JP2002366917A - Ic card incorporating antenna - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize an antenna built-in IC card which is inexpensive in the mounting of an IC chip on an antenna circuit board, is highly reliable, is not influenced by the type of an antenna structure and the size of an IC chip and is applicable in a wide range. SOLUTION: An IC chip 70 in which two input-output terminals of the IC chip 70 are respectively taken out of a front face and a rear face is used. A non-contact IC card or tag where the IC chip is mounted on the antenna circuit board 10 is obtained by folding one end connection part 60 over the other end connection part 50 to be connected to upper and lower input-output terminal electrodes of the IC chip as a method for connecting a conductor pattern 20 for an antenna to the two input-output terminals.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card having a built-in antenna, and more specifically, an IC chip and its IC.
The present invention relates to an IC card (including a non-contact IC tag) in which an antenna for wirelessly coupling a C signal to an external device is mounted on a planar substrate, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A conventional antenna having a built-in antenna is used.
As shown in FIGS. 1A and 1C, the C card is an IC card.
Film antenna circuit board 10 on which chip 70 is mounted
On one surface, a conductor pattern 20 for an antenna is formed. The antenna conductor pattern 20 has a coil shape, and both ends of the antenna conductor pattern 20 are connected to two electrodes 50 and 60 of an IC chip 70, respectively. In this case, since the conductor pattern 20 has a coil (spiral) shape, the inside end of the coil 20 is pulled out to the back surface of the antenna circuit board 10 through the through hole 30 as shown in the drawing.
It is connected to the back side coil pattern 40, pulled out to the surface of the film 10 through the through hole 35, and connected to the connection part 60. This avoids crossing on the same plane. Also, a method not using the through holes 30 and 35 is shown in FIG.
As shown in (c), the shape of the coil is set to a single number of turns,
The connecting portion 50 and the connecting portion 60 of the IC chip 70 are connected to both ends of the conductor pattern 20 for the antenna (Japanese Patent Laid-Open No.
It is described in JP-A-1-176060. ).

[0003]

SUMMARY OF THE INVENTION FIG.
In the manufacture of the IC card shown in (b), it is essential to provide a through-hole in its manufacture, and a plating step and a connection wiring step on the back surface are added thereto. Therefore, the manufacturing cost of the antenna circuit board increases. FIG.
In the IC card shown in (c), the connection between the two input / output terminals of the IC chip is made by the coil-shaped conductor pattern 20 inside the chip.
It is necessary to close the connection at both ends of the IC card, so that the number of turns and the chip size of the antenna conductor pattern 20 are limited, and the application range of the IC card is limited.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems, to provide a low-cost, high-reliability,
An object of the present invention is to provide an IC card with a built-in antenna that is not affected by the size of a chip and has a wide application range. That is, an antenna built-in IC that does not have a through hole and is not limited by the number of turns of a coil, chip size, deterioration of reliability, and the like.
An object of the present invention is to provide a card and a method for manufacturing the card.

[0005]

In order to achieve the above object, an IC card having an antenna of the present invention includes an IC chip having at least two external input / output electrodes,
A conductor pattern for the antenna connected to the three external input / output electrodes, wherein the conductor pattern for the antenna is formed, and the antenna circuit board is configured to have a bent portion so as to contact the upper and lower sides of the IC chip. . Where IC
The card includes a non-contact IC tag that has only two IC chips and is used for identification. Further, in order to manufacture the IC card of the present invention, the method of manufacturing an IC card of the present invention includes forming the conductor pattern for an antenna on a film-like substrate surface, wherein one of the input / output electrodes of the IC chip has the antenna And mounting at least a part of the film-shaped substrate so that the other end of the antenna conductor pattern is in contact with another one of the input / output electrodes of the chip. Has a process. That is, a part of the conductor pattern for the antenna forms a bent portion together with the surface of the film-shaped substrate and is connected to the electrode of the IC chip. According to the present invention, the above-described configuration and manufacturing method can solve the problem without providing a through-hole and without being limited by the number of turns of the coil, the chip size, the deterioration of reliability, and the like. That is, an IC in which one terminal of an IC circuit is a ground terminal is used, and its extraction electrode is provided on the back surface of the silicon substrate, and the two input / output terminals of the IC chip can be extracted from the front surface and the back surface, respectively. Further, even if an IC chip having two normally used input / output terminals formed on the surface of the IC chip is used, the problem can be solved by performing double folding. In addition, even if a material for a low-resistance antenna conductor pattern is used, it can be solved by combining an antioxidant metal and a silver paste.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS <First Embodiment> FIG. 2 is a plan view and a sectional view for explaining a structure and a manufacturing method of an IC card according to a first embodiment of the present invention.

