JP6984362B2 - Inlet and non-contact communication medium - Google Patents

Description

The present invention relates to a non-contact communication medium. Further, the present invention relates to a non-contact communication medium provided with a sublimation type image receiving paper and an inlet used for the non-contact communication medium.

In the electromagnetic induction communication method generally used for non-contact communication media such as non-contact IC tags and non-contact IC cards, the magnetic field generated by the loop antenna on the reader / writer side is the coil built into the IC tag / IC card. Inductive electromotive force is generated by penetrating a closed loop circuit such as an antenna, and power is supplied to the IC chip to activate the IC chip and enable communication with a reader / writer.

The coil antenna embedded in the IC tag / IC card consists of a film antenna manufactured by adhering a metal foil on a resin film and patterning it by etching, etc., and a coil antenna in which a metal wire is wound multiple times in a coil shape. It is mainly used.

Communication standards for IC tags and IC cards that use the electromagnetic induction communication method include ISO / IEC15693, 18000-3, and 14443. In particular, ISO / IEC18000-3 is a communication standard used as an IC tag, but there are 18000-3 Mode2 and Mode3 capable of higher speed communication.

As an operation method that makes the best use of high-speed communication speed, it is assumed that batch reading is performed while attached to a document such as a medical record in a hospital, or batch reading is performed when clothes are gathered together.

In such an operational situation, it is expected that the antennas will be placed close to each other and the communication characteristics will be different from the original communication characteristics. Therefore, usually, the antenna with the resonance frequency shifted in advance is designed. Measures such as For example, Patent Document 1 provides a capacitance pattern for adjusting the resonance frequency, and if necessary, a part of the pattern is deleted to reduce the antenna area of the capacitance to prepare the resonance frequency. Is a method of adjusting by branching the antenna coil and changing the length of the antenna coil, a method of changing the chip mounting location, and in Patent Document 3, the length of the antenna is changed by sliding the position of the jumper wire. The method of adjusting by the above is disclosed.

Although it is possible to adjust the desired resonance frequency by these methods, especially when the surface is provided with an image receiving layer made of image receiving paper for printing / printing, the printing / printing can be performed by providing an adjustment pattern. Since the print quality is adversely affected, problems such as omission of printing in the aluminum pattern and the inability to obtain the desired color have occurred.

For example, in a non-contact IC card, the method of providing a capacitance pattern usually causes a wide capacitance pattern to be provided in the card surface, which greatly impairs the printing quality. Further, the method of branching the coil has a problem that the printing quality is impaired because the chip mounting location changes and the chip does not fit in the designated position.

Therefore, in a non-contact communication medium provided with an image receiving layer for printing and printing on the surface, a non-contact communication medium in which the resonance frequency adjusting pattern does not adversely affect the image receiving layer has been desired.

Japanese Unexamined Patent Publication No. 2007-048183 Japanese Unexamined Patent Publication No. 2006-217185 Japanese Unexamined Patent Publication No. 2010-021840

In view of the above circumstances, the present invention provides a non-contact communication medium having an image receiving layer for printing and printing on the surface and capable of adjusting the resonance frequency without adversely affecting the image receiving layer. The challenge is to provide.

As a means for solving the above problems, the first aspect of the present invention is an inlet of a non-contact communication medium having an antenna pattern on one surface of a base film and an IC chip having an input capacity of 0 pF on the other surface. And
The surface of the inlet on the IC chip side is provided with a pair of IC chip connection electrodes to which the IC chip is electrically connected.
The pair of IC chip connection electrodes are electrically connected to both ends of the antenna pattern formed on the back surface thereof, penetrating the base film, respectively.
One end of the electrode for connecting the IC chip is provided with an electrode for forming a capacitor on the IC chip side extending in parallel with the antenna pattern from the end.
From the end of the antenna pattern electrically connected to the other end of the IC chip connection electrode, a capacitor forming electrode on the antenna pattern side is provided so as to overlap the capacitor forming electrode on the IC chip side. It is an inlet of a non-contact communication medium characterized by being present.

The second aspect is the non-contact communication medium in which a paper-based layer is laminated on the front and back surfaces of the inlet according to the first aspect.
The surface of the inlet provided with the antenna pattern is provided with at least a backside paper via an adhesive layer.
On the surface of the inlet provided with the IC chip, at least an intermediate paper having an opening for flattening the convex portion of the IC chip via an adhesive layer, and a sublimation type print on the intermediate paper via the adhesive layer. It is a non-contact communication medium characterized by being provided with an image receiving paper.

The third aspect is the non-contact communication medium according to the second aspect, wherein the capacitor forming electrode is 0.3 to 3.0 times or less the line width of the antenna pattern. be.

