CN1802070A - Processing method for punched hole of flexible pressing circuit substrate - Google Patents
Processing method for punched hole of flexible pressing circuit substrate Download PDFInfo
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- CN1802070A CN1802070A CN 200510097411 CN200510097411A CN1802070A CN 1802070 A CN1802070 A CN 1802070A CN 200510097411 CN200510097411 CN 200510097411 CN 200510097411 A CN200510097411 A CN 200510097411A CN 1802070 A CN1802070 A CN 1802070A
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- circuit substrate
- punching processing
- peristome
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Abstract
To discharge the punching dusts of a flexible printed board from a lower die taper part one after another without flying out the dust on the surface of the lower die, even when using a die having a stroke so short that a punching-through punch inserted in the die does not reach a position, where it projects to the lower die taper part from its punch holeat the shape work such as removal of blind through-holes or unused portions of a flexible printed board. A flexible printed board 14 has circular lands formed on both sides of an insulation layer 17 with copper foils 16a, 16b. When punching a portion surrounded by the dashed line A, the copper foil of a part 18 inside the dashed line A is previously etched to expose the insulation layer 17. A dashed line A part is punched by a punching-through punch to make the inside portion 18 of the punching dust easy to bend, as this portion is of only the insulation layer 17. This relaxes the repulsion force of the punching dust and the lower die to prevent the dust from flying out of the lower die.
Description
Technical field
The present invention relates to be used for the punched hole processing method of the flexible print circuit substrate of electronic equipment, in particular, the present invention relates to adopt punching press to form the punched hole processing method of peristome with impact style with drift at the non through hole processing of loading used for electronic device or without the shape processing of the removal at position etc.
Background technology
As in having flexible flexible print circuit substrate, the method for the peristome of formation non through hole or admittance electronic device etc. adopts the punching processing of punching press with drift widely.Usually, on dielectric substrate,, carry out punching processing afterwards by coverings such as cover layer, scolding tin protective layers by necessary conductor circuits of formation such as Copper Foils.
In the punching processing in the past, people know between backform and bed die the flexible print circuit of insertion substrate, pushes the flexible print circuit substrate by the pressing plate of backform, carry out simultaneously punching method (such as, with reference to patent documentation 1).Fig. 7 represents patent documentation 1 described mould.This mould is made of backform 11 and bed die 12, backform 11 by plate 11a and pressing plate (in patent documentation 1, be top template) the 11c formation, this plate 11a interlocking has the base end part of punching press with drift 13, this pressing plate 11c has the support holes 11b of the punching press made from the leading section insertion of drift 13, in bed die 12, has bore of the punch 12a, in this bore of the punch 12a, insert the leading section of above-mentioned punching press with drift 13, this bore of the punch 12a is by punching press forms to the flexible print circuit substrate, the diameter of the bottom of this bore of the punch 12a enlarges at leisure, and the 12b of taper portion is set.
Shown in the image pattern 8 like that, between backform 11 and bed die 12, insert flexible print circuit substrate 14, make the upright guide finger of being located on the bed die 12 pass the pilot hole that is opened in the flexible print circuit substrate 14 and carry out position alignment, though this is not shown in the drawings.
Shown in the image pattern 9 like that, if backform 11 descends, then at first pressing plate 11c is held on flexible print circuit substrate 14 between itself and the bed die 12, and the distortion of flexible print circuit substrate 14, bending etc. are corrected.This pressing plate 11c fixes at the state of clamping flexible print circuit substrate 14 by the spring mechanism (not shown), at this state, if the plate 11a of backform and the punching press chimeric with it are integral decline with drift 13, then the leading section of punching press with drift 13 inserted among the bore of the punch 12a of bed die, by the shearing of punching press, flexible print circuit substrate 14 is carried out punching press with drift 13 and bed die 12.
