JP2006309401A - Ic tag - Google Patents

Ic tag Download PDF

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Publication number
JP2006309401A
JP2006309401A JP2005129573A JP2005129573A JP2006309401A JP 2006309401 A JP2006309401 A JP 2006309401A JP 2005129573 A JP2005129573 A JP 2005129573A JP 2005129573 A JP2005129573 A JP 2005129573A JP 2006309401 A JP2006309401 A JP 2006309401A
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Prior art keywords
antenna
ic tag
transmission
ic chip
reception antenna
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JP2005129573A
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JP4771115B2 (en
Inventor
Hironobu Ishizaka
Koji Tazaki
耕司 田崎
裕宣 石坂
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Hitachi Chem Co Ltd
日立化成工業株式会社
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Priority to JP2005129573A priority Critical patent/JP4771115B2/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag for attaining waterproof or mechanical strength for satisfying the reliability of the IC tag and flexibility for preventing an adherend itself from being damaged without damaging the comfort of wear or use when the IC tag is mounted on such cloth-shaped adherend as clothes or towel or bed sheet. <P>SOLUTION: This IC tag includes an IC chip for radio communication and a transmission/reception antenna, wherein at least a portion of the transmission/reception antenna is constituted of woven fabric or unwoven fabric or a wire net configured by using a metallic wire. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an IC tag.

  In recent years, a non-contact type individual identification system using an IC tag has attracted attention as a system for managing the entire life cycle of goods in all business categories of manufacturing, distribution, sales, and recycling. In particular, radio frequency type IC tags using UHF waves and microwaves are attracting attention due to the feature that an external antenna is attached to an IC chip and a communication distance of several meters is possible. Systems are being developed for the purpose of product history management and security management.

  Demonstration experiments using electromagnetic induction type IC tags using the 13.56 MHz band are being carried out in various industries such as apparel, home appliances, aviation, publishing, and agriculture, and some industries such as apparel Already, commercialization has already been attempted.

  In order to realize a large quantity of merchandise distribution and article management with a non-contact type individual identification system using an IC tag, it is necessary to attach an IC tag to each of the merchandise. For this purpose, a technique capable of mass-producing inexpensive IC tags and a technique for easily attaching IC tags to various shapes are indispensable.

  Regarding the attachment of the IC tag, it is necessary to select and attach an IC tag suitable for the shape and material of various articles. The current general IC tags include those molded into a card shape with an organic resin film such as vinyl chloride and polyethylene terephthalate (PET), processed into a paper label, or a thermoplastic resin or a thermosetting resin. There are things molded into a shape suitable for the application, etc., and they are often attached to the adherend using strings, adhesives, etc., or put in a packing box. However, when considering cloth-like products such as clothes, towels, and sheets as adherends, and not only logistics management until these products are lined up at retail stores, but also management during use or after use. The IC tag to be attached has a mechanical strength such as water resistance, pressure resistance, folding resistance and twisting resistance that can withstand repeated washing and dehydration, and wear when using clothes and towels with IC tags attached. Flexibility is required so as not to impair comfort and comfort.

  As a radio wave type IC tag using a microwave, for example, a tag using a TCP (Tape Carrier Package) type inlet developed by Hitachi, Ltd. and Renesas Technology Corp. is known. Here, the inlet is a non-contact type solid identification IC chip mounted on a transmission / reception antenna, and is an intermediate form of an IC tag.

As another inlet structure, for example, Hitachi, Ltd. has developed a structure in which an IC chip (hereinafter, double-sided electrode chip) in which one external electrode is formed on each of the front and back surfaces is sandwiched between excitation slit type dipole antennas ( Patent Document 1). The dipole antenna structure having the excitation slit can match the impedance of the antenna and the input impedance of the IC chip by changing the width and length of the slit, and can obtain good communication characteristics.
Japanese Patent Laid-Open No. 2004-127230

  However, in order to satisfy water resistance and mechanical strength, it is preferable to mold with an organic resin or the like in order to protect the IC chip, the transmission / reception antenna or its connection part from destruction, but its rigidity makes it comfortable and comfortable to use. There was a problem that it was damaged or the cloth of the adherend itself was damaged.

  The present invention has been made in view of the above. For example, when attached to cloth-like adherends such as clothes, towels, sheets, etc., water resistance and mechanical strength for satisfying the reliability of the IC tag. The present invention also provides an IC tag capable of realizing flexibility that does not impair the wearing comfort and comfort without damaging the adherend itself.

That is, the present invention is as follows.
1. An IC tag comprising an IC chip for wireless communication and a transmission / reception antenna, wherein at least a part of the transmission / reception antenna is made of a woven fabric, a non-woven fabric or a wire mesh made of a metal wire. .
2. In an IC tag provided with an IC chip for wireless communication and a transmission / reception antenna, the transmission / reception antenna is formed of a first antenna member obtained by processing a metal foil, and a woven fabric, a nonwoven fabric, or a wire mesh formed using a metal wire. An IC tag comprising a second antenna member and configured by electrically connecting the first antenna member and the second antenna member.
3. In an IC tag provided with an IC chip for wireless communication and a transmission / reception antenna, at least a part of the transmission / reception antenna is made of a woven fabric, a nonwoven fabric, or a net having a metal plating layer formed thereon. IC tag.
4). An IC tag having an IC chip for wireless communication and a transmission / reception antenna, wherein the transmission / reception antenna has a first antenna member obtained by processing a metal foil, and a metal plating layer is formed on the surface of a woven or non-woven fabric or mesh An IC tag comprising: a second antenna member comprising: the first antenna member and the second antenna member electrically connected.
5. Item 5. The IC tag according to Item 3 or 4, wherein the metal plated on the surface of the woven or non-woven fabric contains copper, nickel, silver or tin.
6). An IC tag comprising an IC chip for wireless communication and a transmission / reception antenna, wherein at least a part of the transmission / reception antenna is made of a metal processed plate having a plurality of openings.
7). In an IC tag including an IC chip for wireless communication and a transmission / reception antenna, the transmission / reception antenna includes a first antenna member obtained by processing a metal foil, and a second antenna member formed by a metal processing plate having a plurality of openings. An IC tag comprising: the first antenna member and the second antenna member electrically connected to each other.
8). In an IC tag provided with an IC chip for wireless communication and a transmission / reception antenna, at least a part of the transmission / reception antenna is made of a metal thread or a metal-coated thread embroidery on a woven or non-woven fabric or film. IC tag characterized by
9. In an IC tag including an IC chip for wireless communication and a transmission / reception antenna, the transmission / reception antenna has a first antenna member obtained by processing a metal foil, and a metal thread or a metal-coated thread is woven or non-woven fabric or film An IC tag comprising a second antenna member formed by embroidering the first antenna member and electrically connecting the first antenna member and the second antenna member.
10. Item 10. The IC tag according to any one of Items 1 to 9, wherein an electrical connection portion between the IC chip and the transmission / reception antenna is formed by metal bonding.
11. Item 11. The IC tag according to Item 10, wherein the electrical connection between the IC chip and the transmission / reception antenna is selected from solder bonding, resistance welding, or ultrasonic bonding.
12 Item 10. The IC tag according to any one of Items 1 to 9, wherein an electrical connection portion between the IC chip and the transmission / reception antenna is formed of a conductive adhesive, an anisotropic conductive adhesive, or a non-conductive adhesive.
13. Item 13. The IC tag according to any one of Items 1 to 12, wherein at least an electrical connection portion between the IC chip and the transmission / reception antenna is sealed with an organic resin.
14 Item 14. The IC tag according to any one of Items 1 to 13, wherein the external electrode of the IC chip is formed on two opposing surfaces.
15. Item 15. The IC tag according to any one of Items 1 to 14, wherein the transmission / reception antenna is a dipole antenna having an excitation slit.
16. Item 16. The IC tag according to any one of Items 1 to 15, wherein at least a part of the transmission / reception antenna is supported by a base substrate.

