JP5023530B2 - Non-contact data carrier and wiring substrate for non-contact data carrier - Google Patents

Description

  The present invention relates to a non-contact type data carrier used in a non-contact type data carrier device, which includes an antenna circuit part having an antenna pattern on a base material and an IC chip.

In recent years, IC cards are becoming increasingly popular in terms of information confidentiality, and in recent years, contactless IC cards that exchange information without contacting a reader / writer have been proposed. A system in which signal exchange with an apparatus or signal exchange and power supply is performed by electromagnetic waves is being put into practical use.
Under such circumstances, various types of non-contact IC tags in the form of sheets or bills, in which an IC chip carrying data is connected to an antenna coil, have recently been proposed and attached to products, packaging boxes, etc. for shoplifting. It has come to be used for prevention, logistics system, product management, etc.

Such a non-contact type data carrier used for a non-contact type IC card and a non-contact type IC tag incorporates a resonance circuit that is tuned to a specific frequency.
However, there is a variation in the capacity of the IC chip, and in a non-contact type data carrier, the resonance frequency may deviate from a desired specific frequency, which is a problem.
The non-contact type data carrier referred to here is a general term for parts having an antenna circuit part and an IC chip on a base material, and is a non-contact type such as a non-contact type IC card and a non-contact type IC tag. A configuration in which the data carrier is actually used as a data carrier is collectively referred to as a non-contact type data carrier device.

For this reason, a method has been proposed in which the resonance frequency is adjusted by changing the inductance value of the antenna circuit section constituting the resonance circuit of the non-contact data carrier.
For example, a method for adjusting an inductance value by cutting an antenna coil is disclosed in Japanese Patent Laid-Open No. 2000-285214 (Patent Document 1).
However, in the case of this method, since the cutting is performed, it takes time and the number of steps increases.
A method for adjusting the inductance value by changing the position where the IC chip is mounted without cutting the antenna coil is disclosed in Japanese Patent Laid-Open No. 2005-33587 (Patent Document 2).
However, an area for providing a plurality of regions for mounting IC chips is required, which hinders the realization of a small tag of 10 mm square or less.
JP 2000-285214 A JP 2005-33587 A

Further, because of its miniaturization, a non-contact type data carrier in which an antenna circuit portion is formed on a multilayer wiring board is disclosed in Japanese Patent Laid-Open No. 2004-206736 (Patent Document 3). At the stage of making the circuit part as a prototype, a plurality of antenna circuit parts have been produced in order to obtain an antenna circuit part having a desired operating frequency.
For this reason, it took time and effort at the prototype stage, and the cost was high.
JP 2004-206736 A

As described above, in the non-contact type data carrier used in the non-contact type data carrier device, the capacity of the IC chip varies, and the resonance frequency may deviate from a desired specific frequency. This can be easily adjusted. There was a need for a way to do it.
The present invention corresponds to this, and an object of the present invention is to provide a non-contact data carrier wiring substrate capable of adjusting the impedance of an antenna circuit or selecting an impedance in accordance with an impedance that resonates at a desired frequency. An object of the present invention is to provide a non-contact type data carrier whose impedance is adjusted or selected using such a non-contact type data carrier wiring substrate.

The non-contact type data carrier of the present invention is a non-contact type data carrier used in a non-contact type data carrier device , and is a wiring base material having an antenna circuit including an antenna pattern on an insulating base material , and an antenna. A wiring substrate, which is a multilayer wiring board having a multi-layer pattern, and an IC chip . The IC chip is arranged on one side of the wiring substrate with a pair of connection terminals on the outside. And a connection pad electrically connected to the antenna pattern corresponding to one or both connection terminals of the pair of connection terminals of the IC chip. On the IC chip mounting side of the material, a plurality of the antenna patterns are connected to different locations of the antenna pattern, and the connection terminals of the IC chip and the antenna are matched to the impedance that resonates at a desired frequency. The antenna circuit is formed by wire bonding connection to predetermined connection pads of the antenna pattern, or in addition, wire bonding connection of predetermined connection pads of the antenna pattern to each other. A plurality of connection pads are provided corresponding to each of the connection terminal portions of the pair of connection terminal portions of the IC chip, and each of the connection pads includes the IC chip. the IC chip side from said antenna circuit for circulating, drawn by connecting, Ru der those characterized in that by disposing the peripheral IC chip.
In here, the antenna pattern, means a circuit portion functioning as the antenna, although the case of resonance desired frequency as 13.56MHz is also referred to as antenna coils become coiled, e.g. 860~960MHz band, 2. It is not necessarily coiled at other frequencies such as the 45 GHz band.

