
A second base material part joined to one surface of the first base material part by the first adhesive layer;
A third base part joined to the other surface of the first base part by the second adhesive layer;
With
The first base portion has a through-hole that is provided slightly larger than the non-contact IC chip as a chip mounting portion for absorbing the thickness of the non-contact IC chip,
The non-contact IC chip is disposed in the through hole,
A first concave portion that is slightly larger than the non-contact IC chip is formed on the surface of the third base portion on the first base portion side, at a position corresponding to the non-contact IC chip. That
Non-contact communication card characterized by. The contactless communication card according to claim 1,
The non-contact communication unit is
The non-contact IC chip laminated on one side of a sheet-like member;
A first antenna unit and a second antenna unit that are printed with ink containing a conductive material on the first base material unit and mediate communication by electrostatic coupling between the non-contact IC chip and an external reader / writer An antenna unit having
With
The antenna part is disposed between the first base part and the second base part;
Non-contact communication card characterized by. The contactless communication card according to claim 2,
The non-contact IC chip is inserted into the through hole from the second base material part side,
A second concave portion that is slightly larger than the sheet-like member is formed on the surface of the second base portion on the first base portion side, at a position corresponding to the non-contact IC chip. That
Non-contact communication card characterized by. In the non-contact communication card of any one of Claim 1 to Claim 3,
The second base material part and the third base material part are connected to both sides of the first base material part via a planned bending line;
Non-contact communication card characterized by.

Images