JP2002366917A - Ic card incorporating antenna - Google Patents

Ic card incorporating antenna

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Publication number
JP2002366917A
JP2002366917A JP2001172049A JP2001172049A JP2002366917A JP 2002366917 A JP2002366917 A JP 2002366917A JP 2001172049 A JP2001172049 A JP 2001172049A JP 2001172049 A JP2001172049 A JP 2001172049A JP 2002366917 A JP2002366917 A JP 2002366917A
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Patent type
Prior art keywords
antenna
ic chip
input
ic
output
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Pending
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JP2001172049A
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Japanese (ja)
Inventor
Kenji Samejima
Akira Sato
Takashi Tase
朗 佐藤
隆 田勢
賢二 鮫島
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Hitachi Ltd
株式会社日立製作所
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Abstract

PROBLEM TO BE SOLVED: To realize an antenna built-in IC card which is inexpensive in the mounting of an IC chip on an antenna circuit board, is highly reliable, is not influenced by the type of an antenna structure and the size of an IC chip and is applicable in a wide range. SOLUTION: An IC chip 70 in which two input-output terminals of the IC chip 70 are respectively taken out of a front face and a rear face is used. A non-contact IC card or tag where the IC chip is mounted on the antenna circuit board 10 is obtained by folding one end connection part 60 over the other end connection part 50 to be connected to upper and lower input-output terminal electrodes of the IC chip as a method for connecting a conductor pattern 20 for an antenna to the two input-output terminals.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、アンテナを内蔵するICカード、更に詳しく言えば、ICチップとそのI BACKGROUND OF THE INVENTION The present invention is, IC card with a built-in antenna and, more particularly, IC chip and its I
Cの信号を外部の装置と無線で結合するためのアンテナを平面状基板に実装したICカード(非接触ICタグを含む)及びその製造方法に関する。 C signal an external device and the antenna of the IC card mounted on the planar substrate for coupling wirelessly (including non-contact IC tag), and a method for producing the same.

【0002】 [0002]

【従来の技術】従来知られているアンテナを内蔵するI BACKGROUND OF THE INVENTION a built-in conventionally known antenna I
Cカードは、図1(a)及び(c)に示すように、IC C card, as shown in FIG. 1 (a) and (c), IC
チップ70を実装したフィルム状アンテナ回路基板10 Film-like antenna circuit board 10 mounted with the chip 70
の一面に、アンテナ用導体パターン20が形成されている。 On one surface of the conductor pattern 20 is formed for the antenna. アンテナ用導体パターン20はコイル状であり、アンテナ用導体パターン20の両端は、ICチップ70の2つの電極50及び60にそれぞれ接続されている。 Antenna conductor pattern 20 is coiled, both ends of the antenna conductor pattern 20 is connected to two electrodes 50 and 60 of the IC chip 70. この場合に、導体パターン20がコイル(スパイラル)状であるために、図示のように、コイル20の内側端部を貫通孔30でアンテナ回路基板10の裏面に引き出し、 In this case, in order conductor pattern 20 is a coil (spiral) shape, as shown, drawers on the back surface of the antenna circuit board 10 the inner end of the coil 20 in the through-hole 30,
裏面コイルパターン40に接続し、貫通孔35でフィルム10の表面に引き出し、接続部60に接続する。 Connected to the back surface coil pattern 40, a through hole 35 a drawer on the surface of the film 10, connected to the connecting portion 60. これによって、同一平面状での交差を回避している。 Thus, it avoids the cross in the same plane. また、上記貫通孔30、35を用いない方法は、図1 Further, a method which does not use the through-hole 30 and 35, FIG. 1
(c)のように、コイルの形状を巻き数を単一にして、 As in (c), and the number of turns of the shape of the coil in a single,
ICチップ70の接続部50と接続部60とをアンテナ用導体パターン20の両端部に接続している(特開平1 And a connecting portion 60 and the connecting portion 50 of the IC chip 70 are connected to both ends of the antenna conductor pattern 20 (JP-A-1
1−16760号公報に記載されている。 It is described in 1-16760 JP. )。 ).

【0003】 [0003]

【発明が解決しようとする課題】前記図1(a)、 [SUMMARY OF THE INVENTION] FIG 1 (a),
(b)に示すICカードは、その製造において、貫通孔を設けることが必須であり、それに付随するメッキ行程及び裏面の接続配線行程が付加される。 (B) the IC card shown in its production, it is essential to provide a through-hole, the plating process and the back surface of the connecting wires stroke associated therewith is added. そのために、アンテナ回路基板の製造コストが高くなる。 Therefore, manufacturing cost of the antenna circuit board is increased. また、図1 In addition, FIG. 1
(c)に示すICカードは、ICチップの2つの出入力端子接続は、チップの内側でコイル状導体パターン20 IC card shown in (c) has two input and output terminals connected to the IC chip, the coil-shaped conductor pattern 20 on the inside of the chip
の両端の接続を閉じることが必要なために、アンテナ用導体パターン20の巻き数及びチップサイズ等の制限を受け、そのICカードの応用範囲が制限される。 For both ends of the need to close a connection, receives a number of turns and limitations, such as the chip size of the antenna conductor pattern 20, the application range of the IC card is limited.