The non-contact type data carrier wiring base material of the present invention is a wiring base material having an antenna circuit including an antenna pattern on an insulating base material composed of a multi-layer wiring substrate in which antenna patterns are arranged in multiple layers , and An IC chip is placed on one side of the wiring substrate with the pair of connection terminals facing outward, and each connection terminal of the pair of connection terminals and the antenna pattern are electrically connected by wire bonding. Wiring base material for non-contact type data carrier used for non-contact type data carrier of connection type, and each connection terminal of one or both of a pair of connection terminals of IC chip to be mounted Corresponding to each of the antenna patterns, a plurality of connection pads for wire bonding connection are provided on the IC chip mounting side of the wiring substrate. One that is arranged to connect to different locations over emissions, in correspondence with each connection terminal portions of both of the pair of connecting terminal portions of the IC chip, respectively, the connection pads, a plurality, provided The connection pads are connected to the IC chip side from the antenna circuit that circulates around the IC chip, and are arranged around the IC chip .

(Function)
The non-contact type data carrier according to the present invention has such a configuration, so that the wiring substrate can be connected to the connection terminal of the IC chip and the connection pad of the wiring base material in addition to or in addition to the wiring substrate. It is possible to provide a non-contact type data carrier in which the impedance of the antenna circuit is adjusted or the impedance is selected in accordance with the impedance that resonates at a desired frequency depending on the method of wire bonding between the connection pads of the material.
Specifically, a wiring substrate having an antenna circuit including an antenna pattern on an insulating substrate, and a wiring substrate that is a multilayer wiring substrate in which the antenna patterns are arranged in multiple layers, and an IC chip, The IC chip is arranged on one side of the wiring substrate with the pair of connection terminals outside, and one or both of the pair of connection terminals of the IC chip are connected to each connection terminal. Correspondingly, a plurality of connection pads that are electrically connected to the antenna pattern are connected to the IC chip mounting side of the wiring substrate and connected to different portions of the antenna pattern. The connection terminal of the IC chip and the predetermined connection pad of the antenna pattern are connected by wire bonding in accordance with the impedance that resonates at a desired frequency, or in addition to this. The antenna circuit is formed by wire-bonding predetermined connection pads of the antenna pattern to each of the connection terminal portions of the pair of connection terminal portions of the IC chip. A plurality of connection pads are provided, and each of the connection pads is connected to and pulled out from the antenna circuit that circulates around the IC chip to the IC chip side. This is achieved by arranging it.
A plurality of connection pads are provided corresponding to each of the connection terminal portions of the pair of connection terminal portions of the IC chip, so that the pair of connection terminal portions of the IC chip are provided. The degree of freedom of impedance adjustment and impedance selection to be selected is increased depending on the wire bonding method, as compared with a configuration in which a plurality of connection pads are provided corresponding to one of the connection terminal portions.
The wiring substrate is a multilayer wiring board in which antenna patterns are arranged in multiple layers . In particular, the width and the degree of freedom of impedance selected can be increased depending on the method of wire bonding.
In this embodiment, the size of the non-contact data carrier can be further reduced.
For example, a 4-layer has a 5.5 mm square area size, and an 8-layer has a 3 mm × 6 mm square area size.