Shown in the image pattern 10 like that, if punching press is deviate from from the bore of the punch 12a of bed die with drift 13, be inserted into the position of the 12b of taper portion, then the blinking scrap 15 of flexible print circuit substrate 14 falls to the below of bed die 12, and this blinking scrap 15 does not fill up in the inside of bed die 12.For this reason, must increase punching press with the total length of drift 13 and the stroke of bed die 12 (the bore of the punch 12a of bed die run through length).
Generally, machining accuracy is good more in short-term with the total length of drift 13 in punching press, and in addition, with the plate 11a interlocking of backform the time, the outstanding length precision of vertical angle more in short-term improves.In addition, also prolong in the stroke of bed die 12 life-span little, mould of rubbing more in short-term.Therefore, punching press is preferably short as much as possible with the total length and the stroke of drift 13, if the leading section of flexible print circuit substrate 14 inserts to bore of the punch 12a from the surface of bed die 12 according to the distance of 0.3～0.5mm, just then the necessary stroke of the punching press of flexible print circuit substrate 14 is enough.
Relative this situation, from the surface of the bore of the punch 12a of bed die, even to the length at the top of the 12b of taper portion under bed die 12 adopts situation such as higher material such as the hardness of HS steel etc., still must 2mm or more than so that guarantee intensity.Therefore, as aforementioned, occasion in the scope of punching stroke at 0.3～0.5mm of flexible print circuit substrate 14, shown in the image pattern 11 like that, punching press is not thrown off with the bore of the punch 12a of bed die with the leading section of drift 13, be inserted into the position of the 12b of taper portion, the blinking scrap 15 of flexible print circuit substrate 14 fills up in the inside of bore of the punch 12a, shown in dotted line G part blinking scrap 15 accumulate successively.
It is believed that reason that blinking scrap 15 flies out from bore of the punch 12a is as following.In order in flexible print circuit substrate 14, to form non through hole etc., punch process is carried out at the position that has Copper Foil on the two sides, in this occasion, shown in the image pattern 13 like that, the Copper Foil part 16a of the top side of blinking scrap 15 is the basic trapezoidal shape that falls greater than the Copper Foil part 16b of bottom side.Its reason is by shearing it to be cut off in punch process.
Therefore, shown in the image pattern 14 like that, when the blinking scrap 15 with flexible print circuit substrate 14 was pressed into the inside of punching hole 12a of bed die, as dotted line H part, top surface side was convex curvature, because of its resilience force blinking scrap 15 flies out to the surface of bed die 12.
On the other hand, in the occasion that need not partly carry out punching processing, removing Copper Foil by etching to flexible print circuit substrate 14, when only forming insulating barrier, because mechanical strength is lower, thus shown in the image pattern 15 like that, be in the state that blinking scrap 15 bends.
Therefore, it is believed that, shown in the image pattern 16 like that, when the blinking scrap 15 with flexible print circuit substrate 14 is pressed into the inside of punching hole 12a of bed die, the blinking scrap 15 that bends shown in dotted line I part is difficult to hang on the inner peripheral surface of bore of the punch 12a of bed die, when punching press was risen with drift 13, blinking scrap 15 was adsorbed onto by vacuum on the bottom surface of punching press with the leading section of drift 13 in moment, on lift to the top of bed die 12.
Like this, if because of certain reason, the blinking scrap 15 of flexible print circuit substrate 14 flies out on the surface of bed die 12, then by following step, when new flexible print circuit substrate 14 is carried out punching processing, the blinking scrap 15 that flies out is sandwiched between bed die 12 and the flexible print circuit substrate 14, does not produce the defective of impression etc. on flexible print circuit substrate 14.
Thus, has following problem, promptly, when new flexible print circuit substrate 14 is installed, confirm on the surface of bed die 12, not have blinking scrap 15 at every turn, when contingency has blinking scrap 15, must be after removing blinking scrap 15 by air blowing, brush, next flexible print circuit substrate 14 is installed, and operating efficiency is poor.
