JP2001325574A - Ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a pattern coil on a substrate by printing and to secure a sufficient turn number for the coil of an antenna. SOLUTION: This IC card is constituted by providing a filmy substrate 2 with an antenna 5 and an electronic component 7, and the antenna 5 is formed of a 1st layer pattern coil 9 in spiral winding pattern formed on the substrate 2 by printing, an insulating layer 11 which is formed on the 1st layer pattern coil 9 by printing, and a 2nd layer pattern coil 10 in spiral winding pattern which is formed on the insulating layer 11 by printing. Thus, since the patterns coils 9 and 10 of two layers are formed by printing, a turn number needed for the coil of the antenna 5 can sufficiently be secured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card formed by providing an antenna and electronic components on a film-like substrate.

[0002]

2. Description of the Related Art In an IC card of this kind, for example, a non-contact type IC card, when an antenna is provided on a substrate, a copper foil is attached to the entire surface of the substrate and then the copper foil is etched to form a spiral. Is formed. The copper foil coil is used as an antenna. In the case of the copper foil coil, since a fine pattern can be processed, the number of turns required for the antenna coil can be sufficiently secured. Therefore, the copper foil coil exhibits sufficiently good performance as an antenna of an IC card.

[0003]

However, in the case of the conventional structure described above, when manufacturing a copper foil coil, an operation of attaching a copper foil to a substrate (or using a copper-clad substrate).
And the work of etching the copper foil is required, so that the manufacturing workability is not very good. Also, the manufacturing cost was high.

On the other hand, a spiral pattern coil is formed by printing a conductive paste on a substrate,
A configuration is conceivable in which the printed pattern coil is used as an antenna. With this configuration, the manufacturing workability is improved and the manufacturing cost is reduced.

However, in the case of a configuration in which the pattern coil is formed by printing, it is difficult to form a fine pattern. Since the conductive paste is printed, if the width of the pattern to be printed is reduced, the conductive resistance of the pattern increases, and there is also a problem that required antenna characteristics cannot be obtained. For this reason, when the pattern coil is formed by printing, there arises a problem that the number of turns required for the antenna coil cannot be sufficiently secured.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an IC card in which a pattern coil is formed on a substrate by printing, and the number of turns required for an antenna coil can be sufficiently secured.

[0007]

According to the first aspect of the present invention, the antenna includes a first layer pattern coil having a spiral winding pattern formed by printing on a substrate, and the first layer coil.
An insulating layer formed by printing on the layer pattern coil, and a second layer pattern coil having a spiral winding pattern formed by printing on the insulating layer.
In this configuration, since the two-layer pattern coil is formed by printing, the number of turns required for the antenna coil can be sufficiently ensured.

According to the second aspect of the present invention, the antenna is formed by printing the first layer pattern coil having a spiral winding pattern formed on the substrate by printing and on the first layer pattern coil. A first insulating layer, a second layer pattern coil having a spiral winding pattern formed by printing on the first insulating layer, and a second layer pattern coil formed by printing on the second layer pattern coil. A second insulating layer, and a third layer pattern coil having a spiral winding pattern formed on the second insulating layer by printing, and further comprising the first to third layer patterns. Two of the coils have first and second partial coils, each of which is a multiple-turn winding pattern, and the other one of the first to third layer pattern coils Since yl is configured to have a third part coil is wound pattern of one turn, it is possible to further sufficiently ensure the number of turns required as a coil antenna. In particular, in the case of the invention of claim 2, if the size of the third partial coil is set to a size at which the strongest power can be obtained, the antenna characteristics can be further improved.

