JP2017174098A - Wireless IC tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wireless IC tag or the like that is effective in extending communication distance with the outside.SOLUTION: A wireless IC tag comprises: an insulation substrate 1 including a top face including a concave 1a; a coil conductor 2A arranged at a portion surrounding the concave 1a of the insulation substrate 1, surrounding the concave 1a; a semiconductor element 3 housed in the concave 1a and electrically connected with the coil conductor 2A; and a sealing material 4 placed on the semiconductor element 3 and sealing the semiconductor element 3. Magnetic permeability in the concave 1a including the sealing material 4 is larger than that of the insulation substrate 1.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a wireless IC tag (Integrated Circuit Tag) including a semiconductor element such as an IC (Integrated Circuit).

Automatic recognition technology using radio technology such as RFID (radio frequency identifier) is used for information recognition of various articles. In this technique, information is transmitted and received via radio waves between a wireless IC tag placed on an article or the like and a reader / writer (reader / writer, reading and writing device). The IC tag has a semiconductor element capable of reading and writing information, and a coil conductor as an antenna that transmits and receives radio waves to and from a reader / writer (see, for example, Patent Document 1).

  Electric power necessary for reading data (sending to the reader / writer) and writing with the semiconductor element is obtained by electromagnetic induction by the radio wave transmitted from the reader / writer to the coil conductor.

JP-A-2015-79534

  The automatic recognition technology as described above is required to increase the effective communication distance of the IC tag reader / writer. Increasing the communication distance makes it easy to send and receive information between the article and the reader / writer, shortens the time required for sending and receiving information, and improves the degree of freedom in the positional relationship between them (reducing the distance that needs to be close to each other) Etc. are advantageous.

  An IC tag according to one aspect of the present invention is accommodated in an insulating substrate having an upper surface including a concave portion, a coil conductor disposed to surround the concave portion of the insulating substrate so as to surround the concave portion, and the concave portion. And a semiconductor element electrically connected to the coil conductor, and a sealing material disposed on the semiconductor element and sealing the semiconductor element. Moreover, the magnetic permeability in the said recessed part containing the said sealing material is larger than the magnetic permeability of the said insulated substrate.

  According to the IC tag of one aspect of the present invention, since the magnetic permeability in the concave portion including the sealing material is higher than the magnetic permeability of the insulating substrate, the radio wave is formed in the concave portion, that is, inside the coil conductor. Can be effectively induced. For this reason, even if the distance between the wireless IC tag and the reader / writer is somewhat increased, power is effectively generated in the coil conductor. Therefore, an IC tag that can effectively increase the communication distance with the reader / writer can be provided.

It is sectional drawing which shows an example of the radio | wireless IC tag of the 1st Embodiment of this invention. FIG. 2 is an exploded cross-sectional view illustrating an example of a coil conductor in the wireless IC tag illustrated in FIG. 1. (A) is sectional drawing which shows an example of the wireless IC tag of the 2nd Embodiment of this invention, (b) is sectional drawing which shows an example of the wireless IC tag of the 3rd Embodiment of this invention. (A) is sectional drawing which shows the modification of Fig.3 (a), (b) is sectional drawing which shows the modification of FIG. (A) is sectional drawing which shows the other modification of FIG. 3 (a), (b) is sectional drawing which shows the other modification of FIG. It is sectional drawing which shows the other modification of FIG.

  A wireless IC tag according to an embodiment of the present invention will be described with reference to the accompanying drawings. Note that the distinction between the upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when the wireless IC tag is actually used.

(First embodiment)
FIG. 1 is a sectional view showing a wireless IC tag 10 according to a first embodiment of the present invention. FIG. 2 is an exploded sectional view showing an example of the coil conductor 2A in the wireless IC tag 10 shown in FIG. An insulating substrate 1 having a recess 1a on the upper surface and a coil conductor 2A disposed in a portion surrounding the recess 1a of the insulating substrate 1 constitute a package body (no reference numeral as a package body) for housing the semiconductor element 3. Has been. A semiconductor element 3 mounted on the bottom of the recess 1a of the package body is sealed with a sealing material 4 to basically constitute a wireless IC tag 10.

