CN110267454A - A kind of FPC production technology and structure - Google Patents
A kind of FPC production technology and structure Download PDFInfo
- Publication number
- CN110267454A CN110267454A CN201910560475.9A CN201910560475A CN110267454A CN 110267454 A CN110267454 A CN 110267454A CN 201910560475 A CN201910560475 A CN 201910560475A CN 110267454 A CN110267454 A CN 110267454A
- Authority
- CN
- China
- Prior art keywords
- reinforcement
- fpc
- ontology
- glue
- tin cream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000005516 engineering process Methods 0.000 title claims abstract description 15
- 230000002787 reinforcement Effects 0.000 claims abstract description 105
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000003292 glue Substances 0.000 claims abstract description 21
- 239000006071 cream Substances 0.000 claims abstract description 19
- 238000003475 lamination Methods 0.000 claims abstract description 7
- 239000003351 stiffener Substances 0.000 claims abstract description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 8
- 239000010959 steel Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
Abstract
The invention discloses a kind of FPC production technology, mainly include the following steps: for reinforcement and IC to be attached on FPC ontology using SMT brush tin；Cross reflow ovens；It will be on another stiffener lamination to reinforcement and IC with IC；Fast press compacting reinforcement and FPC ontology；Solidify FPC.A kind of FPC structure, including FPC ontology, the top of FPC ontology are arranged at intervals with tin cream, and the top of tin cream is equipped with IC and/or reinforcement, and reinforcement and/or the top IC are coated with glue；The top of glue is connected with another reinforcement；Another reinforcement is connect by glue with IC and/or reinforcement.By the way that FPC ontology is arranged, the top interval of FPC ontology is arranged tin cream, the top setting IC of tin cream and/or reinforcement, is coated with glue on reinforcement and/or IC；The top of glue connects another reinforcement；Another is connect with IC and/or reinforcement by glue by force, is formed a kind of reinforcement and is connect reliable FPC structure with FPC ontology.
Description
Technical field
The technical program is related to flexible circuit board production technical field, specially a kind of FPC production technology and structure.
Background technique
In general FPC production process, when pasting steel disc reinforcement, needs first to carry out SMT welding IC component, pass through later
An other procedure carries out patch steel disc reinforcement, carries out baking sheet solidification later.The FPC of this production method production, reinforcement and FPC
Peel strength between ontology is small, and reinforcement easily falls off from FPC ontology, so that the poor reliability of FPC product, low efficiency.
Therefore, it is necessary to a kind of novel FPC production technologies and FPC structure to solve the above problems.
Summary of the invention
The technical problem to be solved by the present invention is a kind of FPC production technology and structure are provided, to solve reinforcement and FPC
The problem of being connected between ontology.
The present invention is to solve a kind of technical solution that its technical problem provides to be: a kind of FPC production technology, main includes such as
Lower step: reinforcement and IC are attached on FPC ontology using SMT brush tin；Cross reflow ovens；By the reinforcement of another stiffener lamination to IC
On IC；Fast press compacting reinforcement and FPC ontology；Solidify FPC.
As an improvement of the above scheme, during being laminated, member and temperature setting are 180 degrees Celsius, and pressure is set
It is set to 35kgf, pressing time 300s.
The method have the benefit that: by the way that reinforcement and IC are attached on FPC ontology using SMT brush tin note；It crosses back
Flow furnace；It will be on another stiffener lamination to reinforcement and IC with IC；Fast press compacting reinforcement and FPC ontology；Solidify FPC, is formed
A method of solving connectivity problem between reinforcement and FPC ontology.
The present invention also provides a kind of FPC structure, including FPC ontology, the top of FPC ontology is arranged at intervals with tin cream, tin
The top of cream is equipped with IC and/or reinforcement, and the reinforcement and/or the top IC are coated with glue；The top of the glue is connected with separately
One reinforcement；Another reinforcement is connect by glue with IC and/or reinforcement.
As an improvement of the above scheme, IC and the reinforcement positioned at the two sides IC are connected as one by tin cream and FPC ontology.
As a further improvement of the foregoing solution, the reinforcement includes the first reinforcement and the second reinforcement, first reinforcement
It is Nian Jie by glue between second reinforcement.
