JP2007058400A - Communicating circuit holding body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a communicating circuit holding body securing stability of electrical connection of an IC chip and a circuit without requiring preparation of an inlet additionally and establishing communication only when needed. <P>SOLUTION: This communicating circuit holding body 10 has a base material 13 having a first area 11 and a second area 12. In the same face 13a, the communicating circuit holding body 10 has at least: a space part 14 disposed in the first area 11; the spiral circuit 15 disposed on the second area 12; the IC chip 17 electrically connected to an inner circumferential end 15a and an outer circumferential end 15b of the circuit 15 through an interposer 16; and a recessed part 18 disposed in the second area 12. In the communication circuit holding body 10, when bending the base material 13 to overlap the first area 11 on the second area 12, the inner circumferential end 15a and a vicinity area thereof of the circuit 15, the outer circumferential end 15b and a vicinity area thereof, the interposer 16, and the IC chip 17 are disposed inside an air gap comprising the space part 14 and the recessed part 18. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a communication circuit holder.

  In recent years, for example, a technique related to a non-contact type medium (non-contact type IC card or the like) called RFID (Radio Frequency Identification) has been rapidly advanced, and its use is also various.

  This type of RFID is manufactured by patterning an antenna on a base material and attaching what is called an inlet with an IC chip mounted on another base material. Many of such inlets use a paper material or a film as a base material, and a paper base material or film on which various information is printed is bonded to the inlet with an adhesive or the like.

  In addition, in an inlet made of a base material such as paper or film, it is common to form a pattern of an antenna for communication into a spiral circuit by, for example, winding a plurality of patterns, and contact points at both ends of the pattern Communication is made possible by electrically connecting the gaps using a conductive member. Further, various functions can be provided by adopting a configuration in which an IC chip is mounted on the circuit.

  Such an inlet can be cut into a card shape from the perforation line and is attached to a postcard consisting of three connected postcards, and when the three connected postcards are folded and bonded, The entire surface of each of the first postcard part and the second postcard part is detachably bonded, the entire surface of each of the second postcard part and the third postcard part is strongly bonded so as not to be peeled off, and the inlet is connected to the second postcard part or the second postcard part. A communication circuit holding body mounted on a three postcard part has been proposed (for example, Patent Document 1).

  The communication circuit holder described in Patent Document 1 is in a usable state by removing the inlet from the card-shaped perforation line provided in the second postcard part and the third postcard part by the above-described configuration. The concealment information displayed on the peeling surface can be browsed by peeling off the first postcard part and the second postcard part.

  Further, the inlet is attached to a sealed letter formed by bending three connected form pieces into a Z shape and adhering the edges, and by cutting three predetermined sides of the sealed letter from the perforation, A communication circuit holder has been proposed in which a form piece can be opened and internal information can be browsed, and an inlet is cut into a card shape on the form piece at the center of the opened letter (for example, Patent Document 2).

With the above-described configuration, the communication circuit holder described in Patent Document 2 cuts and opens the three sides of the sealed letter from the perforation line, cuts the inlet mounted on the center form piece into a card shape along the perforation line, and The information printed on each form piece inside the sealed letter can be browsed.
JP 2003-141492 A JP 2003-141493 A

  However, in the communication circuit holders described in Patent Document 1 and Patent Document 2, an inlet that is separate from the base material is bonded to a preprinted film or paper base material with an adhesive. Since it is composed of three layers of the inlet and the upper and lower substrates, the number of steps is increased and the material cost is increased.

  Further, in the configurations of the communication circuit holders of Patent Document 1 and Patent Document 2, the circuit formed as the inlet is always in a conductive and operating state, and the inlet cannot be operated only when necessary.

  The present invention has been made in view of the above circumstances, and it is not necessary to prepare an inlet as a separate body, ensuring the stability of the electrical connection between the IC chip and the circuit, and enabling communication only when necessary. An object of the present invention is to provide a communication circuit holder.

  The present invention is a substrate having a first region and a second region connected to each other, a space portion disposed in the first region on the same surface of the substrate, a spiral circuit disposed in the second region, Each of an inner peripheral end and an outer peripheral end of the circuit, an IC chip electrically connected via an interposer, and a recess disposed in the second region, and bending the base material, When one region is overlaid on the second region, the inner peripheral edge of the circuit and the vicinity thereof, the outer peripheral edge and the vicinity thereof, the interposer, and the IC chip are separated from the space and the recess. Provided is a communication circuit holder disposed in a gap.