In the invention of claim 3, the antenna is
A first layer pattern coil having a spiral wound pattern formed on a substrate by printing, a first insulating layer formed on the first layer pattern coil by printing,
A second layer pattern coil having a spiral winding pattern formed by printing on the second insulating layer, a second insulating layer formed by printing on the second layer pattern coil, And a third layer pattern coil having a spiral winding pattern formed by printing on the insulating layer, wherein one of the first to third layer pattern coils is insulated. And the second and fourth partial coils in which the two patterns obtained are spirally wound, and the remaining two pattern coils of the first to third layer pattern coils are one. The first pattern is a spiral pattern in which the pattern is spirally wound.
And a third partial coil, and the four partial coils are electrically connected in a first, second, third, and fourth order. According to this configuration, the number of turns required for the coil of the antenna can be more sufficiently secured.

According to the fourth aspect of the present invention, since the winding pattern of the third partial coil and the winding pattern of the first partial coil overlap, the stray capacitance of the coil is reduced. Can be bigger.

According to the fifth aspect of the present invention, since the winding pattern of the third partial coil and the winding pattern of the first partial coil are deviated, the stray capacitance of the coil is reduced. Can be smaller.

According to the invention of claim 6, the second layer pattern coil has the second and fourth partial coils, and the first and third layer pattern coils are the first and third layer coils, respectively. 3 so as to have a partial coil, it is possible to reduce the step of the connecting portion of the coil,
Can increase reliability.

[0013]

FIG. 1 to FIG. 5 show a first embodiment in which the present invention is applied to a non-contact type IC card.
This will be described with reference to FIG. First, FIG.
The circuit board 2 constituting the exterior of the C card 1 of the C card 1 on the lower side in FIG. 5, the cover member 3 constituting the exterior of the IC card 1 on the upper side in FIG. 5, and the circuit board 2 and the cover 3 And an adhesive layer 4 to be adhered.

The circuit board 2 and the cover member 3 are
It is made of, for example, a plastic plate which is a film-shaped insulating member. Here, a coil-shaped antenna 5, a capacitive plate 6, an IC chip (electronic component) 7, and the like are provided on a mounting surface (an upper surface in FIG. 5) of the circuit board 2. The antenna 5 and the capacitive plate 6
Is composed of a conductor pattern (circuit pattern) formed as described later. In addition, IC chip 7
Are connected on the circuit board 2 by flip chip mounting, wire bonding, soldering or the like. The circuit board 2
A conductor pattern (wiring pattern, land, or the like) 8 having a shape as shown in FIG. 2 is formed on the upper portion, and the conductor pattern 8 connects the IC chip 7 and the antenna 5 together with the IC chip. 7 and the capacity plate 6 are connected.

The adhesive layer 4 is made of, for example, a plastic sheet having heat-fusibility. In the case of this configuration, when a laminate of the circuit board 2, the plastic sheet, and the cover member 3 is thermocompression-bonded by a hot press device, the intermediate plastic sheet is melted to have fluidity. The space between the cover member 3 and the cover member 3 is sufficiently filled, and the two members are firmly bonded. IC card 1 thus bonded
Is configured such that its thickness dimension is, for example, 0.76 mm or less.

In the case of the IC card 1 having the above configuration,
A data signal is transmitted / received to / from an IC card read / write device (not shown) via the antenna 5, and power is supplied from the IC card read / write device.

Next, a method of forming the antenna 5 on the circuit board 2 by printing will be described with reference to FIGS. In this case, first, a circuit pattern (conductor pattern) as shown in FIG. 2 is formed by screen-printing a conductive paste on the circuit board 2. The circuit pattern includes a first layer pattern coil 9 formed of a spirally wound conductor pattern, a capacitive plate 6 formed of, for example, four rectangular flat conductor patterns, and a plurality of pattern shapes as illustrated. And a plurality of conductor patterns 8. In other words, the first layer pattern coil 9, the capacitive plate 6, and the conductor pattern 8 are formed at the same time by the step of printing the conductive paste on the circuit board 2.

Here, the end 9 a of the outermost peripheral portion of the first layer pattern coil 9 is connected so as to be continuous with one conductor pattern 8. The innermost end 9b of the first layer pattern coil 9 is an end connected to the innermost end 10b of the second layer pattern coil 10 described later (see FIG. 1).

