JP2002280252A - Capacitor, and manufacturing method of capacitor, and id tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a capacitor which has advantages such as that the its own formation being easy, that desired capacity properties can be obtained, that it can suppress waste of materials, that it can prevent the adverse effects to other circuit elements of itself, and others, and an ID tag. SOLUTION: This capacitor has a first capacitor electrode provided on an insulating substrate, a connector terminal provided on the same plane as the insulating substrate, a metal tape having an insulating adhesive layer at its one side and having a metal layer to serve as a second capacitor electrode this insulating adhesive layer and being joined covering the first capacitor electrode and the connector terminal, and an electrical continuity means for electrically connecting the connector terminal with the metal layer part which is to serve as the second capacitor electrode above it. This ID tag is one with this capacitor applied.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a capacitor, a method for manufacturing a capacitor, and an ID tag.

[0002]

2. Description of the Related Art In recent years, an ID tag (also called an IC card) has been used for various processes such as personal authentication, product management, and physical distribution. In particular,
The use of non-contact type ID tags is increasing.

[0003] Some non-contact type ID tags obtain the operating power supply from a built-in battery, while others obtain the operation power from energy such as radio waves or magnetic flux for interrogation from an interrogator to the ID tag. Extracts necessary energy using an LC resonance circuit.

FIG. 4 is an explanatory diagram of an example of a conductive pattern in a conventional non-contact type ID tag 30 having an LC resonance circuit.

In the plan view shown in FIG. 4A, a multiple loop coil 1 (L component) and a capacitor 22 (C component) are connected in parallel via connection terminals 3U and 3L.
An LC parallel resonance circuit is configured. Although not shown in FIG. 4A, an IC chip for performing predetermined processing is provided so as to be connected between the connection terminals 3U and 3L.

The multi-loop coil 1 and the capacitor 22 are provided on an insulating substrate 25 (see FIG. 4B) as a conductive pattern. The conductive pattern may be formed by any method. In the following, it is assumed that a copper foil having a thickness of 35 μm is formed on the insulating substrate 25 using an adhesive so that the adhesive layer has a thickness of 20 μm. The insulating substrate 25 is, for example, polyethylene terephthalate (PET) having a thickness of 50 μm.

[0007] The multiple loop coil 1 includes an insulating substrate 25.
It is provided on one surface (hereinafter, referred to as an upper surface) of the substrate (see FIG. 4B) with an adhesive layer interposed therebetween. The multiple loop coil 1
The pattern portion 4 indicates an overpass where silver paste or the like is provided on the insulating resist layer, and one end of the coil 1 is connected to the connection terminal 3L without shorting each turn of the coil 1. It is for.

On the other hand, as shown in FIG. 4B, two electrodes (electrode patterns) 2U and 2L of the capacitor 22 are bonded to the upper and lower surfaces of the insulating substrate 25 with the insulating substrate 25 interposed therebetween. It is provided via layers 6U and 6L.

Although not clearly shown in FIG. 4, one connection terminal 3L has a through hole connecting the upper and lower surfaces of the insulating substrate 25, and is connected to the capacitor 22 via the conductive pattern 7 extending on the lower surface. It is connected to the lower electrode 2L.

FIG. 5 is an explanatory view of another example of the conductive pattern in the conventional non-contact ID tag 30 in which the size of the circuit is reduced, and the same reference numerals are given to the same and corresponding parts as in FIG. Is shown. The biggest difference from the one shown in FIG. 4 is that the insulating substrate 25 is formed of, for example, polyimide (PI) having a thickness of 25 μm.

[0011]

However, conventional non-contact type ID tags and capacitors have the following problems.

As shown in FIG. 4 and FIG.
Since the two electrodes (electrode patterns) 2U and 2L are provided with the insulating substrate 25 interposed therebetween, when the thickness of the insulating substrate 25 is increased, the electrodes 2U and
The area of L was considerably large.

In order to realize such a large-area capacitor 22 in a product called an ID tag, which is required to be miniaturized, as shown in FIG. 4 and FIG. Without providing the capacitor 22 in the part S,
Since the capacitor 22 provided in the central portion S captures a part of the magnetic flux that the multiple loop coil 1 should originally capture,
The function of the multiple loop coil 1 was impaired. as a result,
The communicable distance of the ID tag 30 is shortened.