  According to such a configuration, the inner peripheral edge of the circuit and the vicinity thereof, the outer peripheral edge and the vicinity thereof, the interposer, and the IC chip are not exposed to the outside of the base material. It is possible to prevent the electrical connection between the end and the interposer and the electrical connection between the interposer and the IC chip from being hindered.

  In the communication circuit holding body configured as described above, the base material further includes a third region further connected to the second region, and a short-circuit portion disposed in the third region, and the third region in the second region. It is preferable that the short-circuit portion is in electrical contact with the circuit when the two are overlapped.

  According to such a configuration, the communication of the communication circuit holding body can be inhibited or disabled when the third region is overlapped with the second region.

  In the communication circuit holder configured as described above, the IC chip is preferably disposed in the space portion.

  According to such a configuration, since the thickness of the IC chip can be accommodated within the thickness of the first region of the base material, when the first region is overlaid on the second region, swelling due to the thickness of the IC chip occurs. Can be prevented. Further, since the first region of the substrate does not directly touch the IC chip, the reliability of the IC chip can be ensured.

  In the communication circuit holder configured as described above, it is preferable that the IC chip and the interposer are arranged in the space portion.

  According to this configuration, since the thickness of the interposer and the IC chip can be accommodated within the thickness of the first region of the base material, the interposer and the IC chip can be obtained when the first region is overlapped with the second region. It is possible to prevent the swelling due to the thickness of the material. In addition, since the first region of the base material does not directly touch the interposer and the IC chip, the reliability of the IC chip and the connection stability to the inner and outer peripheral ends of the circuit of the IC chip via the interposer Can be secured.

  According to the communication circuit holding body of the present invention, the base material having the first region and the second region connected to each other, the space portion arranged in the first region on the same surface of the base material, the second region A spiral-shaped circuit to be arranged, each of an inner peripheral end and an outer peripheral end of the circuit, an IC chip electrically connected via an interposer, and a concave portion arranged in the second region, When the substrate is bent and the first area is overlapped with the second area, the inner peripheral edge of the circuit and its vicinity area, the outer peripheral edge and its vicinity area, the interposer, and the IC chip are Since it is disposed in the gap formed by the space and the recess, the inner peripheral edge of the circuit and its vicinity area, the outer peripheral edge and its vicinity area, the interposer, and the IC chip are not exposed to the outside of the base material. , External force More, the inner peripheral end and outer peripheral end of the circuit, electrical connection between the interposer, and it is possible to prevent the electrical connection between the interposer and the IC chip is inhibited.

  Hereinafter, the communication circuit holder embodying the present invention will be described in detail.

(1) First Embodiment FIG. 1 is a schematic plan view showing a first embodiment of a communication circuit holding body according to the present invention, where (a) is an overall view, and (b) is a diagram of (a). It is the figure which expanded the area | region A enclosed with the broken line. FIG. 2 is a cross-sectional view taken along line BB in FIG. 1B when the substrate is bent and the first region is overlapped with the second region. FIG. 3 is a cross-sectional view taken along line CC in FIG. 1B when the base material is bent and the first region is overlapped with the second region.
1 to 3, reference numeral 10 is a communication circuit holder, 11 is a first region, 12 is a second region, 13 is a base material, 14 is a space, 15 is a circuit, and 15 a is an inner peripheral end of the circuit 15. 15b is an outer peripheral edge of the circuit 15, 16 is an interposer, 17 is an IC chip, 18 is a recess, 19 is an insulating member, 20 is a conductor, 21 is a broken line, 22 is a gap, and 23 is a conductive member. .

  The communication circuit holder 10 of this embodiment includes a base material 13 having a first region 11 and a second region connected to each other, and a space portion 14 disposed in the first region 11 on the same surface 13 a of the base material 13. A spiral circuit 15 disposed in the second region 12, an inner peripheral end 15a and an outer peripheral end 15b of the circuit 15, an IC chip 17 electrically connected via an interposer 16, and a second It is schematically configured from a recess 18 disposed in the region 12.

  Moreover, the space part 14 has comprised the penetration part which penetrates the base material 13 in the thickness direction. Further, the interposer 16 includes an insulating member 19 and conductors 20 and 20 that are disposed on one surface 19 a and are electrically connected to the IC chip 17. Furthermore, the conductors 20 and 20 and the inner peripheral end 15a and the outer peripheral end 15b of the circuit 15 are electrically connected via the conductive members 23 and 23, respectively.