  In the example shown in FIG. 1, the wiring conductor 5 provided from the inside of the recess 1 a of the insulating substrate 1 to the coil conductor 2 </ b> A and the semiconductor element 3 are electrically connected to each other through the bonding wire 6. By this electrical connection, the coil conductor 2A and the semiconductor element 3 are electrically connected to each other, and the supply of power (details will be described later) generated in the coil conductor 2A to the semiconductor element 3, that is, the information to the semiconductor element 3 You can write and so on. In addition, information can be transmitted from the semiconductor element 3 to an external electric circuit (such as a computer having a reader / writer). The wiring conductor 5 has a function of electrically connecting the coil conductor and another conductor as described above, for example.

  The insulating substrate 1 functions as an electrically insulating base for arranging the coil conductor 2A in a predetermined pattern while ensuring the electrical insulation of the coil conductor 2A itself. The insulating substrate 1 also functions as a base for fixing the semiconductor element 3. The insulating substrate 1 also has a function of protecting the coil conductor 2A and the semiconductor element 3 from the outside air.

  The insulating substrate 1 has a rectangular plate shape, for example. On the upper surface of the insulating substrate 1, a recess 1 a for accommodating the semiconductor element 3 is provided. Moreover, the part surrounding the recessed part 1a among the upper surfaces of the insulated substrate 1 is frame shape. In other words, the insulating substrate 1 has a recess 1a and a frame-shaped upper surface surrounding the recess 1a.

  The insulating substrate 1 is formed of, for example, a ceramic sintered body such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. If the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, it can be manufactured as follows. That is, first, raw material powders such as aluminum oxide and silicon oxide are formed into a sheet shape together with an appropriate organic binder and an organic solvent to produce a plurality of square sheet-like ceramic green sheets. Next, these ceramic green sheets are laminated to produce a laminate. Then, the insulating substrate 1 can be manufactured by firing this laminate at a temperature of 1300 to 1600 ° C.

In this case, if a central portion of a plurality of ceramic green sheets to be laminated on the upper side of the insulating substrate 1 is punched out by mechanical punching or the like and formed into a frame-like sheet, the insulating substrate having the recess 1a 1 can be made. The central opening of the frame-shaped sheet forms the recess 1a together with the upper surface of the ceramic green sheet (insulating layer) laminated on the lower side. The manufactured insulating substrate 1 is a laminated body formed by laminating a plurality of insulating layers (no symbol) each of which is a fired ceramic green sheet.

  The coil conductor 2A functions as an antenna for transmitting / receiving radio waves to / from an external device such as a reader / writer. As described above, an induced current is generated in the coil conductor 2A according to the radio wave transmitted from the reader / writer, and electric power necessary for the operation of the semiconductor element 3 and the like is obtained.

  The coil conductor 2A is constituted by a coil conductor 2Aa disposed on a plurality of insulating layers as shown in FIGS. 1 and 2, for example. The coil conductors 2Aa arranged in the upper and lower insulating layers are electrically connected to each other by, for example, a through conductor 2Ab that penetrates the insulating layer in the thickness direction. That is, a plurality of coil conductors 2Aa are sequentially connected in series via the through conductors 2Ab to form one solenoidal coil conductor 2A. The example shown in FIG. 2 schematically shows the top surfaces of two insulating layers that are adjacent to each other in the vertical direction in the insulating layer 1 in which the coil conductor 2Aa is disposed. These two insulating layers may correspond to any insulating layer as long as the coil conductor 2Aa is provided on the upper surface in FIG.

  The number of insulating layers on which the coil conductor 2A is provided, that is, the number of turns of the coil conductor 2A, may be appropriately set in accordance with conditions such as predetermined induction power or productivity in the coil conductor 2A. The length, line width, and the like of the coil conductor 2Aa included in the coil conductor 2A may be appropriately set in consideration of the characteristics and productivity of the wireless IC tag 10.