In order to obtain a predetermined capacity by suppressing the area of the electrodes 2U and 2L, it is necessary to reduce the thickness of the insulating substrate 25, and even if the material of the insulating substrate 25 is thin, the conductive pattern Are limited to those that can withstand handling (for example, transportation and positioning) in various processes such as a forming process. For example, when the thickness of the insulating substrate 25 is set to 25 μm as in the case of the ID tag 30 shown in FIG. 5, polyimide (PI) is applied. However, PI is more expensive than PET, and It also raises costs.

Further, conventionally, the capacitor 22
For this purpose, the conductive pattern forming process must be performed on both surfaces of the insulating substrate 25. for that reason,
Manufacturing man-hours and time were considerably large. Also,
When the conductive pattern is to be formed by etching, only the electrode 2L of the capacitor 22 is formed.
With respect to the lower surface of the insulating substrate 25, a large amount of conductive material is removed by etching, and the waste of material is increased.

Furthermore, each electrode 2 of the capacitor 22
Since U and 2L are provided on both sides of the insulating substrate 25,
This may cause the thickness t of the D tag 30 to increase.

The electrodes 2U, 2L of the capacitor 22
Is formed in a separate process, the positional relationship between the two electrodes 2U and 2L may deviate from a desired relationship, and the capacitance may slightly differ from the desired capacitance. To compensate for such a capacitance shift, a conductive material must be delicately added to the insulating substrate 25 by manual work or the like, which is complicated.

According to the present invention, a capacitor can be easily formed, and desired characteristics can be obtained as characteristics of the capacitor.
A capacitor, a method of manufacturing a capacitor, and a capacitor that provide various advantages such as minimizing material waste and preventing the capacitor from affecting other circuit elements.
It is intended to provide a D tag.

[0019]

In order to solve the above problems, a capacitor according to the present invention comprises: (1) a first capacitor electrode comprising a conductive layer provided on an insulating substrate;
(3) a connection terminal made of a conductive layer provided on the surface of the insulating substrate on which the first capacitor electrode is provided; and (3) an insulating adhesive layer on one surface, and a second terminal provided above the insulating adhesive layer. A metal tape joined over the first capacitor electrode and the connection terminal, (4) the connection terminal, and the second And a conducting means for electrically connecting the metal layer portion serving as the capacitor electrode of (1).

Further, a method of manufacturing a capacitor according to the present invention comprises:
(1) a step of providing a first capacitor electrode made of a conductive layer on an insulating substrate; and (2) a step of providing a connection terminal made of a conductive layer on the surface of the insulating substrate provided with the first capacitor electrode. And (3) having an insulating adhesive layer on one surface,
Joining a metal tape having a metal layer serving as a second capacitor electrode above the insulating adhesive layer over the first capacitor electrode and the connection terminal; (4)
Electrically connecting the connection terminal and a metal layer portion above the connection terminal, which is to be the second capacitor electrode.

Further, the ID tag of the present invention has a capacitor as a circuit element, and is characterized in that the capacitor of the present invention is applied as the capacitor.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (A) Embodiment An embodiment of a capacitor, a method for manufacturing the capacitor and an ID tag according to the present invention will be described below with reference to the drawings.

(A-1) Configuration of the Embodiment FIG. 1 is an explanatory view of a non-contact type ID tag having an LC resonance circuit according to this embodiment. FIG. 4 is a plan view in a state where an electrical wiring pattern and the like are exposed. FIG. 2 is a cross-sectional view of FIG.
FIG. 2 is a sectional view taken along arrow II.

In FIG. 1, the ID tag 1 of this embodiment
0 is a multiple loop coil 11 (L component) and a capacitor 1
2 (C component) is connected in parallel via the connection terminals 14U and 14L. An IC chip 15 for performing a predetermined transmission / reception process is provided between the connection terminals 14U and 14L.

The multi-loop coil 11 is provided as a conductive pattern on one surface (hereinafter referred to as “upper surface”) of the insulating substrate 17 (see FIG. 2). Multiple loop coil 11
Is connected to the connection terminal 14U, and the other end is connected to the connection terminal 14L via the overpass portion 16.
The overpass portion 16 is made of, for example, an insulating resist layer and a silver paste provided thereon, and
One end of the coil 11 is connected to the connection terminal 14L without shorting each turn of No. 1.

The multi-loop coil 11 of this embodiment comprises:
No electrical element is provided in the central portion S, and the magnetic flux for interrogation from an interrogator (not shown) can be efficiently captured.

The one electrode (lower electrode) 12L of the capacitor 12 is provided on the same surface (ie, the upper surface) as the surface of the insulating substrate 17 on which the multiple loop coil 11 is provided. The lower electrode 12L is formed of the same conductive material as the conductive pattern of the multiple loop coil 11. The lower electrode 12L has, for example, a square shape, and one corner (the lower left corner in the figure) is connected to the connection terminal 14L.

