CN100546441C - A kind of manufacture method of multi-layer flexible circuit board - Google Patents
A kind of manufacture method of multi-layer flexible circuit board Download PDFInfo
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- CN100546441C CN100546441C CNB2006100617647A CN200610061764A CN100546441C CN 100546441 C CN100546441 C CN 100546441C CN B2006100617647 A CNB2006100617647 A CN B2006100617647A CN 200610061764 A CN200610061764 A CN 200610061764A CN 100546441 C CN100546441 C CN 100546441C
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000004080 punching Methods 0.000 claims abstract description 57
- 238000007747 plating Methods 0.000 claims abstract description 40
- 238000007731 hot pressing Methods 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims abstract description 20
- 230000002787 reinforcement Effects 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 239000011889 copper foil Substances 0.000 claims description 25
- 241001232787 Epiphragma Species 0.000 claims description 24
- 239000003292 glue Substances 0.000 claims description 16
- 238000001020 plasma etching Methods 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 3
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- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
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- 230000000052 comparative effect Effects 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 238000003466 welding Methods 0.000 description 8
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000006664 bond formation reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
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Abstract
The invention discloses a kind of manufacture method of multi-layer flexible circuit board, may further comprise the steps: A1, the screen of making inner plating and cooperating with inner plating; B1, by the first punching press profile, go out semicircle orifice in the end of the connection finger of inner plating; C1, in the two sides hot pressing reinforcement of the inner plating of the good semicircle orifice of punching press; D1, press screen at the outermost heat of reinforcement; E1, by the second punching press profile, will go out on the multi-layer flexible circuit board Dan Pincong motherboard.The present invention is owing to process semicircle orifice to being connected the finger place before the hot pressing process of screen, silver foil and auxiliary material, avoided the mismachining tolerance problem that exists tolerance to bring by material contracts and mould, so the place can process good semicircle orifice at the connection finger, therefore improved yield of products, make the connection of product more firm, can bend more frequently.
Description
[technical field]
The present invention relates to a kind of manufacture method of multi-layer flexible circuit board, particularly an end is the manufacture method that semicircle connects the multi-layer flexible circuit board of finger.
[background technology]
Multi-layer flexible circuit board is by single-sided flexible circuit board or double-faced flexible wiring board, adds by interlayer and puts adhesive, and hot pressing makes adhesive solidify the strong bond that realizes between each layer and forms.
Miniaturization and light-weighted development along with various electronic equipments just require product size little, and the thermal endurance height has the flexible circuit board of superior bending performance and multifunction simultaneously.In order to process the flexible circuit board with superior bending performance and multifunction, multi-layer flexible circuit board just arises at the historic moment, and has the zone that dynamic area does not promptly have adhesive, so that excellent bending performance to be provided.Multi-layer flexible circuit board is divided into two kinds: a kind ofly be, as shown in Figure 1, it is that semicircle connects finger that an end has the connection finger of semicircle orifice 81, and this connections finger is also referred to as golden finger usually, and the other end need weld the multi-layer flexible circuit board of individual connector; Another kind is not have semicircle to connect finger, and two ends all need to weld the multi-layer flexible circuit board of a connector.Because two ends all are that the multi-layer flexible circuit board of connector is the multi-layer flexible circuit board cost height that semicircle connects finger than an end, therefore a lot of clients are that to adopt an end be that semicircle connects the multi-layer flexible circuit board of pointing.
Existing five layers of flexible circuit board, as shown in Figure 2, comprise Copper Foil 2,5,8,10,15, it is the rolled copper foil of 4～50 μ m for thickness, epiphragma 1,4,7,11,16, it is that polyimides (PI), PETG (PET) film of 5～50 μ m formed by thickness, adhesive 3,6,9,12,14 thickness are 10～25 μ m, also have reinforcement 13, each part mentioned above is realized strong bonded by hot pressing.
Existing six layers of flexible circuit board as shown in Figure 3, comprising: Copper Foil 2,5,8,10,15,18, and it is the rolled copper foil of 4～50 μ m for thickness; Epiphragma 1,4,7,11,16,19, it is that polyimides (PI), PETG (PET) film of 5～50 μ m formed by thickness; Adhesive 3,6,9,12,14,17 thickness are 10～25 μ m, also have reinforcement 13, and each part mentioned above is realized strong bonded by hot pressing.