  The semiconductor element 3 has functions of storing various types of information on articles (writing and rewriting, etc.) and processing various types of information transmitted from a reader / writer. For example, an IC (integrated circuit) or an LSI (large scale) Integrated circuit) and the like.

  The semiconductor element 3 is sealed by a sealing material 4 disposed on the semiconductor element 3 and is protected from the environment such as outside air. Thereby, for example, the semiconductor element 3 is protected from corrosive action such as moisture or oxygen contained in the outside air, and the reliability of the operation of the semiconductor element is enhanced.

  The sealing material 4 in the wireless IC tag 10 shown in FIG. 1 fills the recess 1 a and covers the semiconductor element 3. In this example, the wiring conductor 5 and the bonding wire 6 are also integrally covered with the semiconductor element 3 by the sealing material 4. The sealing material 4 in this case is a covering material 4A that directly covers the semiconductor element 3 and the like. Hereinafter, regarding the first embodiment, the sealing material 4 may be referred to as a covering material 4A.

  The covering material 4A is formed of, for example, an epoxy resin material. The resin element such as epoxy resin having fluidity before curing is filled in the recess 1a, and then the uncured resin material is cured with heat or ultraviolet rays, thereby easily covering the semiconductor element 3 or the like. it can. That is, when the covering material 4A is made of a resin material, it can be easily formed and the semiconductor element 3 can be easily sealed.

  In the wireless IC tag 10 of this embodiment, the magnetic permeability in the recess 1 a including the sealing material 4 is larger than the magnetic permeability of the insulating substrate 1. The magnetic permeability in the recess 1a including the sealing material 4 is the overall magnetic permeability in the recess 1a including the sealing material 4, and the recess 1a is filled with the sealing material 4 (covering material 4A). In this case, it corresponds to the magnetic permeability of the covering material 4A.

In this case, the magnetic permeability of the insulating substrate 1 made of an aluminum oxide sintered body or the like is about 1 as a relative magnetic permeability, whereas the magnetic permeability of a resin material such as an epoxy resin is also about 1 as a relative magnetic permeability. Therefore, an additive (not shown) made of a material having a relatively high permeability (such as a relative permeability of about 1000 to 8000) such as iron, nickel, cobalt, or ferrite is present in the covering material 4A. Be placed.

  As a material for forming the additive, for example, a metal material that is a magnetic material such as iron, nickel, or cobalt as described above, or a metal material containing an alloy of these metal materials, or ferrite can be used. These materials may be dispersed in the covering material 4A as powder, for example, or may be inserted as a foil-like or plate-like member at the upper end of the covering material 4A. When the additive is an electrically conductive material such as a metal, the arrangement position is appropriately set so that an electrical short circuit does not occur between the conductors such as the bonding wire 6, the wiring conductor 5, and the electrode of the semiconductor element 3. There is a need to. For example, the surface of the powder may be covered with an insulating material such as glass, a resin material, or a conductor (metal) oxide film, or a portion in contact with the conductor may be covered only with the resin material.

  When the sealing material 4 is the covering material 4A, the covering material 4A has a base material made of a resin material and a magnetic material (powder or the like) dispersed in the base material. Sometimes, it is easy to simultaneously perform sealing by covering the semiconductor element 3 with the covering material 4A and increasing the magnetic permeability in the recess 1a. For this reason, the wireless IC tag 10 is also advantageous in terms of productivity and economy (cost, etc.).

  The coil conductor 2A (individual coil conductor 2Aa and through conductor 2Ab) and the wiring conductor 5 are made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel, or cobalt. Further, the coil conductor 2A and the wiring conductor 5 may be formed of an alloy material containing these metal materials. Such a metal material or the like is provided in a predetermined portion of the insulating substrate 1 as a metal layer such as a metallized layer or a plating layer. The coil conductor 2A and the wiring conductor 5 may be provided by laminating the above metal material or alloy material into a plurality of layers, and the plurality of layers may include layers formed by different methods. Good.