The non-contact type data carrier wiring substrate according to the present invention is configured in this manner, so that when it is used in a non-contact type data carrier, the impedance adjustment of the antenna circuit is adjusted to the impedance that resonates at a desired frequency. Alternatively, impedance selection is possible.
Corresponding to each connection terminal portions of both of the pair of connecting terminals of the IC chip to be mounted, respectively, the connection pads, a plurality, by an in and form provided, subjected to non-contact data carrier Impedance, which is selected depending on the method of wire bonding, as compared with the case where a plurality of connection pads are provided corresponding to one of the connection terminal portions of the pair of connection terminal portions of the IC chip. The degree of freedom for adjustment and impedance selection increases.
The wiring substrate is a multilayer wiring board which is disposed in the antenna pattern in multiple layers, when it is subjected to contactless type data carrier, in particular, by way of wire bonding, the width of the impedance to be selected, The degree of freedom can be increased, and as a result, the versatility can be applied to different IC chips.

As described above, the present invention provides a non-contact type data carrier wiring substrate capable of adjusting an impedance of an antenna circuit or selecting an impedance in accordance with an impedance that resonates at a desired frequency when used in a non-contact type data carrier. It was possible to provide.
At the same time, using such a non-contact type data carrier wiring substrate, it is possible to provide a non-contact type data carrier in which impedance adjustment or impedance selection is made.

Embodiments of the present invention will be described with reference to the drawings.
FIG. 1A to FIG. 1C are schematic views of examples of embodiments of the contactless data carrier of the present invention, respectively. FIG. 2 shows a circuit configuration corresponding to FIG. FIGS. 3 (a) and 3 (b) are diagrams illustrating the non-contact type data carrier according to the present invention using a two-layer wiring board. FIG. 3C is a plan view showing the second wiring layer and the second wiring layer. FIG. 3C is an easy-to-understand description of the positional relationship and connection between the first wiring layer and the second wiring layer. 4 (a), 4 (b), 4 (c), and 4 (d) are diagrams showing the implementation of the non-contact data carrier of the present invention using a four-layer wiring board, respectively. FIG. 5 is a plan view showing a first wiring layer, a second wiring layer, a third wiring layer, a fourth wiring layer, and a fourth wiring layer of FIG. Wiring layer to 4th layer Positional relationship of the layers, clarity of connection, separated, illustrates.
Here, the first wiring layer, the second wiring layer,... From the semiconductor chip mounting side are used.
1 to 5, 10, 10 </ b> A, and 10 </ b> B are non-contact data carriers, 15 is a wiring board (of a non-contact data carrier), 20 is an antenna coil, 21 to 26 are connection pads (also referred to as terminals), 30 is a substrate (also referred to as a resin substrate), 40, 40A and 40B are IC chips, 41 and 42 are connection terminals, 41a and 42a are connection terminals, 41b and 42b are connection terminals, and 50 is a connection circuit. , 51 and 52 are front and back connection portions, 61 to 65 are bonding wires, 111 is a first wiring layer, 112 is a second wiring layer, 120 is an antenna coil, and 121 to 126 are connection pads (both terminals) , 130 is a base material (also referred to as a resin base material), 140 is an IC chip, 141 and 142 are connection terminals, 151 to 154 are connection parts, 150 and 150A are connection circuit parts, and 161 and 162 are Bonn. Ing wire, 211 is the first wiring layer, 212 is the second wiring layer, 213 is the third wiring layer, 214 is the fourth wiring layer, 220 is the antenna coil, and 221 to 223 are for connection Pads (also referred to as terminals), 230 is a base material (also referred to as a resin base material), 240 is an IC chip, 241 and 242 are connection terminals, 251, 251a, 252, 252a, 253, 253a, 254, 254a, 255, 255a is a connection part.