FIGS. 2A and 2B are plan views for explaining one step of the method for manufacturing an IC card according to the present invention. On one surface of continuous films (100) and 100 having a predetermined shape (rectangle), antenna conductor pattern 20 is formed in a coil shape by screen printing of silver paste or etching of copper, aluminum or the like. Films 20 and 100 are 0.05-
A material of about 0.2 mm that can be easily bent is used. The conductor pattern 20 has a width of about 0.05 to 1 mm, and is made of silver paste, copper, or aluminum thin film. At both ends of the conductor pattern 20 for the antenna, an input / output connection portion 50 and an input / output connection portion 60 are present. Next, an anisotropic conductive film 80 for electrical connection is temporarily pressure-bonded on the input / output connection portion 50. The IC chip 70 is positioned on the anisotropic conductive film 80 with the lower terminal thereof aligned with the input / output connection portion 50, and the IC chip 70 is temporarily compressed and fixed. The IC chip 70 used here has a structure in which the ground terminal of the IC circuit is taken out from the silicon substrate, so that the two input / output terminals of the IC chip are taken out from the front surface and the back surface, respectively.

[0008] The insulating film 110 of FIG. 2B is aligned and the first film adhesive 140 is positioned downward. The insulating film 110 is provided with an insulating film opening 160, and the upper input / output electrode 90 is connected to the input / output connection portion 60 through the insulating film opening 160.
It can be connected to When the input / output connection part 60 is folded, the insulating film 110 is
To prevent short circuit.

[0009] Thereafter, a film 100 (hereinafter referred to as a folding film) for temporarily compressing and fixing the anisotropic conductive film 80 is placed in the folded portion 1 toward the surface of the film 10.
Fold it at the part of 05. Since the folding film 100 and the film 10 are the same size, the folding automatically completes the alignment. Input / output connection unit 60 is 0.
Since it is 1 to several mm square, alignment can be easily performed. Thereafter, a load is applied while applying heat to the top and bottom of the IC chip in the state of the cross-sectional view of FIG.
Are electrically conducted. Although the thickness method is exaggerated for the sake of clarity, the left side is bent in a U-shape, but actually has a curved shape. The insulating film 110 has a first film adhesive 14
0, since the second film adhesive 150 is formed, the entire substrate is heated and pressed to form the first film adhesive 140 and the first film adhesive 140.
The film is adhered with a film adhesive 150 to complete a card form.

According to the above-described structure and manufacturing method, an IC card in which an antenna and an IC chip are mounted by folding the outer input / output connection portion 60 without using a through hole can be obtained. In addition, the antenna conductor pattern 20 is realized on the folding film 100 and the film 10 in the same printing process, and the cost can be reduced by a simple manufacturing method by simply folding the folding film 100. <Embodiment 2> FIG. 3 shows a second embodiment of an IC card according to the present invention.
It is a top view and a sectional view explaining a structure and a manufacturing method of an embodiment. In the present embodiment, the antenna conductor pattern 2
Only the portion including the input / output terminal 50 of 0 is folded back. Functions and components substantially the same as those in the configuration of the first embodiment are denoted by the same reference numerals as in FIG. An anisotropic conductive film 80 for electrical connection on the input / output connection portion 60
Is temporarily crimped. IC chip 7 on anisotropic conductive film 80
0 is aligned with the input / output connection portion 60, and the IC chip 70 is temporarily compressed and fixed. Then, the input / output connection unit 50
Also, the anisotropic conductive film 80 is temporarily compressed and fixed.

Next, as shown in FIG. 3 (b), the folding film 100 separated by the cut portion 130 is folded at the folding portions 105 and 106. At this time, by arranging the insulating film 110, a short circuit between the coils is prevented. Next, a load is applied while applying heat to the upper and lower sides of the IC chip 70 to electrically conduct the IC chip 70. Finally, the upper and lower sides are sandwiched by a film with an adhesive, and the entire substrate is heated and pressed to complete a card form. According to the above-described structure and method, a non-contact IC card in which an IC chip is mounted by folding an inner input / output terminal without using a through-hole can be obtained.