The entire area of the lower electrode 12L does not exhibit the charge accumulation function as the capacitor 12, and the area overlapping the area of the metal tape 13 has the charge accumulation function as described later. Is showing.

In the case of this embodiment, one connection terminal 14
U is provided as a rectangular area having a considerable area on the same surface (that is, the upper surface) as the surface of the insulating substrate 17 on which the multiple loop coil 11 and the lower electrode 12L are provided. The length of one side of the rectangular area of the connection terminal 14U is equal to the length of one side of the lower electrode 12L in FIG. 1, but is not particularly limited.

As shown in FIG. 2, the metal tape 13 has an adhesive layer 18 which can function as a dielectric between the electrodes of the capacitor.
And a metal layer 12 that can function as an upper electrode of the capacitor.
U, and is bonded (sticked) from the lower electrode 12L to the connection terminal 14U. The region of the metal layer 12U of the metal tape 13 overlapping with the lower electrode 12L functions as the upper electrode of the capacitor 12.

The one or a plurality of recesses 20 provided in the metal tape 13 are recessed by pressing with a pressing convex member or the like, as described later, and as shown in FIG. Is pushed away, and the connection terminal 14U is electrically connected to the metal layer 12U of the metal tape 13.

(A-2) Manufacturing Method of Embodiment Next, a method of manufacturing the ID tag 10 (also serving as a method of manufacturing a capacitor) of the embodiment including the above circuit elements will be described.

First, on the insulating substrate 17, a conductive pattern to be the multi-loop coil 11, the lower electrode 12L of the capacitor 12, and the connection terminal 14U is formed. For example, as the insulating substrate 17, for example, PET can be applied.
As a method of forming the conductive pattern, for example, etching of copper or aluminum, printing of a silver paste, or the like can be applied. Further, for example, a method of bonding a copper foil using an adhesive can also be applied. FIG. 2 shows a case where a method of bonding a copper foil using an adhesive 19 is applied.

Next, the overpass portion 16 of the multiple loop coil 11 is formed. For example, after providing an insulating resist layer,
It is formed by applying a silver paste. Overpass section 16
May be provided by an etching process.

FIG. 3 shows a conductive pattern and the like on the insulating substrate 17 after such processing is obtained.

Thereafter, the IC chip 15 is mounted at a predetermined position, and the metal tape 13 is joined at the predetermined position. Then, a predetermined position is pressed by a pressing convex member formed of a mold or the like to form a concave portion 20 for electrically connecting the connection terminal 14U to the metal layer 12U functioning as an upper electrode of the metal tape 13.

By the above processing, the ID tag 10 in the state shown in FIG. 1 is formed, and the skin is appropriately coated to complete the ID tag 10.

(A-3) Effects of the Embodiment According to the capacitor, the method of manufacturing the capacitor, and the ID tag 10 of this embodiment, the following effects can be obtained.

(1) The two upper electrodes (metal layer 12U) and the lower electrode 12L of the capacitor 12
Is provided with the insulating layer 18 having an insulating property therebetween, and the distance can be extremely short (conventionally, the thickness of the insulating substrate).
U), the laminated thickness t of the lower electrode 12L can be reduced, and the area of the portion functioning as the capacitor 12 can be reduced. Therefore, as shown in FIG. 1, the capacitor 12 can be provided outside the multi-loop coil 11, the magnetic flux capturing function of the multi-loop coil 11 is effectively exhibited, and the communicable distance is longer than that of the conventional ID tag. Or smaller than conventional ID tags.

Hereinafter, such effects will be described in comparison with Examples, Comparative Examples 1 and 2.

(Embodiment) According to the dimensions shown in FIG.
The ID tag 10 of the example having the configuration shown in FIG.

Insulating substrate (17) PET 50 μm Conductive pattern (11 etc.) Copper foil 35 μm bonded with adhesive 20 μm Metal tape (13) Aluminum 40 μm + hot melt adhesive (polyolefin) 10 μm Overpass bridge part (16) Insulating resist layer + Silver paste And, as IC chip 15, R manufactured by Philips
In the communication using the FID IC chip I · CODE and the ICODE reader ICW90F manufactured by Marantz Japan as an interrogator, the possible distance was 4 cm.

Comparative Example 1 Comparative Example 1 having the configuration and dimensions shown in FIGS. 4A and 4B described in the section of the prior art.
Was formed from the following materials.