First, an example of an embodiment of a contactless data carrier according to the present invention will be described with reference to FIG.
A non-contact type data carrier 10 shown in FIG. 1 (a) is a non-contact type data carrier used in a non-contact type data carrier device, and has an insulating resin base material 30 with an antenna coil 20, connecting portions 51 and 52, and terminals. The wiring board 15 having the antenna circuit including the parts 21 to 26 and the IC chip 40 are provided, and a pair for electrically connecting the IC chip 40 to the antenna coil 20 on one surface side of the wiring board 15. The connection terminals 41 and 42 of the IC chip 40 are arranged with the connection terminals 41 and 42 on the outside, and the connection terminals 41 and 42 of the IC chip 40 are electrically connected to the antenna coil 20 for wire bonding connection. The three connection pads 21 to 23 are electrically connected to the antenna coil 20 and connected to the antenna coil 20 corresponding to the connection terminal portion 42. 6, to the IC chip mounting side of the wiring substrate, are arranged to connect to different locations of the antenna coil 20.
The non-contact type data carrier 10 shown in FIG. 1A is configured to connect the connection terminal portion 41 of the IC chip 40 and the antenna coil 20 by wire bonding in accordance with the impedance for resonance at a desired frequency of 13.56 MHz. The connection pad 21 and the connection terminal portion 42 and the connection pad 24 are electrically connected to form an antenna circuit.

As described above, the non-contact type data carrier 10 shown in FIG. 1A has the antenna coil 20 disposed on one surface of the base material 30, and the connection portions 51 and 52 at both ends of the antenna coil 20 are connected to each other. The connecting portion 51 and the connecting portion 52 are electrically connected by a connecting circuit portion 50 disposed on the other surface.
FIG. 2 shows the entire circuit in a simplified manner, but the desired frequency 13 is obtained by such wire bonding connection between the connection terminals 41 and 42 of the IC chip 40 and the connection pads 21 and 24. Impedance resonating at 56 MHz.
Here, this wire bonding connection is a connection method that maximizes the impedance of the antenna circuit, particularly the inductance.

The non-contact type data carrier 10A shown in FIG. 1 (b) uses the same wiring board as the wiring board shown in FIG. 1 (a). The non-contact type data carrier 10 shown in FIG. The IC chip is different, and the IC chip 10A has a slightly larger internal impedance than the IC chip 40 shown in FIG.
Therefore, as shown in FIG. 1B, the connection terminals 41a and 42a of the IC chip 40A and the connection pads 21 and 24 are connected by wire bonding so as to resonate at a desired frequency of 13.56 MHz. The connection pad 21 and the connection pad 22 are connected by wire bonding.
By doing so, the impedance of the antenna coil as a circuit is substantially adjusted. (See Figure 2)
The non-contact type data carrier 10B shown in FIG. 1C also uses the same wiring board as the wiring board shown in FIG. 1A, and the non-contact type data carrier 10B shown in FIG. 1A and FIG. The IC chip is different from the formula data carrier 10, and the IC chip 10B has a slightly larger internal impedance than the IC chip 40A shown in FIG.
Therefore, as shown in FIG. 1C, the connection terminals 41b and 42b of the IC chip 40B and the connection pads 21 and 24 are connected by wire bonding so as to resonate at a desired frequency of 13.56 MHz. The connection pad 21 and the connection pad 22 are connected by wire bonding, the connection pad 22 and the connection pad 23 are connected, and the connection pad 24 and the connection pad 25 are connected by wire bonding.
By doing so, the impedance of the antenna coil as a circuit is substantially adjusted. (See Figure 2)
Thus, the non-contact data carriers 10, 10A, 10B have different internal impedances depending on the IC chip to be used. Therefore, the wire bonding connection method is changed in accordance with this.
The connection method is not limited to the above.
For example, a configuration in which the connection terminal 41 and the connection pad 23 are connected and the connection terminal 42 and the connection pad 26 are simply connected may be used.