  When the coil conductor 2A and the wiring conductor 5 are, for example, tungsten metallized layers, a metal paste prepared by mixing tungsten powder with an organic solvent and an organic binder is placed at a predetermined position of the ceramic green sheet serving as the insulating substrate 1. It can form by the method of printing and baking by methods, such as a screen printing method. The through conductor 2Ab can be formed by providing a through hole in the ceramic green sheet in advance and applying and filling a metal paste in the through hole.

  In the case of the wiring conductor 5, a plating layer such as nickel (including nickel-cobalt alloy) and gold is applied to the exposed surface of the metallized layer by a plating method such as electroplating or electroless plating. Furthermore, you may make it adhere.

  The bonding wire 6 is a wire such as a so-called gold wire or aluminum wire. Note that the electrical connection between the semiconductor element 3 and the wiring conductor 5 is not limited to the bonding wire 6, but is performed via a metal bump made of a metal material such as solder or another conductive connection material such as a conductive adhesive. It does not matter.

(Second and third embodiments)
FIG. 3A is a sectional view showing an example of the wireless IC tag 10 according to the second embodiment of the present invention, and FIG. 3B is an example of the wireless IC tag 10 according to the third embodiment of the present invention. It is sectional drawing shown. In FIG. 3, the same parts as those in FIG. In the example shown in FIG.
a is closed by the lid 4B, and the semiconductor element 3 is hermetically sealed. That is, in these examples, the sealing material 4 is the lid 4B. Hereinafter, the sealing material 4 is referred to as a lid body 4B.

  The lid 4B is made of a metal material, a ceramic material, or the like. Examples of the metal material include iron alloys such as iron-cobalt alloy, copper alloys, and aluminum alloys. Examples of the ceramic material include an aluminum oxide sintered body and a glass ceramic sintered body. The lid 4B is bonded to the insulating substrate 1 by a bonding material such as a brazing material, glass, or adhesive.

  The example shown in FIG. 3A is a lid 4B in which the sealing material 4 seals the semiconductor element 3 by closing the opening of the recess 1a. The magnetic permeability of the lid 4B is larger than the magnetic permeability of the insulating substrate 1. Thereby, the magnetic permeability in the recess 1 a including the lid 4 </ b> B as the sealing material 4 is larger than the magnetic permeability of the insulating substrate 1. That is, the lid 4B has a function of increasing the magnetic permeability in the recess 1a in addition to the hermetic sealing of the semiconductor element 3.

  The lid 4B in this case is formed of a metal material that is a magnetic material such as iron, nickel, or cobalt, or an alloy material that includes one or more of these metal materials. For example, the lid 4B is made of an iron-nickel alloy or an iron-nickel-cobalt alloy. In this case, a base metal layer 8 (not shown) is provided on a portion of the upper surface of the insulating substrate 1 where the lid 4B is joined, and the lid 4B is joined to the base metal layer with a brazing material or the like. What is necessary is just to make it join through material (not shown).

  Moreover, in the example shown to Fig.3 (a), the part (central part) located in the recessed part 1a by planar seeing among the lid | cover 4B is convex in the downward direction. That is, the center part of the lower surface of the lid 4B enters deeper into the recess 1a. By entering the convex portion of the lid 4B, the magnetic permeability in the concave portion 1a can be effectively increased. Further, the permeability in the recess 1a can be easily adjusted by adjusting the penetration depth.

  The wireless IC tag 10 of the example shown in FIG. 3B has a magnetic permeability higher than that of the insulating substrate 1 and further includes an auxiliary member 7 disposed in the recess 1a. By the action of the auxiliary member 7, the magnetic permeability in the recess 1 a including the lid 4 </ b> C as the sealing material 4 is larger than the magnetic permeability of the insulating substrate 1.