  According to the IC tag of the present invention, the following effects can be obtained. That is, an IC chip for wireless communication is connected to a transmission / reception antenna formed by embroidering a woven or non-woven fabric or a wire mesh composed of metal wires, or a metal thread or a metal-coated thread on an adherend. Depending on the structure, for example, when attached to cloth-like adherends such as clothes, towels, sheets, etc., water resistance and mechanical strength to satisfy the reliability of IC tags, as well as comfort and ease of use are not impaired. An IC tag that can realize flexibility without damaging the body itself can be realized.

  Embodiments of the present invention will be described in detail with reference to the drawings. In addition, the following embodiment is shown as an example and this invention is not limited to these embodiment. Hereinafter, the transmission / reception antenna is referred to as a transmission / reception antenna or an antenna.

  1 and 2 show a first form of the IC tag of the present invention. FIG. 1A is a schematic view seen from above. The IC chip 10 is connected to two metal meshes 20a and 20b serving as dipole antennas via an anisotropic conductive adhesive 40. FIG.1 (b) is the figure which looked at Fig.1 (a) from the cross-sectional direction. Two external electrodes 11a and 11b formed in one surface of the IC chip are electrically connected to the antennas (wire nets) 20a and 20b through the conductive particles 41 contained in the anisotropic conductive adhesive, respectively. The two electrodes are fixed by a matrix resin 42 and electrically insulated. Although the basic operation of the IC tag can be obtained with the structure of FIG. 1, the IC chip and the connection part between the IC chip and the antenna are protected, and the IC chip is protected in order to ensure water resistance and mechanical strength. It is desirable to seal the periphery with an organic resin or the like.

  FIG. 2A shows the IC tag shown in FIG. 1 in which the periphery of the IC chip is sealed with an organic resin 50. FIG. 2B is a diagram showing the cross-sectional structure. That is, as described above, the periphery of the IC chip is secured with mechanical strength such as pressure resistance, bending resistance, and twisting resistance by the sealing resin, and also has water resistance. On the other hand, a metal mesh as an antenna is formed by using a metal wire having a thickness of several tens of micrometers, so that an aluminum foil or copper foil of about 10 to 30 micrometers generally used as an antenna for IC tags, conductive Higher bending resistance and twisting resistance than the cured paste. Moreover, it is excellent in flexibility as compared with a metal plate having the same thickness as the metal wire.

  As described above, the structure described in FIGS. 2A and 2B is a structure suitable as an IC tag having both mechanical strength and flexibility. In the present embodiment described with reference to FIGS. 1 and 2, the antenna may be a woven fabric or a non-woven fabric using a metal wire in addition to the wire mesh. Further, the connection between the IC chip and the antenna may be a conductive adhesive, a non-conductive adhesive, solder bonding, metal bonding by applying ultrasonic waves, or the like instead of the anisotropic conductive adhesive. Furthermore, the antenna used in this embodiment may be supported by a base substrate that does not impair the flexibility required for the IC tag.

3 and 4 show a second form of the IC tag of the present invention.
FIG. 3A is a schematic view seen from above. The IC chip 10 is connected to a first antenna 30 that is slightly larger than the IC chip. The first antenna 30 is preferably an excitation slit type dipole antenna in which a slit 31 is formed in order to achieve impedance matching between the IC chip and the antenna in order to obtain good communication characteristics. Here, since the communication characteristics are greatly influenced by the shape of the slit, it is preferable to use a metal foil such as a copper foil or an aluminum foil as the first antenna material in order to accurately form the optimum slit. In order to obtain sufficient flexibility of the antenna, it is desirable to make the first antenna as small as possible.

  The IC chip has an external electrode connected to a predetermined position across the slit via an anisotropic conductive adhesive 40. Further, the first antenna is connected to the two metal meshes 20a and 20b serving as the second antenna via an anisotropic conductive adhesive. FIG. 3B is a view of FIG. 3A viewed from the cross-sectional direction. Two external electrodes 11a and 11b formed in one surface of the IC chip are electrically connected to the first antenna 30 via conductive particles 41 contained in the anisotropic conductive adhesive, and between the two electrodes. Is fixed by the matrix resin 42 and electrically insulated. In FIG. 3B, the first antenna is formed of a conductor 32 serving as an antenna and a base substrate 33 that supports the conductor, but the base substrate may be omitted. Both ends of the first antenna are connected to second antennas (wire meshes) 20a and 20b via conductive adhesives, respectively.

  Although the basic operation of the IC tag and good communication characteristics can be obtained with the structure of FIG. 3, the connection between the IC chip and the IC chip and the antenna, and the first antenna and the second antenna In order to protect the connection portion and ensure water resistance and mechanical strength, it is desirable to seal the periphery of the first antenna with an organic resin or the like.

  FIG. 4A shows the IC tag shown in FIG. 3 in which the periphery of the IC chip, the first antenna, and the connection portion between the first antenna and the second antenna is sealed with an organic resin 50. FIG. 4B is a diagram showing the cross-sectional structure. That is, as described above, the surrounding area of the first antenna is secured with mechanical strength such as pressure resistance, bending resistance, and twisting resistance by the sealing resin, and also has water resistance. On the other hand, the metal mesh as the second antenna is formed by using a metal wire having a thickness of several tens of micrometers, so that an aluminum foil or copper foil of about 10 to 30 micrometers generally used as an antenna for IC tags. In addition, higher bending resistance and torsion resistance than the cured conductive paste can be obtained. Moreover, it is excellent in flexibility as compared with a metal plate having the same thickness as the metal wire.

  As described above, the structure described with reference to FIGS. 4A and 4B is a structure suitable as an IC tag having both mechanical strength and flexibility and obtaining good communication characteristics. In the present embodiment described with reference to FIGS. 3 and 4, the second antenna may be a woven fabric or a non-woven fabric using a metal wire in addition to the wire mesh. In addition, each connection between the IC chip and the first antenna and between the first antenna and the second antenna is made of a conductive adhesive, a non-conductive adhesive, a solder joint or an ultrasonic wave instead of the anisotropic conductive adhesive. Metal bonding by application may be used. Furthermore, the antenna used in this embodiment may be supported by a base substrate that does not impair the flexibility required for the IC tag.

5 and 6 show a third form of the IC tag of the present invention.
FIG. 5A is a schematic view seen from above. The IC chip 10 is connected to an antenna 21 made of a metal plate having a plurality of openings via an anisotropic conductive adhesive 40. As in the second embodiment, the antenna is preferably provided with a slit 22 for impedance matching between the IC chip and the antenna in order to obtain good communication characteristics. In order to obtain flexibility, the metal plate is preferably thin, and the ratio of the opening to the area of the antenna is preferably as large as possible.

  FIG.5 (b) is the figure which looked at Fig.5 (a) from the cross-sectional direction. The two external electrodes 11a and 11b formed in one surface of the IC chip are electrically connected to the antennas 20a and 20b through the conductive particles 41 contained in the anisotropic conductive adhesive, respectively. Is fixed by the matrix resin 42 and electrically insulated.

  Although the basic operation and good communication characteristics of the IC tag can be obtained with the structure of FIG. 5, the connection between the IC chip and the IC chip and the antenna is protected to ensure water resistance and mechanical strength. Therefore, it is desirable to seal the periphery of the IC chip with an organic resin or the like.

  FIG. 6A shows the IC tag shown in FIG. 6 in which the IC chip, the first antenna, and the periphery of the first antenna and the second antenna are sealed with an organic resin 50. FIG. 6B shows the cross-sectional structure. That is, as described above, the periphery of the IC chip is secured with mechanical strength such as pressure resistance, bending resistance, and twisting resistance by the sealing resin, and also has water resistance. On the other hand, the metal plate as an antenna is as thin as possible, and flexibility can be obtained by increasing the ratio of the openings.