The method for designing of existing multi-layer flexible circuit board, with five layers of flexible circuit board is example, idiographic flow: as shown in Figure 4,101. select the raw material Copper Foil, can be single face Copper Foil or two-sided Copper Foil as requested, generally all be the single face Copper Foil, and severing, elder generation do the circuit of internal layer flexible circuit board separately, circuit forms after heat and presses epiphragma, forms a single-sided flexible circuit board; 102. prepreg on all fitting on the positive and negative of this single sided board does not have outer two layers of single face glue or glue material Copper Foil is arranged by hot pressing, through integral body of the bonding formation of hot pressing; 103. hole, plasma etching, black hole press dry film, and exposure is developed, and circuit is produced in etching, epiphragma in the hot pressing of two difference; 104. expose in the place that the part of epiphragma uplifting window mouth will need to weld, lead plating tin, gold-plated, change gold, lamination reinforcement, hot pressing; 105. outer two layers of screen of product are all carried out circuit separately, circuit forms after heat and presses epiphragma, and expose in the place that epiphragma uplifting window notch portion will need to weld, and lead plating tin, gold-plated, change gold form two single-sided flexible circuit boards again; 106. two layers of screen all go punching press separately; 107. fit with the three layers of mainboard in the inside by prepreg, hot pressing, the silk-screen character is at last according to auxilliary materials such as design requirement applying high temperature gummed tape or gummed papers; 108. stamp out the shape of product that the band semicircle orifice connects finger by the profile mould.
On the connection finger of product, stamp out semicircle orifice, increased the cost of manufacture of product, if do not have semicircle orifice but product connects finger, so in doing the process of welding the welding of product and liquid crystal display screen mainboard easily generation do not weld, come off, problem such as rosin joint, reduced the bending number of times of product.For guaranteeing the quality of product, require product on the connection finger, to process semicircle orifice.Usually, the semicircle orifice that this semicircle connects the multi-layer flexible circuit board of finger is with a drawing of mould in manufacturing process, because it is little that semicircle connects the diameter of finger, add the hot pressing of follow-up screen, silver foil and auxiliary material, material is easy to shrink, and die forming has tolerance again, so once-forming punching press (towards shape) time, product connects finger place semicircle orifice and is difficult to good rushing out, and has a strong impact on yield of products.
[summary of the invention]
At the problem that the above-mentioned connection finger place that mentions is difficult for making good semicircle orifice, the present invention proposes a kind of method for designing of multi-layer flexible circuit board, can connect the semicircle orifice that the finger place produces standard, thereby improve yield of products and bending number of times.
For achieving the above object, the present invention proposes a kind of manufacture method of multi-layer flexible circuit board, may further comprise the steps:
A1, the screen of making inner plating and cooperating with inner plating;
B1, by the first punching press profile, go out semicircle orifice in the end of the connection finger of inner plating;
C1, in the two sides hot pressing reinforcement of the inner plating of the good semicircle orifice of punching press;
D1, press screen at the outermost heat of reinforcement;
E1, by the second punching press profile, will go out on the multi-layer flexible circuit board Dan Pincong motherboard.
The first punching press profile is preferably the rectangular strip of end abutment that is connected finger with inner plating among the described step B1, and the size of described rectangular strip on its length direction is more than or equal to the overall dimension of the inner plating and the first punching press profile adjoiner.
The preferred size of described rectangular strip is: on the rectangular strip length direction, its size is than each long 0.3mm～1.5mm of the every limit of overall dimension of the inner plating and the first punching press profile adjoiner, and described rectangular strip is of a size of 0.5mm～2mm on its length direction.
Making inner plating in the described steps A 1 may further comprise the steps:
A11, select the raw material Copper Foil, make the inner plating of multi-layer flexible circuit board as requested;
A12, on inner plating, hole, plasma etching, black hole, produce circuit as requested on the two sides of inner plating, and on the two sides of inner plating epiphragma in the hot pressing respectively.
Described steps A 1 is made screen and be may further comprise the steps:
A13, employing single face have glue material Copper Foil, make circuit as requested;
A14, hot pressing epiphragma on the line, and carry out surface treatment;
Profile is dodged in A15, punching press: punching press connects the profile of dodging of finger, reaches the product that finally comes out, and can see connecting finger and finger semicircle orifice.
