CN210469912U - FPC structure - Google Patents
FPC structure Download PDFInfo
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- CN210469912U CN210469912U CN201920985995.XU CN201920985995U CN210469912U CN 210469912 U CN210469912 U CN 210469912U CN 201920985995 U CN201920985995 U CN 201920985995U CN 210469912 U CN210469912 U CN 210469912U
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- Prior art keywords
- reinforcement
- fpc
- solder paste
- fpc body
- glue
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- 230000002787 reinforcement Effects 0.000 claims abstract description 101
- 239000003292 glue Substances 0.000 claims abstract description 22
- 229910000679 solder Inorganic materials 0.000 claims abstract description 20
- 229910000831 Steel Inorganic materials 0.000 claims description 9
- 239000010959 steel Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 230000001680 brushing effect Effects 0.000 abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 7
- 238000010030 laminating Methods 0.000 abstract description 7
- 238000003825 pressing Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Abstract
The utility model discloses a FPC production technology mainly includes following step: attaching the reinforcement and the IC to the FPC body by adopting SMT tin brushing; a reflow furnace; laminating another reinforcement to the reinforcement with the IC and the IC; pressing the reinforced FPC body by a quick press; and curing the FPC. A FPC structure comprises an FPC body, wherein solder paste is arranged on the upper portion of the FPC body at intervals, an IC and/or a reinforcement is arranged on the upper portion of the solder paste, and glue solution is coated on the upper portion of the reinforcement and/or the IC; the upper part of the glue solution is connected with another reinforcement; the other reinforcement is connected to the IC and/or the reinforcement by glue. By arranging the FPC body, solder paste is arranged on the upper part of the FPC body at intervals, an IC and/or a reinforcement is arranged on the upper part of the solder paste, and glue solution is coated on the reinforcement and/or the IC; the upper part of the glue solution is connected with another reinforcement; the other part is connected with the IC and/or the reinforcement through glue, so that a FPC structure with reliable connection between the reinforcement and the FPC body is formed.
Description
Technical Field
This technical scheme relates to flexible circuit board production technical field, specifically is a FPC structure.
Background
In the general FPC production process, when steel sheet reinforcement is pasted, an SMT (surface mount technology) is needed to weld IC (integrated circuit) components, then steel sheet reinforcement is pasted through another procedure, and then baking and curing are carried out. The FPC produced by the production method has small peeling strength between the reinforcement and the FPC body, and the reinforcement is easy to fall off from the FPC body, so that the FPC product has poor reliability and low efficiency.
Therefore, a new FPC production process and FPC structure are required to solve the above problems.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: a FPC production process and structure are provided, so that the problem of connection between reinforcement and an FPC body is solved.
The invention provides a technical scheme for solving the technical problem, which comprises the following steps: a FPC production process mainly comprises the following steps: attaching the reinforcement and the IC to the FPC body by adopting SMT tin brushing; a reflow furnace; laminating another reinforcement layer to the reinforcement of the IC and the IC; pressing the reinforced FPC body by a quick press; and curing the FPC.
As a modification of the above, in the course of performing lamination, the element and temperature were set to 180 degrees celsius, the pressure was set to 35kgf, and the press-bonding time was 300 s.
The beneficial technical effects of the invention are as follows: the reinforcement and the IC are attached to the FPC body by adopting SMT tin brushing; a reflow furnace; laminating another reinforcement to the reinforcement with the IC and the IC; pressing the reinforced FPC body by a quick press; and curing the FPC to form a method for solving the problem of connection between the reinforcement and the FPC body.
The invention also provides an FPC structure, which comprises an FPC body, wherein solder paste is arranged at intervals on the upper part of the FPC body, an IC and/or a reinforcement is arranged on the upper part of the solder paste, and glue solution is coated on the upper part of the reinforcement and/or the IC; the upper part of the glue solution is connected with another reinforcement; the other reinforcement is connected to the IC and/or the reinforcement by glue.
As an improvement of the scheme, the IC and the reinforcements positioned at two sides of the IC are connected with the FPC body into a whole through solder paste.
As a further improvement of the above scheme, the reinforcement includes a first reinforcement and a second reinforcement, and the first reinforcement and the second reinforcement are bonded by glue.
As a further improvement of the scheme, one side of the first reinforcement is connected with the FPC body through solder paste, the first reinforcements are arranged at intervals, an IC is arranged between the adjacent first reinforcements, one end of the IC is connected with the FPC body through solder paste, and the other end of the IC is connected with the second reinforcement through glue solution.
As a further improvement of the scheme, the first reinforcements are arranged at intervals.
As a further improvement of the above aspect, the first reinforcement and the second reinforcement are both steel sheets.
As a further improvement of the above aspect, the second reinforcement is attached to an upper portion of the first reinforcement and the IC, and a dimension of the second reinforcement is larger than a dimension of the first reinforcement.
As a further improvement of the scheme, the second reinforcement, the first reinforcement, the IC and the FPC body are mutually matched.
The beneficial technical effects of the invention are as follows: by arranging the FPC body, solder paste is arranged on the upper part of the FPC body at intervals, an IC and/or a reinforcement is arranged on the upper part of the solder paste, and glue solution is coated on the reinforcement and/or the IC; the upper part of the glue solution is connected with another reinforcement; the other reinforcement is connected with the IC and/or the reinforcement through glue solution to form an FPC structure with reliable connection between the reinforcement and the FPC body.
Drawings
In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below.
FIG. 1 is a flow chart of the FPC production process of the present invention;
FIG. 2 is a schematic structural diagram of an FPC structure according to an embodiment of the present invention.