Insulative substrate (25) PET 50 μm Conductive pattern (1 etc.) Copper foil 35 μm is adhered with adhesive 20 μm And, as an IC chip, Philips RFI
In the communication using the IC chip I · CODE for D and the ICODE reader ICW90F manufactured by Marantz Japan as an interrogator, the possible distance was 4 cm.

Comparative Example 1 (FIG. 4) is intended to make the materials of the insulating substrate 25 and the conductive pattern the same as those of the embodiment, and to make the communicable distance the same. 3 and FIG. 4, it can be seen that when the same material is used for the insulating substrate and the conductive pattern, the central portion S and the lamination thickness t of the ID tag 10 of the embodiment are considerably small.

Comparative Example 2 Comparative Example 2 having the configuration and dimensions shown in FIGS. 5A and 5B described in the section of the prior art.
Was formed from the following materials.

Insulative substrate (25) PI 25 μm Conductive pattern (1 etc.) Copper foil 35 μm is adhered with adhesive 20 μm, and RFI manufactured by Philips is used as an IC chip.
In the communication using the IC chip I · CODE for D and the ICODE reader ICW90F manufactured by Marantz Japan as an interrogator, the possible distance was 2 cm.

Comparative Example 2 has the same size as the ID tag 10 of the embodiment. In addition, in order to secure a capacitor capacity, polyimide (PI) is used as an insulating substrate, which is poor in workability but can be formed thin. But,
In Comparative Example 2, the area of the capacitor makes up most of the central portion S of the multi-loop coil, and since the portion receiving the magnetic flux is widely covered with metal, the communicable distance is about half that of the embodiment. .

As described above, according to the comparison between the example, the comparative example 1 and the comparative example 2, the ID tag 10 according to the embodiment is the conventional I tag.
It can be seen that the communicable distance can be made longer than the D tag, or the size can be made smaller than the conventional ID tag.

(2) According to this embodiment, since the capacitance of the capacitor 12 is independent of the thickness of the insulating substrate 17, the material of the insulating substrate 17 does not matter in this aspect. That is, an inexpensive substrate material (eg, PET) having excellent workability can be used.

(3) According to the embodiment, all the circuit elements (including the capacitor 12) can be provided on one surface of the insulating substrate 17. As a result, the formation process of the conductive pattern may be performed only on one side, so that the number of manufacturing steps and time can be reduced. Further, even when a conductive pattern is to be formed by etching, the etching process can be performed on one side, so that the amount of the conductive material to be removed can be reduced, and waste of the material can be suppressed.

(4) According to the embodiment, since all the circuit elements (including the capacitor 12) are provided on one surface of the insulating substrate 17, the thickness of the ID tag 10 can be expected to be reduced.

(5) According to the embodiment, the metal tape 13
The width of the tape, the thickness of the adhesive layer 18 and the type of metal determine the capacitor capacity. Therefore, by selecting the tape width, the thickness of the adhesive layer 18 and the type of metal, the design of the capacitor can be changed or the capacitor can be adjusted. Can be easily performed. Alternatively, the capacitor tape can be changed by peeling off the pasted metal tape 13 and joining another metal tape 13 having a different width, a different thickness of the adhesive layer 18 and a different metal type. In addition, it is also possible to adjust the capacitor capacity by punching a hole in the bonded metal tape 13.

(6) According to the embodiment, the capacitor 12
Since the metal tape 13 is used for the insulating substrate 17
And metal tape 13 are prepared in the form of a roll, and the parts drawn from these rolls can be subjected to continuous processing by applying thermocompression bonding with a heat roll or a foil stamping machine. Therefore, a production process with high production efficiency can be expected.

(B) Other Embodiments In the above embodiment, the metal tape 13 is composed of the metal layer 12U which can be the upper electrode of the capacitor and the adhesive layer 18, but has a layer structure of three or more layers. It may be something. For example, it may have a coating layer. Further, the portion functioning as a dielectric layer may be replaced with a three-layer structure of an adhesive layer, a metal layer serving as a dielectric layer, and an adhesive layer for bonding an electrode to a metal layer, instead of the adhesive layer of the above embodiment. .

Metal layer 1 that can be an upper electrode of a capacitor
The metal type of 2U is arbitrary, and may be arbitrarily selected, such as aluminum or copper. The material of the adhesive layer 18 may be any of a hot-melt adhesive, a thermosetting adhesive, a moisture-curable adhesive, a pressure-sensitive adhesive, and the like.

