CN1170462C - Electronic device - Google Patents
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- CN1170462C CN1170462C CNB011203471A CN01120347A CN1170462C CN 1170462 C CN1170462 C CN 1170462C CN B011203471 A CNB011203471 A CN B011203471A CN 01120347 A CN01120347 A CN 01120347A CN 1170462 C CN1170462 C CN 1170462C
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- wiring pattern
- mentioned
- printing substrate
- flexible printing
- electronic equipment
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Abstract
To provide an electronic apparatus to reduce short-circuiting at low cost even when a flexible board is mounted in a position easy to contact a conductive material a possible to form a projected part like a burr. A flexible printed board 20 with at least one wiring pattern 23 is provided on the electronic apparatus 20. A dummy pattern 27a is provided at a position with which part of the flexible printed board 20 is put in contact with an conductive projected part, like burr 33a of the metallic screw 33 preventing the conductive projected part conducting with the wiring pattern 23.
Description
Technical field
The present invention relates to electronic equipment, specifically, relate to the electronic equipment that is carrying the flexible printing substrate.
Background technology
In recent years, in electronic equipment, use various flexible printing substrates.
Fig. 7 is the sectional drawing of one of expression single face flexible printing substrate 10 example.
Among Fig. 7, on base material 1, be provided with bond layer 2.On this bond layer 2, form some Wiring patterns 3, and be provided with the bond layer 4 that covers this Wiring pattern 3.On this bond layer 4, be provided with coverlay 5.
Fig. 8 is the sectional drawing of one of expression double-faced flexible printed base plate 11 example.
Among Fig. 8, on the one side of base material 1, with the single face flexible printing substrate of Fig. 7 similarly, be provided with bond layer 2, Wiring pattern 3, bond layer 4, coverlay 5.On the another side of base material 1, with above-mentioned one side similarly, be provided with bond layer 6, some Wiring patterns 7, bond layer 8, coverlay 9.
But in the above-mentioned existing electronic equipment, as Fig. 9 (a) with (b), majority is disposing the structure of metal primary screw below the flexible printing substrate.
Fig. 9 (a) is the figure that sees the flexible printing substrate that is positioned on the metallic plate from the top.Fig. 9 (b) is the sectional drawing along A-A ' line among the figure (a).
On single face flexible printing substrate 10a, form some thin Wiring pattern 3a and the Wiring pattern 3a ' thicker than this Wiring pattern 3a.Below flexible printing substrate 10a, be provided with the metallic plate 14 and the pedestal 15 of ground connection.These metallic plates 14 and pedestal 15 usefulness metal primary screws 16 are interfixing.
But, shown in Fig. 9 (b), when the head of metal primary screw 16 is formed with burr 16a, this burr 16a runs through base material 1, the bond layer 2 in the single face flexible printing substrate 10a, arrive Wiring pattern 3a, Wiring pattern 3a and 16 short circuits of metal primary screw have problems.
Figure 10 represents the 2nd conventional example.(a) being the top figure of flexible printing substrate, (b) is the B-B ' line sectional drawing of figure (a).
That is,, on this equipment, in the face of the single face flexible printing substrate 10b that is formed with Wiring pattern 3b, 3b ', avoid metal primary screw 16 head ground and form peristome 17 as Figure 10 (a) with (b).
Figure 11 represents the 3rd conventional example.(a) being the top figure of flexible printing substrate, (b) is the C-C ' line sectional drawing along figure (a).
That is,, in this equipment, form Wiring pattern 3c, 3c ' in the pairing part of the head of avoiding metal primary screw 16 as Figure 11 (a) with (b).Like this, can avoid being formed on the short circuit risk that the burr 16a of metal primary screw 16 heads causes.
In addition, adopt the equipment of double-faced flexible printed base plate, as shown in figure 12.
Figure 12 (a) is the top figure that represents double-faced flexible printed base plate face side before, (b) is the perspective view of seeing double-faced flexible printed base plate rear side shown in this figure (a) from face side, (c) is along the figure (a) and (b) sectional drawing of middle D-D ' line.
This double-faced flexible printed base plate 11a forms some Wiring pattern 3d and 3d ' in face side, and side is avoided metal primary screw 16 heads institute counterpart overleaf, forms some Wiring pattern 7a and 7a '.
At this moment, in order to ensure the distribution zone, shown in Figure 12 (a), with the head of the metal primary screw 16 direct Wiring pattern of contact side not, do not avoid the head counterpart of metal primary screw 16, shown in Figure 12 (b), only avoid metal primary screw 16 head counterparts with the Wiring pattern of the direct contact side of head of metal primary screw 16.