People also consider according to the fly out mode on surface of bed die 12 of the blinking scrap in the flexible print circuit substrate 14 15, make the bottom of bed die 12 form hermetically-sealed construction, attract to discharge the method for blinking scrap 15 by air, but, have a plurality of positions of flexible print circuit substrate 14 being carried out punching processing, occasion by same system attraction, has any one position in a plurality of positions, discharge the moment of blinking scrap 15, suction pressure descends, the shortcoming that attracts discharging operation not carry out continuously.Attraction mechanism can be set respectively at whole position of carrying out punching processing, and still, the mould structure complexity is difficult to realize.
In addition, in order to prevent when the punching processing, produce the situation in crack at the peristome periphery, people also know have at the position of punching processing in advance by boring processing offer method less than the hole of peristome (such as, with reference to patent documentation 2 and patent documentation 3), before peristome is carried out punching processing, the opening inner peripheral by boring processing offer a plurality of holes method (such as, with reference to patent documentation 4), in the formation portion of seam hole, offer prepared hole in advance than minor diameter, by the seam hole drift of projection is set, the method for punch process prepared hole (such as, with reference to patent documentation 5) etc.
Patent documentation 1:JP spy opens flat 7-24792 document
Patent documentation 2:JP spy opens clear 64-51295 document
Patent documentation 3:JP spy opens flat 7-256594 document
Patent documentation 4:JP spy opens flat 6-164100 document
Patent documentation 5:JP spy opens flat 7-24793 document
Summary of the invention
For patent documentation 1 described invention, as aforementioned since punching press with the leading section of drift bore of the punch from bed die, to longer to the stroke of the outstanding position of taper portion, so be difficult to improve the precision of machining accuracy and vertical angle, the life-span of mould shortens easily because friction is more.If the shortening stroke then has at the inside of bore of the punch accumulation blinking scrap, above-mentioned blinking scrap flies out on the surface of bed die, the rough sledding of operating efficiency variation.
Patent documentation 2, patent documentation 3, patent documentation 4 described inventions all can prevent to produce at peristome periphery the situation in crack, even and under the situation that can prevent from not to attract by air, still the fly out lip-deep situation of bed die of blinking scrap., recently, have by punch process and form the situation of diameter, have situation in addition, be difficult to offer prepared hole by boring processing in the thinner shape of local punching press less than the non through hole of 1mm.
In documents 5 described inventions, adopt the seam hole drift that projection is set, still, it necessarily requires prepared hole to process, and the projection of drift is not set then the punching press warpage if do not form prepared hole.
Therefore, the object of the present invention is to provide a kind of punched hole processing method, its relate at the non through hole of flexible print circuit substrate, need not part the shape processing of removal etc., adopt the punching press drift, form the punched hole processing method of peristome with impact style, even adopting punching press not to be inserted under the mould situation than short stroke of the outstanding position of taper portion from the bore of the punch of bed die with drift, the blinking scrap of flexible print circuit substrate does not still fly out on the surface of bed die, and can discharge downwards successively from the taper portion of bed die.
The present invention proposes to achieve these goals, technical scheme 1 described invention is the punching processing that forms peristome in the flexible print circuit substrate by impact style, relate to the position of carrying out this punching processing forms the occasion at position for the pattern that Copper Foil is set on face of insulating barrier or two faces punching processing, it is characterized in that before above-mentioned peristome is carried out punching processing, remove the above-mentioned pattern formation position of the inboard that forms above-mentioned peristome in advance by etching, above-mentioned insulating barrier is exposed.
According to this scheme, the pattern that the such Copper Foil of non through hole is set is being formed the occasion that punching processing is carried out at the position, by remove the Copper Foil of the inboard that forms peristome in advance with etching mode, because the part of getting rid of Copper Foil in the blinking scrap only forms insulating barrier, so this part can be easily bending, can slow down resilience force and prevent the fly out lip-deep situation of bed die of blinking scrap.