Next, as shown in FIG. 3, an insulating paste is screen-printed on the first layer pattern coil 9 on the circuit board 2 so as to cover the first layer pattern coil 9. 11 is provided. This insulating layer 1
1 has a substantially circular shape as a whole, and a through hole 11a is formed at the center thereof. This through hole 11a
Accordingly, as shown in FIGS. 1 and 3, the innermost peripheral end 9b of the first layer pattern coil 9 is exposed.

Subsequently, as shown in FIG. 4, a conductive paste is screen-printed on the insulating layer 11 on the circuit board 2 to form a spiral winding pattern on the insulating layer 11. The second layer pattern coil 10 made of a conductor pattern is formed. This second layer pattern coil 1
As shown in FIG. 1, the end 10b of the innermost peripheral portion of the first layer pattern coil 9 is connected to the end 9b of the innermost peripheral portion of the first layer pattern coil 9 through a through hole 11a of the insulating layer 11. . The outermost end 10a of the second layer pattern coil 10 is connected to the conductor pattern 8 as shown in FIGS.

In the case of the above configuration, the antenna 5 is composed of the first layer pattern coil 9, the insulating layer 11, and the second layer pattern coil 10. The two ends of the antenna 5 for connection are the outermost end 9a of the first layer pattern coil 9 and the outermost end 10a of the second layer pattern coil 10.

According to the present embodiment having such a configuration, the antenna 5 of the non-contact type IC card 1 is connected to the first layer pattern coil 9 formed on the circuit board 2 by printing and the first layer pattern coil 9. An insulating layer 11 formed by printing on the coil 9 and a second layer pattern coil 10 formed by printing on the insulating layer 11 were provided. In the case of this configuration, even if it is difficult to form a fine pattern by printing, or there is a restriction that the width of the pattern to be printed has to be increased to some extent, the two-layer pattern coils 9, 10 Is formed by printing, the number of turns required for the coil of the antenna 5 can be sufficiently secured. Further, according to the above embodiment, the manufacturing workability is improved and the manufacturing cost is also reduced.

FIGS. 6 to 8 show a second embodiment of the present invention. In addition, the same configuration as the first embodiment includes:
The same reference numerals are given. In this second embodiment,
The insulating layer 12 is printed on the second layer pattern coil 10 by printing.
And a third-layer pattern coil 13 composed of a conductor pattern of a winding pattern for one turn is formed on the insulating layer 12 by printing.

Specifically, first, as in the first embodiment, as shown in FIG. 6, a conductive paste is screen-printed on the circuit board 2 to form a spiral winding pattern. The first layer pattern coil 9 and other circuit patterns (conductor patterns) are formed. In FIG. 6,
Only the first layer pattern coil 9 and its peripheral portion are shown. The first layer pattern coil 9 forms a first partial coil 30. This first partial coil 30
Has multiple turns. Here, the first partial coil 3
The outermost end 30 a of the zero is connected to one conductive pattern 8.

Next, as shown by a two-dot chain line in FIG. 6, the first layer pattern coil 9 is formed by screen printing an insulating paste on the first layer pattern coil 9 on the circuit board 2. Cover the insulating layer (first
Is provided. The first partial coil 30 is formed through a through hole 11 a formed in the center of the insulating layer 11.
Is exposed at the innermost peripheral end 30b.

Subsequently, as shown in FIG. 7, a conductive paste is screen-printed on the insulating layer 11 on the circuit board 2 to form a spiral winding pattern on the insulating layer 11. Is formed. The second layer pattern coil 10 forms a second partial coil 31. This second partial coil 31
Also have multiple turns. The innermost end 31b of the second partial coil 31 is connected to the innermost end 30b of the first partial coil 30 through the through hole 11a of the insulating layer 11. .