As a further improvement of the foregoing solution, the side of first reinforcement is connect by tin cream with the FPC ontology,
First reinforcement interval is arranged, and IC is equipped between the first adjacent reinforcement, and one end of IC is connect by tin cream with FPC ontology,
The other end of IC is connect by glue with the second reinforcement.
As a further improvement of the foregoing solution, setting is spaced between first reinforcement.
As a further improvement of the foregoing solution, first reinforcement, the second reinforcement are steel disc.
As a further improvement of the foregoing solution, second reinforcement is attached to the upper of first reinforcement and the IC
Portion, the specification of second reinforcement are greater than the specification of first reinforcement.
As a further improvement of the foregoing solution, second reinforcement, the first reinforcement, between IC, FPC ontology three mutually
Adaptation.
The method have the benefit that: by the way that FPC ontology is arranged, tin cream, tin cream is arranged in the top interval of FPC ontology
Top setting IC and/or reinforcement, reinforcement and/or IC on be coated with glue；The top of glue connects another reinforcement；Another reinforcement
It is connect by glue with IC and/or reinforcement, forms a kind of reinforcement and connect reliable FPC structure with FPC ontology.
Detailed description of the invention
For the clearer technical solution illustrated in the embodiment of the present invention, will make below to required in embodiment description
Attached drawing briefly describes.
Fig. 1 is the flow chart of FPC production technology of the present invention；
Fig. 2 is a kind of structural schematic diagram of embodiment of FPC structure of the present invention.
Specific embodiment
Carried out with reference to embodiments with technical effect of the attached drawing to design of the invention, specific structure and generation it is clear,
It is fully described by, to fully understand the purpose of the present invention, scheme and effect.It should be noted that in the absence of conflict originally
The feature in embodiment and embodiment in application can be combined with each other.Furthermore the upper and lower, left and right etc. used in the present invention
It describes in only opposite figure for each component part mutual alignment relation of the present invention.
Fig. 1 is the flow chart of FPC production technology of the present invention, and with reference to Fig. 1, a kind of FPC production technology, main includes following step
Suddenly, reinforcement and IC are attached on FPC ontology using SMT brush tin note, reinforcement shields to IC；Pass through reflow ovens later, it will
On another stiffener lamination to reinforcement and IC with IC；Then reinforcement and FPC ontology are suppressed by fast press, is finally solidified
FPC forms a kind of reinforcement and connect reliable FPC production technology with FPC ontology.
Preferably during carrying out reinforcement and FPC ontology is laminated, pressing-in temp is set as 180 degrees Celsius, pressure is set
It is set to 35kgf, pressing time is set as 300S, ensures the reliability of reinforcement and FPC bulk adhesive in lamination process.
IC and reinforcement are fitted on FPC ontology by more present invention simultaneously by SMT brush tin, compared to traditional reinforcement
Attachment is opened with IC points, reduces process flow steps, the production efficiency of flexible circuit board can be significantly improved.
In one embodiment, using traditional adhesion process, the peel strength between reinforcement and FPC ontology only has
0.6kg/cm attaches steel disc reinforcement by the way of SMT brush tin, and peel strength reaches 5.0kg/cm or more, so that steel disc is mended
Greatly enhanced with the binding force of FPC by force.
When more IC components are pressure-sensitive components, dispensing can not be carried out during carrying out patch assembling, it is no
IC disabler can then be made, but IC must be protected again using reinforcement, and the production technology in technical solution of the present invention can expire
Manufacturing technique requirent as foot, the scope of application for the technical program that extended.
Fig. 2 is a kind of structural schematic diagram of embodiment of FPC structure of the present invention, with reference to Fig. 2, a kind of FPC structure, including
FPC ontology 10, the top of FPC ontology 10 are arranged at intervals with tin cream 20, the top of tin cream 20 be equipped with two be symmetrical set first
Reinforcement 31, IC (Integrated Circuit) 40 is equipped between the first reinforcement 31, and the first reinforcement 31 and IC40 pass through SMT brush tin
It is attached to the upper surface FPC.It is coated with glue 50 on the top of the first reinforcement 31 and IC40, second is equipped on the top of glue 50 and mends
Strong by 60, the upper surface of the second reinforcement 60 and the first reinforcement 31 and IC40 is fitted and connected.Steel disc is attached to FPC compared to traditional
The lower surface of ontology 10, IC are connected to the upper surface of FPC ontology 10 by tin cream 20, and technical solution of the present invention is equipped with IC strong
Protection, so that FPC structure of the invention has better stability, reliability.Preferred first reinforcement 31 and the second reinforcement 60
It is steel disc, robust, intensity is good.