  As described above, the structure described with reference to FIGS. 6A and 6B is a structure suitable as an IC tag having both mechanical strength and flexibility and obtaining good communication characteristics. Note that in the present embodiment described with reference to FIGS. 5 and 6, the connection between the IC chip and the antenna is made of a conductive adhesive, a non-conductive adhesive, a solder joint or an ultrasonic wave instead of the anisotropic conductive adhesive. Metal bonding by application may be used. Furthermore, the antenna used in this embodiment may be supported by a base substrate that does not impair the flexibility required for the IC tag.

FIG. 7 shows a fourth form of the IC tag of the present invention.
FIG. 7A is a schematic view seen from above. The IC chip 10 is connected to a first antenna 30 that is slightly larger than the IC chip. As the first antenna, an excitation slit type dipole antenna in which a slit 31 is formed for impedance matching between the IC chip and the antenna is preferable in order to obtain good communication characteristics. Here, since the communication characteristics are greatly influenced by the shape of the slit, it is preferable to use a metal foil such as a copper foil or an aluminum foil as the first antenna material in order to accurately form the optimum slit. In order to obtain sufficient flexibility of the antenna, it is desirable to make the first antenna as small as possible. The IC chip has an external electrode connected to a predetermined position across the slit via an anisotropic conductive adhesive 40.

  The second antenna is composed of two parts (embroidery antennas) 23a and 23b in which a metal thread or a metal-coated thread is embroidered on the adherend 60 of the IC tag, and the second antenna is covered with the metal thread or metal that is the second antenna. The first antenna and the second antenna are electrically connected and fixed by embroidering the adherend 60 so that a part of the formed thread penetrates the end of the first antenna.

  FIG.7 (b) is the figure which looked at Fig.7 (a) from the cross-sectional direction. Two external electrodes 11a and 11b formed in one surface of the IC chip are electrically connected to the first antenna 30 via conductive particles 41 contained in the anisotropic conductive adhesive, and between the two electrodes. Is fixed by the matrix resin 42 and electrically insulated. In FIG. 7B, the first antenna is formed of a conductor 32 serving as an antenna and a base substrate 33 that supports the conductor, but the base substrate may be omitted. Both ends of the first antenna are sewn in a state of being integrated with the adherend 60 with a metal thread that becomes the second antenna (embroidery antenna) 23a and 23b or a thread coated with metal, and at the same time as the electrical connection It is fixed.

  Although the basic operation and good communication characteristics of the IC tag can be obtained with the structure of FIG. 7, the connection between the IC chip and the IC chip and the antenna, and the first antenna and the second antenna In order to protect the connection part and ensure water resistance and mechanical strength, the periphery of the IC chip may be sealed with an organic resin or the like before or after fixing the first antenna to the second antenna. desirable. In this embodiment, the IC chip and the first antenna are connected by a conductive adhesive, a non-conductive adhesive, solder bonding, metal bonding by applying ultrasonic waves, or the like instead of the anisotropic conductive adhesive. May be.

8 and 9 show a fifth form of the IC tag of the present invention.
FIG. 8A is a schematic view seen from above. Two external electrodes are formed on the front and back surfaces of the IC chip, respectively, on the IC chip 12, and anisotropically conductively bonded to the two metal nets 20a and 20b that serve as dipole antennas with the front and back surfaces of the IC chip interposed therebetween. It is connected via the agent 40. FIG. 8B is a view of FIG. 8A viewed from the cross-sectional direction. Two external electrodes 13a and 13b formed on the front and back surfaces of the IC chip are electrically connected to the antennas (wire nets) 20a and 20b through conductive particles 41 contained in an anisotropic conductive adhesive, respectively. The space is fixed by the matrix resin 42 and is electrically insulated.

  Unlike the case where an IC chip in which two external electrodes are formed on the same surface is connected to two antennas, the present structure in which the antenna is connected across the IC chip is aligned with each antenna of the IC chip and the antenna. Therefore, this structure is effective when the size of the IC chip is small. Although the basic operation of the IC tag can be obtained with the structure shown in FIG. 8, the IC chip and the connection part between the IC chip and the antenna are protected, and the IC chip is protected in order to ensure water resistance and mechanical strength. It is desirable to seal the periphery with an organic resin or the like.

  FIG. 9A shows the IC tag shown in FIG. 8 in which the periphery of the IC chip is sealed with an organic resin 50. FIG. 9B is a diagram showing the cross-sectional structure. That is, as described above, the periphery of the IC chip is secured with mechanical strength such as pressure resistance, bending resistance, and twisting resistance by the sealing resin, and also has water resistance. On the other hand, a metal mesh as an antenna is formed by using a metal wire having a thickness of several tens of micrometers, so that an aluminum foil or copper foil of about 10 to 30 micrometers generally used as an antenna for IC tags, conductive Higher bending resistance and twisting resistance than the cured paste. Moreover, it is excellent in flexibility as compared with a metal plate having the same thickness as the metal wire.

  Thus, the structure described in FIGS. 9A and 9B is a structure suitable as an IC tag having both mechanical strength and flexibility. In the present embodiment described with reference to FIGS. 8 and 9, the antenna may be a woven fabric or a non-woven fabric using a metal wire in addition to the wire mesh. Further, the connection between the IC chip and the antenna may be a conductive adhesive, a non-conductive adhesive, solder bonding, metal bonding by applying ultrasonic waves, or the like instead of the anisotropic conductive adhesive. Furthermore, the antenna used in this embodiment may be supported by a base substrate that does not impair the flexibility required for the IC tag.

  FIG. 10 shows a sixth form of the IC tag of the present invention. FIG. 10A is a schematic view seen from above. The IC chip 12 has two external electrodes formed on the front and back surfaces of the IC chip, respectively, and a wire mesh that forms an excitation slit type dipole antenna having a slit 25 for impedance matching between the IC chip and the antenna. 24 is connected via a short-circuit plate 34. The IC chip and the antenna, the IC chip and the short circuit board, and the short circuit board and the antenna are connected via an anisotropic conductive adhesive.

  FIG.10 (b) is the figure which looked at Fig.10 (a) from the cross-sectional direction. The external electrode 13a formed on the lower surface of the IC chip is on one side of the slit formed on the antenna, the external electrode 13b formed on the upper surface is on the short-circuit plate 34, and the other electrode of the slit formed on the antenna is the short-circuit plate. Are electrically connected to each other via conductive particles 41 contained in the anisotropic conductive adhesive, and each connection portion is fixed by a matrix resin 42 and electrically insulated. . In FIG. 10B, the short-circuit plate is shown as a two-layer structure of the connecting conductor 35 and the base substrate 36 that supports the conductor 35, but the base substrate 36 may be omitted.

  Although the basic operation of the IC tag can be obtained with the structure of FIG. 10, the IC chip and the IC chip and the antenna, the connection between the IC chip and the short circuit plate, the short circuit plate and the antenna are protected, In order to ensure mechanical strength, although not shown in the figure, it is desirable to seal the periphery of the IC chip and the short-circuit plate with an organic resin or the like. In this embodiment, the antenna may be a woven fabric or a non-woven fabric using a metal wire in addition to the wire mesh.

  In addition, each connection between IC chip and antenna, IC chip and short circuit board, short circuit board and antenna is made of conductive adhesive, non-conductive adhesive, solder joint or ultrasonic application instead of anisotropic conductive adhesive. Metal bonding or the like may be used. Furthermore, the antenna used in this embodiment may be supported by a base substrate that does not impair the flexibility required for the IC tag.

  FIG. 11 shows a seventh form of the IC tag of the present invention. FIG. 11A is a schematic view seen from above. Two external electrodes are formed on the front and back surfaces of the IC chip, respectively, on the IC chip 12 and connected to the first antenna 30. As the first antenna, an excitation slit type dipole antenna in which a slit 31 for impedance matching between the IC chip and the antenna is formed is preferable in order to obtain good communication characteristics.