Then, as shown by a solid line in FIG. 8, an insulating paste is screen-printed on the second layer pattern coil 10 on the circuit board 2 so as to cover the second layer pattern coil 10. An insulating layer (second insulating layer) 14 is provided. Further, a conductive paste is screen-printed on the insulating layer 14,
On the insulating layer 14, a third layer pattern coil 15 composed of a conductor pattern of a winding pattern for one turn is formed.
The third layer pattern coil 15 is formed by the third partial coil 3.
2 are formed. One end 32a of the third partial coil 32 is connected to the outermost end 31 of the second partial coil 31.
a. The other end 32 b of the third partial coil 32 is connected to another conductor pattern 8.

The size of the winding pattern for one turn of the third partial coil 32 is such that the strongest power can be obtained when transmitting and receiving signals and the like to and from the IC card read / write device. (The size of the antenna coil in the IC card read / write device).

In the case of the above configuration, the first partial coil 30,
The insulating layer 11, the second partial coil 31, the insulating layer 14, the third
The antenna 16 is composed of a part of the coil 32.
The two ends of the antenna 16 are connected to the outermost end 30 a of the first partial coil 30 and the third partial coil 3.
2 is the other end 32b.

The configuration of the second embodiment other than that described above is the same as the configuration of the first embodiment. Therefore, in the second embodiment, substantially the same operation and effect as in the first embodiment can be obtained. Further, in the second embodiment, as shown in FIG. 8, the third layer pattern coil 15 is configured to form a coil corresponding to one turn of the third partial coil 32. Alternatively, another pattern coil (the first layer pattern coil 9 or the second layer pattern coil 10) may be configured to form a coil of one turn of the third partial coil.

In particular, in the second embodiment, in addition to the second-layer pattern coil 10, the third partial coil 32 having a winding pattern for one turn is formed via the insulating layer 14. Thus, the number of turns required for the coil of the antenna 16 can be more sufficiently secured. Also, the third
Since the size of the partial coil 32 is set to a size at which the strongest power can be obtained, the antenna characteristics can be further improved.

FIGS. 9 to 15 show a third embodiment of the present invention. The same components as those in the first embodiment are denoted by the same reference numerals. In the third embodiment, an antenna 19 is formed by forming three layers of coil patterns 9, 17, and 18 on a circuit board 2 by printing.

More specifically, first, as in the first embodiment, as shown in FIG. 9, a conductive paste is screen-printed on the circuit board 2 to form a spiral winding pattern. The first layer pattern coil 9 and other circuit patterns (conductor patterns) are formed. In FIG. 9,
Only the first layer pattern coil 9 and its peripheral portion are shown. The first layer pattern coil 9 forms a first partial coil 30. Here, the end 30 a of the outermost peripheral portion of the first partial coil 30 is connected to one conductor pattern 8.
Are connected so as to be continuous.

Next, as shown by a two-dot chain line in FIG. 9, the first layer pattern coil 9 is covered by screen-printing an insulating paste on the first layer pattern coil 9 on the circuit board 2. So that the insulating layer (first
Is provided. The first partial coil 30 is formed through a through hole 11 a formed in the center of the insulating layer 11.
Is exposed at the innermost peripheral end 30b.

Subsequently, as shown in FIG.
The conductive paste is screen-printed on the upper portion of the insulating layer 11 so that the second
The layer pattern coil 17 is formed. The second layer pattern coil 17 is composed of a second partial coil 20 and a fourth partial coil 21 which are two insulated wiring patterns, and these partial coils 20, 21 are spirally wound. And a winding pattern wound in the same direction. The end 20 b of the innermost peripheral portion of the second partial coil 20 is connected to the first partial coil 30 through the through hole 11 a of the insulating layer 11.
Is connected to the innermost end 30b. Also, the fourth
The outermost end portion 21 a of the partial coil 21 is connected to another wiring pattern 8.

Then, as shown by a two-dot chain line in FIG.
The insulating layer 2 is screen-printed on the portion to cover the second layer pattern coil 17.
2 is provided. The innermost end 21b of the other wiring pattern 21 of the second layer pattern coil 17 is exposed through a through hole 22a formed in the center of the insulating layer 22.