But shown in Figure 12 (c), because of varying in size of the burr 16a of metal primary screw 16, big burr runs through coverlay 9, bond layer 8, bond layer 6, base material 1, bond layer 2 sometimes, exists the risk of short-circuits with Wiring pattern 3d.
In addition, on metallic plate the time, be following structure with 2 single face flexible printing substrate overlay configuration.
Figure 13 represent before with the example of 2 single face flexible printing substrate overlay configuration on metallic plate.(a) being the top figure of expression upside single face flexible printing substrate surface side, (b) is the top figure of expression downside single face flexible printing substrate surface side, is along this figure (a) and the sectional drawing of the E-E ' line (b) (c).
The single face flexible printing substrate 10d of upside
1, by base material 1
1, bond layer 2
1, some Wiring pattern 3e
1And 3e
1', bond layer 4
1, coverlay 5
1Constitute.Equally, the single face flexible printing substrate 10d of downside
2, by base material 1
2, bond layer 2
2, some Wiring pattern 3e
2And 3e
2', bond layer 4
2, coverlay 5
2Constitute.
In order to ensure the distribution zone, the direct single face flexible printing substrate 10d of contacting metal primary screw 16 heads not
1Wiring pattern 3e
1And 3e
1', do not avoid the counterpart of metal primary screw 16 heads, only the direct single face flexible printing substrate 10d of contacting metal primary screw 16 heads
2Wiring pattern 3e
2And 3e
2' avoid the counterpart of metal primary screw 16 heads.
But even like this, shown in Figure 13 (c), Yin Maoci 16a varies in size, and big burr runs through the single face flexible printing substrate 10d2 of downside sometimes, runs through the flexible printing substrate 10d of upside
1Base material 1
1, bond layer 2
1, exist and Wiring pattern 3e
1And 3e
1' risk of short-circuits.
Summary of the invention
The present invention makes in view of the above problems, its purpose is to provide a kind of electronic equipment and flexible printing substrate, this flexible printing substrate even be configured in and the conductive component position contacting that may form juts such as burr, also can reduce short circuit risk with low cost.
Electronic equipment of the present invention, carrying the flexible printing substrate, this flexible printing substrate has at least more than one Wiring pattern, it is characterized in that, at the part of above-mentioned flexible printing substrate, the position that promptly contacts, form the empty Wiring pattern that prevents this conductive component and above-mentioned Wiring pattern conducting with conductive component in this electronic equipment.
Described electronic equipment is characterized in that, above-mentioned flexible printing substrate is a two sides flexible printing substrate, is formed with the 1st Wiring pattern in a side of substrate, is formed with the 2nd Wiring pattern at the opposite side of substrate.
Described electronic equipment is characterized in that, above-mentioned empty Wiring pattern is formed on on the one side with the Wiring pattern near above-mentioned conductive component in above-mentioned the 1st Wiring pattern and the 2nd Wiring pattern.
Double-faced flexible printed base plate of the present invention; holding side's side of base material under the arm; form the 1st Wiring pattern; in the opposing party's side; form the 2nd Wiring pattern; it is characterized in that, see from above with above-mentioned the 1st Wiring pattern position overlapped, promptly with above-mentioned the 2nd Wiring pattern with one side on, form the empty Wiring pattern of above-mentioned the 1st Wiring pattern of protection.
Like this, the available low-cost Wiring pattern of flexible printing substrate and the short circuit risk between conductive component of reducing.
Description of drawings
Fig. 1 represents the structure of the electronic equipment of the present invention the 1st embodiment, (a) be the top figure of expression double-faced flexible printed base plate face side, (b) being the perspective view of representing the rear side of double-faced flexible printed base plate shown in (a) from face side, (c) is along (a) and the sectional drawing of the F-F ' line (b).
Fig. 2 represents the structure of the electronic equipment of the present invention the 2nd embodiment, (a) be the top figure of the single face flexible printing substrate surface side of expression upside, (b) being the top figure of expression downside single face flexible printing substrate surface side, is along (a) and the sectional drawing of the G-G ' line (b) (c).
Fig. 3 represents the structure of the electronic equipment of the present invention the 3rd embodiment, (a) be the top figure of expression double-faced flexible printed base plate face side, (b) being the perspective view of representing the rear side of double-faced flexible printed base plate shown in (a) from face side, (c) is along (a) and the sectional drawing of the H-H ' line (b).
