CN100546441C - A kind of manufacture method of multi-layer flexible circuit board - Google Patents
A kind of manufacture method of multi-layer flexible circuit board Download PDFInfo
- Publication number
- CN100546441C CN100546441C CNB2006100617647A CN200610061764A CN100546441C CN 100546441 C CN100546441 C CN 100546441C CN B2006100617647 A CNB2006100617647 A CN B2006100617647A CN 200610061764 A CN200610061764 A CN 200610061764A CN 100546441 C CN100546441 C CN 100546441C
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- punching press
- inner plating
- layer flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000004080 punching Methods 0.000 claims abstract description 57
- 238000007747 plating Methods 0.000 claims abstract description 40
- 238000007731 hot pressing Methods 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims abstract description 20
- 230000002787 reinforcement Effects 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 239000011889 copper foil Substances 0.000 claims description 25
- 241001232787 Epiphragma Species 0.000 claims description 24
- 239000003292 glue Substances 0.000 claims description 16
- 238000001020 plasma etching Methods 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 73
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 238000005452 bending Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 238000003466 welding Methods 0.000 description 8
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000006664 bond formation reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Images
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- Structure Of Printed Boards (AREA)
Abstract
Description
Project | The bending number of times | The product yields |
Method of testing | IPC bends |
10 times of magnifying glasses are examined entirely |
Embodiment | 105926 times | 92% |
Comparative example 1 | 72530 times | 70% |
Comparative example 2 | 52630 times | 55% |
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100617647A CN100546441C (en) | 2006-07-19 | 2006-07-19 | A kind of manufacture method of multi-layer flexible circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100617647A CN100546441C (en) | 2006-07-19 | 2006-07-19 | A kind of manufacture method of multi-layer flexible circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101111131A CN101111131A (en) | 2008-01-23 |
CN100546441C true CN100546441C (en) | 2009-09-30 |
Family
ID=39042971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100617647A Expired - Fee Related CN100546441C (en) | 2006-07-19 | 2006-07-19 | A kind of manufacture method of multi-layer flexible circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100546441C (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106604570A (en) * | 2016-12-21 | 2017-04-26 | 深圳市景旺电子股份有限公司 | Flexible laminated board and making method thereof |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101636046B (en) * | 2008-07-24 | 2011-07-13 | 比亚迪股份有限公司 | Method for processing multilayer flexible circuit board |
CN103515815B (en) * | 2012-06-28 | 2016-03-02 | 联想(北京)有限公司 | Based on the MHL connection of flexible PCB, connector, transducer and system |
CN106332445B (en) * | 2015-06-30 | 2019-02-19 | 欣兴电子股份有限公司 | The manufacturing method of flexible circuit board |
CN107835569B (en) * | 2017-09-30 | 2020-10-09 | 苏州福莱盈电子有限公司 | Manufacturing process of one-meter eight-large long plate |
CN108513434B (en) * | 2018-05-17 | 2023-11-10 | 扬州市玄裕电子有限公司 | Multilayer flexible circuit board for flat plate |
CN114274658B (en) * | 2021-12-22 | 2022-12-20 | 江苏盛矽电子科技有限公司 | Overflow blocking type silk screen and PI film laminating device and method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5446245A (en) * | 1992-01-14 | 1995-08-29 | Nippon Mektron, Ltd. | Flexible circuit wiring board and method of producing the same |
CN1366445A (en) * | 2000-12-21 | 2002-08-28 | 索尼化学株式会社 | Manufacturing method of multilayer flexible wiring plate |
CN1602134A (en) * | 2003-09-23 | 2005-03-30 | 华生科技股份有限公司 | Flexible printed circuit board |
CN1802070A (en) * | 2005-01-06 | 2006-07-12 | 日本梅克特隆株式会社 | Processing method for punched hole of flexible pressing circuit substrate |
-
2006
- 2006-07-19 CN CNB2006100617647A patent/CN100546441C/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5446245A (en) * | 1992-01-14 | 1995-08-29 | Nippon Mektron, Ltd. | Flexible circuit wiring board and method of producing the same |
CN1366445A (en) * | 2000-12-21 | 2002-08-28 | 索尼化学株式会社 | Manufacturing method of multilayer flexible wiring plate |
CN1602134A (en) * | 2003-09-23 | 2005-03-30 | 华生科技股份有限公司 | Flexible printed circuit board |
CN1802070A (en) * | 2005-01-06 | 2006-07-12 | 日本梅克特隆株式会社 | Processing method for punched hole of flexible pressing circuit substrate |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106604570A (en) * | 2016-12-21 | 2017-04-26 | 深圳市景旺电子股份有限公司 | Flexible laminated board and making method thereof |
Also Published As
Publication number | Publication date |
---|---|
CN101111131A (en) | 2008-01-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. Assignor: BYD Co.,Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Manufacturing method of multi-layer flexible circuit board License type: Exclusive license Record date: 20080504 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14 Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
|
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201207 Address after: No.415 Jiangping Road, Jingjiang City, Taizhou City, Jiangsu Province Patentee after: Jiangsu Jiuyuan Electric Power Construction Engineering Co.,Ltd. Address before: 518119 BYD Industrial Park, Yanan Road, Kwai Chung Town, Longgang District, Guangdong, Shenzhen Patentee before: BYD Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090930 Termination date: 20210719 |
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CF01 | Termination of patent right due to non-payment of annual fee |