【0004】従って、本発明の目的は、上記課題を解決し、低コスト、高信頼性で、アンテナ構造の種類、IC It is therefore an object of the present invention is to solve the above problems, low cost, with high reliability, the type of antenna structure, IC
チップのサイズにも影響されない、応用範囲が広いアンテナ内臓ICカード提供することである。 Not affected the chip size, is that the range of applications to provide a wide antenna visceral IC card. すなわち、貫通孔を設けることなく、また、コイルの巻数、チップサイズ、信頼性の劣化等に制限されないアンテナ内臓IC In other words, without providing the through-hole, also the number of turns of the coil, the chip size is not limited to the reliability deterioration such as an antenna built IC
カード及びその製造方法を提供することである。 To provide a card and a manufacturing method thereof.

【0005】 [0005]

【課題を解決するための手段】上記目的を達成するため、本発明のアンテナを内臓するICカードは、少なくとも2つの外部入出力電極をもつICチップと、上記2 To achieve the above object, according to an aspect of, IC card built the antenna of the present invention, an IC chip having at least two external input and output electrodes, the 2
つの外部入出力電極に接続されたアンテナ用導体パターンとをもち、上記アンテナ用導体パターンが形成されアンテナ回路基板が上記ICチップの上下側に面接するようにした屈曲部をもつように構成される。 One of having an external input and output electrode connected to the antenna conductor pattern configured to have a bending portion that the antenna circuit board the antenna conductor patterns are formed is such that interview vertically side of the IC chip . ここで、IC Here, IC
カードは、ICチップが2つの端子のみで、識別用に使用される非接触ICタグを含む。 Cards, IC chip only two terminals, including the non-contact IC tag that is used for identification. また、上記本発明のICカードを製造するため、本発明のICカードの製造方法は、フィルム状基板面上に上記アンテナ用導体パターンを形成し、上記ICチップの入出力電極の1つが上記アンテナ用導体パターンの一端と接続されるように実装し、上記アンテナ用導体パターンの他端を上記チップの入出力電極の他の1つの電極に接するように上記フィルム状基板の少なくとも一部を屈曲する工程をもつ。 Furthermore, for the production of IC card of the present invention, an IC card manufacturing method of the present invention, the conductor pattern for the antenna is formed on a film-shaped substrate surface, one of the input and output electrodes of the IC chip but the antenna implement so as to be connected to one end of use the conductor pattern, bending at least a portion of the film-form substrate so that the other end of the conductor pattern for the antenna in contact with the other one of the electrodes of the input and output electrodes of the chip with the process. すなわち、上記アンテナ用導体パターンの一部はフィルム状基板面と一緒に屈曲部を形成してICチップの電極に接続される。 That is, part of the conductor pattern the antenna is connected to the electrode of the IC chip to form a bent portion with the film-shaped substrate surface. 本発明によれば、上述の構成及び製造方法により、貫通孔を設けることなく、また、コイルの巻数、チップサイズ、信頼性の劣化等に制限されることなく課題は解決できる。 According to the present invention, the configuration and the manufacturing method described above, without providing the through hole, also issue without being limited number of turns of the coil, chip size, etc. on the reliability of the degradation can be solved. すなわち、IC回路の一方の端子が接地端子となるICを用い、その取り出し電極をシリコン基板の裏面に設け、ICチップの2つの入出力端子を、表面と裏面からそれぞれ取り出すことをできる。 That is, using the IC that one terminal of the IC circuit becomes ground terminal, provided the extraction electrode on the back surface of the silicon substrate, the two output terminals of the IC chip, may the be taken from each of the front and back surfaces. また、通常使用する2つの入出力端子がICチップ表面に形成されているICチップを用いても、折りたたみを2重に行うことにより解決できる。 Moreover, even with an IC chip in which two output terminals normally use is formed on the IC chip surface can be solved by performing a folding double. また、低抵抗のアンテナ用導体パターンの材料を用いても、酸化防止金属と銀ペーストを組み合わせることにより解決できる Moreover, even with the antenna conductor pattern of a low resistance material can be solved by combining the oxidation-resistant metal and the silver paste

【0006】 [0006]

【発明の実施の形態】<実施の形態1>図2は本発明によるICカードの第1の実施形態の構造及び製造方法を説明する平面図及び断面図である。 Figure 2 [OF THE PREFERRED EMBODIMENTS OF THE INVENTION <Embodiment 1> is a plan view and cross-sectional views illustrating the structure and manufacturing method of the first embodiment of the IC card according to the present invention.

【0007】図2(a)及び(b)は、本発明によるICカードの製造方法の一工程を説明する平面図である。 [0009] FIG. 2 (a) and (b) are plan views for explaining a process of an IC card manufacturing method of the present invention. 連続する所定形状(長方形)のフィルム20及び100の一面に、銀ペーストのスクリーン印刷又は銅、アルミニウム等のエッチングによるアンテナ用導体パターン20をコイル状に形成する。 On one surface of the film 20 and 100 consecutive predetermined shape (rectangle), screen printing or copper silver paste, the antenna conductor pattern 20 by etching such as aluminum is formed in a coil shape. フィルム20及び100は0.05〜 Film 20 and 100 0.05
0.2mm程度の容易に折り曲げることができる材料が使用される。 Material is used which can be bent easily about 0.2 mm. 導体パターン20は0.05〜1mm程度の幅で、銀ペースト、銅、アルミ薄膜が使用される。 The conductor pattern 20 is a width of about 0.05 to 1 mm, silver paste, copper, aluminum thin film is used. アンテナ用導体パターン20の両端には、入出力接続部50及び入出力接続部60が存在する。 At both ends of the antenna conductor pattern 20, input-output connection 50 and the input-output connection unit 60 is present. 次に、入出力接続部50上に、電気的接続するための異方導電フィルム80を仮圧着する。 Next, on output connection 50, the anisotropic conductive film 80 for electrically connecting to the temporary pressure bonding. 異方導電フィルム80上にICチップ70をその下側端子を入出力接続部50に、位置合わせをして、ICチップ70を仮圧着し固定する。 The anisotropic conductive film 80 IC chip 70 that lower terminal input and output connection 50 on top, and alignment, to fix temporarily bonding the IC chip 70. ここで用いるICチップ70は、IC回路の接地端子を、シリコン基板から取り出す構造とすることにより、ICチップの2つの入出力端子を、表面と裏面からそれぞれ取り出したICチップを用いる。 IC chip 70, as used herein, a ground terminal of the IC circuit, by employing a structure in removal from the silicon substrate, the two output terminals of the IC chip, using the IC chip taken out respectively from the front and back sides.