Fig. 4 is the 1st application examples of the present invention, is illustrated in the state that forms punching on the metallic plate, (a) is stereogram, the I-I ' line sectional drawing in (b) (a).
Fig. 5 is the 2nd application examples of the present invention, and the engagement state of 2 metallic plates of expression (a) is stereogram, (b) is the J-J ' line sectional drawing in (a).
Fig. 6 is the 3rd application examples of the present invention, and expression lead-type electric parts is installed in the figure of state on the printed base plate.
Fig. 7 is a sectional drawing of representing one of single face flexible printing substrate example before.
Fig. 8 is a sectional drawing of representing one of double-faced flexible printed base plate example before.
Fig. 9 (a) is the figure that sees the flexible printing substrate that is positioned on the metallic plate from the top, and Fig. 9 (b) is the A-A ' line sectional drawing in (a).
Figure 10 represents the 2nd example before, is the top figure of flexible printing substrate (a), (b) is the B-B ' line sectional drawing in (a).
Figure 11 represents the 3rd example before, is the top figure of flexible printing substrate (a), (b) is the C-C ' line sectional drawing in (a).
Among Figure 12, (a) being the top figure that represents double-faced flexible printed base plate face side before, is the perspective view of representing the rear side of double-faced flexible printed base plate shown in (a) from face side (b), (c) be (a) and (b) in D-D ' line sectional drawing.
Figure 13 represent before with the example of 2 single face flexible printing substrate overlay configuration on metallic plate, (a) be the top figure of expression upside single face flexible printing substrate surface side, (b) be the top figure of expression downside single face flexible printing substrate surface side, (c) be (a) and (b) in E-E ' line sectional drawing.
Embodiment
Below, with reference to the description of drawings embodiments of the invention.
Fig. 1 represents the structure of the electronic equipment of the present invention the 1st embodiment.(a) being the top figure of expression double-faced flexible printed base plate face side, is the perspective view of representing the rear side of double-faced flexible printed base plate shown in (a) from face side (b), (c) be (a) and (b) in F-F ' line sectional drawing.
This double-faced flexible printed base plate 20 is as constitute followingly.That is, on a face of base material 21, bond layer 22 is set.On this bond layer 22, separate predetermined space, form some Wiring patterns 23 and the Wiring pattern 23 thicker than this Wiring pattern 23 '.On bond layer 22, be provided with cover Wiring pattern 23 and 23 ' bond layer 24.On this bond layer 24, coverlay 25 is set.
On another face of base material 21, with an above-mentioned face side similarly, bond layer 26 is set.On this bond layer 26,, form empty Wiring pattern (ダ ミ one distribution パ -Application) 27a at the counterpart of this flexible printing substrate 20 with the head contact position of aftermentioned metal primary screw 33.This void Wiring pattern 27a, be with other Wiring pattern 27,27 ' electric independent be provided with prevent the Wiring pattern that short circuit is used.
On above-mentioned bond layer 26, avoid above-mentioned empty Wiring pattern 27a, with predetermined space form some Wiring patterns 27 and the Wiring pattern 27 thicker than this Wiring pattern 27 '.In addition, on above-mentioned bond layer 26, be provided with and cover above-mentioned Wiring pattern 27,27 ' and bond layer 28 of empty Wiring pattern 27a.On this bond layer 28, coverlay 29 is set.Above-mentioned Wiring pattern 23,23 ', 27,27 ' and empty Wiring pattern 27a, be to constitute with metal materials such as copper, aluminium.
Below the flexible printing substrate 20 of this structure, the metallic plate 31 and the pedestal 32 of ground connection is set.These metallic plates 31 and pedestal 32 usefulness metal primary screws 33 interfix.
Like this, on metallic plate 31, disposing in the electronic equipment of flexible printing substrate 20, supposing at the jagged 33a of the head of metal primary screw 33.So before, this burr 33a runs through coverlay 29, the bond layer 28 in the flexible printing substrate 20a, exists and the Wiring pattern risk of short-circuits.
And in the technology of present embodiment, with the counterpart of the head contact position of above-mentioned metal primary screw 33, form empty Wiring pattern 27a.Therefore, run through the burr 33a of coverlay 29, bond layer 28, arrived empty Wiring pattern 27a.Because empty Wiring pattern 27a is the electric independently Wiring pattern that prevents that short circuit from using, so, do not produce short circuit with metal primary screw 33.
