JP6048740B2 - Circuit board for non-contact type IC card or non-contact type IC tag and non-contact type IC card or non-contact type IC tag - Google Patents

Description

  The present invention relates to a circuit board for a non-contact type IC card or a non-contact type IC tag, and a non-contact type IC card or a non-contact type IC tag that transmit and receive information and the like in a non-contact manner by an information reading / writing device.

  In recent years, contactless IC cards or contactless IC tags are widely used in a wide range of industries such as cash cards (bank cards), credit cards, employee ID cards, prepaid cards used for transportation services such as railways and buses, and amusement services. It has been introduced and has been used in various fields from everyday life to business. Furthermore, it has begun to be used in fields with high security such as basic resident register cards and driver's license cards used for public institution services. For this reason, various IC chips having different communication protocols, security functions, memory capacities, and the like have been put on the market as IC chips mounted on non-contact IC cards. On the other hand, manufacturers of non-contact type IC cards or non-contact type IC tags can provide a wide variety of non-contact type IC cards or non-contact type IC tags equipped with the IC chip with low cost and short delivery time. It is desirable.

  In order to manufacture a wide variety of non-contact type IC cards or non-contact type IC tags on which such IC chips are mounted, it is necessary to prepare circuit boards corresponding to the various IC chips. This is because the chip size, bump position, internal capacitance, etc. are different for each IC chip, and the optimum circuit layout that determines the impedance on the antenna side, such as the mounting terminal position, antenna size, number of turns, capacitor area, etc., is different. It is. Here, the circuit board is a circuit board having an antenna patterned by an etching or printing system, and is the most widely applied system as a circuit board for a non-contact IC card or a non-contact IC tag. It is. Therefore, it is necessary to manufacture a mask or a plate for forming a pattern for each circuit board corresponding to various IC chips, and the initial cost for each type is generated.

  Therefore, in order to provide a circuit board that can be used as a common material corresponding to several types of IC chips, a method in which the capacitor area can be changed with one type of circuit board and an optimum resonance frequency can be obtained for each IC chip is disclosed in Patent Document 1. It is described in. According to Patent Document 1, the card base has a planar adjustment capacitor composed of a plurality of plane patterns having the same unit adjustment amount of capacitance as the antenna, and the unit adjustment amount of the plane pattern is cut stepwise. Thus, there is shown a non-contact type IC card characterized in that a good communication state can be secured by adjusting the resonance frequency by reducing the capacitor capacity.

Japanese Patent No. 4286777

  However, in the non-contact type IC card of Patent Document 1, it is shown that the circuit board is cut using a cutting tool such as a cutter or a cutting die in order to adjust the capacitor capacity. In the step of forming into, for example, when roll laminating, there is a possibility that the circuit board breaks due to tension or pressure, and that the surface of the cut portion is uneven after lamination. Also, if an adhesive or adhesive material is laminated on one side of the circuit board for bonding to the card skin material, problems such as adhesive or adhesive material seeping out from the opposite surface and adhering to the laminate roll may occur. Is also possible.

  According to the present invention, any one of two or more types of IC chips having different bump positions and internal capacitances can be mounted, and an optimum resonance frequency for various IC chips to perform communication operation can be obtained. An object of the present invention is to provide a circuit board for a non-contact IC card or a non-contact IC tag, and a non-contact IC card or a non-contact IC tag.

The present invention is arranged in parallel on an insulating substrate, an antenna circuit disposed on one surface side and the other surface side of the insulating substrate, and a part of the antenna circuit disposed on the one surface side, Non-contact having a counter terminal portion corresponding to two or more kinds of IC chip bump positions and a capacitor pattern portion arranged in parallel with the counter terminal portion in a part of the antenna circuit arranged on the one surface side A circuit board for an IC card or a non-contact IC tag, wherein the capacitor pattern portion is disposed on one surface side of the insulating substrate, and on the other surface side of the insulating substrate. This is a circuit board for a non-contact IC card or a non-contact IC tag having one planar pattern B arranged so as to overlap with the conductive tape on one surface side in plan view.
In the present invention, it is arranged in parallel in a part of the antenna circuit and has the opposing terminal portion corresponding to two or more types of IC chip bump positions. Therefore, not only one type of IC chip but also different types of bumps having different bump positions. Since an IC chip can be mounted, two or more types of IC chips can be used as one antenna circuit. For this reason, any one type arbitrarily selected from two or more types of IC chips having different bump positions can be mounted. In addition, one capacitor pattern portion is disposed so as to overlap the conductive tape disposed on one surface side of the insulating substrate and the conductive tape on one surface side on the other surface side of the insulating substrate. Therefore, an optimum resonance frequency for the mounted IC chip to perform a communication operation can be obtained by applying the conductive tape to an area predetermined by the mounted IC chip. be able to.