Among the described step C1 by prepreg in the hot pressing reinforcement of the two sides of inner plating.
Press screen by prepreg at the outermost heat of reinforcement among the described step D1.
The preferred size of the second punching press profile is in the described step e 1: in the longitudinal direction, the size of the second punching press profile is identical with the overall dimension of Dan Pin, and on Width, the size of the second punching press profile is greater than the overall dimension of Dan Pin.
The gravel size decision of the described second punching press profile on Width is greater than the overall dimension of Dan Pin and the width sum of the first punching press profile.
The invention has the beneficial effects as follows:
The manufacture method of multi-layer flexible circuit board provided by the present invention, owing to before the hot pressing process of screen, silver foil and auxiliary material, process semicircle orifice to being connected the finger place, avoided the mismachining tolerance problem that exists tolerance to bring by material contracts and mould, so the place can process good semicircle orifice at the connection finger, therefore improved yield of products, make the connection of product more firm, can bend more frequently.
Feature of the present invention and advantage will be elaborated in conjunction with the accompanying drawings by embodiment.
[description of drawings]
Fig. 1 is for having the plane schematic top plan view that five layers of flexible circuit board semicircle connect finger in the prior art;
Fig. 2 connects the schematic cross-section of pointing for having five layers of flexible circuit board semicircle in the prior art;
Fig. 3 connects the schematic cross-section of pointing for having six layers of flexible circuit board semicircle in the prior art;
Fig. 4 produces the flow chart of multi-layer flexible circuit board for prior art;
Fig. 5 is the flow chart of preparation multi-layer flexible circuit board in the embodiment of the invention one;
Fig. 6 is the structural representation of multi-layer flexible circuit board before the shape for the first time in the embodiment of the invention one;
Fig. 7 is for the first time towards the floor map of shape in the embodiment of the invention one;
Fig. 8 is for the second time towards the floor map of shape in the embodiment of the invention one;
Fig. 9 is the plane schematic top plan view that 1 five layers of flexible circuit board semicircle of comparative example connect finger;
Figure 10 dashes the shape floor map for 1 five layers of flexible circuit board of comparative example;
Figure 11 is the plane schematic top plan view that 2 six layers of flexible circuit board semicircle of comparative example connect finger;
Figure 12 dashes the shape floor map for 2 six layers of flexible circuit board of comparative example;
In the accompanying drawing 1,4,7,11,16,19 is epiphragma; 2,5,8,10,15,18 is Copper Foil; 3,6,9,12,14,17 is prepreg/adhesive; L1, L2, L3, L4, L5, L6, L7, L8 are that each limit is towards shape length; 81 is semicircle orifice; 82 is the profile of punching press for the first time; 83 is the profile of punching press for the second time; The 13rd, reinforcement.
[embodiment]
Core of the present invention is: multi-layer flexible circuit board can be divided into inner plating, reinforcement and screen, and inner plating is meant and is positioned at wiring board reinforcement inside, that press together.Screen is meant that multi-layer flexible circuit board is outmost two-layer.Connecting finger (being golden finger) is on inner plating, connects finger on the screen, can be shaped well for guaranteeing the semicircle orifice that connects on pointing, and the present invention is by twice punching press, for the first time towards semicircle orifice, for the second time towards Dan Pin.