  In this communication circuit holder 10, as shown in FIGS. 2 and 3, when the base material 13 is bent along the fold line 21 and the first region 11 is overlapped with the second region 12, the space portion 14. And the recess 18 communicate with each other to form a gap 22. In the gap 22, the inner peripheral end 15 a of the circuit 15 and the vicinity thereof, the outer peripheral end 15 b and the vicinity thereof, the interposer 16, and the IC chip 17 are arranged.

  Thus, when the base material 13 is bent and the first region 11 is overlapped with the second region 12, the inner peripheral end 15a of the circuit 15 and the vicinity thereof, the outer peripheral end 15b and the vicinity thereof, the interposer 16 In addition, since the IC chip 17 is disposed in the gap 22 formed by the space portion 14 and the recess portion 18, these are not exposed to the outside of the base material 13, and therefore the inner peripheral end 15 a and the outer peripheral end of the circuit 15 are externally applied. It is possible to prevent the electrical connection between 15b and the interposer 16 and the electrical connection between the interposer 16 and the IC chip 17 from being hindered.

  In particular, in FIGS. 2 and 3, the size of the space portion 14 is slightly larger than that of the IC chip 17, only the IC chip 17 is disposed in the space portion 14, and the depth of the recess portion 18 is set to the circuit 15. The inner peripheral end 15a and the outer peripheral end 15b of the circuit 15 are made larger than the total thickness of the inner peripheral end 15a and the outer peripheral end 15b, the thickness of the conductive member 23, and the thickness of the interposer 16, so The interposer 16 is arranged. In this way, the thickness of the IC chip 17 can be accommodated within the thickness of the first region 11 of the substrate 13, so that when the first region 11 is superimposed on the second region 12, It is possible to prevent the swelling due to the thickness. In addition, since the first region 11 of the substrate 13 does not directly touch the IC chip 17, the reliability of the IC chip 17 can be ensured.

  As the first base material 13, at least in the surface layer portion, a woven fabric, a nonwoven fabric, a mat, paper or the like made of inorganic fibers such as glass fibers or alumina fibers, or a combination thereof, organic fibers such as polyester fibers or polyamide fibers Woven fabrics, nonwoven fabrics, mats, papers, etc., or combinations thereof, or composite substrates formed by impregnating them with resin varnish, polyamide resin substrates, polyester resin substrates, polyolefin resins Substrate, polyimide resin substrate, ethylene-vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate Resin base material, Acrylonitrile butadiene styrene copolymer resin base material, Polyether sulfone Surface treatments such as plastic base materials such as resin base materials, or mat processing, corona discharge processing, plasma processing, ultraviolet irradiation processing, electron beam irradiation processing, flame plasma processing, ozone processing, or various types of easy adhesion processing. It selects from well-known things, such as what gave. Among these, an electrically insulating film or sheet made of polyethylene terephthalate or polyimide is preferably used.

  In the second region 12, the circuit 15 is formed by screen printing on a surface 13a of the base material 13 using a polymer-type conductive ink in a predetermined pattern, or formed by etching a conductive foil. It is.

  As the polymer type conductive ink in the present invention, for example, conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are mixed in the resin composition. The thing which was done is mentioned.

If a thermosetting resin is used as the resin composition, the polymer conductive ink becomes a thermosetting type capable of forming a coating film forming the circuit 16 at 200 ° C. or less, for example, about 100 to 150 ° C. The electric path of the coating film forming the circuit 16 is formed by contact of the conductive fine particles forming the coating film with each other, and the resistance value of the coating film is on the order of 10 ⁻⁵ Ω · cm.

  Further, as the polymer type conductive ink in the present invention, known ones such as a photo-curing type, a permeation drying type, and a solvent volatilization type are used in addition to the thermosetting type.

  The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photocurable polymer type conductive ink include, for example, a thermoplastic resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin composed of polyester and isocyanate) and 60 mass of conductive fine particles. % Or more and 10% by mass or more of a polyester resin, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), or a thermoplastic resin Or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate), in which a polyester resin is blended in an amount of 10% by mass or more, that is, a crosslinkable type or a crosslinked / heat A plastic combination type is preferably used.