In addition, in flexible printing substrate 20, in the part that head contacted of metal primary screw 33, form empty Wiring pattern 27a, like this, the Wiring pattern 23 of face side draws back with the distance of the burr 33a of metal primary screw 33, so, can reduce Yin Maoci 33a and cause risk of short-circuits.
In addition, owing to have the metal level of empty Wiring pattern 27a, flexible printing substrate 20 hardness own also increase.Available and the common same operation of Wiring pattern formation method of the manufacturing of substrate is carried out, and does not need special cost, but qurer is realized.
Below, the 2nd embodiment of the present invention is described.
The 2nd embodiment is that expression is with the stacked example of single face flexible printing substrate.
Among Fig. 2, (a) being the top figure of single face flexible printing substrate surface side of expression upside, (b) is the top figure of expression downside single face flexible printing substrate surface side, (c) be (a) and (b) in G-G ' line sectional drawing.
The single face flexible printing substrate 35 of upside is by base material 21
1, be arranged on this base material 21
1On bond layer 22
1, be formed on this bond layer 22 with predetermined space
1On some Wiring patterns 23
1And than this Wiring pattern 23
1Thick Wiring pattern 23
1', cover this Wiring pattern 23
1With Wiring pattern 23
1' bond layer 24
1, and be arranged on this bond layer 24
1On coverlay 25
1Constitute.
The single face flexible printing substrate 36 of downside is by base material 21
2, be arranged on this base material 21
2On bond layer 22
2, be formed on this bond layer 22 with predetermined space
2On some Wiring patterns 23
2, 23
2', empty Wiring pattern 23a, cover this Wiring pattern 232, Wiring pattern 23
2' and the bond layer 24 of empty Wiring pattern 23a
2, and be arranged on this bond layer 24
2On coverlay 25
2Constitute.
Above-mentioned empty Wiring pattern 23a is and other Wiring pattern 23
2, 23
2' electric independent anti-short circuit the Wiring pattern that is provided with is formed on flexible printing substrate 36 part corresponding with the head contact position of metal primary screw 33.In addition, Wiring pattern 23
2, 23
2', avoid the configuration of empty Wiring pattern 23a ground.
Like this, not with upside single face flexible printing substrate 35 that metal primary screw 33 directly contacts in, Wiring pattern Figure 23
1And 23
1' do not avoid metal primary screw 33, with downside single face flexible printing substrate 36 that metal primary screw 33 directly contacts on, form empty Wiring pattern 23a.
With downside single face flexible printing substrate 36 that metal primary screw 33 directly contacts on, form empty Wiring pattern Figure 23 a, like this, the Wiring pattern 23 of upside single face flexible printing substrate 35
2, Wiring pattern 23
2' draw back with the distance of the burr 33a of metal primary screw 33, so, can reduce burr 33a and cause risk of short-circuits.
In addition, owing to form the metal level of empty Wiring pattern 23a, so the hardness of flexible printing substrate 36 also increases.On making, carry out with the operation that common Wiring pattern formation method is same, thus do not need special cost, but qurer is realized.
Below, the present invention the 3rd embodiment is described.
The 3rd embodiment is the example that the empty Wiring pattern of double-faced flexible printed base plate is also used as ground wire.
Among Fig. 3, being the top figure of expression double-faced flexible printed base plate face side (a), is the perspective view of representing the rear side of double-faced flexible printed base plate shown in (a) from face side (b), (c) be (a) and (b) in H-H ' line sectional drawing.
Double-faced flexible printed base plate 38, by base material 21, bond layer 22, some Wiring patterns 23 and Wiring pattern 23 ', bond layer 24, coverlay 25, bond layer 26, some Wiring patterns 27 and Wiring pattern 27b, ground wire Wiring pattern 27c, bond layer 28, coverlay 29 constitute.
Among the 3rd embodiment, some Wiring patterns 23 of face side, with above-mentioned the 1st embodiment similarly, form with predetermined space.And the Wiring pattern of rear side such as following formation.
That is, ground wire Wiring pattern 27c comprises flexible printing substrate 38 and forms with metal primary screw 33 head contact position counterpart ground.Avoid this ground wire Wiring pattern 27c, form some Wiring patterns 27 and the Wiring pattern 27b thicker than this Wiring pattern 27 with predetermined space.
On metallic plate 31, in the electronic equipment of the flexible printing substrate 38 of this structure of configuration, suppose at the jagged 33a of the head of metal primary screw 33.So this burr 33a runs through coverlay 29, the bond layer 28 in the flexible printing substrate 38a, exists and the Wiring pattern risk of short-circuits.