【0008】図2(b)の絶縁用フィルム110を位置合わせして第1フィルム接着剤140が下になるように合わせる。 [0008] Figure 2 the first film adhesive 140 and insulating film 110 to align the (b) is tailored so that the bottom. 絶縁用フィルム110は、絶縁用フィルム開口部160が設けられており、上部入出力電極90が絶縁用フィルム開口部160を介して、入出力接続部60 Insulating film 110, the insulating film opening 160 is provided, an upper output electrode 90 via the insulating film opening 160, input-output connecting portion 60
と接続できる構造としている。 It has a structure that can be connected to. 絶縁用フィルム110は入出力接続部60を折り返した時にコイルアンテナ20 Coil antenna 20 when the insulating film 110 is folded back the input and output connections 60
のショートを防止する。 To prevent short.

【0009】その後、異方導電フィルム80を仮圧着し固定する、フィルム100(以下折り込み用フィルムと呼ぶ)を、フィルム10の表面に向かって折り込み部1 [0009] Thereafter, the anisotropic conductive film 80 temporarily pressure bonded and fixed, the film 100 (hereinafter referred to as the interfolding film), folding unit 1 toward the surface of the film 10
05の部分で折りたたむ。 Collapse in 05 parts. 折り込み用フィルム100とフィルム10は同サイズなので、折りたたむことにより自動的に位置合わせが完了する。 Since the interfolding film 100 and the film 10 is a same size, automatically aligned is completed by folding. 入出力接続部60は0. Input and output connection unit 60 0.
1〜数mm平方であるため、位置合わせは容易にできる。 Because it is 1 to several mm square, the alignment can be facilitated. その後に、図2(c)の断面図の状態にして、ICチップの上下に熱をかけながら荷重をかけ、ICチップ70 Then, in the state of a cross-sectional view of FIG. 2 (c), the applying a load while applying heat above and below the IC chip, the IC chip 70
を電気的に導通させる。 It is allowed to electrical conduction. なお、図面は見易くするため、厚さ方法を誇張して示しているため、左側はコの字型に曲げられているが、実際には湾曲した形となる。 Since the drawing clarity, since the exaggerated thickness method, the left is bent in U-shape, a curved shape in practice. 絶縁用フィルム110には、第1フィルム接着剤14 The insulating film 110, first film adhesive 14
0、第2フィルム接着剤150を形成しているため、基板全体を加熱圧着して第1フィルム接着剤140、第1 0, since forming the second film adhesive 150, first film adhesive 140 bonded under heat the whole substrate, first
フィルム接着剤150により接着し、カード形態として完成させる。 Bonded by a film adhesive 150, to complete a card form.

【0010】上記の構造及び製造方法により、貫通孔を用いること無く、外側の入出力接続部60を折り返してアンテナ及びICチップを実装したICカードが得られる。 [0010] The structure and manufacturing method described above, without using the through-hole, IC card mounting the antenna and the IC chip by folding the outer input and output connecting portion 60 is obtained. また、アンテナ用導体パターン20は折り込み用フィルム100とフィルム10に同一印刷工程で実現され、折り込み用フィルム100を折り込むだけの工程で、簡単な製造方法により低コスト化ができる。 Further, the antenna conductor pattern 20 is realized by the same printing process interfolding film 100 and the film 10, only the step folding the interfolding film 100, it is low cost by a simple production method. <実施の形態2>図3は本発明によるICカードの第2 <Embodiment 2> FIG. 3 is a second IC card according to the present invention
の実施形態の構造及び製造方法を説明する平面図及び断面図である。 Structure and manufacturing method of the embodiment is a plan view and a cross-sectional view of a. 本実施形態は、アンテナ用導体パターン2 This embodiment, the antenna conductor pattern 2
0の入出力端子50を含む部分のみを折り返して構成したものである。 Wrap only a portion including the input and output terminals 50 of 0 is obtained by configuration. 第1の実施形態の構成と実質的に同じ機能、構成部には図2と同じ番号を付した。 Configurations substantially the same function as in the first embodiment, the components denoted by the same numbers as in FIG. 入出力接続部60上に、電気的接続するための異方導電フィルム80 On output connecting portion 60, the anisotropic conductive film for electrically connecting 80
を仮圧着する。 The temporarily crimped. 異方導電フィルム80上にICチップ7 IC chip 7 on the anisotropic conductive film 80
0を入出力接続部60に、位置合わせをして、ICチップ70を仮圧着し固定する。 0 input and output connecting portion 60, and alignment, to fix temporarily bonding the IC chip 70. その後、入出力接続部50 Then, the input-output connection 50
にも、異方導電フィルム80を仮圧着し固定する。 Also, fixed temporarily bonding the anisotropic conductive film 80.