Further, when more flexibility is required for the communication circuit holding body 10 and, as a result, further bending resistance is required in the circuit 15, flexibility imparting agent is added to the polymer type conductive ink. May be blended.
Examples of the flexibility imparting agent include a polyester flexibility imparting agent, an acrylic flexibility imparting agent, a urethane flexibility imparting agent, a polyvinyl acetate flexibility imparting agent, and a thermoplastic elastomer flexibility. Include a property-imparting agent, a natural rubber-based flexibility imparting agent, a synthetic rubber-based flexibility imparting agent, and a mixture of two or more thereof.

  On the other hand, examples of the conductive foil forming the circuit 15 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.

Examples of the insulating member 19 constituting the interposer 16 include a resin substrate and a paper material.
Examples of the conductor 20 constituting the interposer 16 include a lead frame made of a metal such as copper, aluminum, gold, and silver.

The IC chip 17 is not particularly limited and may be a non-contact IC tag, a non-contact IC label, or a non-contact type as long as information can be written and read out in a non-contact state via the circuit 15. Anything applicable to RFID media such as an IC card can be used.
As the conductive member 23, an ACF (Anisotropic Conductive Film), ACP (Anisotropic Conductive Paste), NCF (Non Conductive Resin Film), NCP (NonConditive Condensate Film) Paste: non-conductive particle paste).

  According to the communication circuit holding body 10 of this embodiment, the base portion 13 having the first region 11 and the second region 12 connected to each other, and the space portion arranged in the first region 11 on the same surface 13a of the base member 13. 14, an IC chip 17 electrically connected to the spiral circuit 15 disposed in the second region 12, each of the inner peripheral end 15a and the outer peripheral end 15b of the circuit 15 via the interposer 16, and the second region 12, at least a concave portion 18 disposed on the base plate 13, and when the first region 11 is overlapped with the second region 12, the inner peripheral end 15 a of the circuit 15, the vicinity thereof, and the outer peripheral end 15 b And the vicinity thereof, the interposer 16 and the IC chip 17 are disposed in the gap 22 formed by the space portion 14 and the recess portion 18, so that the inner peripheral end 15 and the outer periphery of the circuit 15 are externally applied. And 15b, the electrical connection between the interposer 16, as well, it is possible to prevent the electrical connection between the interposer 16 and the IC chip 17 is inhibited.

  In addition, in this embodiment, although the circuit holder 10 for communication in which the printing information was not provided in the one surface 13a of the base material 13 was illustrated, the circuit holder for communication of this invention is not limited to this. In the communication circuit holder of the present invention, on one surface of the base material, a portion other than the space portion of the first region, or a portion where the circuit of the second region is not provided, characters, patterns, images, etc. Various print information may be provided. In the communication circuit holder of the present invention, various print information such as characters, patterns or images may be provided on the other surface of the substrate (the surface opposite to one surface).

  Moreover, in this embodiment, although the space part 14 was made into the penetration part which penetrates the base material 13 in the thickness direction, the circuit holder for communication of this invention is not limited to this. In the communication circuit holder of the present invention, the space portion arranged in the first region of the base material may be a recess that does not penetrate the base material.

Moreover, in this embodiment, although the circuit holder 10 for communication in which the adhesive member was not provided in the one surface 13a of the base material 13 was illustrated, the circuit holder for communication of this invention is not limited to this. In the communication circuit holder of the present invention, an adhesive member may be provided on one surface of the base material.
In this case, as the adhesive member, an adhesive member that can be peeled off even after sticking and cannot be stuck again after peeling is used. Examples of the adhesive member that can be peeled even after such sticking and cannot be re-sticked after peeling include a thermoplastic resin film that can be heat-sealed. As such a heat-sealable thermoplastic resin film, a material having a peeling force of about 110 gf / 25 mm to 170 gf / 25 mm is used. Examples of such a thermoplastic resin film include polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-methacrylic acid copolymer, ethylene-methacrylic acid ester copolymer, ethylene-acrylic acid copolymer, ethylene. -Films composed of acrylic acid ester copolymers and cross-linked products of these metals can be mentioned, and among these, transparent ones are desirable.

(2) Manufacturing Method in First Embodiment Next, an example of a manufacturing method of the resonance tag according to the first embodiment will be described with reference to FIGS.
First, the base material 13 in which the first region 11 and the second region 12 are connected to each other with the broken line 21 as a boundary is prepared.

