CN210469869U - Circuit board of low-cost aluminium preparation circuit - Google Patents
Circuit board of low-cost aluminium preparation circuit Download PDFInfo
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- CN210469869U CN210469869U CN201921620810.1U CN201921620810U CN210469869U CN 210469869 U CN210469869 U CN 210469869U CN 201921620810 U CN201921620810 U CN 201921620810U CN 210469869 U CN210469869 U CN 210469869U
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- circuit
- pad
- circuit board
- paste
- foil
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Abstract
A circuit board of low-cost aluminium preparation circuit, including the circuit board body, the said circuit board body includes the base plate, insulating glue layer, aluminium foil circuit and pad, the insulating glue layer that at least one side of the base plate is coated with, the glue layer of insulating glue bonds the aluminium foil circuit, the aluminium foil circuit prints the conductive paste or presses the metal foil with conductive adhesive in the area of the pad needing to weld or weld the metal foil on the pad position of the aluminium foil circuit and form the pad that can be soldered directly with the tin with the ultrasonic equipment, one does not have solder mask, two do not need pad cover the weldable substance again, the pad that can be soldered has been obtained directly, the structure is greatly simplified; the preparation method is greatly simplified, and because the aluminum and the conventional solder paste can not be welded, the short circuit phenomenon caused by welding the solder paste to a circuit is avoided; firstly, need not to cover printing ink or plastic film at the circuit layer and form the solder mask, secondly need not to cover the material that can weld in the pad position, shortened production cycle greatly and practiced thrift manufacturing cost.
Description
Technical Field
The utility model relates to a circuit board technical field, in particular to circuit board of low-cost aluminium preparation circuit.
Background
The existing circuit board comprises a base material, an insulating glue layer, a circuit layer, a solder mask layer and a welding pad layer, and is realized through the following processes: 1. the base material and the aluminum foil are bonded together through the insulating glue to form the base material; 2. forming a circuit layer on the aluminum foil surface of the substrate; 3. reserving a region needing to be welded with components to form a pad layer when the circuit layer covers the solder mask layer; 4. and covering the circuit layer with ink or a plastic film to form a solder mask layer. Therefore, in the preparation process, a solder mask layer is required to be manufactured, a position of a welding pad is required to be covered with a weldable substance, the solder mask layer is manufactured at least through the following steps of firstly manufacturing a solder mask silk-screen printing plate, then silk-screening solder mask ink, and finally drying the solder mask ink to obtain the solder mask layer; in addition, the circuit board with aluminum circuit has the difficulty of difficult soldering.
Because the solder mask layer is required to be manufactured on the aluminum circuit board, the position of the bonding pad is required to be covered with the weldable substance, the structure is complex, and the manufacturing cost is increased.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to prior art not enough, provide a circuit board of low-cost aluminium preparation circuit, not only can soldering tin, still saved the solder mask, optimized the structure, the cost is reduced.
In order to solve the above problem, the utility model provides a following technical scheme:
the utility model provides a circuit board of low-cost aluminium preparation circuit, includes the circuit board body, the circuit board body includes base plate, insulating glue layer, aluminium foil line and pad, the at least one side coating of base plate have the insulating glue layer, it has the aluminium foil line to bond on the insulating glue layer, the aluminium foil line has the metal forming of conducting resin or directly welds the metal forming at aluminium foil line pad position with ultrasonic equipment at the regional printing conducting paste of pad that needs the welded or pressfitting and form the pad that can soldering tin.
Specifically, the substrate is a soft substrate or a hard substrate.
Specifically, the soft substrate is any one of a PI film, a PET film, and a PVC film.
Specifically, the hard substrate is any one of an aluminum plate, a glass fiber plate and a copper plate.
Specifically, the metal foil is any one of copper foil, nickel foil and tin foil
Specifically, the aluminum foil circuit is manufactured by any one of etching, die cutting and laser.
Specifically, the conductive paste is any one of conductive copper paste, conductive silver paste, conductive nickel paste, conductive carbon paste and conductive graphene paste.