【0011】次に、切り込み部130で分離された、折り込み用フィルム100を図3(b)の様に、折り込み部105、106の部分で折りたたむ。 [0011] Next, separated by cuts 130, as shown in FIG. 3 (b) the interfolding film 100, folded in the portion of the folded portion 105 and 106. このとき、絶縁用フィルム110を配置することにより、コイル間の短絡は防止されている。 At this time, by arranging the insulating film 110, short-circuit between coils is prevented. 次に、ICチップ70の上下に熱をかけながら荷重をかけ、ICチップ70を電気的に導通させる。 Then, a load while applying heat above and below the IC chip 70, connecting electrically the IC chip 70. 最後に接着剤付フィルムで上下をはさみ、基板全体を加熱圧着してカード形態として完成させる。 Finally, up and down in a film with an adhesive scissors, to complete a card form by heat pressing the entire substrate. 上述の構造及び方法により、貫通孔を用いること無く、内側の入出力端子を折り返してICチップを実装した非接触ICカードが得られる。 The structure and method described above, without using the through-hole, the non-contact IC card mounting an IC chip folded inside the input and output terminals can be obtained.

【0012】本発明のICカードにおけるアンテナパターンは、コイル状に限定されない。 [0012] antenna pattern in the IC card of the present invention is not limited to the coil shape. 図4は、コイル状以外の形状のアンテナについて示し、上記同様にICチップの2つの入出力端子を、表面と裏面からそれぞれ取り出すICチップを用いて実装するが、フィルム10上のアンテナ用導体パターン20がコイル状でない形状を示す。 Figure 4 illustrates the antenna having a shape other than coiled, the two output terminals of said Similarly IC chip, but implemented with an IC chip is taken out from each of the front and back surfaces, the conductor antenna on the film 10 pattern 20 shows the shape is not coiled. なお、簡明のため、ICチップ部の表示は省略されている。 Note that for simplicity, the display of the IC chip portion is omitted.

【0013】図4(a)は、1ターンのアンテナ構造を示した。 [0013] FIG. 4 (a), showing the antenna structure 1 turn. ICチップを上記同様に実装した後、フィルム10の中心線から、入出力接続部50と入出力接続部6 After the IC chip mounted in the same manner described above, from the center line of the film 10, input-output connecting portions and the output connection 50 6
0が破線105を折り込み部として重なり合う様に折りたたむ。 0 collapse as overlapping dashed 105 as folded portion. ICチップの入出力電極と入出力接続部50と入出力接続部60は電気的な接続行い、ICチップを実装した非接触ICカード及びタグが得られる。 Output connecting portion 60 and the input-output connection unit 50 and the input and output electrodes of the IC chip performs electrical connection, the non-contact IC card and tag mounting the IC chip is obtained.

【0014】図4(b)は、アンテナ用導体パターン2 [0014] FIG. 4 (b), the antenna conductor pattern 2
0にアンテナスリット45を入れて形成したものを示した。 0 showed that formed by putting the antenna slit 45. これも、フィルム10の中心線105から、入出力接続部50と入出力接続部60が重なり合う様に折りたたむ。 This also from the center line 105 of the film 10, folded as output connecting portion 60 and the input-output connection unit 50 overlap. ICチップの入出力電極と入出力接続部50と入出力接続部60は電気的な接続行い、ICチップを実装した非接触ICカード及びタグが得られる。 Output connecting portion 60 and the input-output connection unit 50 and the input and output electrodes of the IC chip performs electrical connection, the non-contact IC card and tag mounting the IC chip is obtained.

【0015】図4(c)は、ダイポールアンテナを示したものである。 [0015] FIG. 4 (c) shows a dipole antenna. フィルム10の中心線105から、入出力接続部50と入出力接続部60が重なり合う様に折りたたむ。 From the center line 105 of the film 10, folded as output connecting portion 60 and the input-output connection unit 50 overlap. ICチップの入出力電極と入出力接続部50と入出力接続部60は電気的な接続行い、ICチップを実装した非接触ICカードが得られる。 Output connecting portion 60 and the input-output connection unit 50 and the input and output electrodes of the IC chip performs electrical connection, the non-contact IC card mounting an IC chip is obtained.

【0016】上記の方法により、貫通孔を設けることなく、また、コイルの巻数、チップサイズに制限されることなく、ICチップを実装した非接触ICカード及びタグが得られる。 [0016] By the above method, without providing the through-hole, also the number of turns of the coils, are not limited to the chip size, the non-contact IC card and tag mounting the IC chip is obtained. <実施の形態3>図5は本発明によるICカードの第3 <Embodiment 3> FIG. 5 is a third IC card according to the present invention
の実施形態を説明する図である。 Is a diagram illustrating the embodiment.

【0017】同図(a)及び(b)は、製造方法を説明する平面図で、(c)はICカードの断面図((a)の [0017] FIG. (A) and (b) is a plan view for explaining the manufacturing method of (c) is a sectional view of an IC card ((a)
D−D'断面図)を示す。 D-D 'cross sectional view) showing a. 本実施形態はアンテナ用導体パターン20を2重巻きしたものである。 This embodiment is obtained by winding a double antenna conductor pattern 20.