Technical solution of the present invention 2 described inventions provide a kind of punched hole processing method of flexible print circuit substrate, it is the punching processing that is to form by impact style in the flexible print circuit substrate peristome, relate to the position of carrying out this punching processing and be the circuitry substrate of sticking tablet, film etc. on face of insulating barrier or two faces punching processing with the occasion at the reinforcement position of reinforcement, it is characterized in that before above-mentioned peristome is carried out punching processing, by removing the above-mentioned reinforcement of the inboard that forms above-mentioned peristome, above-mentioned insulating barrier is exposed in advance.
According to this scheme, the circuitry substrate of sheet, film etc. is being pasted on the occasion that punching processing is carried out at position on the insulating barrier with reinforcement, by remove the reinforcement of the inboard that forms peristome in advance in modes such as punching press processing, the part of getting rid of reinforcement in the blinking scrap only forms insulating barrier, thus, it is can be easily crooked, can slow down resilience force and prevent the fly out lip-deep situation of bed die of blinking scrap.
Technical solution of the present invention 3 described inventions provide a kind of punched hole processing method of flexible print circuit substrate, it is the punching processing that is to form by impact style in the flexible print circuit substrate peristome, relate to the position of carrying out this punching processing be not provided with Copper Foil, the punching processing of the occasion of the extending part that insulating barrier exposes, it is characterized in that before above-mentioned peristome is carried out punching processing, above-mentioned extending part in the inboard that forms this peristome, in advance when the etch processes that pattern forms, Copper Foil arranged in that at least a portion of a face of insulating barrier or two faces is residual.
According to this scheme, do not carry out the occasion of punching processing Copper Foil being arranged at position on the flexible print circuit substrate, the at least a portion at the position that the insulating barrier in the inboard that forms peristome exposes is residual in advance Copper Foil, the section of blinking scrap is convex, and thus, mechanical strength increases, the bending of blinking scrap can be suppressed, can be suspended to the inner peripheral surface of the bore of the punch of bed die easily, not realize to prevent the situation about flying out of blinking scrap to the top of bed die towards the vacuum suction of punching press with drift.
Technical solution of the present invention 4 described inventions provide a kind of punched hole processing method of flexible print circuit substrate; it is the punching processing that is to form by impact style in the flexible print circuit substrate peristome; the position of carrying out this punching processing be not provided with Copper Foil; form the extending part that insulating barrier exposes; it is characterized in that before above-mentioned peristome is carried out punching processing; above-mentioned extending part in the inboard that forms this peristome; in advance when the scolding tin protective layer forms, on a face of insulating barrier or two faces, form the scolding tin protective layer.
According to this scheme; do not carry out the occasion of punching processing Copper Foil being arranged at position on the flexible print circuit substrate; the at least a portion at the position that the insulating barrier in the inboard that forms peristome exposes is pre-formed the scolding tin protective layer; like this; the cross section of blinking scrap is convex; thus; mechanical strength increases; the bending of blinking scrap can be suppressed; can be suspended to the inner peripheral surface of the bore of the punch of bed die easily; do not realize to prevent the situation about flying out of blinking scrap to the top of bed die towards the vacuum suction of punching press with drift.
The present invention as described above, relate to a kind of punched hole processing method, this method is at the non through hole processing of the used for electronic device that loads the flexible print circuit substrate, the punching press drift is adopted in shape processing without the removal of parts etc., form opening portion with impact style, wherein, even adopting punching press not to be inserted into drift under the situation of the mould of short stroke of the outstanding position of taper portion from the bore of the punch of bed die, blinking scrap does not still fly out on the surface of bed die, and can discharge downwards successively with good efficiency from the taper portion of bed die, thus, can eliminate the various defective of following blinking scrap.In addition, before the new punching processing of beginning, do not need to confirm on the surface of bed die, not have the operation of blinking scrap at every turn, can improve operating efficiency significantly.