Here, the non-contact type data carrier 10 (10A, 10B) is preferably rigid as a whole and can maintain a planar shape, and the substrate 30 is preferably a hard insulating substrate such as glass epoxy or paper phenol. In addition, a flexible base material such as polyethylene terephthalate or polyimide can also be applied.
For example, the wiring substrate 15 is a single-sided copper-clad substrate in which a hard insulating substrate made of glass epoxy, paper phenol, or the like having a thickness of 0.1 mm is used as the base material 30 and a copper foil having a thickness of 18 μm is laminated on one side. Then, the antenna coil 20 and the connection pads 21 to 26 having a desired shape are formed by etching using a photoetching method.
In addition, the connection parts 51 and 52 are formed by arranging a conductive material in the through-hole part that penetrates the front and back, and conducting the front and back, and are further electrically connected by the connection circuit part 50. The connection is not limited to this.
The surface IC chip 10, bonding wires 61 and 62, and antenna coil 20 are covered and protected by a solder resist and a sealing resin (not shown).
The antenna coil has a line width of about 80 μm, a line width of about 70 μm, and a line thickness of about 18 μm, and is formed by a known photoetching method.
The IC chip 10 mainly includes a ROM, a RAM, a logic circuit, and a CPU. As the IC chip 10, a chip that is commercially available as a chip for a 13.56 MHz band RFID tag, such as Philips I-CODE SLI chip, Infineon Technology my-d chip, etc. Use.

Next, an example of an embodiment of a non-contact type data carrier of the present invention using a two-layer wiring board will be described with reference to FIG.
In this example, a multilayer wiring board in which antenna coils are arranged in two layers is used as a wiring board, and an antenna coil 120, connection parts 151 to 154, and terminal parts 121 to 126 are provided on an insulating resin base material 130. In the same manner as in each example shown in FIG. 1, the IC chip 140 is placed on one side of the wiring board and the antenna coil 120. A pair of connection terminals 141 and 142 for electrical connection are arranged on the outside, and corresponding to both connection terminal parts 141 and 142 of the IC chip 140, wire bonding connection The six connection pads 121 to 126 that are electrically connected to the antenna coil 120 are connected to different locations of the antenna coil 20 on the IC chip mounting side of the wiring board. That.
Also in this example, the connection terminal portion 141 of the IC chip 140 and the connection pad 122 of the antenna coil 120 are connected by wire bonding in accordance with the impedance that resonates at a desired frequency of 13.56 MHz. The terminal portion 142 and the connection pad 126 are electrically connected to form an antenna circuit.
Then, as shown in FIG. 3C, the connection portion 151 of the first wiring layer and the connection portion 153 of the second wiring layer are connected, and the connection portions 152 and 2 of the first wiring layer are connected. The connection part 154 of the wiring layer of the layer is electrically connected to each other.
In this way, the wire bonding connection is used, and the impedance is adjusted so as to resonate at a desired frequency of 13.56 MHz.
The change in the impedance of the antenna circuit depending on the method of wire bonding connection is the same as that described in each example of FIG. 1 and the description, and also in this example, the connection according to the IC chip 140 to be used is selected.
When IC chips having different internal impedances are used, connection according to this is performed.

As a wiring board in this example, for example, each layer is electrically connected through a through-hole or a via provided in a laminated wiring substrate in which a substrate in which a part of an antenna coil is formed is laminated on the surface of each substrate 130. The antenna circuit part by connecting them to each other.
Then, the IC chip 140 is mounted on the surface portion of the laminated wiring board and electrically connected to the antenna coil 120 to form the non-contact type data carrier of this example.
The formed non-contact type data carrier has rigidity as a whole and can maintain a planar shape.
Here, the antenna coil 120 has a two-layer spiral shape in which the number of turns of each layer is about nine.
The IC chip 140, the bonding wires 161 and 162, and the antenna coil 120 on the surface are covered and protected by a solder resist and a sealing resin (not shown).
The antenna coil 120 has a line width of about 80 μm, a line width of about 70 μm, and a line thickness of about 18 μm. The antenna coil 120 can be formed in such a laminated structure by a known additive method or semi-additive method.
The IC chip 140 is mainly composed of a ROM, a RAM, a logic circuit, and a CPU.
As the IC chip 140, a chip that is commercially available as a chip for a 13.56 MHz band RFID tag, such as Philips I-CODE SLI chip, Infineon Technology my-d chip, etc. Use.
In addition, as the substrate 130 of the wiring board, for example, each layer is a hard insulating substrate made of glass epoxy, phenol or the like having a thickness of 0.1 mm, and a copper foil having a thickness of 18 μm is laminated on one surface thereof. Then, using a single-sided copper-clad substrate, the antenna coil 120 having a desired shape is formed by etching using a photoetching method, and each layer is laminated by heating and pressing through an insulating adhesive layer. Form and make.