【0018】図5(a)のフィルム10上に、アンテナ用導体パターン20は、アンテナ用導体パターン20を向かい合わせた時に、コイルの巻き数が2倍に成るように、中心で点対称に配置して形成する。 [0018] On the film 10 of FIG. 5 (a), the antenna conductor pattern 20, when facing the antenna conductor pattern 20, as the number of turns of the coils is doubled, arranged in point symmetry with the center to be formed. 入出力接続部6 Input and output connection 6
0上に、異方導電フィルム80を仮圧着し固定する。 On 0, fixed temporarily bonding the anisotropic conductive film 80. 異方導電フィルム80上に、ICチップ70を入出力接続部60に位置合わせをして、ICチップ70を仮圧着し固定する。 On the anisotropic conductive film 80, and the positioning of the IC chip 70 to the input-output connection unit 60, to fix temporarily bonding the IC chip 70. 入出力接続部50にも、異方導電フィルム8 To output connection 50, the anisotropic conductive film 8
0を仮圧着し固定する。 0 temporary pressure bonding and fixed. 上下のアンテナ用導体パターン20同士が接触しない為に、図5(b)に示す絶縁用フィルム110を、位置合わせして第1フィルム接着剤1 For the upper and lower antenna conductor pattern 20 to each other do not contact, 5 an insulating film 110 (b), the first film adhesive is aligned 1
40が下になるように合わせる。 40 match to be under. この絶縁用フィルム1 The insulating film 1
10には絶縁用フィルム開口部160が設けられており、上部入出力電極90が絶縁用フィルム開口部160 The 10 is provided with an insulating film opening 160, the upper input and output electrode 90 insulating film opening 160
を介して、入出力接続部60と接続できる構造としている。 Through, it has a structure that can be connected to the input-output connecting part 60. フィルム10を矢印の方向のアンテナ用導体パターン20が向かい合う方向に、折り込み部105の部分で折りたたみ、ICチップ70を加熱圧着して電気的に接続する。 The film 10 in a direction opposite the direction of the antenna conductor pattern 20 of the arrow, folding the portion of the folded portion 105 are electrically connected by heating and pressing the IC chip 70. 最後に基板全体を加熱圧着して第1フィルム接着剤140、第1フィルム接着剤150により接着し、 The first film adhesive 140 and finally heated crimping the entire substrate, and bonded by the first film adhesive 150,
カード形態として完成させる。 To complete as a card form. <実施の形態5>図6は本発明によるICカードの第5 <Embodiment 5> FIG. 6 is a fifth IC card according to the present invention
の実施形態を説明する図である。 Is a diagram illustrating the embodiment. 同図(a)及び(b) FIG (a) and (b)
は、製造方法を説明する平面図を示す。 Shows a plan view for explaining a manufacturing method. 本実施形態はアンテナ用導体パターン20を2重巻きしたものである。 This embodiment is obtained by winding a double antenna conductor pattern 20.
第4の実施形態と比べ、アンテナ用導体パターンの重なる形態において異なる。 Compared with the fourth embodiment differs in the form of overlapping conductive pattern antenna. 実質的に同じ構成、機能部には図5の同一部分と同じ番号を示す。 Substantially the same configuration, the functional unit indicates the same number as the same portion of FIG. なお、ICチップ部分については省略している。 Incidentally, it is omitted IC chip portion.

【0019】フィルム10上にアンテナ用導体パターン20、第2アンテナ用導体パターン25、入出力接続部50、入出力接続部60を形成する。 [0019] Film 10 antenna conductor pattern 20 on the second antenna conductor pattern 25, input-output connection 50, to form the input and output connections 60. 破線部105を折り込む。 It folded the broken line 105. 折り込んだ後は、同図(b)のように、アンテナ用導体パターン20、第2アンテナ用導体パターン2 After folding, as in FIG. (B), the antenna conductor pattern 20, for the second antenna conductor pattern 2
5、入出力接続部50、入出力接続部60が重なりあった状態になる。 5, input-output connection 50, in a state in which input and output connections 60 are overlapped. 入出力接続部とコイルの交差部分以外は重なり合わないようにする。 Except the intersection of input and output connections and coils are non-overlapping. ここでは、アンテナ用導体パターンを説明したが、ICチップの接続及び絶縁、接着等は前記同様に行い、カード形態として完成させる。 Here it has been described the conductor pattern for antenna connection and insulation of IC chip, the adhesive or the like is performed in the same manner as described above, to complete a card form.

【0020】上述の方法により、貫通孔を設けることなく、また、行程を増やすこともなく、コイルを2重することによって、巻数を2倍にしたアンテナ回路基板を実現し、さらに、アンテナ用導体パターンの形状を工夫することにより、寄生容量を増加させることなく、ICチップを実装した非接触ICカード及びタグが得られる。 [0020] By the method described above, without providing the through-holes, also without increasing the stroke by the double coil, and realize an antenna circuit board in which the number of turns twice, further antenna conductor by devising the shape of the pattern, without increasing the parasitic capacitance, the non-contact IC card and tag mounting the IC chip is obtained. <実施の形態6>図7は本発明によるICカードの第6 The IC card according to the invention FIG 7 <Embodiment 6> The sixth
の実施形態を説明する図である。 Is a diagram illustrating the embodiment. 同図(a)、(b)及び(c)は、製造方法を説明する平面図を示し、(d) FIG (a), (b) and (c) is a plan view illustrating the manufacturing method, (d)
は(c)のE−E断面を示す断面図である。 Is a sectional view showing the E-E cross section of (c). 本実施形態は、ICチップの2つの電極がICチップの同じ平面側にある場合に適したものである。 This embodiment is one in which two electrodes of the IC chip is suitable for a case in the same plane side of the IC chip.