The manufacture craft flow process of multi-layer flexible circuit board is as follows: as shown in Figure 5, be example with five layers of flexible circuit board, may further comprise the steps:
In step 201, select the raw material Copper Foil, can be single face Copper Foil or two-sided Copper Foil as requested, generally all be the single face Copper Foil, severing, elder generation do the circuit of internal layer flexible circuit board separately, and circuit forms after heat and presses epiphragma, form a single-sided flexible circuit board, carry out step 202 then;
In step 202, prepreg on all fitting on the positive and negative of this single sided board does not have outer two layers of single face glue or glue material Copper Foil is arranged by hot pressing, through integral body of the bonding formation of hot pressing, carry out step 203 then;
In step 203, hole, plasma etching, black hole, press dry film, exposure, development, etching and produce circuit, at two epiphragmas in the hot pressing respectively, carry out step 204 then;
In step 204, as shown in Figure 7, carry out punching press first time profile, semicircle orifice is gone out at the place at the connection finger, carry out step 205 then, and the product after the profile of punching press for the first time is as shown in Figure 6;
In step 205, expose in the place that the part of epiphragma uplifting window mouth will need to weld, lead plating tin, gold-plated, change gold, lamination reinforcement, hot pressing carry out step 208 then;
In step 206, outer two layers of screen of product are all carried out circuit separately, and circuit forms after heat and presses epiphragma, expose in the place that epiphragma uplifting window notch portion will need to weld, lead plating tin, gold-plated, change gold form two single-sided flexible circuit boards again, carry out steps 207 then;
In step 207, two layers of screen all go punching press separately, punching press inner plating finger dodge profile, reach the product that finally comes out, can see welding golden finger and golden finger semicircle orifice, be used for follow-up welding, carry out step 208 then;
In step 208, screen is fitted with three layers of mainboard in the inside (being inner plating) by prepreg, hot pressing, and the silk-screen character according to auxilliary materials such as design requirement applying high temperature gummed tape or gummed papers, carry out step 209 at last then;
In step 209, carry out punching press second time profile by the profile mould, will stamp out on the Dan Pincong motherboard come, stamp out shape of product that the band semicircle orifice connects finger as shown in Figure 8.
A described punching press and secondary punching course above describing in detail below in the operation, semicircle should be that the profile limit of L4 overlaps with the length of product needed when connecting the independent punch designs in the profile limit of finger, the structural representation of multi-layer flexible circuit board as shown in Figure 6 before the shape, product shaping is divided the secondary punching press, during the profile of punching press for the first time, mainly be that the connection of product finger semicircle orifice 81 limits are rushed out, punching press is for the first time pointed semicircle orifice except punching press, sometimes also can be used for making things convenient for follow-up processing towards some openings, the profile of punching press for the first time is owing to be that the pattern tool forms towards shape, in hot pressing and punching press, the structure that equates can make product stressed mutually evenly, and product size can have good dimensional stability.The finger semicircle orifice only forms when first time punching press, just points on the golden finger of three layers of wiring board that semicircle orifice only is positioned at the inside.All not pointing the semicircle orifice requirement for general outer two layers, all is screen, that is to say for six layers of flexible circuit board, has only four layers of the insides that the requirement of finger semicircle orifice is arranged.For the second time during punch extermal form, exactly other profile limit of product is rushed out.The profile of the profile of punching press for the first time 82 as shown in Figure 7, the profile of punching press for the first time 82 is preferably the rectangular strip that is connected the end abutment of pointing with inner plating, if the direction parallel with the long limit of rectangular strip is length direction, the direction parallel with the minor face of rectangular strip is Width.The length of the profile of punching press for the first time 82 is L8, width is L3, its length is than length each length of side L1, L2, the L3 of product reality, mainly is because if unlike each length of side of length of product reality, it is just not concordant that product connects finger semicircle orifice limit, not not straight line, product is done with regard to bad in outward appearance and welding, and length should satisfy L1=L2, and L7 is the length of Dan Pinyu punching press for the first time profile 82 adjoiners, L8=L7+L1+L2, the wherein span of L3 0.5～2mm preferably.Length L 1, L2 can be arranged between 0.3mm～1.5mm according to product requirement.Be illustrated in figure 8 as the profile of punching press for the second time 83, L6＞L4 can not be flushed to connect when making for the second time towards shape and point, and is preferably L6 〉=L3+L4, is flushed to wiring board in the time of can making for the second time towards shape like this.