In the present invention, the capacitor pattern portion further includes two or more isolated planar patterns A disposed on one surface side of the insulating substrate, and the other surface side of the insulating substrate. One planar pattern B arranged so as to overlap with the conductive tape on the one surface side in plan view has two or more isolated planar patterns on the one surface side on the other surface side of the insulating substrate. A non-contact arrangement in which the conductive tape arranged on the one surface side of the insulating substrate is disposed so as to overlap with A in plan view and electrically connects the two or more isolated planar patterns A A circuit board for an IC card or a non-contact IC tag.
As a result, two or more planar patterns A that are isolated on the surface side are connected by connecting a predetermined number of conductive tapes to the IC chip to be mounted so that the mounted IC chip can perform communication operation. The optimum resonance frequency for the purpose can be obtained.

  The present invention provides a circuit board for any of the above non-contact type IC cards or non-contact type IC tags, and an IC mounted on any of the opposing terminal portions corresponding to the two or more types of IC chip bump positions. A non-contact IC card or a non-contact IC tag having a chip.

  According to the present invention, any one of two or more types of IC chips having different bump positions and internal capacitances can be mounted, and an optimum resonance frequency for various IC chips to perform communication operation can be obtained. It is possible to provide a circuit board for a non-contact type IC card or a non-contact type IC tag and a non-contact type IC card or a non-contact type IC tag.

The surface side of the circuit board for the non-contact type IC card or the non-contact type IC tag of the first embodiment is shown. The back side of the circuit board for the non-contact type IC card or the non-contact type IC tag of the first embodiment is shown. The enlarged view of the opposing terminal part of the surface side of the circuit board for the non-contact-type IC card of 1st Embodiment or a non-contact-type IC tag is shown. The surface side of the circuit board for the non-contact type IC card or the non-contact type IC tag of the second embodiment is shown. The back surface side of the circuit board for non-contact type IC cards or non-contact type IC tags of a 2nd embodiment is shown. The surface side of the circuit board for the non-contact type IC card or the non-contact type IC tag of the second embodiment is shown. The surface side of the circuit board for the non-contact type IC card or the non-contact type IC tag of the second embodiment is shown. The enlarged view of the capacitor | condenser pattern part of the surface side of the circuit board for the non-contact-type IC card of 2nd Embodiment or a non-contact-type IC tag is shown.

  Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings. The technical idea of the present invention does not specify the material, shape, structure, arrangement, etc. of the component parts as follows. Various modifications can be made within the technical scope described in the claims.

(First embodiment)
1 to 3 show a schematic configuration of a circuit board 11 for a non-contact type IC card or a non-contact type IC tag according to the first embodiment. FIG. 1 is a plan view of the entire circuit board 11 for a non-contact type IC card or a non-contact type IC tag as viewed from the front side (one side), and FIG. 2 is for a non-contact type IC card. Or it is the top view which looked at the whole circuit board 11 for non-contact-type IC tags from the back surface side (the other surface side), and FIG. 3 is the enlarged plan view which looked at the opposing terminal part 3 of FIG. 1 from the surface side. It is.

  As shown in FIGS. 1 to 3, a circuit board 11 for a non-contact type IC card or a non-contact type IC tag according to the first embodiment is formed on an insulating board 1 and the surface side of the insulating board 1. Antenna circuit 2, the opposing terminal portion 3 corresponding to two or more kinds of IC chip bumps connected in parallel so as to separate a part of the pattern of the antenna circuit 2, and a part of the antenna circuit 2 And a capacitor pattern part 4 formed in parallel with the opposing terminal part 3, and a through-hole part A6 on the surface side formed in a part of the outermost peripheral part and innermost peripheral part of the antenna circuit 2 And have. The capacitor pattern part 4 is disposed so that the conductive tape 5 attached to the front surface side of the insulating substrate 1 and the back surface side of the insulating substrate 1 overlap the conductive tape 5 on the front surface side. Plane pattern B4b. The one plane pattern B4b is branched from a part of the jumper line 7 arranged on the back side. Further, the through-hole portion B9 on the back surface side is disposed at a position overlapping the through-hole portion A6 on the front surface side at both ends of the jumper wire 7. In the present embodiment, the “capacitor pattern portion 4” refers to a region where one plane pattern B4b on the back surface side is provided and a region on the front surface side of the insulating substrate 1 corresponding thereto.