  In this case, since the auxiliary member 7 has a function of increasing the magnetic permeability in the recess 1a, the lid 4C in the example shown in FIG. 3 needs to have a higher magnetic permeability than the insulating substrate 1. There is no. For example, in this example, the lid 4C may be made of a ceramic material such as the above-described aluminum oxide sintered body.

  The auxiliary member 7 includes a material having a relatively high magnetic permeability such as iron, nickel, cobalt, or ferrite. Such an auxiliary member 7 is, for example, a material in which a powder of a magnetic material is dispersed in a resin material, like the covering material 4A in the first embodiment.

  The auxiliary member 7 may be a plate-like member made of a metal material such as iron. Moreover, the auxiliary member 7 which is such a plate-shaped member may be joined to the center part of the lower surface of the lid 4C made of a ceramic material. The auxiliary member 7 made of a metal material and the lid body 44C made of a ceramic material are joined by brazing the lid body 4C to a metallized layer (not shown) provided in advance on the lower surface of the lid body 4C, for example. Can be done.

In the form in which the auxiliary member 7 is disposed, the semiconductor element 3 may be sealed with a sealing means other than the lid 4C. As such a sealing means, for example, the same resin material as that of the covering material 4A in the first embodiment described above (one not containing a magnetic material) can be used.

(Modification)
4A is a cross-sectional view showing a modification of FIG. 3A, and FIG. 4B is a cross-sectional view showing a modification of FIG. In FIG. 4, the same parts as those in FIGS.

  The wireless IC tag 10 of the example shown in FIG. 4A further includes an auxiliary coil conductor 2B that is disposed inside the lid 4B and is electrically connected to the coil conductor 2A.

  Such an auxiliary coil conductor 2B improves the effect of induction of radio waves into the recess 1a. Therefore, the communication distance of the wireless IC tag 10 to the reader / writer is improved. The auxiliary coil conductor 2B can be formed by using the same material as that of the coil conductor 2 and using the same method, for example.

  When the auxiliary coil conductor 2B is provided, the number of turns of the coil conductor 2A can be reduced by the amount of the induced current caused by the auxiliary coil conductor 2B. Therefore, it is also effective for reducing the height of the wireless IC tag. Moreover, the freedom degree of design can also be raised as the whole coil conductor (no code | symbol) combining the coil conductor 2A and the auxiliary coil conductor 2B.

  Moreover, the part by which the conductor part including the auxiliary coil conductor 2B at least among the cover bodies 4B is arrange | positioned shall consist of insulating materials, such as a ceramic material. As the lid 4B in this case, for example, a square frame-shaped portion (not shown) made of a ceramic material and a square plate-shaped portion made of a metal material fitted inside and joined to the frame-shaped portion (Not shown).

  In the example shown in FIG. 4B, the insulating substrate 1 further has a stepped portion 1c that protrudes from the inner surface of the recess 1a into the recess 1a. The wireless IC tag 10 of this example further includes an auxiliary coil conductor 2C that is disposed in the stepped portion 1c and is electrically connected to the coil conductor 2A.

  A part of the wiring conductor 5 is disposed on the upper surface of the stepped portion 1c. As a result, the distance between the electrode on the upper surface of the semiconductor element 3 and the wiring conductor 5 is shortened, and the electrical resistance in the bonding wire 6 portion is reduced. Further, since the bonding wire 6 can be easily connected, it is advantageous in terms of productivity of the wireless IC tag 10.

  Also in this example, the effect of inducing radio waves into the recess 1a is improved by the auxiliary coil conductor 2C in the stepped portion 1c. Therefore, the communication distance of the wireless IC tag 10 to the reader / writer is improved. Also in this case, the degree of freedom of design can be increased as the entire coil conductor (no symbol) including the coil conductor 2A and the auxiliary coil conductor 2C.