The fourth aspect is the non-contact communication medium according to the second or third aspect, wherein the number of turns of the antenna pattern is 1 turn or more and 3 turns or less.

The fifth aspect is the non-contact communication medium according to any one of the second to fourth aspects, wherein the image receiving paper is provided with a vinyl chloride vinyl acetate copolymer resin layer. Is.

The sixth aspect is the non-contact communication according to any one of the second to fifth aspects, wherein the resonance frequency when 10 or more of the non-contact communication media are stacked is 10 MHz to 30 MHz. It is a medium.

The seventh aspect is any one of the second to sixth aspects, wherein the antenna pattern, the IC chip connection electrode, and the capacitor forming electrode are made of aluminum foil having a thickness of 5 μm to 15 μm. The non-contact communication medium described in 1.

The non-contact communication medium of the present invention includes an antenna pattern on one surface of the base film of the inlet, and a pair of electrodes for connecting IC chips on the other surface. Since the electrode on the IC chip side is provided with a capacitor forming electrode extended along the antenna pattern formed on the back surface thereof, the resonance frequency can be adjusted by changing the length of the electrode. It has become. Further, on the surface provided with the IC chip, an intermediate paper having an opening for flattening the convex portion of the IC chip and an image receiving paper having a vinyl acetate vinyl chloride copolymer resin layer on the intermediate paper are provided. Therefore, it is possible to provide a non-contact communication medium in which the surface of the image receiving paper is flattened and the resonance frequency can be adjusted in a state where the adverse effect on the print quality is minimized.

The top view seen from the surface on which the IC chip of the non-contact communication medium of the present invention is mounted is illustrated. Since the antenna pattern 2 is formed on the back surface, it is shown by a broken line. It is sectional drawing which shows an example of the inlet used for the non-contact communication medium of this invention, (a) is the sectional view cut by the cutting line AA' of FIG. 1 which cuts an IC chip in the lateral direction of an inlet. , (B) is a cross-sectional view in which one IC chip connecting electrode 5 in FIG. 1 is cut along the longitudinal direction of the inlet along a BB'cutting line, and (c) is for connecting the other IC chip in FIG. A cross-sectional view of the electrode 5 cut along the longitudinal direction of the inlet along the C—C ′ cutting line is illustrated. It is a layer structure explanatory drawing which illustrates in the state that each layer of the non-contact communication medium of this invention is not laminated.

<Inlet>
The inlet of the present invention is a non-contact communication medium inlet having an antenna pattern on one surface of a base film and an IC chip having an input capacity of 0 pF on the other surface.

A pair of IC chip connecting electrodes to which the IC chip is electrically connected is provided on the surface of the inlet on the IC chip side.

The pair of IC chip connection electrodes are electrically connected to both ends of the antenna pattern formed on the back surface thereof through the base film.

One end of the electrode for connecting an IC chip is provided with an electrode for forming a capacitor on the IC chip side extending in parallel with the antenna pattern from the end.

From the end of the antenna pattern electrically connected to the other end of the IC chip connection electrode, a capacitor forming electrode on the antenna pattern side is provided so as to overlap the capacitor forming electrode on the IC chip side. There is.

Next, the inlet used in the non-contact communication medium of the present invention will be described with reference to the drawings.
FIG. 1 shows an example of a top view of the non-contact communication medium 4 of the present invention as viewed from the side on which the IC chip 3 is mounted. An antenna pattern 2 is provided on the back surface, which is indicated by a broken line. Further, three cutting lines, AA', B-B', and C-C', are shown.

The cutting line AA'is a cutting line obtained by cutting the portion where the IC chip 3 is mounted on the IC chip connection electrode 5 in the vertical direction of the drawing, and the IC chip 3 and the antenna pattern 2 are cut.

The cutting line BB'is a cutting line that cuts one of the IC chip connection electrodes 5 and the antenna pattern 2 in a direction orthogonal to the cutting line AA'.

The cutting line C—C ′ is a cutting line parallel to the cutting line BB ′ and which cuts the other IC chip connection electrode 5, the antenna pattern 2, and the capacitor forming electrodes 6 and 6 ′.

FIG. 2A shows a cross-sectional view taken along the cutting line AA'of FIG.
As shown in FIG. 2A, the inlet 4 used in the non-contact communication medium of the present invention is provided with an antenna pattern 2 on one surface of the base film 1 and an IC chip having an input capacity of 0 pF on the other surface. It is equipped with 3. The IC chip 3 may be sealed with a sealing resin after mounting the bare chip flip chip. Further, it may be a package module or a chip size package.