Description of drawings
Fig. 1 represents an example of the punching processing of flexible print circuit substrate of the present invention, and Fig. 1 (1) is for being provided with the plane graph of the bond pad shapes of Copper Foil at punching position, and Fig. 1 (2) is the cutaway view of the X-X line of Fig. 1 (1);
The longitudinal sectional view of the motion of the blinking scrap in the bed die when Fig. 2 carries out punching processing for expression according to bond pad shapes shown in Figure 1;
Fig. 3 (1)～(3) are the illustrated planar figure of distortion example of the bond pad shapes of presentation graphs 1;
Fig. 4 represents an example of the punching processing of flexible print circuit substrate of the present invention, and Fig. 4 (1) is not for being provided with the plane graph of the bond pad shapes of Copper Foil at punching position, and Fig. 4 (2) is the cutaway view of the Y-Y line of Fig. 4 (1);
The longitudinal sectional view of the motion of the blinking scrap in the bed die when Fig. 5 carries out punching processing for expression according to bond pad shapes shown in Figure 4;
Fig. 6 (1)～(3) are the illustrated planar figure of the distortion example of expression bond pad shapes shown in Figure 4;
Fig. 7 is the longitudinal sectional view of the basic structure of the existing perforating die of expression;
Fig. 8 adopts perforating die shown in Figure 7 for expression, flex circuit substrate is carried out the longitudinal sectional view of the method for punching processing;
Fig. 9 is the longitudinal sectional view of the next step of expression punched hole processing method shown in Figure 8;
Figure 10 is the longitudinal sectional view of the next step of expression processing method shown in Figure 9;
Figure 11 is illustrated in the perforating die in the past, and the stroke of drift is than the longitudinal sectional view of the motion of the blinking scrap in the bed die of short occasion;
Figure 12 is in the perforating die that is illustrated in the past, the stereogram of the motion that the short occasion blinking scrap of the stroke of drift flies out from the bore of the punch of bed die;
Figure 13 is in the past the perforating die, the longitudinal sectional view of the blinking scrap the when part that Copper Foil is set on two faces is carried out punching processing;
Figure 14 is in the past the perforating die, the longitudinal sectional view of the motion that the occasion blinking scrap that the part that Copper Foil is set is carried out punching processing on two faces flies out from the bore of the punch of bed die;
Figure 15 is in the perforating die that is illustrated in the past, the longitudinal sectional view of the blinking scrap when only the part of insulating barrier is carried out punching processing;
Figure 16 is in the perforating die that is illustrated in the past, the longitudinal sectional view of the motion that the occasion blinking scrap that the part of insulating barrier is only carried out punching processing flies out from the bore of the punch of bed die.
Embodiment
Enumerating suitable embodiment below is described the punched hole processing method of flexible print circuit substrate of the present invention.Punched hole processing method at the flexible print circuit substrate, provide on the surface that the blinking scrap of flexible print circuit substrate do not fly out bed die, and from the taper portion of bed die, the purpose of the punched hole processing method of discharging downwards realizes by following manner successively, this mode is: such as, before carrying out the punching processing of peristome on the flexible print circuit substrate, in advance by etching remove Copper Foil that the inboard that forms this peristome is set pattern form the position, insulating barrier is exposed.
In addition, for convenience of explanation, for the identical part of the described structure of Fig. 7～Figure 16, the description that adopt same label, omit to repeat.
Embodiment 1
Fig. 1 is illustrated on the flexible print circuit substrate, forms an example of the punching processing of circular peristome (non through hole) at the pattern position (circular pad) that forms by Copper Foil, and Fig. 1 (1) is a plane graph, and Fig. 1 (2) is the cutaway view of X-X line.On flexible print circuit substrate 14, on the two sides of insulating barrier 17, form circular pad (wiring pattern part) by Copper Foil 16a, 16b, form non through hole in the part punched openings portion that centers on by dotted line A.The inside part 18 of the dotted line A of formation peristome is removed Copper Foil by etching in advance exposes insulating barrier 17.