In order to embody effect of the present invention, below enumerated 2 comparative examples using prior art and compared:
Comparative example 1, make five layers of flexible circuit board, as shown in Figure 9, earlier glue material Copper Foil (material is that the glue by the PI+10um of copper+12um of 18um constitutes) is arranged with single face, do the inside one deck circuit of five layers of flexible circuit board separately, after press epiphragma (be by PI film+15um of 12.5um glue constitute) hot pressing after, form a single-sided flexible circuit board, prepreg (adhesive of 15um) on the positive and negative of this layer flexible circuit board is fitted respectively subsequently, by hot pressing, outer two layers of single face have glue material Copper Foil in the pressing, boring subsequently, plasma etching, black hole, press dry film, exposure is developed, etch circuit after, epiphragma in the hot pressing of two difference, surface treatment has just formed and has not also gone out three layers of flexible circuit board that the band semicircle connects the finger limit, with prepreg (adhesive of 25um) by hot pressing, reinforcement in the pressing (PET of 0.2MM), with two single faces glue material Copper Foil is arranged again, carry out circuit respectively, epiphragma in the difference hot pressing of back, surface treatment respectively again, go punching press separately, fit hot pressing with the three layers of mainboard in the inside with prepreg (adhesive of 10um), character silk printing (white ink), baking.With punching press profile punch extermal form as shown in figure 10, just formed five layers of band semicircle and connected the multi-layer flexible circuit board of pointing.The product of this multi-layer flexible circuit board is placed on examines entirely under 10 times of magnifying glasses and do the bending test with the welding of liquid crystal display screen mainboard, test result is listed in the table 1.
Comparative example 2, make six layers of flexible circuit board, as shown in figure 11, earlier glue material Copper Foil (material is that the glue by the PI+10um of copper+12um of 18um constitutes) is arranged with single face, carry out the two layer line roads, the inside of six floor flexible circuit board, after press epiphragma (be by PI film+15um of 12.5um glue constitute) hot pressing after, form two single-sided flexible circuit boards, use prepreg (adhesive of 15um) again, by fast pressure above-mentioned two-layer circuit is bonded together, prepreg (adhesive of 10um) on fitting respectively on the epiphragma of double-layer flexible wiring board subsequently, by hot pressing, outer two layers of single face have glue material Copper Foil in the pressing, boring subsequently, plasma etching, black hole, press dry film, exposure is developed, etch circuit after, epiphragma in the hot pressing of two difference, surface treatment has just formed and has not also gone out four layers of flexible circuit board that the band semicircle connects the finger limit, with prepreg (adhesive of 25um) by hot pressing, reinforcement in the pressing (PET of 0.2MM), with two single faces glue material Copper Foil is arranged again, carry out circuit respectively, epiphragma in the difference hot pressing of back, surface treatment respectively again, go punching press separately, fit hot pressing with the four layers of mainboard in the inside with prepreg (adhesive of 10um), character silk printing (white ink), baking.With punching press profile punch extermal form as shown in figure 12, just formed six layers of band semicircle and connected the multi-layer flexible circuit board of pointing.The product of this multi-layer flexible circuit board is placed on examines entirely under 10 times of magnifying glasses and do the bending test with the welding of liquid crystal display screen mainboard, test result is listed in the table 1.
Bending of table 1. multi-layer flexible circuit board and product yields test result
| Project | The bending number of times | The product yields |
| Method of testing | IPC bends |
10 times of magnifying glasses are examined entirely |
| Embodiment | 105926 times | 92％ |
| Comparative example 1 | 72530 times | 70％ |
| Comparative example 2 | 52630 times | 55％ |
The above results shows the product that the manufacture method of multi-layer flexible circuit board provided by the present invention is produced, and than the product yields height that prior art is produced, bending often.
The invention provides to solve and connect the scheme that the finger semicircle orifice dashed partially or dashed the problem of not coming out in the multilayer circuit board production process.Because semicircle orifice profile limit is just rushed out in punching press first time profile, product is follow-up with reinforcement, shielding, compound hot pressing the time, the plate face shrinks, and the punching press profile does not influence the semicircle orifice that connects finger, thereby realizes follow-up high yields and follow liquid crystal display screen mainboard firm welding.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to the scope of patent protection that the present invention is determined by claims of being submitted to.
Claims (9)
1. the manufacture method of a multi-layer flexible circuit board is characterized in that may further comprise the steps:
A1, the screen of making inner plating and cooperating with inner plating;
B1, by the first punching press profile, go out semicircle orifice in the end of the connection finger of inner plating;
C1, in the two sides hot pressing reinforcement of the inner plating of the good semicircle orifice of punching press;
D1, press screen at the outermost heat of reinforcement;
E1, by the second punching press profile, will go out on the multi-layer flexible circuit board Dan Pincong motherboard.