  The insulating substrate 1 is not particularly limited as long as it has an insulating property and can be a base substrate on which the antenna circuit 2 can be formed. For example, PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) ), A film substrate such as polyimide can be used.

  The antenna circuit 2 is made of a metal thin film such as copper or aluminum, or a conductive paint such as silver paste. As shown in FIG. 1, when the antenna circuit 2 circulates in a spiral shape, a jumper wire 7 for straddling a part of the antenna circuit 2 is necessary to form a closed circuit. As a wiring method of the jumper wire 7, a method of forming the through-hole portions A 6 and B 9 in the insulating substrate 1 and forming the jumper wire 7 on the back surface side of the insulating substrate 1 is used.

  As shown in an enlarged view in FIG. 3, the counter terminal portion 3 is a connection terminal for connecting to a bump portion (not shown) formed on the IC chip 10, and matches the bump position of various IC chips 10. The terminal shape is formed in Since bump positions differ depending on the various IC chips 10, two or more types of opposing terminal portions 3 can be provided in parallel so that the various IC chips 10 can be connected. In addition, as a method of electrically connecting the bump portion and the counter terminal portion 3, a connection method using an anisotropic conductive adhesive, a method such as ultrasonic bonding, or the like is used.

  Next, as with the antenna circuit 2, the back side flat pattern B4b is made of a metal thin film such as copper or aluminum, or a conductive paint such as silver paste. The plane pattern B4b on the back side is for generating electrostatic capacitance in the capacitor pattern portion 4 together with the conductive tape 5 so that an optimal resonance frequency for the IC chip 10 to be mounted to perform a communication operation can be obtained. Is.

Here, when the optimum resonance frequency is f ₀ , the inductance of the antenna circuit 2 is L, the internal capacitance of the IC chip 10 is C _i , and the capacitance of the capacitor pattern unit 4 is C ₀ , the following equation (1) Can be represented.
f ₀ = 1 / [2 × π × {L × (C _i + C ₀ )} ^1/2 ] (1)
L, because the external size and number of turns of the antenna circuit 2 is determined by the distance between lines or the like, does not change in one antenna circuit pattern, C _i is the internal capacitance varies by the IC chip 10 to be mounted. Therefore, in order to obtain an optimum resonance frequency even when various IC chips 10 having different internal capacitances are mounted, it is necessary to adjust the capacitance C ₀ of the capacitor pattern portion 4.

The capacitance C ₀ generated by the capacitor pattern portion 4 is the plane of the conductive tape 5 and the back surface side plane pattern B 4 b disposed on the opposite surface side capacitor pattern portion 4 formed on the front and back of the insulating substrate 1. It is determined by the overlapping area S in view, the distance d between patterns, and the relative dielectric constant εr depending on the material of the insulating substrate 1, and can be expressed by the following equation (2).
C ₀ = ε _r × S / d (2)
epsilon _r and d, it can not be one of the insulating adjust the substrate 1 can be adjusted by S.
As the method, as shown in FIG. 1, by adjusting the area of the conductive tape 5 to be attached to a part of the capacitor pattern portion 4 on the front surface side, the conductive tape 5 on the front surface side and the flat surface on the back surface side are adjusted. The area S where the pattern B4b overlaps in plan view can be adjusted. That is, the capacitance C ₀ of the capacitor pattern portion 4 can be adjusted.

  From the above, the circuit board 11 for the non-contact type IC card or the non-contact type IC tag according to the first embodiment is arbitrarily selected from any two or more types of IC chips 10 having different bump positions and internal capacitances. In addition, it is possible to obtain an optimum resonance frequency for various IC chips 10 to perform communication operation.

(Second Embodiment)
4 to 8 show a schematic configuration of the circuit board 11 for the non-contact type IC card or the non-contact type IC tag according to the second embodiment. 4, 6, and 7 are plan views of the entire circuit board 11 for a non-contact IC card or a non-contact IC tag as viewed from the front surface side (one surface side). FIG. 8 is a plan view of the entire circuit board 11 for a non-contact type IC card or a non-contact type IC tag as viewed from the back side (the other side), and FIG. 8 shows the capacitor pattern portion 4 of FIG. It is the enlarged plan view seen from.