The preparation method of the circuit board with the low-cost aluminum manufacturing circuit comprises the following steps:
step 1, manufacturing a base material: bonding the substrate and the aluminum foil together through an insulating glue layer to manufacture a base material;
step 2: manufacturing an aluminum foil circuit: then, the base material is processed into an aluminum foil circuit by any one of etching, die cutting and laser;
and step 3: after the aluminum foil circuit is obtained, the aluminum foil circuit is printed with conductive paste in a pad area needing to be welded, or metal foil with conductive adhesive is pressed, or the metal foil is directly welded at the pad position of the aluminum foil circuit by ultrasonic equipment to form a pad capable of soldering tin.
Specifically, in step 3, the manufacturing steps of the bonding pad are as follows: firstly, making a printing stencil into a pad shape, then printing conductive slurry capable of being welded at the pad position of an aluminum foil circuit, and finally drying at 180 ℃ to form the pad capable of being soldered.
Specifically, in step 3, the manufacturing steps of the bonding pad are as follows: firstly, the metal foil with conductive adhesive is processed into the shape of a bonding pad in advance, and then is pressed and sealedThe machine is at 180 ℃ and the pressure is 10kg/cm2Pressing under the condition of (1), and finally forming a soldering tin-soldering bonding pad at the position of the aluminum foil circuit bonding pad.
Specifically, in step 3, the manufacturing steps of the bonding pad are as follows: firstly, metal foil is processed into a pad shape in advance, and then ultrasonic equipment is used for directly welding the metal foil at the pad position of an aluminum foil circuit to form a pad capable of soldering tin.
Has the advantages that: the utility model discloses a circuit board of low-cost aluminium preparation circuit, it has the metallic foil of conducting resin or pressfitting to directly weld the metallic foil in aluminium foil circuit pad position formation soldering tin's pad to need the welded pad region printing conductive paste or pressfitting at aluminium foil circuit, compare with current circuit board, one does not have the solder mask, two need not the pad again cover the material that can weld, directly obtained the pad that can solder tin, the structure is greatly simplified, and the difficult technical problem of soldering tin of the circuit board of aluminium preparation circuit has been solved moreover;
meanwhile, the preparation method is greatly simplified, and because the aluminum and the conventional solder paste cannot be welded, the short circuit phenomenon caused by the fact that the solder paste is welded on a circuit is avoided; the utility model discloses a plurality of process steps have been omitted to the preparation method, firstly, need not to cover printing ink or plastic film at the circuit layer and form the solder mask, secondly, need not to cover the material that can weld in the pad position, production cycle has been shortened greatly and manufacturing cost has been practiced thrift, replace copper foil preparation circuit with the aluminium foil, both reduced raw and other materials cost and solved the soldering tin problem, today that copper price rises day by day, for the cost is reduced of enterprise, economic benefits has been improved, can produce the single face of aluminium system circuit, and is two-sided, multilayer flexible line way board or rigid line way board, and wide application, and the economic value who is showing has.
Drawings
Fig. 1 is a schematic structural view of a double-sided circuit board of the present invention;
fig. 2 is a schematic structural diagram of a single-sided circuit board of the present invention;
Detailed Description
The following detailed description of the embodiments of the present invention is made with reference to the drawings and the accompanying examples:
example 1
Referring to fig. 1-2 a circuit board of low-cost aluminium preparation circuit that shows, including circuit board body 1, circuit board body 1 includes base plate 2, insulating glue layer 3, aluminium foil line 4 and pad 5, the at least one side coating of base plate 2 have insulating glue layer 3, it has aluminium foil line 4 to bond on the insulating glue layer 3, aluminium foil line 4 is in the regional printing electrically conductive thick liquids of pad that needs the welding pad and is formed the pad that can soldering tin.