FIG. 2B shows a cross-sectional view taken along the cutting line BB'of FIG.
As shown in FIG. 2B, a pair of IC chip connection electrodes 5 electrically connected to both ends of the antenna pattern 2 formed on the back surface of the inlet 4 provided with the IC chip 3 are electrically connected to each other. It is equipped with. The IC chip is electrically connected to and mounted on the pair of IC chip connection electrodes 5.

FIG. 2C shows a cross-sectional view taken along the cutting line C—C ′ of FIG.
As shown in FIG. 2C, a capacitor forming electrode 6 is provided at one end of the IC chip connection electrode 5. On the back surface of the capacitor forming electrode 6, a capacitor forming electrode 6'formed so as to overlap the capacitor forming electrode 6 via the base film 1 is provided to form a capacitor. The capacitance of this capacitor can be changed by the overlapping area of the capacitor forming electrode 6 and the capacitor forming electrode 6'. The capacitance can be adjusted by changing the line width and length of both electrodes, the relative arrangement of both electrodes, and the like.

As a method of changing the overlapping area of the capacitor forming electrode 6 and the capacitor forming electrode 6', the length, line width, relative arrangement of both, etc. may be set when forming these electrodes. .. In addition, after forming electrodes that have a constant length and line width relative to each other, the length and line width can be shortened or narrowed by removing the electrodes to make the capacitor static. The capacity can be changed.

<Manufacturing method of inlet>
The inlet 4 of the present invention can be manufactured by using a conventional manufacturing method.
First, the antenna pattern 2 is formed on one surface of the base film 1, and the IC chip connection electrode 5 and the capacitor forming electrode 6 are formed on the other surface.

The antenna pattern 2, the IC chip connection electrode 5, and the capacitor forming electrode 6 may be a metal foil such as an aluminum foil or a copper foil bonded to the base film 1 via an adhesive layer and patterned by photolithography technology. It may be a conductive pattern formed by printing a conductive ink using fine particles of silver or copper.

Further, after forming a copper thin film on the front and back surfaces by copper plating, patterning may be performed by a photolithography technique. In the photolithography technology, the metal foil is etched after forming the etching resist pattern. As a method for forming the etching resist pattern, a method of printing a non-photosensitive resist instead of the photolithography technology is used. You may use it. It may be used properly according to the specifications such as the line width of the pattern to be formed.

Further, only the capacitor forming electrode 6 may be manufactured by another material or a manufacturing method. For example, a method in which a metal foil is first bonded to the front and back surfaces of the base film 1 via an adhesive layer, then patterned by a photolithography technique or the like, and then conductive ink is printed to form a capacitor forming electrode 6. You may make it.

The method of electrically connecting the antenna pattern 2 formed on the front and back surfaces of the base film 1 and the IC chip connection electrode 5 is not particularly limited. For example, the antenna pattern 2 and the IC chip connection electrode 5 can be made conductive by caulking from the front and back surfaces using a rivet made of aluminum or copper, an eyelet and a washer, at a position where the IC chip connection electrode 5 is made conductive. Further, a method may be used in which the antenna pattern 2 and the IC chip connection electrode 5 are formed, holes for conducting them are formed at desired positions, and then the conductive ink is filled to conduct the conduction, or the conduction may be obtained by plating.

As described above, the antenna pattern 2, the IC chip connection electrode 5, and the capacitor forming electrode 6 are formed on the front and back surfaces of the base film 1, and then the IC chip 3 is connected to the IC chip connection electrode 5. As a means for connecting, soldering using low temperature solder, a conductive adhesive, an ACF (anisotropic conductive film), or the like can be used.

With the IC chip 3 connected, the resonance frequency of the inlet 4 is adjusted by adjusting the length of the capacitor forming electrode 6. The resonance frequency is adjusted by using the fact that the resonance frequency of the resonance circuit formed by the antenna pattern 2 of the inlet 4 and the capacitor forming electrode 6 is changed by changing the overlapping electrode area of the capacitor forming electrode 6. be able to.

The means for changing the length of the capacitor forming electrode 6 is not particularly limited, but for example, the length, the line width, and the overlapping state may be set at the time of electrode formation. Further, in order to shorten the lengths of the capacitors 6 and 6'for forming the capacitor, the metal foil may be mechanically removed. For example, a method of scraping a metal foil with a cutting blade or a file, laser processing, and the like can be mentioned. The resonance frequency can also be changed by making a notch in the capacitors 6 and 6'for forming the capacitor. As a means of making a notch, it is possible to make a notch by a method using a knife blade or a partial removal of a metal foil by laser processing.