It can be seen from the above, reinforcement and IC are attached to FPC ontology using SMT brush tin by setting by technical solution of the present invention
On；Cross reflow ovens；It will be on another stiffener lamination to reinforcement and IC with IC；Fast press compacting reinforcement and FPC ontology；Solidification
FPC forms a kind of FPC production technology for being reliably connected reinforcement and FPC ontology and ensureing IC safe and stable operation on FPC ontology
With FPC structure.
Although specifically showing and describing the present invention in conjunction with preferred embodiment, those skilled in the art should be bright
It is white, it is not departing from the spirit and scope of the present invention defined by described claims, it in the form and details can be right
The present invention makes a variety of changes, and is protection scope of the present invention.
Claims (10)
1. a kind of FPC production technology, which is characterized in that mainly include the following steps: for reinforcement and IC to be attached to using SMT brush tin
On FPC ontology；Cross reflow ovens；It will be on another stiffener lamination to reinforcement and IC with IC；Fast press compacting reinforcement and FPC sheet
Body；Solidify FPC.
2. FPC production technology according to claim 1, which is characterized in that during being laminated, pressing-in temp is set
180 degrees Celsius are set to, pressure is set as 35kgf, pressing time 300s.
3. a kind of FPC structure, which is characterized in that including FPC ontology, the top of the FPC ontology is arranged at intervals with tin cream, described
The top of tin cream is equipped with IC and/or reinforcement, and the reinforcement and/or the top IC are coated with glue；The top of the glue is connected with
Another reinforcement；Another reinforcement is connect by glue with IC and/or reinforcement.
4. FPC structure according to claim 3, which is characterized in that IC and the reinforcement positioned at the two sides IC pass through tin cream and FPC
Ontology is connected as one.
5. FPC structure according to claim 4, which is characterized in that the reinforcement includes the first reinforcement and the second reinforcement, institute
It states Nian Jie by glue between the first reinforcement and second reinforcement.
6. FPC structure according to claim 5, which is characterized in that the side of first reinforcement by tin cream with it is described
The connection of FPC ontology, the setting of first reinforcement interval are equipped with IC between the first adjacent reinforcement, one end of IC by tin cream with
The other end of the connection of FPC ontology, IC is connect by glue with the second reinforcement.
7. FPC structure according to claim 6, which is characterized in that be spaced setting between first reinforcement.
8. FPC structure according to claim 5, which is characterized in that first reinforcement, the second reinforcement are steel disc.
9. FPC structure according to claim 8, which is characterized in that second reinforcement be attached to first reinforcement and
The top of the IC, the specification of second reinforcement are greater than the specification of first reinforcement.
10. according to FPC structure described in claim 5 to 9 any one, which is characterized in that second reinforcement, first are mended
By force, it is mutually adapted between IC, FPC ontology three.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910560475.9A CN110267454A (en) | 2019-06-26 | 2019-06-26 | A kind of FPC production technology and structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910560475.9A CN110267454A (en) | 2019-06-26 | 2019-06-26 | A kind of FPC production technology and structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110267454A true CN110267454A (en) | 2019-09-20 |
Family
ID=67921681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910560475.9A Pending CN110267454A (en) | 2019-06-26 | 2019-06-26 | A kind of FPC production technology and structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110267454A (en) |
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-
2019
- 2019-06-26 CN CN201910560475.9A patent/CN110267454A/en active Pending
Patent Citations (16)
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| TW200701329A (en) * | 2005-06-30 | 2007-01-01 | Advanced Semiconductor Eng | The substrate structure for embedded component and process thereof |
| CN203104942U (en) * | 2012-12-31 | 2013-07-31 | 广东欧珀移动通信有限公司 | A flexible printed circuit |
| CN203608444U (en) * | 2013-10-24 | 2014-05-21 | 江西合力泰科技股份有限公司 | FPC preventing IC from being damaged by static electricity |
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| CN205491423U (en) * | 2016-01-08 | 2016-08-17 | 昆山龙显电子有限公司 | Reinforcement structure of flexible line way board |
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