  Note that when the auxiliary coil conductor 2C is disposed in the stepped portion 1c, the semiconductor element 3 may be sealed by covering only with the resin material as described in the third embodiment. Good.

  The auxiliary coil conductors 2B and 2C in the lid 4B and the stepped portion 1c as described above can be formed by the same method using the same material as the coil conductor 2A. In the case of the auxiliary coil conductor 2B in the lid body 4B, the auxiliary coil conductor 2B is coated with a metal paste that becomes the auxiliary coil conductor 2B on the portion made of the ceramic material of the lid body 4B, and the auxiliary coil conductor 2B is fired simultaneously with this ceramic material The conductor 2B can be formed.

  The electrical connection between the auxiliary coil conductors 2B and 2C and the coil conductor 2A can be performed by, for example, a part of the through conductor 2Ab or the wiring conductor 5 as described above.

  The auxiliary coil conductors 2B and 2C in the lid body 4B and the stepped portion 1c may be solenoid-like as in the coil conductor 2A of the present embodiment. In this case, for example, the lid 4B or the stepped portion 1c is formed by dividing it into a plurality of insulating layers, and the coil conductor (coil conductor 2A) that becomes the auxiliary coil conductor 2B or auxiliary coil conductor 2C is formed on the surface of the insulating layer. (Similar to the coil conductor 2Aa) may be disposed.

  5A is a cross-sectional view showing another modification of FIG. 3A, and FIG. 5B is a cross-sectional view showing another modification of FIG. In the example shown in FIG. 5A, the coil conductor 2 </ b> A is arranged biased to the upper part of the insulating substrate 1 surrounding the recess 1 a.

  In this case, the distance between the coil conductor 2A and another conductor (for example, a circuit conductor on a circuit board for mounting) disposed on the article on which the wireless IC tag is mounted can be increased. Therefore, for example, even if an unnecessary current due to electromagnetic induction occurs between such a conductor and the reader / writer, the influence on the coil conductor 2A is reduced. That is, the accuracy of information transmitted from the coil conductor 2A to the semiconductor element 3 is improved.

  In the example shown in FIG. 5A, a part of the coil conductor 2 </ b> A extends to the upper surface of the insulating substrate 1. The coil conductor 2A (coil conductor 2Aa) provided on the upper surface of the insulating substrate 1 is covered with a cover 4B and a bonding material that bonds the cover 4B and the insulating substrate 1, and is protected from the outside air. The bonding material in this case may be made of an electrically insulating material when the lid 4B is made of a metal material. Thereby, the electrical insulation between the lid 4B and the coil conductor 2Aa is improved.

  In the example shown in FIG. 5B, the outer surface of the insulating substrate 1 is covered with the magnetic sheet 8. The magnetic sheet 8 is formed by, for example, molding a material in which a powder of a magnetic material is added and dispersed in a resin material into a sheet shape.

  In this case, it is possible to effectively electromagnetically shield other conductors (for example, circuit conductors on a circuit board for mounting) disposed on the article on which the wireless IC tag is mounted and the coil conductor 2A. it can. Therefore, for example, even if an unnecessary current due to electromagnetic induction occurs between such a conductor and the reader / writer, the influence on the coil conductor 2A is reduced. Therefore, also in this case, the accuracy of information transmitted from the coil conductor 2A to the semiconductor element 3 is improved.

  Examples of the resin material included in the magnetic sheet 8 include epoxy resin, polyimide resin, polypropylene resin, and various acrylic (methacrylic) resins. Further, the magnetic material contained in the magnetic sheet 8 is made of iron, nickel, and the like in the case of the sealing material 4 (particularly, the covering material 4A and the lid 4B having a relatively high magnetic permeability) or the auxiliary member 7 in each of the above examples. Examples include materials such as cobalt and ferrite.

  The magnetic sheet 8 is prepared by, for example, preparing a mixture obtained by adding a powder of a magnetic material to an uncured product of the above resin material, and applying the mixture to the side surface of the insulating substrate 1 and then heating the resin material or irradiating with ultraviolet rays. It can be formed by curing.