As the base film 1, various resin films can be used. For example, PET (polyethylene terephthalate), PP (polypropylene), PE (polyethylene), PEN (polyethylene naphthalate), PES (polyether sulfone) and the like can be mentioned.

<Non-contact communication medium>
The non-contact communication medium of the present invention is a non-contact communication medium in which a paper-based layer is laminated on the front and back surfaces of the inlet of the present invention.

The side of the inlet provided with the antenna pattern is provided with backside paper, at least via an adhesive layer.

On the surface of the inlet provided with the IC chip, at least an intermediate paper having an opening for inserting and flattening a convex portion of the IC chip via an adhesive layer, and further sublimating via an adhesive layer on the intermediate paper. An image receiving paper for pattern printing is provided.

Next, the non-contact communication medium using the inlet described above will be described with reference to FIGS. 2 and 3.

The non-contact communication medium 10 of the present invention is a non-contact communication medium produced by laminating a paper-based layer on the front and back surfaces of the inlet 4.

At least the back surface paper 6 is provided on the surface of the inlet 4 provided with the antenna pattern 2 via the adhesive layer 9.

(Adhesive layer)
The adhesive layer 9 is not particularly limited. Any material may be used as long as the paper-based layer and the inlet 4 and the paper-based layer can be adhered to each other well. Further, any adhesive having excellent adhesiveness to a metal foil such as aluminum foil or copper foil and the IC chip 3 can be preferably used.

Further, on the surface of the inlet 4 provided with the IC chip 3, at least an intermediate paper 8 having an opening 11 for flattening the convex portion of the IC chip via the adhesive layer 9 and an adhesive layer on the intermediate paper 8 are provided. A sublimation type printing image receiving paper 8 is provided via 9.

(Intermediate paper)
The shape and dimensions of the opening 11 for flattening the convex portion of the IC chip are set according to the outer shape on the plane parallel to the plane of the base film 1 of the IC chip 3, and are formed on the intermediate paper 8. The thickness of the intermediate paper 8 is set to a thickness that can flatten the height of the convex portion of the IC chip 3.

The material of the intermediate paper 8 does not need to be particularly limited. A variety of paper and paper-based materials can be used. By using the intermediate paper 8 provided with the opening 11 as described above, it is possible to flatten the convex portion of the IC chip.

Further, the intermediate paper 8 has the flexibility to absorb the unevenness formed by the antenna pattern 2 and the capacitor forming electrode 6. Therefore, the surface of the sublimation type printing image receiving paper bonded on the intermediate paper 8 via the adhesive layer 11 is flattened.

(Image receiving paper for sublimation printing)
Further, it is preferable that the surface of the image receiving paper 8 for sublimation printing is coated with a vinyl chloride vinyl acetate copolymer resin layer. The vinyl chloride vinyl acetate copolymer resin layer is a layer for exhibiting a function as an image receiving paper for sublimation type printing.
Further, the material of the image receiving paper 8 for sublimation printing is not particularly limited. A variety of paper and paper-based materials can be used.

(Back side paper)
The back surface paper 7 is not particularly limited as long as it is a paper-based material.

Further, the capacitor forming electrode 6 is preferably 0.3 times or more and 3.0 times or less the line width of the antenna pattern 2. If it is less than 0.3 times, the overlapping area of the front and back is too small, and if it exceeds 3.0 times, the overlapping will extend to the adjacent coil pattern, which may have an unexpected effect on the electrical characteristics. be.

Inductance value is insufficient for less than one turn,
Since the resonance frequency value is too high, even if it is adjusted by the capacitor pattern of the present invention,
It becomes impossible to aim at the vicinity of 13.56 MHz, resulting in communication failure.
Inductance value is too high for 3 turns or more,
When the cards are stacked due to the low resonance frequency value of the card alone,
This is because the resonance frequency value becomes lower than 13.56 MHz, resulting in poor communication.

Further, the number of turns of the antenna pattern 2 is preferably 1 turn or more and 3 turns or less. If it is less than one turn, the inductance value is insufficient and the resonance frequency value is too high. Therefore, even if the capacitor pattern of the present invention is adjusted, it becomes impossible to aim at the vicinity of 13.56 MHz, resulting in communication failure. Further, if the number of turns exceeds 3, the inductance value is too high, and the resonance frequency value of the card alone becomes low. Therefore, when the cards are stacked, the resonance frequency value becomes lower than 13.56 MHz, resulting in communication failure. ..

Further, it is preferable that the resonance frequency when 10 or more non-contact communication media 10 of the present invention are stacked is 10 MHz to 30 MHz. If the resonance frequency is less than 10 MHz, the electric field strength is most strengthened in the vicinity of 13.56 MHz by the Radio Law in the above-mentioned reader / writer communication standards (ISO / IEC15693, 14443, 18000-3), which is not preferable. The same applies when the frequency exceeds 30 MHz.