  As shown in FIGS. 4 to 8, the circuit board 11 for the non-contact type IC card or the non-contact type IC tag according to the second embodiment is formed on the insulating substrate 1 and the surface side of the insulating substrate 1. Antenna circuit 2, the opposing terminal portion 3 corresponding to two or more kinds of IC chip bumps connected in parallel so as to separate a part of the pattern of the antenna circuit 2, and a part of the antenna circuit 2 And a capacitor pattern part 4 formed in parallel with the opposing terminal part 3, and a through-hole part A6 on the surface side formed in a part of the outermost peripheral part and innermost peripheral part of the antenna circuit 2 And have. The capacitor pattern part 4 is disposed so that the conductive tape 5 attached to the front surface side of the insulating substrate 1 and the back surface side of the insulating substrate 1 overlap the conductive tape 5 on the front surface side. And two or more isolated planar patterns A4a arranged on the surface side of the insulating substrate 1. The one plane pattern B4b is branched from a part of the jumper wire 7 arranged on the back surface side, and two or more isolated plane patterns A4a on the front surface side and a plane view are formed on the back surface side of the insulating substrate 1. Arranged to overlap. A through-hole part B9 on the back surface side is arranged at a position overlapping the through-hole part A6 on the front surface side at both ends of the jumper wire 7. The conductive tape 5 disposed on the surface side of the insulating substrate 1 is disposed so as to electrically connect the two or more isolated planar patterns A4a. In the present embodiment, the “capacitor pattern portion 4” refers to a region provided with one plane pattern B4b on the back surface side and a region on the front surface side of the insulating substrate 1 corresponding thereto.

As shown in FIG. 4, FIG. 6, FIG. 7, and FIG. 8, the capacitor pattern portion 4 on the surface side is formed as two or more isolated flat patterns A4a, and the conductive tape 5 is pasted and connected. By selecting the number of patterns A4a, it is possible to adjust the area S where the planar pattern A4a on the front surface side and the planar pattern B4b on the back surface side overlap in plan view. That is, the capacitance C ₀ of the capacitor pattern portion 4 can be adjusted.

  As described above, the circuit board 11 for the non-contact IC card or the non-contact IC tag according to the second embodiment is arbitrarily selected from any two or more IC chips 10 having different bump positions and internal capacitances. In addition, it is possible to obtain an optimum resonance frequency for various IC chips 10 to perform communication operation.

  Hereinafter, although the Example of this invention is described using FIGS. 4-8, this invention is not limited to this Example.

First, as shown in FIG. 4, an antenna circuit 2 and three types of opposing terminal portions are formed by adhering an aluminum foil having a thickness of 9 μm to one side of a transparent PET having a thickness of 50 μm to be an insulating substrate 1 and spirally turning by etching. 3 and the surface side plane pattern A4a were formed (the conductive tape 5 and the IC chip 10 are shown in FIG. 4, but the conductive tape 5 and the IC chip 10 are not disposed at this time). . The inductance L was designed to be 2 μH depending on the outer size of the antenna circuit 2, the number of turns, the distance between lines, and the like. The three types of opposing terminal portions 3 have terminal shapes on which three types of IC chips 10 of NXP's IC chips 10 “NTAG203”, “SL2ICS20”, and “MF1S5001” (both are trade names) can be mounted. Further, the planar pattern A4a on the front surface side has C ₁ = 12.9 pF, C ₂ = 28.3 pF, and C ₃ = 3.3 so that the optimum resonance frequency for operating various IC chips 10 can be obtained by the following formula. The area for forming three capacitors with a capacitance of 0 pF was used.

The design procedure is as follows.
Inductance L of the antenna circuit 2: 2 μH
Internal capacitance of “NTAG203”: 50pF
Optimal resonance frequency of “NTAG203”: 14.2 MHz
Internal capacitance of “SL2ICS20”: 23.5 pF
Optimal resonance frequency of “SL2ICS20”: 14.0 MHz
Internal capacitance of “MF1S5001”: 16.1 pF
Optimum resonance frequency of “MF1S5001”: 14.5 MHz
The capacitance of the capacitor pattern portion 4 is
Formula (1) f ₀ = 1 / [2 × π × {L × (C _i + C ₀ )} ^1/2 ]
C ₀ = {1 / (2 × π × f ₀ ) ² / L} −C _i (3)
Is required. as a result,
C ₀ = 12.9 pF when “NTAG203” is mounted
C ₀ = 41.2 pF when “SL2ICS20” is mounted
C ₀ = 44.2 pF when “MF1S5001” is mounted
It became. here,
When mounting “NTAG203”, one plane pattern A4a (C ₁ )
"SL2ICS20" during mounting two planar pattern A4a _{(C 1,} C 2)
When the “MF1S5001” is mounted, three plane patterns A4a (C ₁ , C ₂ , C ₃ )
When connecting,
C ₁ = 12.9 pF
C ₁ + C ₂ = 41.2 pF
C ₁ + C ₂ + C ₃ = 44.2 pF
Than,
C ₁ = 12.9 pF
C ₂ = 28.3 pF
C ₃ = 3.0 pF
It becomes.