The antenna pattern in the IC card of the present invention is not limited to a coil. FIG. 4 shows an antenna having a shape other than the coil shape, and the two input / output terminals of the IC chip are mounted using the IC chips respectively taken out from the front surface and the back surface in the same manner as described above. Reference numeral 20 denotes a non-coiled shape. Note that, for simplicity, the display of the IC chip unit is omitted.

FIG. 4A shows a one-turn antenna structure. After the IC chip is mounted in the same manner as described above, the input / output connection 50 and the input / output connection 6
0 folds such that the dashed line 105 overlaps with the folded portion. The input / output electrodes of the IC chip, the input / output connection unit 50 and the input / output connection unit 60 are electrically connected to each other to obtain a non-contact IC card and a tag on which the IC chip is mounted.

FIG. 4B shows a conductor pattern 2 for an antenna.
FIG. 1 shows an example in which the antenna slit 45 is formed in the hole No. 0. This is also folded so that the input / output connection part 50 and the input / output connection part 60 overlap from the center line 105 of the film 10. The input / output electrodes of the IC chip, the input / output connection unit 50 and the input / output connection unit 60 are electrically connected to each other to obtain a non-contact IC card and a tag on which the IC chip is mounted.

FIG. 4C shows a dipole antenna. From the center line 105 of the film 10, the input / output connection part 50 and the input / output connection part 60 are folded so as to overlap. The input / output electrodes of the IC chip, the input / output connection unit 50 and the input / output connection unit 60 are electrically connected to each other, and a non-contact IC card on which the IC chip is mounted is obtained.

According to the above method, a contactless IC card and a tag on which an IC chip is mounted can be obtained without providing a through-hole and without being limited by the number of turns of the coil and the chip size. <Embodiment 3> FIG. 5 shows a third embodiment of an IC card according to the present invention.
It is a figure explaining embodiment of.

FIGS. 2A and 2B are plan views for explaining a manufacturing method, and FIG. 1C is a cross-sectional view of the IC card shown in FIG.
DD ′ cross-sectional view). In this embodiment, the conductor pattern 20 for the antenna is double-wound.

On the film 10 shown in FIG. 5A, the antenna conductor patterns 20 are arranged point-symmetrically at the center so that the number of turns of the coil is doubled when the antenna conductor patterns 20 face each other. Formed. Input / output connection 6
An anisotropic conductive film 80 is temporarily press-bonded and fixed on the upper side of the film. On the anisotropic conductive film 80, the IC chip 70 is aligned with the input / output connection part 60, and the IC chip 70 is temporarily compressed and fixed. The input / output connection part 50 also has an anisotropic conductive film 8.
0 is temporarily pressed and fixed. In order to prevent the upper and lower antenna conductor patterns 20 from contacting each other, the insulating film 110 shown in FIG.
Adjust so that 40 is down. This insulating film 1
10 is provided with an insulating film opening 160, and the upper input / output electrode 90 is connected to the insulating film opening 160.
Via the input / output connection unit 60. The film 10 is folded at the folded portion 105 in the direction in which the antenna conductor pattern 20 faces in the direction of the arrow, and the IC chip 70 is electrically connected by heat compression. Finally, the entire substrate is heat-pressed and bonded with the first film adhesive 140 and the first film adhesive 150,
Complete in card form. <Fifth Embodiment> FIG. 6 shows a fifth embodiment of the IC card according to the present invention.
It is a figure explaining embodiment of. Figures (a) and (b)
Shows a plan view for explaining the manufacturing method. In the present embodiment, the antenna conductor pattern 20 is double-wound.
The fourth embodiment differs from the fourth embodiment in the form of overlapping antenna conductor patterns. Substantially the same configuration and functional units are denoted by the same reference numerals as the same parts in FIG. Note that the IC chip portion is omitted.

On the film 10, an antenna conductor pattern 20, a second antenna conductor pattern 25, an input / output connection part 50, and an input / output connection part 60 are formed. The broken line portion 105 is folded. After being folded, the conductor pattern 20 for the antenna, the conductor pattern 2 for the second antenna, as shown in FIG.
5, the input / output connection unit 50 and the input / output connection unit 60 are in a state of being overlapped. Except for the intersection between the input / output connection and the coil, do not overlap. Here, the conductor pattern for the antenna has been described, but connection, insulation, bonding, and the like of the IC chip are performed in the same manner as described above to complete the card form.