  Next, a space 14 that penetrates the first region 11 in the thickness direction is formed at a predetermined position of the first region 11, and a recess 18 is formed at a predetermined position of the second region 12.

  Next, a circuit 15 having a predetermined thickness and a predetermined pattern is arranged on the one surface 11a of the first base material 11, and the inner peripheral end 15a and the vicinity thereof and the outer peripheral end 15b and the vicinity thereof are arranged in the recess 18. Provide as follows.

  Next, each of the inner peripheral end 15 a and the outer peripheral end 15 b of the circuit 15 and the IC chip 17 are electrically connected via the conductive member 23 and the interposer 16 to obtain the communication circuit holder 10.

(3) Second Embodiment FIG. 4 shows a second embodiment of the communication circuit holder according to the present invention. When the base material is bent and the first region is overlapped with the second region, It is sectional drawing which follows the BB line of FIG.1 (b). FIG. 5 shows a second embodiment of the communication circuit holder according to the present invention. When the base material is bent and the first region is overlapped with the second region, C- of FIG. It is sectional drawing which follows a C line.
The communication circuit holder of this embodiment is different from the first embodiment described above in that the size of the space portion 14 is larger than that of the interposer 16, and the IC chip 17 and the interposer 16 are placed in the space portion 14. In addition, the conductive member 23 is disposed, and the depth of the concave portion 18 is made equal to the thickness of the inner peripheral end 15a and the outer peripheral end 15b of the circuit 15, and the inner peripheral end 15 and the outer peripheral end 15b of the circuit 15 are formed in the concave portion 18. It is a point that is arranged.

  In this way, since the thickness of the interposer 16 and the IC chip 17 can be accommodated within the thickness of the first region 11 of the base material 13, when the first region 11 is superimposed on the second region 12. Further, the occurrence of swelling due to the thickness of the interposer 16 and the IC chip 17 can be prevented. In addition, since the curvature of the circuit 15 disposed in the recess 18 is smaller than in the configuration shown in FIGS. 2 and 3, the deviation of the resonance frequency of the circuit 15 is smaller. Further, since the first region 11 of the substrate 13 does not directly touch the interposer 16 and the IC chip 17, the reliability of the IC chip 17 and the inner peripheral end of the circuit 15 of the IC chip 17 through the interposer 16 Connection stability to 15a and the outer peripheral end 15b can be ensured.

(4) Third Embodiment FIG. 6 is a schematic plan view showing a third embodiment of a communication circuit holder according to the present invention, where (a) is an overall view, and (b) is a diagram of (a). It is the figure which expanded the area | region D enclosed with the broken line.
In FIG. 6, reference numeral 30 is a communication circuit holder, 31 is a first region, 32 is a second region, 33 is a third region, 34 is a base material, 35 is a space portion, 36 is a circuit, 36 a is a circuit 36. The inner peripheral edge, 36b is the outer peripheral edge of the circuit 36, 37 is an interposer, 38 is an IC chip, 39 is a recess, 40 is an insulating member, 41 is a conductor, 43, 43A and 43B are short-circuited portions, and 44 and 45 are broken lines. Respectively.

  The communication circuit holder 30 of this embodiment is different from the first embodiment in that the base material 34 is arranged in the third region 33 and the third region 33 further connected to the second region 32. A short-circuit portion 43, the substrate 34 is bent along the fold lines 44, 45, the first region 31 is superimposed on the second region 32, and the first region 31 and the second region 32 are third. This is a point where the short circuit portion 43 is in electrical contact with the circuit 36 when the regions 33 are overlapped.

  That is, in the communication circuit holder 30, when the base material 34 is bent along the folding line 44 and the first region 31 is overlapped with the second region 32, the position of the straight line 46 shown in FIG. In addition, the end of the first region 31 is arranged so that the first region 31 does not overlap with a part of the circuit 36 arranged in the second region 32 and a part of the circuit 36 is exposed. When the first region 31 is overlapped with the second region 32, the base material 34 is bent along the folding line 45, and the third region 33 is overlapped with the first region 31 and the second region 32. In addition, as indicated by a two-dot chain line in FIG. 6B, the short-circuit portion 43 is in electrical contact with the exposed portion of the circuit 36.