If by punching press drift 13, dotted line A to above-mentioned flexible print circuit substrate 14 partly carries out punching processing, then shown in the image pattern 2 like that, blinking scrap 15 accumulates on the inside of the bore of the punch 12a of bed die 12, but, because the Copper Foil 16a in the inside part 18 of blinking scrap 15,16b is removed, only form insulating barrier 17, so this inside part 18 is crooked easily, shown in dotted line B part, the distortion of inside part 18 is easy, shown in dotted line C part, can slow down Copper Foil 16a, the resilience force of the inner peripheral surface of the circumference of the blinking scrap 15 that 16b is residual and the bore of the punch 12a of bed die prevents the situation that blinking scrap 15 flies out to the surface of bed die 12, blinking scrap 15 arrives the 12b of taper portion of bed die successively, and row downwards effectively.
In addition, the distortion of the blinking scrap 15 shown in the above-mentioned dotted line B part is different because of the flexibility of the insulating barrier 17 of flexible print circuit substrate 14, but, if carry out in the part of dotted line A of punching processing, the inside part 18 of removing Copper Foil by etching then is effective by forming from dotted line A to 0.3mm with interior zone.That is, residual have a Copper Foil 16a, 16b, until from dotted line A to 0.3mm with interior position.Therefore, such as, in the occasion of non through hole, remove the inside part 18 of Copper Foil more than or equal to 0.4mm φ by the punching mode from circular pad to 1.0mm φ.If well then best, further the inside part 18 of Copper Foil is removed in increase to aligning accuracy, it is preferably in the scope of 0.6～0.8mm φ.
In addition, for the shape of the peristome that forms by punching, in occasion for the approximate size of vertical and horizontal, as aforementioned, best, be the shape identical, and form from dotted line A to 0.3mm with interior regional etched Copper Foil removal part with the punching press shape.But, for the shape of the peristome that forms by punching press, if be vertical and horizontal, difference in size is 1.5 times or above occasion, according to end longitudinally, remove the mode of the part of Copper Foil and set, then also can be the shape identical with the peristome of punching press.
Such as, the distortion example shown in image pattern 3 (1)～(3) is such, even be different shape respectively, the inside part 18 of dotted line A is carried out etching, removes under the situation of Copper Foil, still can obtain effect as hereinbefore.Its reason is to have the distortion of blinking scrap longitudinally easily because of etching produces, the further effect that the bore of the punch 12a of bed die and the resilience force between the blinking scrap 15 slow down.
Also have, in the above in the flexible print circuit substrate 14 of the embodiment 1 of Miao Shuing, be illustrated in the pad that has Copper Foil 16a, 16b on the two sides of insulating barrier 17, obvious, even, still obtain identical effect only on a face, having under the situation of Copper Foil.
In addition, be by punching processing to paste bond layer on the one or both sides of insulating barrier, adhesive phase, the reinforcement plate that at least 1 face, has bonding agent or adhesive, the electromagnetic protection sheet, film etc. is in the light, various, the circuitry substrate of film etc. forms peristome with the position of reinforcement, this point is not shown in diagram, equally in this occasion, before peristome is carried out punching processing, by removing the reinforcement of the inboard of this peristome in modes such as punching press processing in advance, because the part of getting rid of reinforcement in the blinking scrap only forms insulating barrier, so this part can be crooked easily, resilience force can be slowed down, the situation that blinking scrap flies out to the surface of bed die can be prevented.For the zone of removing reinforcement, identical with the punching processing of the removal Copper Foil of describing by Fig. 1～Fig. 3.