【0021】図7(a)のフィルム10の表面に、アンテナ用導体パターン20を形成し、内側の入出力接続部50の近傍に、入出力接続部60を配置するために、絶縁用フィルム開口部180を設ける。 [0021] surface of the film 10 of FIG. 7 (a), forming the antenna conductor pattern 20, in the vicinity of the inside of the input and output connection 50, to place the input and output connections 60, the insulating film opening providing a part 180. 第2折り込み用フィルム170を、入出力接続部bが裏側を向くように、 The second folding film 170, as input-output connecting part b faces the back side,
第2折り込み部180の部分で折りたたむ。 Collapse on the portion of the second folding unit 180. 次に、折り込み用フィルム100をアンテナ用導体パターン20が裏側を向くように、折り込み部105の部分で折りたたむ。 Next, the interfolding film 100 antenna conductor pattern 20 is to face the back side, folded at the portion of the folded portion 105. すなわち、(a)の第2折り込み用フィル図7 That is, the second interfolding fill Figure 7 (a)
(c)ム170の面は(a)平面に対し360度回転される。 (C) the surface of the arm 170 is rotated 360 degrees relative to (a) a plane. 図7(b)に、折り込んだ状態を示した。 In FIG. 7 (b), showing a state in which tucked. ICチップ70の電極部を接続する為の、入出力接続部50、 For connecting the electrode portions of the IC chip 70, input-output connection 50,
入出力接続部60が近接して設置できている。 Output connecting portion 60 is can be placed in close proximity.

【0022】図7(d)に示すように、ICチップ70 As shown in FIG. 7 (d), IC chip 70
の、入出力電極200及び入出力電極210は、入出力接続部50、入出力接続部60にそれぞれ、異方導電フィルム80を用い加熱圧着して電気的に接続される。 The input and output electrodes 200 and output electrodes 210, input output connection 50, respectively to the input-output connection unit 60 are electrically connected by thermocompression bonding using anisotropic conductive film 80. 最後に接着剤付フィルムで上下をはさみ、基板全体を加熱圧着してカード形態として完成させる。 Finally, up and down in a film with an adhesive scissors, to complete a card form by heat pressing the entire substrate. 上記の方法により、貫通孔を設けることなく、現在通常用いられている、ICチップ表面に入出力電極を形成しているICチップを用いたアンテナ回路基板を実現し、ICチップを実装した非接触ICカード及びタグが得られる。 By the method described above, without providing the through-hole, is currently used generally to achieve an antenna circuit board using the IC chip forming the input and output electrodes on the IC chip surface, a non-contact mounting the IC chip IC card and tag can be obtained. <実施の形態7>図8は、ICチップを実装するアンテナ回路基板において、低抵抗を実現できる、銅、アルミニウム等を用いた時の、表面の酸化等による、接続信頼性低減を防止する接続構造を平面図及び一部断面図を示す。 <Embodiment 7> FIG. 8, in the antenna circuit board for mounting an IC chip, it is possible to realize a low resistance, copper, when using aluminum or the like, by oxidation of the surface, the connection to prevent the connection reliability reduced structure shows a plan view and a partial sectional view of the. 銅、アルミニウム等でアンテナ導体パターン20を形成した場合、低抵抗のアンテナ回路基板を実現できるが、金属表面の酸化は避けられない、特に高温高湿等の厳しい環境条件においては、接続信頼性の劣化が懸念される。 Copper, in the case of forming the antenna conductor pattern 20 of aluminum or the like, can be realized in the low resistance antenna circuit board, the oxidation of the metal surface can not be avoided, especially in harsh environmental conditions such as high temperature and high humidity, the connection reliability deterioration is a concern.

【0023】図8(a)、(b)のアンテナ導体パターン20の終端である入出力接続部50、入出力接続部6 [0023] FIG. 8 (a), the input-output connection 50 is the end of the antenna conductor pattern 20 of (b), input-output connection 6
0のそれぞれの上層に、酸化防止用金属220を形成し、さらにその上に銀ペーストを積層する、その後、異方導電フィルムを用いてICチップをアンテナ回路基板に実装して、酸化を防止し、さらに、接続信頼性の高い銀ペーストで接続することにより、低抵抗で接続信頼性の高いICチップを実装した非接触ICカード及びタグが得られる。 Each of the upper 0, to form a prevention metal 220 oxide, further laminating a silver paste thereon, then mounting the IC chip on the antenna circuit board using the anisotropic conductive film to prevent oxidation further, by connecting the connection reliable silver paste, the non-contact IC card and tag mounted with high IC chip connection reliability at low resistance.

【0024】上記実施例では、低周波から高周波まで用いることのできる、入出力接続部の部分のみを積層する構造を示した。 [0024] In the above embodiment, it can be used from a low frequency to high frequency, showing a structure of laminating only a portion of the input and output connections. これは、高周波においては、アンテナ金属の1〜2μmの表皮のみ信号電波が流れるため、コイル表面部分は低抵抗材料である必要がある。 This is because in the high frequency, since the flow signal wave only epidermis 1~2μm antenna metal coil surface portion should be a low resistance material. しかし、低周波で用いる場合は、コイル表面部分が低抵抗で有る必要が無いため、アンテナ用導体パターン及び入出力接続部のすべてを積層構造としてもかまわない。 However, when used at low frequencies, because the coil surface portion need not have a low resistance, may be all of the conductor pattern and the input-output connecting portions antenna a stacked structure.