An example of an embodiment of the non-contact type data carrier of the present invention using a four-layer wiring board will be described with reference to FIG.
In this example, a multilayer wiring board having four layers of antenna coils is used as the wiring board. The antenna coil 220 and the connecting portions 251, 251 a, 252, 252 a, and 253 are formed on an insulating resin base material 230. 253a, 254.254a, 255.255a, a four-layer wiring board having an antenna circuit including terminal portions 221 to 223, and an IC chip 40, as in each example shown in FIG. The IC chip 240 is arranged on one side of the wiring board with a pair of connection terminals 241 and 242 for electrical connection with the antenna coil 220 being outside, and both the IC chips 240 are connected. Corresponding to the terminal portions 241 and 242 for wiring, three connection pads 221 to 223 electrically connected to the antenna coil 220 for wire bonding are connected to the wiring. To the IC chip mounting side of the plate, it is arranged to connect to different locations of the antenna coil 220.
Also in this example, the connection terminal portion 241 of the IC chip 240 and the connection pad 221 of the antenna coil 220 are connected by wire bonding in accordance with the impedance that resonates at a desired frequency of 13.56 MHz. The terminal portion 242 and the connection pad 222 are electrically connected to form an antenna circuit.
Then, as shown in FIG. 5, the connection portion 251 of the first wiring layer and the connection portion 251a of the second wiring layer, and the connection portion 252 of the first wiring layer and the second layer The connection portion 252a of the wiring layer, the connection portion 253 of the first wiring layer, the connection portion 253a of the fourth wiring layer, the connection portion 254 of the second wiring layer, and the third layer The connection portion 254a of the wiring layer, and the connection portion 255 of the third wiring layer and the connection portion 255a of the fourth wiring layer are electrically connected. Also in this example, the wire bonding connection is performed in this way, and the impedance is adjusted so as to resonate at a desired frequency of 13.56 MHz.
The impedance of the antenna circuit varies depending on the wire bonding connection method, which is the same as described in each example and description of FIG. 1. In this example, too, the connection according to the IC chip 140 to be used is selected and the internal impedance is changed. In the case of an IC chip having a different IC, the connection corresponding to this is performed. However, in the case of this example, the difference in impedance to be selected can be increased unlike the examples shown in FIGS.
Therefore, it is suitable for general-purpose use with respect to two types of IC chips having greatly different internal impedances on the same wiring board.

The present invention is not limited to the non-contact data carrier of the above example and the wiring substrate used therefor.
For example, a wiring board having a configuration in which a capacitor is connected in series with a coil, and the impedance can be adjusted or selected by changing the capacitance component in addition to the inductance component depending on the connection method, or the wiring board is used. Non-contact data carriers that have been included.
Moreover, the form using flexible materials, such as PET (polyethylene terephthalate) film, and inorganic materials, such as a ceramic, is also mentioned as a base material.
In the above example, the impedance is adjusted so as to resonate at a desired frequency of 13.56 MHz. However, there is a form in which the impedance is adjusted at another desired frequency, for example, 860 to 960 MHz band, 2.45 GHz band, etc. At other frequencies, the antenna pattern does not necessarily have a coil shape.
The non-contact type data carrier of the present invention using the two-layer wiring board shown in FIG. 3 is formed by laminating two wiring boards each having an antenna pattern formed on one side. There is also a type in which an antenna coil having a desired shape is formed on both sides by a photoetching method using a double-sided copper-clad substrate on which a 18 μm thick copper foil is laminated, and the antenna pattern is formed in two layers. .