Embodiment 2
Fig. 4 is given on the flexible print circuit substrate does not have Copper Foil, at the position that insulating barrier exposes, forms the example of punching processing of the peristome of circle that need not part with impact style, and Fig. 4 (1) is a plane graph, and Fig. 4 (2) is the cutaway view along the Y-Y line.In flexible print circuit substrate 14, by the peristome shown in the dotted line D Copper Foil be not set, insulating barrier 17 exposes.Inside part at dotted line D; in advance when the etch processes that pattern forms, residual at least a portion of the one or both sides of insulating barrier 17 have Copper Foil, or shown in the image pattern like that; on at least 1 part of a face of insulating barrier 17 or two faces, form scolding tin protective layer 21a, 21b in advance.
If by punching press drift 13, inside part to the dotted line D of flexible print circuit substrate 14 carries out punching processing, then shown in the image pattern 5 like that, blinking scrap 15 accumulates in the inside of bore of the punch 12a of bed die 12, but, because the cross section of blinking scrap 15 is convex, so mechanical strength increases, shown in dotted line E part and dotted line F part, the bending of blinking scrap 15 is suppressed, hang over easily on the inner peripheral surface of bore of the punch 12a of bed die, can prevent that blinking scrap 15 is to the situation about flying out at the top of bed die 12 to the vacuum suction of punching press with drift 13.
In order to suppress the bending of above-mentioned blinking scrap 15, if by from dotted line D to 0.3mm with interior zone, form in the dotted line D part of carrying out punching processing, Copper Foil or scolding tin protective layer 21a, 21b then are effective.That is, insulating barrier 17 is exposed, until from dotted line D to 0.3mm with interior position.For the male member that forms by Copper Foil or scolding tin protective layer 21a, 21b, if the mode that does not produce blinking scrap according to drift 13 consider, then be preferably in from the zone of dotted line D to 0.1～0.3mm, form the part that the cross section is convex.Therefore, such as the occasion in the punching press of the circle of carrying out 1.0mm Φ, the cross section that forms 0.4～0.8mm Φ is the part of convex.
In addition; shape for the peristome that forms by punching; in occasion for the approximate size of vertical and horizontal; as aforementioned; best, be and the approaching identical shape of punching press shape, and by Copper Foil or scolding tin protective layer 21a, 21b; form the part that the cross section is convex, until from dotted line D to 0.3mm with interior zone.But, if be the part that is convex by the cross section, the bending of blinking scrap 15 is suppressed, blinking scrap 15 is hung on the inner peripheral surface of bore of the punch 12a of bed die easily, slow down blinking scrap 15 and punching press shape, then also can be the shape identical with the peristome of punching processing with the vacuum suction of drift 13.
Such as, the distortion example shown in image pattern 6 (1)～(3) is such, in the inboard of dotted line D; with different shape,, form the part that the cross section is convex respectively by Copper Foil or scolding tin protective layer 21a, 21b; even in this case, still can suppress the bending of blinking scrap, obtain effect as hereinbefore.
Also have, only otherwise break away from spirit of the present invention, the present invention can realize various changes, in addition, obviously, the present invention relates to the scheme of this change.
Claims (4)
1. the punched hole processing method of a flexible print circuit substrate, it is the punching processing that is to form by impact style in the flexible print circuit substrate peristome, it relates to the position of carrying out this punching processing for the pattern that Copper Foil is set forms the punching processing of the occasion at position on face of insulating barrier or two faces, it is characterized in that:
Before above-mentioned peristome is carried out punching processing, remove the above-mentioned pattern formation position of the inboard that forms above-mentioned peristome in advance by etching, above-mentioned insulating barrier is exposed.
2. the punched hole processing method of a flexible print circuit substrate, it is the punching processing that is to form by impact style in the flexible print circuit substrate peristome, it relates to the position of carrying out this punching processing and is the circuitry substrate of sticking tablet, film etc. on face of insulating barrier or two faces punching processing with the occasion at the reinforcement position of reinforcement, it is characterized in that:
Before above-mentioned peristome is carried out punching processing, remove the above-mentioned reinforcement of the inboard that forms above-mentioned peristome in advance, above-mentioned insulating barrier is exposed.