The material of the insulating substrate 17, the material of the conductive pattern, and the method of forming the conductive pattern are not limited, and any material may be used.

The method for electrically connecting the metal layer 12U of the metal tape 13 and the connection terminals 14U is not limited to the pressing method as in the above embodiment. For example, a part of the adhesive layer 18 of the metal tape 13 may be peeled off (not provided), and the part may be connected to the connection terminal 14U. Further, for example, the metal layer 12U and the connection terminal 14U may be electrically connected to each other by piercing a metal needle.

In the above embodiment, the capacitor of the present invention is applied to an ID tag. However, the use of the capacitor of the present invention can be widely applied to a planar electronic circuit including a capacitor as an element. Depending on the application, a plurality of capacitors of the present invention may be included, and a plurality of capacitors may share a metal tape.

[0060]

As described above, according to the capacitor and the method of manufacturing the capacitor of the present invention, an insulating adhesive layer is provided on one side, and a metal layer serving as one capacitor electrode is provided above the insulating adhesive layer. Since the metal tape having is bonded to the other capacitor electrode provided on the insulating substrate to form the capacitor, it is easy to form the capacitor, and the desired characteristics can be obtained as the characteristics of the capacitor.
Various advantages are obtained, such as minimizing material waste and preventing the capacitor from affecting other circuit elements.

According to the ID tag of the present invention, since the capacitor of the present invention is applied as a capacitor,
The characteristics of the ID tag can be improved, and the ID tag can be small and thin.

[Brief description of the drawings]

FIG. 1 is a plan view showing circuit elements and the like of an ID tag according to an embodiment.

FIG. 2 is a sectional view taken along the line II-II in FIG.

FIG. 3 is a plan view showing a conductive pattern and the like of the ID tag of the embodiment.

FIG. 4 is a plan view showing a conductive pattern and the like of a conventional (Comparative Example 1) ID tag and a cross-sectional view taken along line IVB-IVB thereof.

FIG. 5 is a plan view showing a conductive pattern and the like of a conventional (Comparative Example 2) ID tag and a cross-sectional view taken along line VB-VB thereof.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... ID tag, 11 ... Multi-loop coil, 12 ... Capacitor, 12L ... Lower electrode of capacitor (1st capacitor electrode), 12U ... Metal layer (upper electrode of capacitor; 2nd capacitor electrode), 13 ... Metal Tape, 14L, 14U connection terminal, 15 IC chip, 17 insulating substrate, 18 adhesive layer (dielectric between electrodes of capacitor), 20 recess (electric connection between metal layer 12U and connection terminal 14U) part)

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[Procedure amendment]

[Submission date] March 16, 2001 (2001.3.1.
6)

[Procedure amendment 1]

[Document name to be amended] Drawing

[Correction target item name] All figures

[Correction method] Change

[Correction contents]

FIG.

FIG. 2

FIG. 3

FIG. 4

FIG. 5

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Yasukazu Nakada 23-23 Honcho, Itabashi-ku, Tokyo Lintec Co., Ltd. (72) Inventor Katsuhisa 23-23 Honcho, Itabashi-ku, Tokyo F-term in Lintec Co., Ltd. 2C005 MB01 NA06 NA16 NA36 NA47 PA18 PA28 PA29 RA06 RA26 5B035 BA03 BB09 CA01 CA23 5E082 AB01 DD11 EE03 EE23 FF05 FG06

Claims (3)

[Claims] A first capacitor electrode comprising a conductive layer provided on an insulating substrate; and a connection terminal comprising a conductive layer provided on a surface of the insulating substrate provided with the first capacitor electrode. Having an insulating adhesive layer on one surface, and a metal layer serving as a second capacitor electrode above the insulating adhesive layer, which is joined over the first capacitor electrode and the connection terminal. And a conductive means for electrically connecting the connection terminal and the metal layer portion above the connection terminal and serving as the second capacitor electrode. 2. A step of providing a first capacitor electrode made of a conductive layer on an insulating substrate; and a step of providing a connection terminal made of a conductive layer on a surface of the insulating substrate provided with the first capacitor electrode. Joining a metal tape having an insulating adhesive layer on one surface and a metal layer serving as a second capacitor electrode above the insulating adhesive layer over the first capacitor electrode and the connection terminal; And a step of electrically connecting the connection terminal and a metal layer portion above the connection terminal and serving as the second capacitor electrode. 3. An ID tag comprising a capacitor as a circuit element, wherein the capacitor according to claim 1 is applied as the capacitor.