  The external electrode on one side of the IC chip is connected to one side of the slit formed in the first antenna, and the external electrode on the other side is connected to the other side across the slit via the short-circuit plate 34. It is connected. The IC chip and the first antenna, the IC chip and the short circuit board, and the short circuit board and the first antenna are connected via an anisotropic conductive adhesive. Further, the first antenna is connected to the two metal meshes 20a and 20b serving as the second antenna via an anisotropic conductive adhesive.

  FIG.11 (b) is the figure which looked at Fig.11 (a) from the cross-sectional direction. The external electrode 13a formed on the lower surface of the IC chip is formed on one side of the slit formed on the first antenna, the external electrode 13b formed on the upper surface is formed on the short circuit plate 34, and the short circuit plate is formed on the first antenna. The other side across the formed slit is electrically connected through the conductive particles 41 contained in the anisotropic conductive adhesive, and the connecting portions are fixed by the matrix resin 42 and the Insulation is maintained. In FIG. 11B, the short-circuit plate is shown as a two-layer structure of the connecting conductor 35 and the base substrate 36 that supports the conductor 35, but the base substrate 36 may be omitted. Furthermore, both ends of the first antenna are connected to the second antennas 20a and 20b via conductive adhesives, respectively.

  Although the basic operation of the IC tag can be obtained with the structure of FIG. 11, the IC chip and the IC chip and the antenna, the IC chip and the shorting plate, the connection portion between the shorting plate and the antenna are protected, In order to ensure mechanical strength, although not shown in the figure, it is desirable to seal the periphery of the IC chip and the short-circuit plate with an organic resin or the like. As described above, the structure described with reference to FIGS. 11A and 11B is a structure suitable as an IC tag having both mechanical strength and flexibility. In this embodiment, the second antenna may be a woven fabric or a non-woven fabric using a metal wire in addition to the wire mesh.

  In addition, each connection between the IC chip and the first antenna, the IC chip and the short circuit board, the short circuit board and the first antenna, and the first antenna and the second antenna is conducted in place of the anisotropic conductive adhesive. It may be a conductive adhesive, a non-conductive adhesive, solder bonding, metal bonding by applying ultrasonic waves, or the like. Furthermore, the antenna used in this embodiment may be supported by a base substrate that does not impair the flexibility required for the IC tag.

  As described in the embodiment of the present invention with reference to FIGS. 1 to 11, an IC chip for wireless communication is covered with a woven fabric, a non-woven fabric, a metal mesh, a metal thread, or a metal formed using a metal wire. In order to satisfy the reliability of the IC tag when it is attached to a cloth-like adherend such as clothes, towels, sheets, etc., by a structure for connecting the formed thread to a transmitting / receiving antenna formed by embroidering the adherend It is possible to realize an IC tag that can realize water resistance, mechanical strength, and flexibility that does not impair the comfort and ease of use and does not damage the adherend itself.

EXAMPLES Hereinafter, although the suitable Example of this invention is described, this invention is not limited to these Examples.
Example 1
First, an IC chip for wireless communication having a size of 0.5 mm × 0.5 mm in which two external electrodes are formed in the same plane was prepared. Next, a film in which an aluminum foil having a thickness of 10 μm and a polyethylene terephthalate substrate having a thickness of 50 μm are bonded together is prepared, and an etching resist is formed on the surface of the aluminum foil, and then an etching method is used. A first antenna in which a T-shaped slit was formed was manufactured. The size of the first antenna is 3 mm × 3 mm.

  Next, an anisotropic conductive adhesive film (AC-2052P-45, manufactured by Hitachi Chemical Co., Ltd.) is temporarily fixed at a predetermined position on the aluminum foil surface of the first antenna, and two electrodes of the IC chip are formed thereon. Was positioned so as to straddle the slit of the first antenna, and the IC chip and the first antenna were connected and fixed by thermocompression bonding at 180 ° C. and 3 MPa for 20 seconds.

  Next, two pieces of stainless steel wire mesh (mesh 400 × 400, wire thickness 30 μm) serving as the second antenna were cut to a size of 3 mm width and 25 mm length were prepared. Next, an anisotropic conductive adhesive film (AC-2052P-45, manufactured by Hitachi Chemical Co., Ltd.) is temporarily fixed to about 1 mm on both ends of the aluminum foil surface of the first antenna, and a stainless steel wire mesh is formed thereon. One piece was positioned at both ends, and the first antenna and the second antenna were connected and fixed by heating and pressing for 20 seconds under conditions of 180 ° C. and 3 MPa using a pressure-bonding head from above the IC chip. Next, a range having a size of about 5 mm × 4 mm and a thickness of about 1 mm was sealed with polyamide resin so as to cover the IC chip and the first antenna.

  Through the above steps, two IC tags having a width of 4 mm and a length of 51 mm were produced with the structure shown in FIG. When this IC tag was read with an IC tag reader (MR-STD2, output 150 mW, manufactured by Hitachi Kokusai Electric Co., Ltd.) and an antenna (linear polarization type 1 patch antenna, manufactured by Hitachi Kokusai Electric Co., Ltd.), all of them were at a distance of 30 mm. Communication was possible.

  Next, as shown in FIG. 12, one of the above IC tags was sewn inside the folded portion of the towel. As shown in FIG. 13, the other piece was sewn to a small piece of fabric, and the fabric was further sewn to the lower part of the collar on the back of the garment so that the IC tag was inside. When these towels and clothes were used, the comfort of use was not impaired by the IC tag.

  Next, the process of washing and drying the above towel with IC tag and clothes with IC tag in a household drum-type washing and drying machine was repeated 50 times. Then, when the IC tag sewing part of these towels and clothes was read with the IC tag reader and the antenna, communication was possible at a distance of 30 mm.

(Example 2)
First, an IC chip for wireless communication having a size of 0.5 mm × 0.5 mm, in which one external electrode was formed on each of the front and back surfaces, was prepared. Next, a film in which an aluminum foil having a thickness of 10 μm and a polyethylene terephthalate base material having a thickness of 50 μm were bonded together was prepared, and an etching resist was formed on the aluminum foil surface, and then an etching method was used. A first antenna in which a T-shaped slit was formed was manufactured. The size of the first antenna is 4 mm × 3 mm.

  Next, an anisotropic conductive adhesive film (AC-2052P-45, manufactured by Hitachi Chemical Co., Ltd.) is temporarily fixed at a predetermined position in the lower right portion of the T-shaped slit on the aluminum foil surface of the first antenna, and on that, The electrodes on the lower surface of the IC chip were positioned and temporarily fixed so as to face the anisotropic conductive adhesive film of the first antenna. Next, a film in which an aluminum foil having a thickness of 10 μm and a polyethylene terephthalate substrate having a thickness of 50 μm are bonded together is prepared, and an anisotropic conductive adhesive film (AC-2052P-45, manufactured by Hitachi Chemical Co., Ltd.) is formed on the aluminum foil surface. ) Was temporarily bonded to each other and cut into a size of 2 mm × 1.5 mm to obtain a short-circuit plate.

  Next, as shown in FIG. 11, the short-circuit plate straddles the longitudinal slit of the T-shaped slit, and the anisotropic conductive adhesive film surface is on the external electrode on the upper surface of the IC chip and the aluminum foil surface of the first antenna. Positioned in the opposite direction. Next, using a pressure-bonding head provided with a protrusion corresponding to the thickness of the IC chip at a predetermined position so that the short-circuit plate can be simultaneously heat-bonded to the IC chip mounting portion and the first antenna surface, conditions of 180 ° C. and 3 MPa Then, the IC chip and the first antenna, the IC chip and the short circuit board, and the short circuit board and the first antenna were connected and fixed at the same time.