According to the above-mentioned method, an antenna circuit board having twice the number of turns is realized by doubling the coil without providing a through-hole and without increasing the number of strokes. By devising the shape of the pattern, a contactless IC card and a tag on which an IC chip is mounted can be obtained without increasing the parasitic capacitance. <Embodiment 6> FIG. 7 shows a sixth embodiment of the IC card according to the present invention.
It is a figure explaining embodiment of. FIGS. 3A, 3B and 3C are plan views for explaining a manufacturing method, and FIGS.
FIG. 3C is a cross-sectional view showing the EE cross section of FIG. This embodiment is suitable when the two electrodes of the IC chip are on the same plane side of the IC chip.

An antenna conductor pattern 20 is formed on the surface of the film 10 shown in FIG. 7A, and an insulating film opening is formed in order to dispose the input / output connection 60 near the inner input / output connection 50. A part 180 is provided. The second folding film 170 is set so that the input / output connection part b faces the back side.
It is folded at the second folding section 180. Next, the folding film 100 is folded at the folded portion 105 such that the conductor pattern 20 for the antenna faces the back side. That is, FIG. 7A shows the second folding file.
(C) The surface of the rubber 170 is rotated 360 degrees with respect to the (a) plane. FIG. 7B shows the folded state. An input / output connection unit 50 for connecting the electrode unit of the IC chip 70,
The input / output connection unit 60 can be installed in close proximity.

As shown in FIG. 7D, the IC chip 70
The input / output electrode 200 and the input / output electrode 210 are electrically connected to the input / output connection unit 50 and the input / output connection unit 60 by heating and pressing using an anisotropic conductive film 80, respectively. Finally, the upper and lower sides are sandwiched by a film with an adhesive, and the entire substrate is heated and pressed to complete a card form. According to the above method, an antenna circuit board using an IC chip having an input / output electrode formed on the surface of the IC chip, which is generally used at present, is realized without providing a through-hole, and a non-contact mounting the IC chip is realized. An IC card and a tag are obtained. <Embodiment 7> FIG. 8 shows a connection which can realize a low resistance in an antenna circuit board on which an IC chip is mounted and which prevents a reduction in connection reliability due to oxidation of the surface when copper, aluminum or the like is used. The structure is shown by a plan view and a partial sectional view. When the antenna conductor pattern 20 is formed of copper, aluminum, or the like, a low-resistance antenna circuit board can be realized, but oxidation of the metal surface is inevitable. Particularly, in severe environmental conditions such as high temperature and high humidity, the connection reliability is poor. Deterioration is a concern.

8 (a) and 8 (b), the input / output connection portion 50 and the input / output connection portion 6 which are the ends of the antenna conductor pattern 20.
In each of the upper layers of O, an antioxidant metal 220 is formed, and a silver paste is further laminated thereon. Thereafter, an IC chip is mounted on the antenna circuit board using an anisotropic conductive film to prevent oxidation. Furthermore, by connecting with a silver paste having high connection reliability, a non-contact IC card and a tag on which an IC chip having low resistance and high connection reliability are mounted can be obtained.

In the above embodiment, the structure in which only the input / output connection portion, which can be used from low frequency to high frequency, is laminated is shown. This is because, at high frequencies, signal radio waves only flow through the skin of the antenna metal of 1 to 2 μm, so that the coil surface needs to be made of a low-resistance material. However, when used at a low frequency, the coil surface does not need to have low resistance, so that all of the antenna conductor pattern and the input / output connection portion may have a laminated structure.

The above-mentioned oxidation preventing metals are Ti, P
Metals such as t, Au, Ni, Ta, Ag and the like can be used, and a stacked film or alloy of the above metals may be used.

In the first to fourth embodiments of the present invention, the method of using an anisotropic conductive film under the electric connection condition of the IC chip has been described. However, the electric connection is performed by using a solder, a conductive adhesive, an adhesive, Either direct bonding between metal and metal or alloy bonding may be used.