Further, as shown in FIG.
On the insulating layer 22, a third-layer pattern coil 18 formed of a conductor pattern having a spiral winding pattern is formed by screen-printing a conductive paste on the second layer 2. The outermost end 18 a of the third-layer pattern coil 18 is connected to the outermost end 20 a of one of the wiring patterns 20 of the second-layer pattern coil 17. Then, the end 18 of the innermost periphery of the third layer pattern coil 18
“b” is connected to the end 21 b of the innermost peripheral portion of the other wiring pattern 21 of the second layer pattern coil 17.

Here, three layers of pattern coils 9, 1
FIG. 12 is a perspective view schematically and three-dimensionally showing the connection relationship between the respective end portions 7 and 18. FIG. 13 is a cross-sectional view in which connection portions at respective ends of the pattern coils 9, 17, and 18 of three layers are collected and shown. As shown in FIG. 13, at the connection portion of each pattern coil, two layers of patterns stacked vertically with an insulating layer interposed therebetween are directly connected. Thus, the step at the connection portion is reduced, so that disconnection hardly occurs.

In the case of the above configuration, the first layer pattern coil 9, the insulating layer 11, the second layer pattern coil 17, the insulating layer 2
An antenna 19 is composed of the second and third layer pattern coils 18. The two ends of the antenna 19 for connection are the outermost end 9a of the first layer pattern coil 9 and the outermost end 21a of the other wiring pattern 21 of the second layer pattern coil 17. ing.

The configuration of the third embodiment other than the above is the same as the configuration of the first embodiment. Therefore, in the third embodiment, substantially the same operation and effect as in the first embodiment can be obtained.

In particular, in the third embodiment, the second layer pattern coil 17 is connected to the two insulated wiring patterns 20 and 2.
1 has a spirally wound pattern, and the third layer pattern coil 18 is formed on the second layer pattern coil 17 with the insulating layer 22 interposed therebetween. Thus, the number of turns required for the coil of the antenna 19 can be more sufficiently secured.

Further, in the third embodiment, FIG.
It is preferable that the winding pattern of the third layer pattern coil 18 and the winding pattern of the first layer pattern coil 9 overlap as shown in FIG. With such a configuration, the stray capacitance of the coil can be increased, and increasing the stray capacitance of the coil is a configuration suitable for a case where the antenna characteristics are improved. Note that FIG.
Only one pattern coil 9, 18 is shown.

On the other hand, as shown in FIG.
It is also a preferable configuration that the winding pattern of the layer pattern coil 18 and the winding pattern of the first layer pattern coil 9 are shifted so as not to overlap. With such a configuration, the stray capacitance of the coil can be reduced, and a smaller stray capacitance of the coil is suitable for a case where the antenna characteristics are improved.

By appropriately adjusting the degree of overlap between the winding pattern of the third layer pattern coil 18 and the winding pattern of the first layer pattern coil 9 (ie, the degree of deviation), the stray capacitance of the coil is adjusted. Can be set to an appropriate value. The antenna characteristics can be adjusted also by setting the stray capacitance.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view around an antenna of an IC card according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a state where a first layer pattern coil is printed on a circuit board;

FIG. 3 is a partial plan view showing a state where an insulating layer is printed on a circuit board;

FIG. 4 is a partial plan view showing a state where a second layer pattern coil is printed on a circuit board;

FIG. 5 is a longitudinal sectional view of an IC card.

FIG. 6 shows a second embodiment of the present invention, and is a partial plan view showing a state where a first layer pattern coil is printed on a circuit board.

FIG. 7 is a partial plan view showing a state where a second layer pattern coil is printed on a circuit board;

FIG. 8 is a partial plan view showing a state where a third layer pattern coil is printed on a circuit board.

FIG. 9 shows a third embodiment of the present invention, and is a partial plan view showing a state where a first layer pattern coil is printed on a circuit board.