  Next, two pieces of stainless steel wire mesh (mesh 400 × 400, wire thickness 30 μm) serving as the second antenna were cut into 3 mm width and 25 mm length were prepared. Next, an anisotropic conductive adhesive film (AC-2052P-45, manufactured by Hitachi Chemical Co., Ltd.) is temporarily fixed to about 1 mm on both ends of the aluminum foil surface of the first antenna, and a stainless steel wire mesh is formed thereon. One piece was positioned at each end, and the first antenna and the second antenna were connected and fixed by thermocompression bonding at 180 ° C. and 3 MPa for 20 seconds. Next, a range having a size of about 5 mm × 4 mm and a thickness of about 1 mm was sealed with polyamide resin so as to cover the IC chip and the first antenna.

  Through the above process, two IC tags having a width of 4 mm and a length of 52 mm were produced. When this IC tag was read with an IC tag reader (MR-STD2, output 150 mW, manufactured by Hitachi Kokusai Electric Co., Ltd.) and an antenna (linear polarization type 1 patch antenna, manufactured by Hitachi Kokusai Electric Co., Ltd.), all of them were at a distance of 30 mm. Communication was possible.

  Next, as shown in FIG. 12, one of the above IC tags was sewn inside the folded portion of the towel. As shown in FIG. 13, the other piece was sewn to a small piece of fabric, and the fabric was further sewn to the lower part of the collar on the back of the garment so that the IC tag was inside. When these towels and clothes were used, the comfort of use was not impaired by the IC tag.

  Next, the process of washing and drying the above towel with IC tag and clothes with IC tag in a household drum-type washing and drying machine was repeated 50 times. Then, when the IC tag sewing part of these towels and clothes was read with the IC tag reader and the antenna, communication was possible at a distance of 30 mm.

(Comparative Example 1)
First, an IC chip for wireless communication having a size of 0.5 mm × 0.5 mm in which two external electrodes are formed in the same plane was prepared. Next, a film in which an aluminum foil having a thickness of 10 μm and a polyethylene terephthalate substrate having a thickness of 50 μm are bonded together is prepared, and an etching resist is formed on the aluminum foil surface, and then an etching method is used. An antenna having a T-shaped slit was produced. The size of the antenna is 51 mm × 3 mm.

  Next, an anisotropic conductive adhesive film (AC-2052P-45, manufactured by Hitachi Chemical Co., Ltd.) is temporarily fixed at a predetermined position on the aluminum foil surface of the antenna, and the two electrodes of the IC chip are formed on the first electrode. The IC chip and the antenna were connected and fixed by heating and pressing for 20 seconds under the conditions of 180 ° C. and 3 MPa using a pressure-bonding head from above the IC chip. Next, a range having a size of about 5 mm × 4 mm and a thickness of about 1 mm was sealed with polyamide resin so as to cover the IC chip.

  Through the above process, two IC tags having a width of 4 mm and a length of 51 mm were produced. When this IC tag was read with an IC tag reader (MR-STD2, output 150 mW, manufactured by Hitachi Kokusai Electric Co., Ltd.) and an antenna (linear polarization type 1 patch antenna, manufactured by Hitachi Kokusai Electric Co., Ltd.), all of them were at a distance of 30 mm. Communication was possible.

  Next, as in Example 1 and Example 2, the above IC tag is sewn on the inside of the folded portion of the towel, and the other one is sewn on a small piece of cloth. Sewed under the collar on the back of the clothes. When these towels and clothes were used, the comfort of use was not impaired by the IC tag.

  Next, the process of washing and drying the above towel with IC tag and clothes with IC tag in a household drum-type washing and drying machine was repeated 50 times. Thereafter, when the IC tag sewing portion of these towels and clothes was read with the IC tag reader and the antenna, the antenna made of aluminum foil was broken and communication was impossible.

  According to the IC tag of the present invention, the following effects can be obtained. That is, an IC chip for wireless communication is connected to a transmission / reception antenna formed by embroidering a woven or non-woven fabric or a wire mesh composed of metal wires, or a metal thread or a metal-coated thread on an adherend. Depending on the structure, for example, when attached to cloth-like adherends such as clothes, towels, sheets, etc., water resistance and mechanical strength to satisfy the reliability of IC tags, as well as comfort and ease of use are not impaired. An IC tag that can realize flexibility without damaging the body itself can be realized. Similar effects can be obtained by using a metal processed plate having a plurality of openings as in the above embodiment.

It is a figure which shows an example of the IC tag of this invention. It is a figure which shows an example of the IC tag of this invention. It is a figure which shows an example of the IC tag of this invention. It is a figure which shows an example of the IC tag of this invention. It is a figure which shows an example of the IC tag of this invention. It is a figure which shows an example of the IC tag of this invention. It is a figure which shows an example of the IC tag of this invention. It is a figure which shows an example of the IC tag of this invention. It is a figure which shows an example of the IC tag of this invention. It is a figure which shows an example of the IC tag of this invention. It is a figure which shows an example of the IC tag of this invention. It is a figure which shows an example of the IC tag of this invention. It is a figure which shows an example of the IC tag of this invention. It is a figure which shows an example of the IC tag for a comparison.

Explanation of symbols

10, 12: IC chips 11a, 11b, 13a, 13b: External electrodes 20a, 20b: Antenna (wire mesh)
21, 24: Antenna (wire mesh)
22, 25: slits 23a, 23b: embroidery antenna 30: first antenna 31: slit 32: conductor 33: base substrate 34: short circuit board 35: conductor 36: base substrate 37: antenna 40: anisotropic conductive adhesion Agent 41: Conductive particle 42: Matrix resin 50: Sealing resin (organic resin)
60: adherend


Claims (16)

  1.   An IC tag comprising an IC chip for wireless communication and a transmission / reception antenna, wherein at least a part of the transmission / reception antenna is made of a woven fabric, a non-woven fabric or a wire mesh made of a metal wire. .
  2.   In an IC tag provided with an IC chip for wireless communication and a transmission / reception antenna, the transmission / reception antenna is formed of a first antenna member obtained by processing a metal foil, and a woven fabric, a nonwoven fabric, or a wire mesh formed using a metal wire. An IC tag comprising a second antenna member and configured by electrically connecting the first antenna member and the second antenna member.
  3.   In an IC tag provided with an IC chip for wireless communication and a transmission / reception antenna, at least a part of the transmission / reception antenna is made of a woven fabric, a nonwoven fabric, or a net having a metal plating layer formed thereon. IC tag.
  4.   An IC tag having an IC chip for wireless communication and a transmission / reception antenna, wherein the transmission / reception antenna has a first antenna member obtained by processing a metal foil, and a metal plating layer is formed on the surface of a woven or non-woven fabric or mesh An IC tag comprising: a second antenna member comprising: the first antenna member and the second antenna member electrically connected.
  5.   The IC tag according to claim 3 or 4, wherein the metal plated on the surface of the woven or non-woven fabric contains copper, nickel, silver or tin.
  6.   An IC tag comprising an IC chip for wireless communication and a transmission / reception antenna, wherein at least a part of the transmission / reception antenna is made of a metal processed plate having a plurality of openings.
  7.   In an IC tag including an IC chip for wireless communication and a transmission / reception antenna, the transmission / reception antenna includes a first antenna member obtained by processing a metal foil, and a second antenna member formed by a metal processing plate having a plurality of openings. An IC tag comprising: the first antenna member and the second antenna member electrically connected to each other.
  8.   In an IC tag provided with an IC chip for wireless communication and a transmission / reception antenna, at least a part of the transmission / reception antenna is formed by embroidering a metal thread or a metal-coated thread on a woven fabric, a nonwoven fabric or a film. IC tag characterized by this.
  9.   In an IC tag including an IC chip for wireless communication and a transmission / reception antenna, the transmission / reception antenna has a first antenna member obtained by processing a metal foil, and a metal thread or a metal-coated thread is woven or non-woven fabric or film An IC tag comprising a second antenna member formed by embroidering the first antenna member and electrically connecting the first antenna member and the second antenna member.
  10.   The IC tag according to any one of claims 1 to 9, wherein an electrical connection portion between the IC chip and the transmission / reception antenna is formed by metal bonding.
  11.   The IC tag according to claim 10, wherein an electrical connection portion between the IC chip and the transmission / reception antenna is selected from solder bonding, resistance welding, or ultrasonic bonding.
  12.   10. The IC according to claim 1, wherein an electrical connection portion between the IC chip and the transmission / reception antenna is formed of a conductive adhesive, an anisotropic conductive adhesive, or a non-conductive adhesive. tag.
  13.   The IC tag according to claim 1, wherein at least an electrical connection portion between the IC chip and the transmission / reception antenna is sealed with an organic resin.
  14.   The IC tag according to claim 1, wherein external electrodes of the IC chip are formed on two opposing surfaces.
  15.   The IC tag according to claim 1, wherein the transmission / reception antenna is a dipole antenna having an excitation slit.
  16. The IC tag according to claim 1, wherein at least a part of the transmission / reception antenna is supported by a base substrate.