The conductive paste is any one of conductive copper paste, conductive silver paste, conductive nickel paste, conductive carbon paste and conductive graphene paste, a soldering pad capable of soldering is formed in a mode of directly printing the conductive paste in a pad area, a traditional solder mask layer is omitted, a process for manufacturing the solder mask layer is omitted, the structure is optimized, the process is simplified, the production cost can be saved by more than 20%, the conductive copper paste, the conductive silver paste, the conductive nickel paste, the conductive carbon paste and the conductive graphene paste have excellent soldering tin performance, and the technical problem that soldering tin is difficult to perform on an aluminum manufacturing line is solved.
Specifically, the substrate is a soft substrate, and the soft substrate is any one of a PI film, a PET film and a PVC film.
Specifically, the aluminum foil circuit is manufactured by any one of etching, die cutting and laser.
The preparation method of the circuit board with the low-cost aluminum manufacturing circuit comprises the following steps:
step 1, manufacturing a base material: the substrate 2 and the aluminum foil are bonded together through the insulating glue layer 3 to manufacture a base material;
step 2: manufacturing an aluminum foil circuit: then, the base material is processed into an aluminum foil circuit 4 by any one of etching, die cutting and laser;
and step 3: after the aluminum foil circuit is obtained, the aluminum foil circuit 4 is printed with conductive paste in the area of the bonding pad to be welded to form a soldering pad capable of being soldered.
Specifically, in step 3, the manufacturing steps of the bonding pad are as follows: firstly, making a printing stencil into a pad shape, then printing conductive slurry capable of being welded at the pad position of an aluminum foil circuit, and finally drying at 180 ℃ to form the pad capable of being soldered.
Example 2
Referring to fig. 1 to 2, the circuit board with low-cost aluminum production lines comprises a circuit board body 1, wherein the circuit board body 1 comprises a substrate 2, an insulating glue layer 3, an aluminum foil line 4 and a bonding pad 5, the insulating glue layer 3 is coated on at least one surface of the substrate 2, and the aluminum foil line is pressed on a bonding pad area needing to be welded to form a bonding pad capable of soldering tin with metal foil with conductive adhesive.
Specifically, the substrate is a hard substrate, and the hard substrate is any one of an aluminum plate, a glass fiber plate and a copper plate.
Specifically, the aluminum foil circuit is manufactured by any one of etching, die cutting and laser.
The preparation method of the circuit board with the low-cost aluminum manufacturing circuit comprises the following steps:
step 1, manufacturing a base material: the substrate 2 and the aluminum foil are bonded together through the insulating glue layer 3 to manufacture a base material;
step 2: manufacturing an aluminum foil circuit: then, the base material is processed into an aluminum foil circuit 4 by any one of etching, die cutting and laser;
and step 3: and after the aluminum foil circuit is obtained, the aluminum foil circuit 4 is laminated with the metal foil with the conductive adhesive in the area of the bonding pad to be welded to form the bonding pad capable of soldering tin.
Specifically, in step 3, the manufacturing steps of the bonding pad are as follows: firstly, metal foil with conductive adhesive is processed into a bonding pad shape in advance, and then a pressing machine is used for pressing at 180 ℃ and under the pressure of 10kg/cm2Pressing under the condition of (1), and finally forming a soldering tin-soldering bonding pad at the position of the aluminum foil circuit bonding pad. After pressing, the bonding pad is firmly combined with the aluminum foil circuit, no matter the substrate is a hard substrate or a soft substrate, the bonding pad is pressed instantly under high temperature and high pressure, the deformation is less than three ten thousand, and the bonding pad is pressed physicallyThe welding pad is formed in a mode, a traditional solder mask layer and a process for manufacturing the solder mask layer are omitted, the structure is optimized, the process is simplified, and the production cost can be saved by more than 20%.
Example 3
Referring to fig. 1-2, a circuit board of low-cost aluminium preparation circuit that shows, including circuit board body 1, circuit board body 1 includes base plate 2, insulating glue layer 3, aluminium foil circuit 4 and pad 5, at least one side coating of base plate 2 has insulating glue layer 3, directly welds metal foil at aluminium foil circuit pad position with ultrasonic equipment and forms pad 5 that can soldering tin.