【0025】また上記の酸化防止用金属は、Ti、P [0025] The metal for preventing the above-mentioned oxidation, Ti, P
t、Au、Ni、Ta、Ag等の金属を用いることができる、また、前記の金属の重ね膜、合金を用いても良い。 t, Au, Ni, Ta, metal can be used, such as Ag, In addition, the metal lap film may be an alloy.

【0026】上記発明の実施の形態1〜4では、ICチップの電気的接続条件において、異方導電フィルムを用いる方法を述べてきたが、電気的接続は半田、導電性接着剤、接着剤、金属−金属間の直接接合、合金接合のいずれの接合方式を用いても良い。 [0026] In the first to fourth embodiments of the invention, the electrical connection conditions of the IC chip, has been described a method of using the anisotropic conductive film, the electrical connections are solder, conductive adhesive, glue, metal - direct bonding between the metal may be either a bonding method of the alloy bonding.

【0027】 [0027]

【発明の効果】ICチップの2つの入出力端子を、表面と裏面からそれぞれ取り出すことを可能としたICチップを用い、一方の終端接続部を、もう一方の終端接続部の上に折りたたみ、ICチップの上下の入出力端子電極と終端接続部をそれぞれ接続して、アンテナ回路基板にICチップを実装した非接触ICカード及びタグを得ることできる。 Two output terminals of the IC chip according to the present invention, the surface and using the possible and the IC chip to be taken out respectively from the back, one of the sealing end, folding over the other end connecting portion, IC connect the output terminal electrode and the sealing end of the upper and lower chips, respectively, can be obtained a non-contact IC card and tag mounting the IC chip on the antenna circuit board. アンテナ用導体パターンを同一平面上に、 A conductor pattern for antenna on the same plane,
アンテナ用導体パターンの中心で、向かい合わせて折りたたんだ時に、コイルの巻き数が2倍に成るように、中心で点対称に配置して形成することにより、2重巻きにしたアンテナ回路基板にICチップを実装した非接触I IC at the center of the conductor pattern for antenna face each other folded when, as the number of turns of the coils is doubled, by forming the arranged point symmetrically in the center, the antenna circuit board double winding contactless I mounting the chip
Cカード及びタグを得ることできる。 It can be obtained a C card and tag. また、通常使用する2つの入出力端子がICチップ表面に形成されているICチップにおいても、折りたたみを2重に行うことにより、ICチップを実装した非接触ICカード及びタグを得ることできる。 Also in IC chip in which two output terminals normally use is formed on the IC chip surface, by performing the folding double, it can be obtained a non-contact IC card and tag mounting an IC chip. また、低抵抗のアンテナ用導体パターンの材料を用いても、酸化防止金属と銀ペーストを組み合わせることにより、ICチップを実装した非接触I Moreover, even with the antenna conductor pattern of a low resistance material, by combining the oxidation-resistant metal and the silver paste, the contactless I mounting the IC chip
Cカード及びタグを得ることできる。 It can be obtained a C card and tag.

【0028】上記の方法により、貫通孔を設けることなく、また、コイルの巻数、チップサイズ、信頼性の劣化等に制限されることなくチップを実装した非接触ICカード及びタグを得ることできる。 [0028] By the above method, without providing a through hole, also possible to obtain a non-contact IC card and tag mounting the chip without being limited number of turns of the coil, chip size, etc. reliability degradation.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】 従来のICカードの構成を示す図である。 1 is a diagram showing a configuration of a conventional IC card.

【図2】 発明によるICカードの第1の実施形態を説明する平面図及び断面図である。 2 is a plan view and cross-sectional views illustrating a first embodiment of an IC card according to the invention.

【図3】 発明によるICカードの第2の実施形態を説明する平面図及び断面図である。 3 is a plan view and a cross-sectional view illustrating a second embodiment of an IC card according to the invention.

【図4】 発明によるICカードの第3の実施形態を説明する平面図及び断面図である。 4 is a plan view and a cross-sectional view illustrating a third embodiment of an IC card according to the invention.

【図5】 発明によるICカードの第4の実施形態を説明する平面図及び断面図である。 5 is a plan view and a cross-sectional view illustrating a fourth embodiment of an IC card according to the invention.

【図6】 発明によるICカードの第5の実施形態を説明する平面図及び断面図である。 6 is a plan view and a cross-sectional view illustrating a fifth embodiment of an IC card according to the invention.

【図7】 発明によるICカードの第6の実施形態を説明する平面図及び断面図である。 7 is a plan view and a cross-sectional view illustrating a sixth embodiment of the IC card according to the invention.

【図8】 発明によるICカードの第7の実施形態を説明する平面図及び断面図である。 8 is a plan view and cross-sectional views illustrating a seventh embodiment of an IC card according to the invention.