FIG. 10 is a partial plan view showing a state where a second layer pattern coil is printed on a circuit board.

FIG. 11 is a partial plan view showing a state where a third layer pattern coil is printed on a circuit board.

FIG. 12 is a perspective view schematically and three-dimensionally showing a connection relationship between ends of pattern coils 9, 17, and 18 of three layers.

FIG. 13 is a cross-sectional view in which connection portions at respective ends of pattern coils 9, 17, and 18 of three layers are collected and shown.

FIG. 14 is a diagram showing that the winding pattern of the third-layer pattern coil and the winding pattern of the first-layer pattern coil overlap each other.

FIG. 15 is a view showing that the winding pattern of the third layer pattern coil and the winding pattern of the first layer pattern coil are shifted so as not to overlap.

[Explanation of symbols]

1 is an IC card, 2 is a circuit board, 3 is a cover member, 4 is an adhesive layer, 5 is an antenna, 7 is an IC chip, 8 is a conductor pattern, 9 is a first layer pattern coil, 9a and 9b are ends, 10 is a second layer pattern coil, 10a and 10b are end portions, 11 is an insulating layer, 12 is an insulating layer, 13 is a third layer pattern coil, 14 is an insulating layer, 15 is a third layer pattern coil, 16 is an antenna, 17 is a second layer pattern coil, 1
8 is a third layer pattern coil, 19 is an antenna, 20 is a wiring pattern, 21 is a wiring pattern, and 22 is an insulating layer.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01Q 1/38 G06K 19/00 H 7/00 K

Claims (6)

[Claims] 1. An IC card comprising an antenna and electronic components provided on a film-like substrate, wherein the antenna comprises: a first layer pattern coil having a spiral winding pattern formed by printing on the substrate; And an insulating layer formed by printing on the first layer pattern coil, and a second layer pattern coil having a spiral winding pattern formed by printing on the insulating layer. IC card to do. 2. An IC card comprising an antenna and electronic components provided on a film-like substrate, wherein the antenna comprises: a first layer pattern coil having a spiral winding pattern formed by printing on the substrate; A first insulating layer formed by printing on the first layer pattern coil; a second layer pattern coil having a spiral winding pattern formed by printing on the first insulating layer; A second insulating layer formed by printing on the second layer pattern coil; and a third layer pattern coil having a spiral winding pattern formed by printing on the second insulating layer. Wherein two of the first to third layer pattern coils have first and second partial coils, each of which has a winding pattern of a plurality of turns. The remaining IC card is one pattern coils, characterized in that a structure having a third portion coil is a winding pattern of one turn of the layers to the third layer pattern coils. 3. An IC card comprising an antenna and an electronic component provided on a film-like substrate, wherein the antenna comprises: a first-layer pattern coil having a spiral winding pattern formed by printing on the substrate; A first insulating layer formed by printing on the first layer pattern coil; a second layer pattern coil having a spiral winding pattern formed by printing on the first insulating layer; A second insulating layer formed by printing on the second layer pattern coil; and a third layer pattern coil having a spiral winding pattern formed by printing on the second insulating layer. Wherein one of the first to third layer pattern coils has second and fourth partial coils in which two insulated patterns are spirally wound. The remaining two pattern coils of the first to third layer pattern coils have first and third partial coils, each of which is a wound pattern obtained by spirally winding one pattern. The four partial coils are electrically connected to first, second, third,
I is characterized in that it is configured to be connected in a fourth order.
C card. 4. The IC card according to claim 3, wherein the pattern of the first partial coil and the pattern of the third partial coil overlap each other. 5. The IC card according to claim 3, wherein the pattern of the first partial coil and the pattern of the third partial coil are configured to be shifted from each other. 6. The second layer pattern coil has the second and fourth partial coils, and the first and third layer pattern coils have the first and third partial coils, respectively. The IC card according to claim 3, wherein: