CN106455305A - Rigid-flexible plate with reinforced flexible area and production method thereof - Google Patents
Rigid-flexible plate with reinforced flexible area and production method thereof Download PDFInfo
- Publication number
- CN106455305A CN106455305A CN201611046200.6A CN201611046200A CN106455305A CN 106455305 A CN106455305 A CN 106455305A CN 201611046200 A CN201611046200 A CN 201611046200A CN 106455305 A CN106455305 A CN 106455305A
- Authority
- CN
- China
- Prior art keywords
- rigid
- central layer
- flexible
- combined board
- flex combined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Abstract
The invention discloses a rigid-flexible plate with reinforced flexible area and a production method thereof. The rigid-flexible plate comprises a rigid core plate, a flexible core plate, an adhesive PP sheets, covering film and reinforcing material; the covering film is adhered to at least part of the surface of the flexible core plate, upper and lower surfaces of the flexible core plate are connected to the rigid core plate respectively through the adhesive PP sheets, a cavity is formed between the flexible core plate and the rigid core plate, the flexible core plate at least comprises a welding pad, and the reinforcing material is adhered to one side of the welding pad; the problem is solved that since a common rigid-flexible plate has holes and pads required for assembly and welding and designed only in the rigid area and is only provided in the flexible area with a connection circuit only for electrical connection, the assembly needs of different modules cannot be met.
Description
Technical field
The present invention relates to rigid-flex combined board field, the more particularly to a kind of rigid-flex combined board of flexibility zone reinforcement and its preparation
Method.
Background technology
Rigid-flex combined board is not a kind of ordinary circuit board, as the term suggests, be combining for soft board and hardboard, be by lamelliform
Flexible bottom and rigid bottom combine, then be laminated in a single component, the circuit board of formation.Rigid-flex combined board volume
Little, lightweight, achievable stereoscopic three-dimensional is installed and has high connecting reliability, is widely used in consumer electronics product, communication
The fields such as industry, automobile industry, military aircraft, radar, guided missile, play the part of more and more important role in printed circuit board field.
The design of common rigid-flex combined board is mainly made up of " rigid region+flexible region+rigid region ", needs hole and the pad of follow-up assembly welding
Only design is in rigid region, and the circuit of connection is only designed in flexible region, only plays electrical connection.With the development of electronic equipment,
For meeting the group reload request of disparate modules, it is desirable to which electrical connection is not only played in the flexible region of rigid-flex combined board, it is also desirable to set
Corresponding hole and pad is counted, to meet follow-up welding requirements, while iff only flexible layers are designed, because flexible layers are relatively thin,
Intensity is insufficient for force request when welding, so weld zone that need to be in flexible layers increases supporting material, increases thickness
With compressive resistance ability, welding requirements is met.
Content of the invention
The technical problem to be solved is to provide rigid-flex combined board and its preparation side of a kind of zone reinforcement of flexibility
Method, solves in common rigid-flex combined board, and which needs the hole of follow-up assembly welding and pad only to design in rigid region, and flexible region is only
The circuit of design connection, only plays electrical connection, it is impossible to meet the problem of the group reload request of disparate modules.
For achieving the above object, the present invention provides following technical scheme：A kind of rigid-flex combined board of flexibility zone reinforcement,
The rigid-flex combined board includes rigid central layer, flexible central layer, bonding PP piece, coverlay and supporting material；The flexibility central layer
Surface is at least partly pasted with the coverlay, the upper and lower surface of the flexibility central layer respectively by the bonding PP piece with described
Rigid central layer connection so that be formed with cavity between the flexibility central layer and the rigid central layer, the flexibility central layer is at least wrapped
Welded disc is included, the one side of the welded disc is bonded with the supporting material.
Preferably, the supporting material is PI supporting material, FR4 supporting material or steel disc supporting material.
Preferably, in the one side for not being bonded with the supporting material in the welded disc, auxiliary spacer is fixed with.
Preferably, the auxiliary spacer is Heat Conduction Material.
Preferably, the Heat Conduction Material is politef or silica gel material.
Present invention also offers a kind of preparation method of rigid-flex combined board, the preparation method includes：
(1) rigid central layer, flexible central layer, bonding PP piece, coverlay and supporting material are provided；
(2) route being completed on the flexibility central layer to make and hole metallization flow process, then pastes epiphragma on its surface, patch
During film, the pad on the flexibility central layer is exposed, then bonding and reinforcing material on pad；
(3) route making is completed on the rigid central layer, afterwards with bonding PP piece, has pasted the flexible central layer of supporting material
Overlap successively, and be laminated, form rigid-flex combined board；
(4) carry out on obtained rigid-flex combined board drilling, hole metallization, graphic making and print welding resistance flow process, and complete
Lid is taken off, exposes flexible region, then the pad of rigid region, flexible region is surface-treated, after removing garbage area, be finally fabricated to and scratch
The rigid-flex combined board of property zone reinforcement.
Preferably, after described in step (2), supporting material is bonded on the pad, need to be pressed with fast press, wherein,
The pressing pressure is 120-150kg/cm2, it is 180-300s that the pressing-in temp is 170-190 DEG C, the pressing time.
Preferably, need to be toasted after the pressing, the temperature of the baking is 100-130 DEG C, the time of the baking
For 1-2h.
Present invention also offers the preparation method of another rigid-flex combined board, the preparation method includes：
(1) rigid central layer, flexible central layer, bonding PP piece, coverlay and supporting material are provided；
(2) route being completed on the flexibility central layer to make and hole metallization flow process, then pastes epiphragma on its surface, patch
During film, the pad on the flexibility central layer is exposed；
(3) complete route making on the rigid central layer, afterwards with bonding PP piece, process in step (2) after flexibility
Central layer is overlapped successively, and is laminated, and forms rigid-flex combined board；
(4) supporting material is pre-machined into required form, and is fixed on the pad of the flexibility central layer, use
Fast press compression reinforcement, after the completion of remove other garbage areas after form the rigid-flex combined board of flexible zone reinforcement.
The invention provides a kind of rigid-flex combined board of flexible zone reinforcement and preparation method thereof, the method includes to provide just
Property central layer, flexible central layer, bonding PP piece, coverlay and supporting material；Route is completed on the flexibility central layer to make and Kong Jin
Categoryization flow process, then pastes epiphragma on its surface, exposes the pad on the flexibility central layer, then glue on pad during pad pasting
Connect supporting material；Route making is completed on the rigid central layer, afterwards with bonding PP piece, has pasted the flexible central layer of supporting material
Overlap successively, and be laminated, form rigid-flex combined board；Carry out on obtained rigid-flex combined board drilling, hole metallization, graphic making
With print welding resistance flow process, and complete lid is taken off, expose flexible region, then the pad of rigid region, flexible region is surface-treated, remove and give up
Behind material area, the rigid-flex combined board of flexible zone reinforcement is finally fabricated to, wherein supporting material can also be suppressed in rigid-flex combined board
After the completion of carry out bonding.The rigid-flex combined board that the present invention is provided not only can meet the assembling of rigid-flex combined board multiple module will
Ask, and can ensure that the reinforcement of flexible region patch will not fall off, meet follow-up welding assembly and require.
Description of the drawings
Fig. 1 is the structural representation of the rigid-flex combined board of the flexible zone reinforcement that the present invention is provided.
Wherein, 1 rigid central layer, 2 flexible central layers, 3 bonding PP pieces, 4 coverlays, 5 supporting materials.
Mode is specifically applied
The preferred embodiment of the present invention is described in detail below in conjunction with the accompanying drawings.
The invention provides a kind of flexibility zone reinforcement rigid-flex combined board, the rigid-flex combined board include rigid central layer 1,
Flexible central layer 2, bonding PP piece 3, coverlay 4 and supporting material 5；The surface of the flexibility central layer 2 is at least partly pasted with described
Coverlay 4, the upper and lower surface of the flexibility central layer 2 is connected with the rigid central layer 1 by the bonding PP piece 3 respectively so that
Cavity is formed between the flexibility central layer 2 and the rigid central layer 1, the flexibility central layer 2 at least includes welded disc, described
The one side of welded disc is bonded with the supporting material 5.
Wherein, the supporting material 5 is PI supporting material, FR4 supporting material or steel disc supporting material, in the welded disc
Auxiliary spacer is fixed with the one side for not being bonded with the supporting material 5, the auxiliary spacer is Heat Conduction Material, the heat conduction material
Expect for politef or silica gel material.
When the thickness of reinforcement thickness ＜ cavity, the first flow process following is selected：The preparation method includes：1 provides just
Property central layer, flexible central layer, bonding PP piece, coverlay and supporting material；2 complete route on the flexibility central layer makes and Kong Jin
Categoryization flow process, then pastes epiphragma on its surface, exposes the pad on the flexibility central layer, then glue on pad during pad pasting
Connect supporting material；3 complete route making on the rigid central layer, afterwards with bonding PP piece, have pasted the flexible core of supporting material
Plate is overlapped successively, and is laminated, and forms rigid-flex combined board；4 carry out on obtained rigid-flex combined board drilling, hole metallization, figure
Make and print welding resistance flow process, and complete lid is taken off, expose flexible region, then the pad of rigid region, flexible region is surface-treated, goes
After garbage area, the rigid-flex combined board of flexible zone reinforcement is finally fabricated to.
Wherein, after supporting material described in step 2 is bonded on the pad, need to be pressed with fast press, wherein, described
Pressing pressure is 120-150kg/cm2, it is 180-300s that the pressing-in temp is 170-190 DEG C, the pressing time, the pressure
Need after conjunction to be toasted, the temperature of the baking is 100-130 DEG C, the time of the baking is 1-2h.
When the thickness of reinforcement thickness >=cavity, following second flow process is selected：
The preparation method includes：1 provides rigid central layer, flexible central layer, bonding PP piece, coverlay and supporting material；2
Route being completed on the flexibility central layer to make and hole metallization flow process, then epiphragma is pasted on its surface, scratch described during pad pasting
Pad on property central layer exposes；3 complete on the rigid central layer route making, afterwards with bonding PP piece, step 2 process after
Flexible central layer overlap successively, and be laminated, form rigid-flex combined board；The supporting material is pre-machined into required form by 4, and
Be fixed on described flexibility central layer pad on, using fast press compress reinforcement, after the completion of remove other garbage areas after i.e. formed scratch
The rigid-flex combined board of property zone reinforcement.
The pluses and minuses of two kinds of flow processs such as following table：
Above-described is only the preferred embodiment of the present invention, it is noted that for one of ordinary skill in the art
For, without departing from the concept of the premise of the invention, some deformation can also be made and improved, these belong to the present invention
Protection domain.
Claims (9)
1. a kind of flexibility zone reinforcement rigid-flex combined board, it is characterised in that the rigid-flex combined board include rigid central layer (1),
Flexible central layer (2), bonding PP piece (3), coverlay (4) and supporting material (5)；
The surface of flexibility central layer (2) is at least partly pasted with the coverlay (4), the upper following table of flexibility central layer (2)
Face is connected with rigid central layer (1) by bonding PP piece (3) respectively so that flexibility central layer (2) and the rigidity
Central layer is formed with cavity between (1), and flexibility central layer (2) at least includes welded disc, and the one side of the welded disc is bonded with
Supporting material (5).
2. rigid-flex combined board according to claim 1, it is characterised in that described supporting material (5) be PI supporting material,
FR4 supporting material or steel disc supporting material.
3. rigid-flex combined board according to claim 1, it is characterised in that be not bonded with the reinforcing material in the welded disc
Auxiliary spacer is fixed with the one side of material (5).
4. rigid-flex combined board according to claim 3, it is characterised in that the auxiliary spacer be.
5. rigid-flex combined board according to claim 4, it is characterised in that the Heat Conduction Material is politef or silica gel
Material.
6. a kind of preparation method of rigid-flex combined board, it is characterised in that the preparation method includes：
(1) rigid central layer, flexible central layer, bonding PP piece, coverlay and supporting material are provided；
(2) route being completed on the flexibility central layer to make and hole metallization flow process, then pastes epiphragma on its surface, during pad pasting
Pad on the flexibility central layer is exposed, then bonding and reinforcing material on pad；
(3) complete on the rigid central layer route making, afterwards with bonding PP piece, the flexible central layer for having pasted supporting material successively
Overlapping, and be laminated, form rigid-flex combined board；
(4) carry out on obtained rigid-flex combined board drilling, hole metallization, graphic making and print welding resistance flow process, and complete to take off lid,
Expose flexible region, then the pad of rigid region, flexible region is surface-treated, after removing garbage area, be finally fabricated to flexible region
Rigid-flex combined board with reinforcement.
7. preparation method according to claim 6, it is characterised in that described in step (2), supporting material is bonded in institute
After stating on pad, need to be pressed with fast press, wherein, the pressing pressure is 120-150kg/cm2, the pressing-in temp is 170-
190 DEG C, the pressing time is 180-300s.
8. preparation method according to claim 7, it is characterised in that need to be toasted after the pressing, the baking
Temperature is 100-130 DEG C, and the time of the baking is 1-2h.
9. the preparation method of rigid-flex combined board according to claim 6, it is characterised in that the preparation method includes：
(1) rigid central layer, flexible central layer, bonding PP piece, coverlay and supporting material are provided；
(2) route being completed on the flexibility central layer to make and hole metallization flow process, then pastes epiphragma on its surface, during pad pasting
Pad on the flexibility central layer is exposed；
(3) complete route making on the rigid central layer, afterwards with bonding PP piece, process in step (2) after flexible central layer
Overlap successively, and be laminated, form rigid-flex combined board；
(4) supporting material is pre-machined into required form, and is fixed on the pad of the flexibility central layer, pressed using fast
Machine compresses reinforcement, after the completion of remove the rigid-flex combined board for forming flexible zone reinforcement after other garbage areas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611046200.6A CN106455305A (en) | 2016-11-22 | 2016-11-22 | Rigid-flexible plate with reinforced flexible area and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611046200.6A CN106455305A (en) | 2016-11-22 | 2016-11-22 | Rigid-flexible plate with reinforced flexible area and production method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106455305A true CN106455305A (en) | 2017-02-22 |
Family
ID=58218131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611046200.6A Pending CN106455305A (en) | 2016-11-22 | 2016-11-22 | Rigid-flexible plate with reinforced flexible area and production method thereof |
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| CN (1) | CN106455305A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106852031A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of mixed-compression board of three layers of HDI plates and aluminium base and preparation method thereof |
| CN113939075A (en) * | 2021-09-24 | 2022-01-14 | 珠海杰赛科技有限公司 | Rigid-flex board for improving color change of brown oxide layer of multi-layer flexible core board and manufacturing method thereof |
| CN115038244A (en) * | 2022-05-06 | 2022-09-09 | 江门崇达电路技术有限公司 | Method for improving steel sheet reinforcing and laminating process of rigid-flex combined plate |
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| JP2006173477A (en) * | 2004-12-17 | 2006-06-29 | Fujikura Ltd | Rigid flex multilayer printed circuit board and its manufacturing method |
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| CN206402513U (en) * | 2016-11-22 | 2017-08-11 | 珠海杰赛科技有限公司 | A kind of rigid-flex combined board of flexible region with reinforcement |
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2016
- 2016-11-22 CN CN201611046200.6A patent/CN106455305A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006173477A (en) * | 2004-12-17 | 2006-06-29 | Fujikura Ltd | Rigid flex multilayer printed circuit board and its manufacturing method |
| CN101330805A (en) * | 2007-06-18 | 2008-12-24 | 比亚迪股份有限公司 | Method for preparing firm flexible printed board |
| CN103687284A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Rigidity-flexibility combined circuit board of flying-tail structure and manufacturing method thereof |
| CN104507260A (en) * | 2014-12-16 | 2015-04-08 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flexible board with reinforce panel |
| CN206402513U (en) * | 2016-11-22 | 2017-08-11 | 珠海杰赛科技有限公司 | A kind of rigid-flex combined board of flexible region with reinforcement |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106852031A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of mixed-compression board of three layers of HDI plates and aluminium base and preparation method thereof |
| CN113939075A (en) * | 2021-09-24 | 2022-01-14 | 珠海杰赛科技有限公司 | Rigid-flex board for improving color change of brown oxide layer of multi-layer flexible core board and manufacturing method thereof |
| CN113939075B (en) * | 2021-09-24 | 2023-01-03 | 珠海杰赛科技有限公司 | Rigid-flex board for improving color change of brown oxide layer of multi-layer flexible core board and manufacturing method thereof |
| CN115038244A (en) * | 2022-05-06 | 2022-09-09 | 江门崇达电路技术有限公司 | Method for improving steel sheet reinforcing and laminating process of rigid-flex combined plate |
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