[0027]

According to the present invention, an IC chip capable of taking out two input / output terminals of an IC chip from a front surface and a back surface is used, and one terminal connection portion is folded over the other terminal connection portion. By connecting the upper and lower input / output terminal electrodes of the chip and the terminating connector, respectively, a non-contact IC card and a tag having an IC chip mounted on an antenna circuit board can be obtained. Place the conductor pattern for the antenna on the same plane,
At the center of the conductor pattern for the antenna, when it is folded face-to-face, the number of turns of the coil is doubled so that it is arranged point-symmetrically at the center so that the IC is mounted on the double-wound antenna circuit board. Non-contact I with chip mounted
C card and tag can be obtained. Further, even in the case of an IC chip in which two normally used input / output terminals are formed on the surface of the IC chip, a non-contact IC card and a tag on which the IC chip is mounted can be obtained by performing double folding. In addition, even when using a low-resistance antenna conductor pattern material, a non-contact IC chip mounted IC chip can be obtained by combining an antioxidant metal and a silver paste.
C card and tag can be obtained.

According to the above method, a non-contact IC card and a tag on which a chip is mounted can be obtained without providing a through-hole and without being limited by the number of turns of the coil, the chip size, the reliability, and the like.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a conventional IC card.

FIGS. 2A and 2B are a plan view and a cross-sectional view illustrating a first embodiment of an IC card according to the present invention.

FIG. 3 is a plan view and a cross-sectional view illustrating a second embodiment of an IC card according to the present invention.

FIG. 4 is a plan view and a sectional view illustrating a third embodiment of an IC card according to the present invention.

FIG. 5 is a plan view and a cross-sectional view illustrating a fourth embodiment of the IC card according to the present invention.

FIG. 6 is a plan view and a cross-sectional view illustrating a fifth embodiment of the IC card according to the present invention.

FIG. 7 is a plan view and a cross-sectional view illustrating a sixth embodiment of an IC card according to the present invention.

8A and 8B are a plan view and a cross-sectional view illustrating a seventh embodiment of the IC card according to the present invention.

[Explanation of symbols]

 Reference Signs List 10: Film 20: Conductor pattern for antenna 25: Conductor pattern for second antenna 30: Through hole a 35: Through hole b 40: Conductor pattern for backside antenna 45: Antenna slit 50: Input / output connection part a 60: Input / output connection Part b 70: IC chip 80: Anisotropic conductive film 90: Upper input / output electrode 100: Folding film 105: Folding part 110: Insulating film 120: Lower input / output electrode 130: Folding cut part 140: First adhesive 150: second adhesive 160: insulating film opening 170: second folding film 180: second folding part 190: film opening 200: input / output electrode a 210: input / output electrode b 220: antioxidant metal 230: Silver paste

Continued on the front page (72) Inventor Takashi Tase 1-280 Higashi-Koigabo, Kokubunji-shi, Tokyo F-term in Central Research Laboratory, Hitachi, Ltd. (Reference) 2C005 MA18 NA08 NA36 5B035 BA03 BB09 CA01 CA23

Claims (5)

[Claims] An I / O having at least two external input / output electrodes
A C chip and an antenna conductor pattern connected to the two external input / output electrodes, wherein the antenna conductor pattern is formed and at least a part of the antenna circuit board is connected to the two external input / output electrodes of the IC chip; An IC card having a built-in antenna, comprising a bent portion connected to an end of the conductor pattern for an antenna. 2. The IC chip has a flat shape, the two external input / output electrodes are on and under the IC chip, and the antenna conductor pattern is a continuous coil, and both ends of the two external input / output electrodes are the two external electrodes. 2. The IC card according to claim 1, wherein the IC card is connected to an input / output electrode. 3. The IC chip is flat, the two external input / output electrodes are on the same side of the IC chip, and the antenna conductor pattern is in a continuous coil state. The antenna according to claim 1, wherein one end of the antenna is connected to the external input / output electrode by connecting the antenna conductor pattern at one end to the outer peripheral portion of the card. IC card. 4. The IC according to claim 1, wherein
A method of manufacturing a card, comprising: forming the antenna conductor pattern on a film-like antenna circuit board surface;
One of the input / output electrodes of the C chip is mounted so as to be connected to one end of the antenna conductor pattern, and a portion of the antenna circuit board surface including at least the other end of the antenna conductor pattern is bent. A method of manufacturing an IC card, comprising a step of bending so as to be in contact with another one of the input / output electrodes of the IC chip. 5. The method for manufacturing an IC card according to claim 4, wherein the step of bending at least a part of the film-like antenna circuit board includes the step of bending the antenna conductor pattern of the film-like antenna circuit board and the film-like antenna circuit board. A method for manufacturing an IC card, comprising a step of forming an insulating layer for avoiding contact with an antenna conductor pattern other than at least a part of an antenna circuit board.