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Cited By (117)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007265145A (en) * 2006-03-29 2007-10-11 Toppan Forms Co Ltd Non-contact communication medium
WO2008136308A1 (en) 2007-04-27 2008-11-13 Nec Corporation Feed device
WO2008136414A1 (en) * 2007-04-27 2008-11-13 Nec Corporation Wideband antenna
WO2009005080A1 (en) * 2007-07-04 2009-01-08 Murata Manufacturing Co., Ltd. Radio ic device and component for radio ic device
JP2009253549A (en) * 2008-04-03 2009-10-29 Hitachi Ltd Rfid antenna and rfid tag
JP2010109698A (en) * 2008-10-30 2010-05-13 Nec Corp Reconfigurable antenna
US7764928B2 (en) 2006-01-19 2010-07-27 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US7762472B2 (en) 2007-07-04 2010-07-27 Murata Manufacturing Co., Ltd Wireless IC device
US7786949B2 (en) 2006-04-14 2010-08-31 Murata Manufacturing Co., Ltd. Antenna
WO2010116935A1 (en) * 2009-04-11 2010-10-14 福井県 Composite string and fabric with same
US7830311B2 (en) 2007-07-18 2010-11-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic device
US7857230B2 (en) 2007-07-18 2010-12-28 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7871008B2 (en) 2008-06-25 2011-01-18 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7932730B2 (en) 2006-06-12 2011-04-26 Murata Manufacturing Co., Ltd. System for inspecting electromagnetic coupling modules and radio IC devices and method for manufacturing electromagnetic coupling modules and radio IC devices using the system
US7931206B2 (en) 2007-05-10 2011-04-26 Murata Manufacturing Co., Ltd. Wireless IC device
US7967216B2 (en) 2008-05-22 2011-06-28 Murata Manufacturing Co., Ltd. Wireless IC device
US7990337B2 (en) 2007-12-20 2011-08-02 Murata Manufacturing Co., Ltd. Radio frequency IC device
US7997501B2 (en) 2007-07-17 2011-08-16 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
JP2011523820A (en) * 2008-05-29 2011-08-18 キンバリー クラーク ワールドワイド インコーポレイテッド Radiation element for signal transmitter
US8009101B2 (en) 2007-04-06 2011-08-30 Murata Manufacturing Co., Ltd. Wireless IC device
US8031124B2 (en) 2007-01-26 2011-10-04 Murata Manufacturing Co., Ltd. Container with electromagnetic coupling module
US8070070B2 (en) 2007-12-26 2011-12-06 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8081119B2 (en) 2006-04-26 2011-12-20 Murata Manufacturing Co., Ltd. Product including power supply circuit board
US8081121B2 (en) 2006-10-27 2011-12-20 Murata Manufacturing Co., Ltd. Article having electromagnetic coupling module attached thereto
US8081541B2 (en) 2006-06-30 2011-12-20 Murata Manufacturing Co., Ltd. Optical disc
US8081125B2 (en) 2006-07-11 2011-12-20 Murata Manufacturing Co., Ltd. Antenna and radio IC device
US8177138B2 (en) 2008-10-29 2012-05-15 Murata Manufacturing Co., Ltd. Radio IC device
US8179329B2 (en) 2008-03-03 2012-05-15 Murata Manufacturing Co., Ltd. Composite antenna
US8193939B2 (en) 2007-07-09 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8228075B2 (en) 2006-08-24 2012-07-24 Murata Manufacturing Co., Ltd. Test system for radio frequency IC devices and method of manufacturing radio frequency IC devices using the same
US8228252B2 (en) 2006-05-26 2012-07-24 Murata Manufacturing Co., Ltd. Data coupler
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8264357B2 (en) 2007-06-27 2012-09-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8299968B2 (en) 2007-02-06 2012-10-30 Murata Manufacturing Co., Ltd. Packaging material with electromagnetic coupling module
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8342416B2 (en) 2009-01-09 2013-01-01 Murata Manufacturing Co., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8360324B2 (en) 2007-04-09 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device
US8360325B2 (en) 2008-04-14 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8384547B2 (en) 2006-04-10 2013-02-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8390459B2 (en) 2007-04-06 2013-03-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8400307B2 (en) 2007-07-18 2013-03-19 Murata Manufacturing Co., Ltd. Radio frequency IC device and electronic apparatus
US8418928B2 (en) 2009-04-14 2013-04-16 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
WO2013061592A1 (en) * 2011-10-27 2013-05-02 サトーホールディングス株式会社 Rfid tag for flexible material product, rfid antenna of rfid tag for flexible material product, and rfid antenna continuum of same
JP2013092972A (en) * 2011-10-27 2013-05-16 Sato Knowledge & Intellectual Property Institute Rfid tag for a flexible material product
JP2013092973A (en) * 2011-10-27 2013-05-16 Sato Knowledge & Intellectual Property Institute Rfid antenna of rfid tag for flexible material product, rfid antenna continuous body thereof
US8474725B2 (en) 2007-04-27 2013-07-02 Murata Manufacturing Co., Ltd. Wireless IC device
JP2013171430A (en) * 2012-02-21 2013-09-02 Sato Holdings Corp Rfid antenna of rfid tag
JP2013171429A (en) * 2012-02-21 2013-09-02 Sato Holdings Corp Rfid tag
JP2013171428A (en) * 2012-02-21 2013-09-02 Sato Holdings Corp Rfid tag
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8546927B2 (en) 2010-09-03 2013-10-01 Murata Manufacturing Co., Ltd. RFIC chip mounting structure
US8544754B2 (en) 2006-06-01 2013-10-01 Murata Manufacturing Co., Ltd. Wireless IC device and wireless IC device composite component
JP2013206080A (en) * 2012-03-28 2013-10-07 Toppan Forms Co Ltd Non-contact type data reception/transmission body
JP5310552B2 (en) * 2007-07-25 2013-10-09 富士通株式会社 Wireless tag and manufacturing method thereof
US8570173B2 (en) 2007-07-25 2013-10-29 Fujitsu Limited Radio frequency tag and method of manufacturing the same
US8583043B2 (en) 2009-01-16 2013-11-12 Murata Manufacturing Co., Ltd. High-frequency device and wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8596545B2 (en) 2008-05-28 2013-12-03 Murata Manufacturing Co., Ltd. Component of wireless IC device and wireless IC device
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8632014B2 (en) 2007-04-27 2014-01-21 Murata Manufacturing Co., Ltd. Wireless IC device
JP2014021824A (en) * 2012-07-20 2014-02-03 Toppan Forms Co Ltd Non-contact type data reception/transmission body and resin-molded body having the same
US8668151B2 (en) 2008-03-26 2014-03-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8692718B2 (en) 2008-11-17 2014-04-08 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US8742998B2 (en) 2008-08-28 2014-06-03 Nec Corporation Goods storage tool and connection method
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
JP2014191713A (en) * 2013-03-28 2014-10-06 Toppan Forms Co Ltd Method for manufacturing noncontact data reception/transmission body
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8905316B2 (en) 2010-05-14 2014-12-09 Murata Manufacturing Co., Ltd. Wireless IC device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
WO2015029489A1 (en) * 2013-08-27 2015-03-05 株式会社村田製作所 Antenna device and method for manufacturing same
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8994605B2 (en) 2009-10-02 2015-03-31 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
JP2015118651A (en) * 2013-12-20 2015-06-25 日油技研工業株式会社 Wireless tag
US9077067B2 (en) 2008-07-04 2015-07-07 Murata Manufacturing Co., Ltd. Radio IC device
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9123996B2 (en) 2010-05-14 2015-09-01 Murata Manufacturing Co., Ltd. Wireless IC device
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9231305B2 (en) 2008-10-24 2016-01-05 Murata Manufacturing Co., Ltd. Wireless IC device
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
WO2017135331A1 (en) * 2016-02-02 2017-08-10 マイティキューブ株式会社 Rfid tag
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US10235544B2 (en) 2012-04-13 2019-03-19 Murata Manufacturing Co., Ltd. Inspection method and inspection device for RFID tag
WO2019151475A1 (en) * 2018-02-02 2019-08-08 株式会社村田製作所 Wireless communication device and fiber product