  In the communication circuit holding body 30, as shown in FIG. 6B, even if the short-circuit portion 43A is in electrical contact with one row of the spiral-shaped circuit 36, the short-circuit portion 43B is not connected to the spiral-shaped circuit 36. Two or more rows may be in electrical contact, or a combination of both may be used. When the short-circuit portion 43A is in electrical contact with one row of the circuit 36, communication of the communication circuit holding body 30 is inhibited, and when the short-circuit portion 43B is in electrical contact with two or more rows of the circuit 36, the communication The circuit holder 30 is completely incapable of communication.

  In addition, when the base material 34 is bent along the folding line 45 and the third region 33 is overlapped with the second region 32, the region near the short-circuit portion 43 of the third region 33 and the circuit 36 of the second region 32. And the area between the broken line 45 are bonded via an adhesive member.

As the base material 34, the thing similar to said base material 13 is used.
As a material forming the circuit 36, the same material as that forming the circuit 15 is used.

As the interposer 37, the same one as the above interposer 16 is used.
As the IC chip 38, the same one as the above IC chip 17 is used.

  According to the communication circuit holding body 30 of this embodiment, as in the first embodiment, the external connection causes the electrical connection between the inner peripheral end 36a and the outer peripheral end 36b of the circuit 36 and the interposer 37, and It is possible to prevent the electrical connection between the interposer 37 and the IC chip 38 from being hindered. Further, when the third region 33 is superposed on the second region 32, communication of the communication circuit holding body 30 can be inhibited or disabled. Therefore, unauthorized use of information stored in the IC chip 38 can be prevented.

  Even in the communication circuit holder 30 of this embodiment, as shown in FIGS. 2 and 3, when the first region 31 is overlaid on the second region 32, the IC chip is placed in the space portion 35. Only 38 may be arranged. 4 and 5, the IC chip 38 and the interposer 37 may be disposed in the space 35 when the first region 31 is overlaid on the second region 32.

  The communication circuit holder of the present invention can also be applied to a concealing postcard or the like on which an IC chip is mounted.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic plan view which shows 1st embodiment of the circuit holder for communication which concerns on this invention, (a) is a general view, (b) is the figure which expanded the area | region A enclosed with the broken line of (a). . It is sectional drawing which follows the BB line of Drawing 1 (b), when a substrate is bent and the 1st field is piled up on the 2nd field. It is sectional drawing which follows the CC line of FIG.1 (b), when a base material is bent and a 1st area | region is overlapped on a 2nd area | region. 2nd Embodiment of the circuit holding body for communication which concerns on this invention is shown, When a base material is bent and a 1st area | region is piled up on a 2nd area | region, it follows the BB line of FIG.1 (b). It is sectional drawing. 2nd Embodiment of the circuit holding body for communication which concerns on this invention is shown, When a base material is bent and a 1st area | region is piled up on a 2nd area | region, it follows the CC line of FIG.1 (b). It is sectional drawing. It is a schematic plan view which shows 3rd embodiment of the circuit holder for communication which concerns on this invention, (a) is a general view, (b) is the figure which expanded the area | region D enclosed with the broken line of (a). .

Explanation of symbols

10, 30 ... communication circuit holder, 11, 31 ... first area, 12, 32 ... second area, 13, 34 ... base material, 14, 35 ... space part, 15, 36 ... Circuit, 15a, 36a ... Inner peripheral edge, 15b, 36b ... Outer peripheral edge, 16, 37 ... Interposer, 17, 38 ... IC chip, 18, 39 ...・ Recess, 19, 40 ... insulating member, 20, 41 ... conductor, 21, 44, 45 ... broken line, 22 ... gap, 23 ... conductive member, 43 ... short circuit part .

Claims (4)

A substrate having a first region and a second region connected to each other;
On the same surface of the base material, a space portion arranged in the first region, a spiral circuit arranged in the second region, each of an inner peripheral end and an outer peripheral end of the circuit, via an interposer An IC chip electrically connected, a recess disposed in the second region,
Comprising at least
When the substrate is bent and the first region is overlapped with the second region, the inner peripheral edge of the circuit and its vicinity area, the outer peripheral edge and its vicinity area, the interposer, and the IC chip Is disposed in a gap formed by the space and the recess. The base material includes a third region further connected to the second region, and a short-circuit portion disposed in the third region,
The communication circuit holder according to claim 1, wherein when the third region is superimposed on the second region, the short-circuit portion is in electrical contact with the circuit.   The circuit holder for communication according to claim 1, wherein the IC chip is disposed in the space portion. The communication circuit holder according to claim 1, wherein the IC chip and the interposer are arranged in the space.

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