FIG. 6 is a cross-sectional view showing another modification of FIG. In FIG. 6, the same parts as those in FIGS. In the example shown in FIG. 6, the insulating substrate 1 has a larger thickness in a portion located below the recess 1 a than in a portion where the recess 1 a is provided. Also in this case, the influence of unnecessary induced current on the coil conductor 2A is reduced by increasing the distance between the coil conductor 2A and another conductor arranged on the article on which the wireless IC tag 10 is mounted. . Therefore, the accuracy of information transmitted from the coil conductor 2A to the semiconductor element 3 is improved.

  Moreover, the magnetic permeability of the insulating substrate 1 may be smaller than the portion surrounding the concave portion below the concave portion 1a. As a result, it is possible to suppress unnecessary external induced current (radio waves from the induced current) from entering the concave portion 1a from below the concave portion 1a. Therefore, the influence of an unnecessary induced current on the coil conductor 2A is reduced, and the accuracy of information transmitted from the coil conductor 2A to the semiconductor element 3 is improved.

  In addition, this invention is not limited to the example of the above embodiment, A various change is possible if it is in the range of the summary of this invention. For example, the configuration in which the magnetic permeability of the insulating substrate 1 is smaller than the portion surrounding the recess below the recess 1a may be applied to any of the first to third embodiments and these modifications. . Similarly, the configuration in which the magnetic sheet 8 is provided on the outer surface of the insulating substrate 1 may be applied to any of the first to third embodiments and these modifications.

DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 1a ... Concave part 1c ... Frame-like part 2A ... Coil conductor 2Aa ... Coil conductor 2Ab ... Penetration conductor 2B ... Auxiliary coil conductor (inside the lid)
2C ・ ・ Auxiliary coil conductor (in stepped part)
DESCRIPTION OF SYMBOLS 3 ... Semiconductor element 4 ... Sealing material 4A ... Cover material 4B ... Cover body 4C ... Cover body 5 ... Wiring conductor 6 ... Bonding wire 7 ... Auxiliary member 8 ... Magnetic sheets
10 ... Wireless IC tag

Claims (9)

An insulating substrate having an upper surface including a recess;
A coil conductor disposed so as to surround the recess in a portion surrounding the recess of the insulating substrate;
A semiconductor element housed in the recess and electrically connected to the coil conductor;
And a sealing material disposed on the semiconductor element and sealing the semiconductor element,
The wireless IC tag, wherein a magnetic permeability in the concave portion including the sealing material is larger than a magnetic permeability of the insulating substrate. The sealing material is a covering material that covers the semiconductor element, and the covering material includes a base material made of a resin material and a magnetic material dispersed in the base material. The wireless IC tag according to claim 1, wherein: The sealing material is a lid that seals the semiconductor element by closing the opening of the recess, and the magnetic permeability of the lid is larger than the magnetic permeability of the insulating substrate. Item 2. The wireless IC tag according to Item 1. The wireless IC tag according to claim 1, further comprising an auxiliary member that has a higher magnetic permeability than the insulating substrate and is disposed in the recess. The wireless IC tag according to claim 3, further comprising an auxiliary coil conductor disposed inside the lid body and electrically connected to the coil conductor. The insulating substrate further includes a stepped portion protruding from the inner surface of the recess into the recess, and the auxiliary coil is disposed in the stepped portion and is electrically connected to the coil conductor. The wireless IC tag according to any one of claims 1 to 4, further comprising a conductor. The wireless IC tag according to any one of claims 1 to 4, wherein the magnetic permeability of the insulating substrate is smaller than a portion surrounding the concave portion below the concave portion. 5. The wireless IC tag according to claim 1, wherein the coil conductor is biased to an upper portion of a portion surrounding the concave portion of the insulating substrate. The wireless IC tag according to any one of claims 1 to 8, wherein an outer surface of the insulating substrate is covered with a magnetic sheet.

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