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04207508A (en) * 1990-11-30 1992-07-29 Mitsubishi Electric Corp Manufacture of mesh material for antenna
JPH1145318A (en) * 1997-07-28 1999-02-16 Nippon Steel Corp Ic card and forming method for loop-shaped coil
JP2000124730A (en) * 1998-10-19 2000-04-28 Dx Antenna Co Ltd Vhf and uhf band film antenna
JP2000340896A (en) * 1999-05-27 2000-12-08 Kyocera Corp Wiring board module
JP2001028037A (en) * 1999-07-14 2001-01-30 Hitachi Maxell Ltd Noncontact information medium and communication system using the medium
JP2002298117A (en) * 2001-03-30 2002-10-11 Toppan Forms Co Ltd Contactless ic tag and method for using contactless ic tag and contactless ic card having contactless ic tag
JP2002366915A (en) * 2001-06-06 2002-12-20 Dainippon Printing Co Ltd Rfid tag with high design and manufacture thereof
JP2002366917A (en) * 2001-06-07 2002-12-20 Hitachi Ltd Ic card incorporating antenna
JP2004139405A (en) * 2002-10-18 2004-05-13 Tokushu Paper Mfg Co Ltd Anticounterfeit thread, sheet-shaped material for anticounterfeit using the same, and method of producing sheet-shaped material for anticounterfeit
JP2005042223A (en) * 2003-07-24 2005-02-17 Isuikkusu World Kk Electromagnetic-wave protective garment

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04207508A (en) * 1990-11-30 1992-07-29 Mitsubishi Electric Corp Manufacture of mesh material for antenna
JPH1145318A (en) * 1997-07-28 1999-02-16 Nippon Steel Corp Ic card and forming method for loop-shaped coil
JP2000124730A (en) * 1998-10-19 2000-04-28 Dx Antenna Co Ltd Vhf and uhf band film antenna
JP2000340896A (en) * 1999-05-27 2000-12-08 Kyocera Corp Wiring board module
JP2001028037A (en) * 1999-07-14 2001-01-30 Hitachi Maxell Ltd Noncontact information medium and communication system using the medium
JP2002298117A (en) * 2001-03-30 2002-10-11 Toppan Forms Co Ltd Contactless ic tag and method for using contactless ic tag and contactless ic card having contactless ic tag
JP2002366915A (en) * 2001-06-06 2002-12-20 Dainippon Printing Co Ltd Rfid tag with high design and manufacture thereof
JP2002366917A (en) * 2001-06-07 2002-12-20 Hitachi Ltd Ic card incorporating antenna
JP2004139405A (en) * 2002-10-18 2004-05-13 Tokushu Paper Mfg Co Ltd Anticounterfeit thread, sheet-shaped material for anticounterfeit using the same, and method of producing sheet-shaped material for anticounterfeit
JP2005042223A (en) * 2003-07-24 2005-02-17 Isuikkusu World Kk Electromagnetic-wave protective garment