Detailed Description
The conception, the specific structure and the technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the schemes and the effects of the present invention. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. Furthermore, the descriptions of the upper, lower, left, right, etc. used in the present invention are only relative to the positional relationship of the components of the present invention with respect to each other in the drawings.
FIG. 1 is a flow chart of the FPC production process of the present invention, referring to FIG. 1, an FPC production process mainly includes the following steps, reinforcing and IC are attached to an FPC body by SMT tin brushing, and the reinforcing protects the IC; then laminating another reinforcement over the reinforcement with the IC and the IC through a reflow oven; then pressing the reinforced and FPC body by a fast press, and finally curing the FPC to form the FPC production process with reliable connection of the reinforced and FPC body.
Preferably, in the laminating process of the reinforcement and the FPC body, the pressing temperature is set to be 180 ℃, the pressure is set to be 35kgf, and the pressing time is set to be 300S, so that the bonding reliability of the reinforcement and the FPC body in the laminating process is guaranteed.
More ICs and reinforcements are simultaneously attached to the FPC body through SMT tin brushing, compared with the traditional method that the reinforcements and the ICs are separately attached, the method reduces the steps of the process flow, and can obviously improve the production efficiency of the flexible circuit board.
In one embodiment, the peeling strength between the reinforcement and the FPC body is only 0.6kg/cm by adopting a traditional gluing process, and the peeling strength reaches more than 5.0kg/cm by adopting an SMT tin brushing mode to attach the steel sheet reinforcement, so that the bonding force between the steel sheet reinforcement and the FPC is greatly enhanced.
When more IC components are pressure-sensitive components, glue can not be dispensed in the process of assembling the pasting component, otherwise, the IC function is invalid, but the IC must be protected by reinforcement.
Fig. 2 is a schematic structural view of an embodiment of the FPC structure of the present invention, and referring to fig. 2, the FPC structure includes an FPC body 10, solder pastes 20 are disposed at intervals on an upper portion of the FPC body 10, two first reinforcements 31 are symmetrically disposed on a top of the solder paste 20, an IC (integrated circuit)40 is disposed between the first reinforcements 31, and the first reinforcements 31 and the IC40 are attached to an upper surface of the FPC by SMT solder brushing. The glue solution 50 is coated on the upper parts of the first reinforcement 31 and the IC40, the second reinforcement 60 is arranged on the upper part of the glue solution 50, and the second reinforcement 60 is attached and connected with the upper surfaces of the first reinforcement 31 and the IC 40. Compared with the traditional method of attaching a steel sheet to the lower surface of the FPC body 10 and connecting the IC to the upper surface of the FPC body 10 through the solder paste 20, the technical scheme of the invention has strong protection on the IC, so that the FPC structure has better stability and reliability. The first reinforcement 31 and the second reinforcement 60 are preferably made of steel sheets, so that the steel sheets are reliable and firm and have good strength.
According to the technical scheme, the reinforcement and the IC are attached to the FPC body by adopting SMT tin brushing; a reflow furnace; laminating another reinforcement to the reinforcement with the IC and the IC; pressing the reinforced FPC body by a quick press; and curing the FPC to form an FPC production process and an FPC structure which are used for reliably connecting the reinforcement and the FPC body and ensuring the safe and stable work of the IC on the FPC body.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. The FPC structure is characterized by comprising an FPC body, wherein solder paste is arranged on the upper part of the FPC body at intervals, an IC and/or a reinforcement is arranged on the upper part of the solder paste, and glue solution is coated on the upper part of the reinforcement and/or the IC; the upper part of the glue solution is connected with another reinforcement; the other reinforcement is connected to the IC and/or the reinforcement by glue.
2. The FPC structure of claim 1, wherein the IC and the reinforcement at both sides of the IC are integrally connected to the FPC body by solder paste.
3. The FPC structure of claim 2, wherein the reinforcement includes a first reinforcement and a second reinforcement, and the first reinforcement is bonded to the second reinforcement by a glue.
4. The FPC structure of claim 3, wherein one side of the first reinforcements is connected with the FPC body through solder paste, the first reinforcements are arranged at intervals, an IC is arranged between the adjacent first reinforcements, one end of the IC is connected with the FPC body through solder paste, and the other end of the IC is connected with the second reinforcement through glue solution.
5. The FPC structure of claim 4, wherein the first reinforcements are spaced apart.
6. The FPC structure of claim 3, wherein the first and second reinforcements are steel sheets.
7. The FPC structure of claim 6, wherein the second reinforcement is attached to the first reinforcement and an upper portion of the IC, the second reinforcement having a gauge size larger than a gauge size of the first reinforcement.
8. The FPC structure of any one of claims 3 to 7, wherein the second reinforcement, the first reinforcement, the IC, and the FPC body are mutually matched.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920985995.XU CN210469912U (en) | 2019-06-26 | 2019-06-26 | FPC structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920985995.XU CN210469912U (en) | 2019-06-26 | 2019-06-26 | FPC structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210469912U true CN210469912U (en) | 2020-05-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920985995.XU Active CN210469912U (en) | 2019-06-26 | 2019-06-26 | FPC structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN210469912U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110267454A (en) * | 2019-06-26 | 2019-09-20 | 深圳市新宇腾跃电子有限公司 | A kind of FPC production technology and structure |
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2019
- 2019-06-26 CN CN201920985995.XU patent/CN210469912U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110267454A (en) * | 2019-06-26 | 2019-09-20 | 深圳市新宇腾跃电子有限公司 | A kind of FPC production technology and structure |
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