  Next, as shown in FIG. 5, through-hole portions A6 are provided in a part of the outermost peripheral portion and the innermost peripheral portion of the antenna circuit 2, and then the jumper wires 7 and silver paste conductive paint are formed on the back side of the insulating substrate 1 and A back side flat pattern B4b was formed by a printing method, and was electrically connected to the antenna circuit 2 on the front side. Next, as shown in FIG. 4, in order to mount any one of the three types of IC chips 10, anisotropic conductive adhesion is applied to the tip of one type of opposite terminal portion 3 corresponding to the IC chip 10. An agent (not shown) was potted, the IC chip 10 was mounted thereon, and the counter terminal portion 3 and the IC chip 10 were connected by thermocompression bonding. Next, as shown in FIG. 4, depending on the type of the mounted IC chip 10, the conductive tape 5 is affixed so that the capacitance of the capacitor pattern portion 4 obtained above is obtained, and the surface side plane pattern A <b> 4 a is predetermined. Number connected.

  Here, a plan view of the circuit board 11 on which “NTAG203” is mounted is shown in FIG. 4, a plan view of the circuit board 11 on which “SL2ICS20” is mounted is shown in FIGS. 6 and 8, and the circuit board 11 on which “MF1S5001” is mounted. A plan view is shown in FIG.

As a result of evaluating the resonance frequency of the circuit board 11 for the non-contact type IC card or non-contact type IC tag of Example 3 manufactured as described above with a network analyzer, the optimal resonance frequency is obtained as follows. It was proved that the information reading and writing device can stably communicate.
Resonant frequency of circuit board 11 when “NTAG203” is mounted: 14.22 MHz
Resonant frequency of circuit board 11 when “SL2ICS20” is mounted: 14.01 MHz
Resonant frequency of the circuit board 11 when “MF1S5001” is mounted: 14.48 MHz

DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 2 ... Antenna circuit 3 ... Opposite terminal part 4 ... Capacitor pattern part 4a ... Planar pattern A
4b ... Plane pattern B
5 ... Conductive tape 6 ... Through-hole part A
7 ... Jumper wire 9 ... Through-hole part B
10 ... IC chip 11 ... Circuit board for non-contact type IC card or non-contact type IC tag

Claims (3)

An insulating substrate, an antenna circuit disposed on one surface side and the other surface side of the insulating substrate, and a part of the antenna circuit disposed on the one surface side are arranged in parallel, and two or more kinds A non-contact IC card having a counter terminal portion corresponding to an IC chip bump position and a capacitor pattern portion arranged in parallel with the counter terminal portion in a part of the antenna circuit arranged on the one surface side, or A circuit board for a non-contact IC tag,
The capacitor pattern portion is disposed so as to overlap the conductive tape disposed on one surface side of the insulating substrate and the conductive tape on the one surface side on the other surface side of the insulating substrate. 1 plane pattern B
A circuit board for a non-contact IC card or a non-contact IC tag. In claim 1,
The capacitor pattern portion further includes two or more isolated planar patterns A disposed on one surface side of the insulating substrate,
One planar pattern B arranged on the other surface side of the insulating substrate so as to overlap the conductive tape on the one surface side in plan view is formed on the other surface side of the insulating substrate on the one surface side. Arranged so as to overlap with two or more isolated planar patterns A in plan view,
A non-contact IC card or non-contact IC tag in which a conductive tape disposed on one side of the insulating substrate is disposed so as to electrically connect the two or more isolated planar patterns A Circuit board.   A circuit board for a non-contact type IC card or a non-contact type IC tag according to claim 1 or 2, and an IC chip mounted on one of the opposing terminal portions corresponding to the two or more types of IC chip bump positions. A non-contact IC card or a non-contact IC tag.

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