Cited By (151)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7764928B2 (en) 2006-01-19 2010-07-27 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8078106B2 (en) 2006-01-19 2011-12-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8725071B2 (en) 2006-01-19 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8676117B2 (en) 2006-01-19 2014-03-18 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8326223B2 (en) 2006-01-19 2012-12-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
JP2007265145A (en) * 2006-03-29 2007-10-11 Toppan Forms Co Ltd Non-contact communication medium
US8384547B2 (en) 2006-04-10 2013-02-26 Murata Manufacturing Co., Ltd. Wireless IC device
US7786949B2 (en) 2006-04-14 2010-08-31 Murata Manufacturing Co., Ltd. Antenna
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US8081119B2 (en) 2006-04-26 2011-12-20 Murata Manufacturing Co., Ltd. Product including power supply circuit board
US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US8228252B2 (en) 2006-05-26 2012-07-24 Murata Manufacturing Co., Ltd. Data coupler
US8544754B2 (en) 2006-06-01 2013-10-01 Murata Manufacturing Co., Ltd. Wireless IC device and wireless IC device composite component
US7932730B2 (en) 2006-06-12 2011-04-26 Murata Manufacturing Co., Ltd. System for inspecting electromagnetic coupling modules and radio IC devices and method for manufacturing electromagnetic coupling modules and radio IC devices using the system
US8081541B2 (en) 2006-06-30 2011-12-20 Murata Manufacturing Co., Ltd. Optical disc
US8228765B2 (en) 2006-06-30 2012-07-24 Murata Manufacturing Co., Ltd. Optical disc
US8081125B2 (en) 2006-07-11 2011-12-20 Murata Manufacturing Co., Ltd. Antenna and radio IC device
US8228075B2 (en) 2006-08-24 2012-07-24 Murata Manufacturing Co., Ltd. Test system for radio frequency IC devices and method of manufacturing radio frequency IC devices using the same
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8081121B2 (en) 2006-10-27 2011-12-20 Murata Manufacturing Co., Ltd. Article having electromagnetic coupling module attached thereto
US8031124B2 (en) 2007-01-26 2011-10-04 Murata Manufacturing Co., Ltd. Container with electromagnetic coupling module
US8299968B2 (en) 2007-02-06 2012-10-30 Murata Manufacturing Co., Ltd. Packaging material with electromagnetic coupling module
US8009101B2 (en) 2007-04-06 2011-08-30 Murata Manufacturing Co., Ltd. Wireless IC device
US8390459B2 (en) 2007-04-06 2013-03-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8360324B2 (en) 2007-04-09 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device
US8424762B2 (en) 2007-04-14 2013-04-23 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8632014B2 (en) 2007-04-27 2014-01-21 Murata Manufacturing Co., Ltd. Wireless IC device
WO2008136414A1 (en) * 2007-04-27 2008-11-13 Nec Corporation Wideband antenna
US8130157B2 (en) 2007-04-27 2012-03-06 Nec Corporation Feed device
WO2008136308A1 (en) 2007-04-27 2008-11-13 Nec Corporation Feed device
US8314739B2 (en) 2007-04-27 2012-11-20 Nec Corporation Wideband antenna
US8474725B2 (en) 2007-04-27 2013-07-02 Murata Manufacturing Co., Ltd. Wireless IC device
US7931206B2 (en) 2007-05-10 2011-04-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8264357B2 (en) 2007-06-27 2012-09-11 Murata Manufacturing Co., Ltd. Wireless IC device
WO2009005080A1 (en) * 2007-07-04 2009-01-08 Murata Manufacturing Co., Ltd. Radio ic device and component for radio ic device
US7762472B2 (en) 2007-07-04 2010-07-27 Murata Manufacturing Co., Ltd Wireless IC device
US8662403B2 (en) 2007-07-04 2014-03-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8193939B2 (en) 2007-07-09 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8552870B2 (en) 2007-07-09 2013-10-08 Murata Manufacturing Co., Ltd. Wireless IC device
US8413907B2 (en) 2007-07-17 2013-04-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US7997501B2 (en) 2007-07-17 2011-08-16 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8191791B2 (en) 2007-07-17 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US7830311B2 (en) 2007-07-18 2010-11-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic device
US8400307B2 (en) 2007-07-18 2013-03-19 Murata Manufacturing Co., Ltd. Radio frequency IC device and electronic apparatus
US9830552B2 (en) 2007-07-18 2017-11-28 Murata Manufacturing Co., Ltd. Radio IC device
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
US7857230B2 (en) 2007-07-18 2010-12-28 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
JP5310552B2 (en) * 2007-07-25 2013-10-09 富士通株式会社 Wireless tag and manufacturing method thereof
US8570173B2 (en) 2007-07-25 2013-10-29 Fujitsu Limited Radio frequency tag and method of manufacturing the same
US8610636B2 (en) 2007-12-20 2013-12-17 Murata Manufacturing Co., Ltd. Radio frequency IC device
US7990337B2 (en) 2007-12-20 2011-08-02 Murata Manufacturing Co., Ltd. Radio frequency IC device
US8915448B2 (en) 2007-12-26 2014-12-23 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8070070B2 (en) 2007-12-26 2011-12-06 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8360330B2 (en) 2007-12-26 2013-01-29 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8179329B2 (en) 2008-03-03 2012-05-15 Murata Manufacturing Co., Ltd. Composite antenna
US8668151B2 (en) 2008-03-26 2014-03-11 Murata Manufacturing Co., Ltd. Wireless IC device
JP2009253549A (en) * 2008-04-03 2009-10-29 Hitachi Ltd Rfid antenna and rfid tag
US8360325B2 (en) 2008-04-14 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device
US9022295B2 (en) 2008-05-21 2015-05-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8960557B2 (en) 2008-05-21 2015-02-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8973841B2 (en) 2008-05-21 2015-03-10 Murata Manufacturing Co., Ltd. Wireless IC device
US7967216B2 (en) 2008-05-22 2011-06-28 Murata Manufacturing Co., Ltd. Wireless IC device
US8047445B2 (en) 2008-05-22 2011-11-01 Murata Manufacturing Co., Ltd. Wireless IC device and method of manufacturing the same
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US8596545B2 (en) 2008-05-28 2013-12-03 Murata Manufacturing Co., Ltd. Component of wireless IC device and wireless IC device
JP2011523820A (en) * 2008-05-29 2011-08-18 キンバリー クラーク ワールドワイド インコーポレイテッド Radiation element for signal transmitter
US8011589B2 (en) 2008-06-25 2011-09-06 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7871008B2 (en) 2008-06-25 2011-01-18 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US9077067B2 (en) 2008-07-04 2015-07-07 Murata Manufacturing Co., Ltd. Radio IC device
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US8742998B2 (en) 2008-08-28 2014-06-03 Nec Corporation Goods storage tool and connection method
US9231305B2 (en) 2008-10-24 2016-01-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8177138B2 (en) 2008-10-29 2012-05-15 Murata Manufacturing Co., Ltd. Radio IC device
JP2010109698A (en) * 2008-10-30 2010-05-13 Nec Corp Reconfigurable antenna
US8917211B2 (en) 2008-11-17 2014-12-23 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8692718B2 (en) 2008-11-17 2014-04-08 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8544759B2 (en) 2009-01-09 2013-10-01 Murata Manufacturing., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8342416B2 (en) 2009-01-09 2013-01-01 Murata Manufacturing Co., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8583043B2 (en) 2009-01-16 2013-11-12 Murata Manufacturing Co., Ltd. High-frequency device and wireless IC device
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
WO2010116935A1 (en) * 2009-04-11 2010-10-14 福井県 Composite string and fabric with same
US8418928B2 (en) 2009-04-14 2013-04-16 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8690070B2 (en) 2009-04-14 2014-04-08 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8876010B2 (en) 2009-04-14 2014-11-04 Murata Manufacturing Co., Ltd Wireless IC device component and wireless IC device
US9203157B2 (en) 2009-04-21 2015-12-01 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US9564678B2 (en) 2009-04-21 2017-02-07 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US9117157B2 (en) 2009-10-02 2015-08-25 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US8994605B2 (en) 2009-10-02 2015-03-31 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US8704716B2 (en) 2009-11-20 2014-04-22 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US8528829B2 (en) 2010-03-12 2013-09-10 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US8905316B2 (en) 2010-05-14 2014-12-09 Murata Manufacturing Co., Ltd. Wireless IC device
US9123996B2 (en) 2010-05-14 2015-09-01 Murata Manufacturing Co., Ltd. Wireless IC device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8546927B2 (en) 2010-09-03 2013-10-01 Murata Manufacturing Co., Ltd. RFIC chip mounting structure
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US8960561B2 (en) 2011-02-28 2015-02-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8757502B2 (en) 2011-02-28 2014-06-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US9064199B2 (en) 2011-10-27 2015-06-23 Sato Holdings Kabushiki Kaisha RFID tag for flexible material product, RFID antenna of RFID tag for flexible material product, and RFID antenna continuum of same
WO2013061592A1 (en) * 2011-10-27 2013-05-02 サトーホールディングス株式会社 Rfid tag for flexible material product, rfid antenna of rfid tag for flexible material product, and rfid antenna continuum of same
JP2013092972A (en) * 2011-10-27 2013-05-16 Sato Knowledge & Intellectual Property Institute Rfid tag for a flexible material product
JP2013092973A (en) * 2011-10-27 2013-05-16 Sato Knowledge & Intellectual Property Institute Rfid antenna of rfid tag for flexible material product, rfid antenna continuous body thereof
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
JP2013171430A (en) * 2012-02-21 2013-09-02 Sato Holdings Corp Rfid antenna of rfid tag
JP2013171428A (en) * 2012-02-21 2013-09-02 Sato Holdings Corp Rfid tag
JP2013171429A (en) * 2012-02-21 2013-09-02 Sato Holdings Corp Rfid tag
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
JP2013206080A (en) * 2012-03-28 2013-10-07 Toppan Forms Co Ltd Non-contact type data reception/transmission body
US10235544B2 (en) 2012-04-13 2019-03-19 Murata Manufacturing Co., Ltd. Inspection method and inspection device for RFID tag
JP2014021824A (en) * 2012-07-20 2014-02-03 Toppan Forms Co Ltd Non-contact type data reception/transmission body and resin-molded body having the same
JP2014191713A (en) * 2013-03-28 2014-10-06 Toppan Forms Co Ltd Method for manufacturing noncontact data reception/transmission body
WO2015029489A1 (en) * 2013-08-27 2015-03-05 株式会社村田製作所 Antenna device and method for manufacturing same
JP2015118651A (en) * 2013-12-20 2015-06-25 日油技研工業株式会社 Wireless tag
WO2017135331A1 (en) * 2016-02-02 2017-08-10 マイティキューブ株式会社 Rfid tag
WO2019151475A1 (en) * 2018-02-02 2019-08-08 株式会社村田製作所 Wireless communication device and fiber product

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