2. the manufacture method of multi-layer flexible circuit board as claimed in claim 1, it is characterized in that: the first punching press profile is and the rectangular strip that is connected the end abutment of pointing of inner plating among the described step B1, and the size of described rectangular strip on its length direction is more than or equal to the overall dimension of the inner plating and the first punching press profile adjoiner.
3. the manufacture method of multi-layer flexible circuit board as claimed in claim 2, it is characterized in that: the size of described rectangular strip on its length direction is than each long 0.3mm～1.5mm of the every limit of overall dimension of the inner plating and the first punching press profile adjoiner.
4. the manufacture method of multi-layer flexible circuit board as claimed in claim 2 is characterized in that: make inner plating in the described steps A 1 and may further comprise the steps:
A11, select the raw material Copper Foil, make the inner plating of multi-layer flexible circuit board as requested;
A12, on inner plating, hole, plasma etching, black hole, produce circuit as requested on the two sides of inner plating, and on the two sides of inner plating epiphragma in the hot pressing respectively.
5. the manufacture method of multi-layer flexible circuit board as claimed in claim 4 is characterized in that: described steps A 1 is made screen and be may further comprise the steps:
A13, employing single face have glue material Copper Foil, make circuit as requested;
A14, hot pressing epiphragma on the line, and carry out surface treatment;
Profile is dodged in A15, punching press: punching press connects the profile of dodging of finger, reaches the product that finally comes out, and can see connecting finger and finger semicircle orifice.
6. the manufacture method of multi-layer flexible circuit board as claimed in claim 5 is characterized in that: among the described step C1 by prepreg in the hot pressing reinforcement of the two sides of inner plating.
7. the manufacture method of multi-layer flexible circuit board as claimed in claim 6 is characterized in that: press screen by prepreg at the outermost heat of reinforcement among the described step D1.
8. as the manufacture method of each described multi-layer flexible circuit board in the claim 1 to 7, it is characterized in that: second punching press profile size in the longitudinal direction is identical with the overall dimension of Dan Pin in the described step e 1, and the size on Width is greater than the overall dimension of Dan Pin.
9. the manufacture method of multi-layer flexible circuit board as claimed in claim 8, it is characterized in that: the size of the described second punching press profile on Width is greater than the overall dimension of Dan Pin and the width sum of the first punching press profile.
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| CNB2006100617647A CN100546441C (en) | 2006-07-19 | 2006-07-19 | A kind of manufacture method of multi-layer flexible circuit board |
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| CNB2006100617647A CN100546441C (en) | 2006-07-19 | 2006-07-19 | A kind of manufacture method of multi-layer flexible circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106604570A (en) * | 2016-12-21 | 2017-04-26 | 深圳市景旺电子股份有限公司 | Flexible laminated board and making method thereof |
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|---|---|---|---|---|
| CN101636046B (en) * | 2008-07-24 | 2011-07-13 | 比亚迪股份有限公司 | Method for processing multilayer flexible circuit board |
| CN103515815B (en) * | 2012-06-28 | 2016-03-02 | 联想(北京)有限公司 | Based on the MHL connection of flexible PCB, connector, transducer and system |
| CN106332445B (en) * | 2015-06-30 | 2019-02-19 | 欣兴电子股份有限公司 | The manufacturing method of flexible circuit board |
| CN107835569B (en) * | 2017-09-30 | 2020-10-09 | 苏州福莱盈电子有限公司 | Manufacturing process of one-meter eight-large long plate |
| CN108513434B (en) * | 2018-05-17 | 2023-11-10 | 扬州市玄裕电子有限公司 | Multilayer flexible circuit board for flat plate |
| CN114274658B (en) * | 2021-12-22 | 2022-12-20 | 江苏盛矽电子科技有限公司 | Overflow blocking type silk screen and PI film laminating device and method |
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| CN1366445A (en) * | 2000-12-21 | 2002-08-28 | 索尼化学株式会社 | Manufacturing method of multilayer flexible wiring plate |
| CN1602134A (en) * | 2003-09-23 | 2005-03-30 | 华生科技股份有限公司 | Flexible printed circuit board |
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| CN106604570A (en) * | 2016-12-21 | 2017-04-26 | 深圳市景旺电子股份有限公司 | Flexible laminated board and making method thereof |
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| CN101111131A (en) | 2008-01-23 |
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