Further, the antenna pattern 2, the connection electrode 5 of the IC chip, and the capacitor forming electrode 6 are preferably made of aluminum foil having a thickness of 5 μm to 15 μm. If the thickness is less than 5 μm, roll tension during card processing and shrinkage when the adhesive is applied may occur, and depending on the usage environment of the end user, disconnection may occur. If the thickness exceeds 15 μm, the card image will be received. The aluminum pattern is noticeably raised on the surface, which is not preferable in terms of appearance. Since the thickness of the aluminum foil has no effect on the communication characteristics and communication quality of the IC tag, select a thickness that has a certain degree of durability and does not impair the quality of appearance.

<Manufacturing method of non-contact communication medium>
The non-contact communication medium of the present invention can be manufactured by laminating a paper-based layer on the front and back surfaces of the inlet 4 of the present invention via an adhesive layer.

First, the back surface paper is attached to the antenna pattern 2 side of the inlet 4 via the adhesive layer 11.

Next, the intermediate paper 8 having the opening 12 for inserting and smoothing the convex portion formed by the IC chip 3 is attached to the IC chip 3 side of the inlet 4 via the adhesive layer 11. At the time of bonding, the opening 12 must be aligned with the convex portion formed by the IC chip 3 and then bonded.

Next, the sublimation type printing image receiving paper 9 is bonded onto the intermediate paper 8 via the adhesive layer 11.

In the non-contact communication medium 10 manufactured as described above, the convex portion formed by the IC chip 3 is flattened, and the frequency adjusting capacitor is located in the vicinity of the antenna pattern 2 formed around the non-contact communication medium 10. Since it is formed, the surface of the sublimation type printing image receiving paper 9 becomes a flat surface, and the resonance frequency can be adjusted without adversely affecting the sublimation type printing image receiving paper 9 which is the image receiving layer. It can be the medium 10. Moreover, the resonance frequency of the non-contact communication medium 10 can be adjusted by the frequency adjusting capacitor.

1 ... Base film 2 ... Antenna pattern 3 ... IC chip 4 ... Inlet 5 ... IC chip connection electrode 6 ... Capacitor forming electrode 7 ... Backside paper 8 ... Intermediate Paper 9 ... Sublimation type printing image receiving paper 10 ... Non-contact communication medium 11 ... Adhesive layer 12 ... Opening

Claims (7)

An inlet of a non-contact communication medium having an antenna pattern on one side of a base film and an IC chip having an input capacity of 0 pF on the other side.
The surface of the inlet on the IC chip side is provided with a pair of IC chip connection electrodes to which the IC chip is electrically connected.
The pair of IC chip connection electrodes are electrically connected to both ends of the antenna pattern formed on the back surface thereof, penetrating the base film, respectively.
One end of the electrode for connecting the IC chip is provided with an electrode for forming a capacitor on the IC chip side extending in parallel with the antenna pattern from the end.
From the end of the antenna pattern electrically connected to the other end of the IC chip connection electrode, a capacitor forming electrode on the antenna pattern side is provided so as to overlap the capacitor forming electrode on the IC chip side. An inlet of a non-contact communication medium characterized by being present. In a non-contact communication medium in which a paper-based layer is laminated on the front and back surfaces of the inlet according to claim 1.
The surface of the inlet provided with the antenna pattern is provided with at least a backside paper via an adhesive layer.
On the surface of the inlet provided with the IC chip, at least an intermediate paper having an opening for inserting and flattening a convex portion of the IC chip via an adhesive layer, and further sublimating via an adhesive layer on the intermediate paper. A non-contact communication medium characterized by being provided with an image receiving paper for pattern printing. The non-contact communication medium according to claim 2, wherein the line width of the capacitor forming electrode is 0.3 to 3.0 times the line width of the antenna pattern. The non-contact communication medium according to claim 2 or 3, wherein the number of turns of the antenna pattern is 1 to 3 turns. The non-contact communication medium according to any one of claims 2 to 4, wherein the image receiving paper is provided with a vinyl chloride vinyl acetate copolymer resin layer. The non-contact communication medium according to any one of claims 2 to 5, wherein the resonance frequency when 10 or more non-contact communication media are stacked is 10 MHz to 30 MHz. The non-contact communication medium according to any one of claims 2 to 6, wherein the antenna pattern, the IC chip connection electrode, and the capacitor forming electrode are made of aluminum foil having a thickness of 5 μm to 15 μm.

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