【符号の説明】 DESCRIPTION OF SYMBOLS

10 :フィルム 20 :アンテナ用導体パターン 25 :第2アンテナ用導体パターン 30 :貫通孔a 35 :貫通孔b 40 :裏面アンテナ用導体パターン 45 :アンテナスリット 50 :入出力接続部a 60 :入出力接続部b 70 :ICチップ 80 :異方導電フィルム 90 :上部入出力電極 100:折り込み用フィルム 105:折り込み部 110:絶縁用フィルム 120:下部入出力電極 130:折り込み用切り込み部 140:第1接着剤 150:第2接着剤 160:絶縁用フィルム開口部 170:第2折り込み用フィルム 180:第2折り込み部 190:フィルム開口部 200:入出力電極a 210:入出力電極b 220:酸化防止金属 230:銀ペースト 10: Film 20: Antenna conductor pattern 25: for the second antenna conductor pattern 30: through hole a 35: through hole b 40: backside antenna conductor pattern 45: Antenna slit 50: input-output connecting portion a 60: input and output connections part b 70: IC chip 80: anisotropic conductive film 90: top output electrode 100: interfolding film 105: folded portion 110: insulating film 120: lower output electrode 130: interfolding incisions 140: first adhesive 150: second adhesive 160: insulating film opening 170: second interfolding film 180: second folding unit 190: film opening 200: input and output electrodes a 210: input and output electrodes b 220: antioxidant metal 230: silver paste

フロントページの続き (72)発明者 田勢 隆 東京都国分寺市東恋ヶ窪一丁目280番地 株式会社日立製作所中央研究所内 Fターム(参考) 2C005 MA18 NA08 NA36 5B035 BA03 BB09 CA01 CA23 Front page of the continuation (72) inventor field urging Takashi Tokyo Kokubunji east Koigakubo chome 280 address Hitachi Central Research Laboratory in the F-term (reference) 2C005 MA18 NA08 NA36 5B035 BA03 BB09 CA01 CA23

Claims (5)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】少なくとも2つの外部入出力電極をもつI 1. A I having at least two external input and output electrodes
    Cチップと、上記2つの外部入出力電極に接続されたアンテナ用導体パターンとをもち、上記アンテナ用導体パターンが形成されアンテナ回路基板の少なくとも一部が上記ICチップの2つの外部入出力電極に上記アンテナ用導体パターンの端部に接続されるようにした屈曲部をもって構成されたことを特徴とするアンテナを内蔵するICカード。 And C chip, the two have the external input and output electrode connected to the antenna conductor pattern, at least a portion of the antenna circuit board the antenna conductor patterns are formed on the two external input and output electrodes of the IC chip IC card having a built-in antenna, characterized in that it is configured with a bent portion which is to be connected to the end of the conductor pattern the antenna.
  2. 【請求項2】上記ICチップが扁平状で、上記2つの外部入出力電極が上記ICチップ上及び下側にあり、上記アンテナ用導体パターンが連続するコイル状で、その両端が上記2つの外部入出力電極に接続されていることを特徴とする請求項1記載のアンテナを内蔵するICカード。 In wherein said IC chip is flat, there the two external input and output electrodes on the upper IC chip and the lower, in coiled the antenna conductor patterns are continuous, and both ends of the two outer IC card having a built-in antenna according to claim 1, characterized in that it is connected to the input and output electrodes.
  3. 【請求項3】上記ICチップが扁平状で、上記2つの外部入出力電極が上記ICチップの同一面側にあり、上記アンテナ用導体パターンが連続するコイル状態で、その両端は両端が上記2つの外部入出力電極に接続され、その一端はカードの外周部を上記アンテナ用導体パターンが屈曲して上記外部入出力電極に接続されていることを特徴とする請求項1記載のアンテナを内蔵するICカード。 In wherein said IC chip is flat, there the two external input and output electrodes on the same side of the IC chip, a coil state in which the antenna conductor patterns are continuous, and both ends thereof opposite ends the two one of which is connected to the external input and output electrode, one end of a built-in antenna according to claim 1, characterized in that it is connected to the external input and output electrode outer peripheral portion of the card is bent conductor pattern the antenna IC card.
  4. 【請求項4】請求項1ないし3の何れか1つに記載のIC 4. IC according to any one of claims 1 to 3
    カードの製造方法であって、フィルム状アンテナ回路基板面上に上記アンテナ用導体パターンを形成し、上記I A card manufacturing method, to form a conductive pattern for the antenna to the film-like antenna circuit board surface, the I
    Cチップの入出力電極の1つが上記アンテナ用導体パターンの一端と接続されるように実装し、上記アンテナ回路基板面の少なくとも上記アンテナ用導体パターンの他端を含む部分を折り曲げ、当該他端が上記ICチップの入出力電極の他の1つの電極に接するように屈曲する工程をもつことを特徴とするICカードの製造方法。 One of the C-chip input and output electrodes mounted so as to be connected to one end of the conductor pattern for the antenna, bending a portion including the other end of at least the antenna conductor pattern of the antenna circuit board surface, is the other end method of manufacturing an IC card which is characterized by having a step of bending in contact with the other one of the electrodes of the input and output electrodes of the IC chip.
  5. 【請求項5】請求項4記載のICカードの製造方法において、上記フィルム状アンテナ回路基板の少なくとも一部を屈曲する工程の際に、上記フィルム状アンテナ回路基板のアンテナ用導体パターンと上記フィルム状アンテナ回路基板の少なくとも一部以外のアンテナ用導体パターンの接触を回避するための絶縁層を形成する工程をもつことを特徴とするICカードの製造方法。 5. A manufacturing method of IC card according to claim 4, wherein, when the step of bending at least a portion of the film-form antenna circuit board, the film-form antenna circuit shaped antenna conductor patterns and the film of the substrate IC card manufacturing method, characterized by having a step of forming an insulating layer for avoiding the contact of the antenna conductor pattern other than at least a portion of the antenna circuit board.
JP2001172049A 2001-06-07 2001-06-07 Ic card incorporating antenna Pending JP2002366917A (en)

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