Specifically, the substrate is a soft substrate, and the soft substrate is any one of a PI film, a PET film and a PVC film.
Specifically, the aluminum foil circuit is manufactured by any one of etching, die cutting and laser.
The preparation method of the circuit board with the low-cost aluminum manufacturing circuit comprises the following steps:
step 1, manufacturing a base material: the substrate 2 and the aluminum foil are bonded together through the insulating glue layer 3 to manufacture a base material;
step 2: manufacturing an aluminum foil circuit: then, the base material is processed into an aluminum foil circuit 4 by any one of etching, die cutting and laser;
and step 3: and after the aluminum foil circuit is obtained, the aluminum foil circuit 4 is laminated with the metal foil with the conductive adhesive in the area of the bonding pad to be welded to form the bonding pad capable of soldering tin.
Specifically, in step 3, the manufacturing steps of the bonding pad are as follows: firstly, metal foil is processed into a pad shape in advance, and then ultrasonic equipment is used for directly welding the metal foil at the pad position of an aluminum foil circuit to form a pad capable of soldering tin. The ultrasonic wave is used for rubbing the surface of a workpiece and high-frequency vibration between molecules for tens of thousands of times per second, then certain pressure is applied, so that the metal surfaces rub with each other to form fusion between molecular layers, the purpose of welding is achieved, a welding pad is formed in an ultrasonic welding mode, a traditional solder mask layer and a process for manufacturing the solder mask layer are omitted, the structure is optimized, the process is simplified, and the production cost can be saved by more than 20%.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (7)
1. The utility model provides a circuit board of low-cost aluminium preparation circuit, includes the circuit board body, its characterized in that: the circuit board body includes base plate, insulating glue layer, aluminium foil circuit and pad, the at least one side coating of base plate have insulating glue layer, it has the aluminium foil circuit to bond on the insulating glue layer, the aluminium foil circuit has the metal forming of conducting resin or directly welds the metal forming in aluminium foil circuit pad position with ultrasonic equipment at the regional printing conducting paste of pad that needs the welded or pressfitting and form the pad that can soldering tin.
2. The circuit board of low-cost aluminum wiring according to claim 1, characterized in that: the substrate is a soft substrate or a hard substrate.
3. A low-cost aluminum wiring circuit board as claimed in claim 2, wherein: the soft substrate is any one of a PI film, a PET film and a PVC film.
4. A low-cost aluminum wiring circuit board as claimed in claim 2, wherein: the hard substrate is any one of an aluminum plate, a glass fiber plate and a copper plate.
5. The circuit board of low-cost aluminum wiring according to claim 1, characterized in that: the metal foil is any one of copper foil, nickel foil and tin foil.
6. The circuit board of low-cost aluminum wiring according to claim 1, characterized in that: the aluminum foil circuit is manufactured in any one of etching, die cutting and laser modes.
7. The circuit board of low-cost aluminum wiring according to claim 1, characterized in that: the conductive paste is any one of conductive copper paste, conductive silver paste, conductive nickel paste, conductive carbon paste and conductive graphene paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921620810.1U CN210469869U (en) | 2019-09-26 | 2019-09-26 | Circuit board of low-cost aluminium preparation circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921620810.1U CN210469869U (en) | 2019-09-26 | 2019-09-26 | Circuit board of low-cost aluminium preparation circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210469869U true CN210469869U (en) | 2020-05-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921620810.1U Expired - Fee Related CN210469869U (en) | 2019-09-26 | 2019-09-26 | Circuit board of low-cost aluminium preparation circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210469869U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113473698A (en) * | 2021-07-15 | 2021-10-01 | 重庆御光新材料股份有限公司 | Strippable circuit board and manufacturing method thereof |
-
2019
- 2019-09-26 CN CN201921620810.1U patent/CN210469869U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113473698A (en) * | 2021-07-15 | 2021-10-01 | 重庆御光新材料股份有限公司 | Strippable circuit board and manufacturing method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200505 Termination date: 20210926 |
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| CF01 | Termination of patent right due to non-payment of annual fee |