FIG. 1 (a) to FIG. 1 (c) are each a schematic diagram of an example of an embodiment of a contactless data carrier of the present invention. FIG. 2 is a diagram showing a circuit configuration corresponding to FIG. FIG. 3A and FIG. 3B respectively show a first wiring layer and a second layer of an example of an embodiment of the non-contact data carrier of the present invention using a two-layer wiring board. FIG. 3C is a plan view showing the wiring layers. FIG. 3C is a diagram showing the positional relationship and connection between the first wiring layer and the second wiring layer in an easy-to-understand manner. 4 (a), 4 (b), 4 (c), and 4 (d) are examples of embodiments of the non-contact type data carrier of the present invention using a four-layer wiring board, respectively. FIG. 3 is a plan view showing a first wiring layer, a second wiring layer, a third wiring layer, and a fourth wiring layer. It is the figure which separated and showed the positional relationship and connection of the 1st wiring layer-the 4th wiring layer shown in FIG. 4 in an easy-to-understand manner.

Explanation of symbols

10, 10A, 10B Non-contact data carrier 15 (non-contact data carrier) wiring board 20 Antenna coils 21 to 26 Connection pads (also referred to as terminals)
30 base material (also called resin base material)
40, 40A, 40B IC chip 41, 42 Connection terminal 41a, 42a Connection terminal 41b, 42b Connection terminal 50 Connection circuit part 51, 52 Front / back connection parts 61-65 Bonding wire 111 First wiring layer 112 2 Layer wiring layer 120 Antenna coils 121-126 Connection pads (also referred to as terminals)
130 Base material (also called resin base material)
140 IC chips 141 and 142 Connection terminals 151 to 154 Connection parts 150 and 150A Connection circuit parts 161 and 162 Bonding wire 211 First wiring layer 212 Second wiring layer 213 Third wiring layer 214 Four layers Eye wiring layer 220 Antenna coils 221 to 223 Connection pads (also referred to as terminals)
230 Base material (also called resin base material)
240 IC chips 241 and 242 Connection terminals 251 and 251a Connection portions 252 and 252a Connection portions 253 and 253a Connection portions 254 and 254a Connection portions 255 and 255a Connection portions

Claims (2)

A non-contact type data carrier used in a non-contact type data carrier device, which is a wiring substrate having an antenna circuit including an antenna pattern on an insulating substrate , and a multilayer wiring in which antenna patterns are arranged in multiple layers A wiring base material that is a substrate; and an IC chip , the IC chip being arranged on one surface side of the wiring base material with the pair of connection terminals outside, and a pair of the IC chips Corresponding to one or both of the connection terminals, a plurality of connection pads electrically connected to the antenna pattern are provided on the IC chip mounting side of the wiring substrate. The connection terminals of the IC chip and the predetermined connection pads of the antenna pattern are arranged so as to be connected to different portions of the antenna pattern, and according to the impedance that resonates at a desired frequency. Are connected by wire bonding, or in addition to this, predetermined connection pads of the antenna pattern are connected by wire bonding to form the antenna circuit. A plurality of connection pads are provided corresponding to each of the connection terminal portions of the connection terminal portion, and each of the connection pads is connected to the IC from the antenna circuit that circulates around the IC chip. A non-contact type data carrier characterized in that it is connected and pulled out to the chip side and arranged around the IC chip. A wiring substrate having an antenna circuit including an antenna pattern on an insulating substrate made of a multilayer wiring board having a multi-layered antenna pattern, and an IC chip on one side of the wiring substrate. Used for a non-contact type data carrier of a type in which a pair of connection terminals are arranged outside and each connection terminal of the pair of connection terminals and the antenna pattern are electrically connected by wire bonding connection. A wiring substrate for a non-contact data carrier, which is electrically connected to an antenna pattern corresponding to one or both of the connection terminals of a pair of IC chips to be mounted. and it has a connection pad for the wire bonding, to the IC chip mounting side of the wiring substrate, one that is arranged to connect a plurality, to different parts of the antenna pattern and Corresponding to each connection terminal portions of both of the pair of connecting terminal portions of the IC chip, respectively, the connection pads, a plurality, and provided, said connection pads, respectively, orbiting the IC chip A non-contact type data carrier wiring substrate characterized by being connected and pulled out from the antenna circuit to the IC chip side and arranged around the IC chip.

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