3. the punched hole processing method of a flexible print circuit substrate, it is the punching processing that is to form by impact style in the flexible print circuit substrate peristome, relate to the position of carrying out this punching processing be not provided with Copper Foil, the punching processing of the occasion of the extending part that insulating barrier exposes is characterized in that:
Before above-mentioned peristome was carried out punching processing, in advance when the etch processes that pattern forms, there was a Copper Foil the above-mentioned extending part in the inboard that forms this peristome in that at least a portion of a face of insulating barrier or two faces is residual.
4. the punched hole processing method of a flexible print circuit substrate, it is the punching processing that is to form by impact style in the flexible print circuit substrate peristome, relate to the position of carrying out this punching processing be not provided with Copper Foil, the punching processing of the occasion of the extending part that insulating barrier exposes is characterized in that:
Before above-mentioned peristome is carried out punching processing, the above-mentioned extending part in the inboard that forms this peristome, in advance when the scolding tin protective layer forms, formation scolding tin protective layer on face of insulating barrier or two faces.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005001738 | 2005-01-06 | ||
| JP2005001738A JP4369874B2 (en) | 2005-01-06 | 2005-01-06 | Punching method for flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1802070A true CN1802070A (en) | 2006-07-12 |
| CN100548087C CN100548087C (en) | 2009-10-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100974118A Expired - Fee Related CN100548087C (en) | 2005-01-06 | 2005-12-28 | The punched hole processing method of flexible print circuit substrate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4369874B2 (en) |
| CN (1) | CN100548087C (en) |
| TW (1) | TW200626042A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100546441C (en) * | 2006-07-19 | 2009-09-30 | 比亚迪股份有限公司 | A kind of manufacture method of multi-layer flexible circuit board |
| CN101188909B (en) * | 2006-11-16 | 2010-06-16 | 比亚迪股份有限公司 | A flexible circuit board and its copper plating method |
| CN102170748A (en) * | 2010-02-26 | 2011-08-31 | 佳必琪国际股份有限公司 | Attaching type flexible circuit board, manufacturing method thereof and strip light with attaching type flexible circuit board |
| CN104972511A (en) * | 2015-07-08 | 2015-10-14 | 沪士电子股份有限公司 | Drilling method improving PCB plate counter-drilling precision |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5753976B2 (en) * | 2011-06-09 | 2015-07-22 | パナソニックＩｐマネジメント株式会社 | Punch material punching method, punching device and printed circuit board |
| CN105072807A (en) * | 2015-07-07 | 2015-11-18 | 安徽中大印制电路有限公司 | Circuit board production process |
-
2005
- 2005-01-06 JP JP2005001738A patent/JP4369874B2/en not_active Expired - Fee Related
- 2005-11-23 TW TW094141162A patent/TW200626042A/en not_active IP Right Cessation
- 2005-12-28 CN CNB2005100974118A patent/CN100548087C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100546441C (en) * | 2006-07-19 | 2009-09-30 | 比亚迪股份有限公司 | A kind of manufacture method of multi-layer flexible circuit board |
| CN101188909B (en) * | 2006-11-16 | 2010-06-16 | 比亚迪股份有限公司 | A flexible circuit board and its copper plating method |
| CN102170748A (en) * | 2010-02-26 | 2011-08-31 | 佳必琪国际股份有限公司 | Attaching type flexible circuit board, manufacturing method thereof and strip light with attaching type flexible circuit board |
| CN104972511A (en) * | 2015-07-08 | 2015-10-14 | 沪士电子股份有限公司 | Drilling method improving PCB plate counter-drilling precision |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100548087C (en) | 2009-10-07 |
| JP4369874B2 (en) | 2009-11-25 |
| TW200626042A (en) | 2006-07-16 |
| TWI301735B (en) | 2008-10-01 |
| JP2006190835A (en) | 2006-07-20 |
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