But the Wiring pattern that contacts with above-mentioned burr 33a is ground wire Wiring pattern 27c.So, metallic plate 31 ground connection of fixing with metal primary screw 33, thus on circuit, can not have problems.
Like this, part in 33 contacts of metal primary screw, form ground wire Wiring pattern 27c, so the Wiring pattern 23 of face side draws back with the distance of the burr 33a of metal primary screw 33, in addition, owing to form the metal level of ground wire Wiring pattern 27c, so, flexible printing substrate 38 hardness own also increase, and can reduce burr 33a and cause risk of short-circuits.
Like this, empty Wiring pattern can be used as Wiring pattern, can guarantee other Wiring pattern zone easily.
In the foregoing description, the situation when the flexible printing substrate contacts with the metal primary screw has been described, still, when the flexible printing substrate is configured in other conductive component (may produce the parts of the such jut of burr) position contacting, also can have used.
Below, application examples of the present invention is described.
Fig. 4 is illustrated in the state that forms punching on the metallic plate, (a) is stereogram, the I-I ' line sectional drawing in (b) (a).
When on metallic plate 40, forming hole 41, produced burr.Therefore, when being configured in the flexible printing substrate on this metallic plate 40, the position that contacts with above-mentioned jut on the flexible printing substrate forms empty Wiring pattern as described above.
Fig. 5 represents the engagement state of 2 metallic plates, (a) is stereogram, (b) is the J-J ' line sectional drawing in (a).
Predetermined position at a side metallic plate 43 forms 2 holes 44.2 juts of the opposing party's metallic plate 45 insert in the above-mentioned hole 44 respectively and bending, and such 2 metallic plates are fixed.
At this moment, owing to produce burr, so when the flexible printing substrate being configured on the jut of this metallic plate 45, the position that contacts with above-mentioned jut on the flexible printing substrate forms empty Wiring pattern as described above at the jut front end of metallic plate 45.
Fig. 6 is the figure that expression lead-type electric parts is installed in state on the printed base plate.
The lead 51 of electronic unit 50 inserts in the hole 49 that is formed on the printed base plate 48, with soldering 52 this electronic unit 50 is fixed on the printed base plate 48.By the lead 51 of the electronic unit 50 of soldering, leading section 53 forms sharp-pointed shape when cutting.
At this moment, the leading section 53 of the lead 51 that is cut is states identical with burr, so, when being configured on this leading section 53, form empty Wiring pattern as described above onboard to the flexible printing substrate.In addition, above-mentioned printed base plate 48 can be illustrated hard substrate, also can be the flexible printing substrate.
As mentioned above, according to the present invention, part in conductive component and flexible printing substrate contacts, form empty Wiring pattern, the distance of Wiring pattern and conductive component is drawn back, owing to have the metal level of empty Wiring pattern,, can reduce burr etc. and cause risk of short-circuits so the hardness of flexible printing substrate also increases.
In addition, empty Wiring pattern is also used as the ground wire Wiring pattern, empty Wiring pattern can be used as Wiring pattern, can easily guarantee other Wiring pattern zone.
Claims (17)
1. electronic equipment, carrying the flexible printing substrate, this flexible printing substrate has at least more than one Wiring pattern, it is characterized in that, at the part of above-mentioned flexible printing substrate, the position that promptly contacts, form the empty Wiring pattern that prevents this conductive component and above-mentioned Wiring pattern conducting with conductive component in this electronic equipment.
2. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned empty Wiring pattern is between the Wiring pattern and above-mentioned conductive component of flexible printing substrate.
3. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned flexible printing substrate is a two sides flexible printing substrate, is formed with the 1st Wiring pattern in a side of substrate, is formed with the 2nd Wiring pattern at the opposite side of substrate.
4. electronic equipment as claimed in claim 3 is characterized in that, above-mentioned empty Wiring pattern is formed on on the one side with the Wiring pattern near above-mentioned conductive component in above-mentioned the 1st Wiring pattern and the 2nd Wiring pattern.
5. electronic equipment as claimed in claim 3 is characterized in that, above-mentioned empty Wiring pattern insulate with respect to the parts of the outside of this substrate.
6. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned flexible printing substrate is the single face flexible printing substrate that only forms Wiring pattern in the one side side of this substrate.
7. electronic equipment as claimed in claim 6 is characterized in that, above-mentioned single face flexible printing substrate on above-mentioned single face flexible printing substrate, is also disposing another flexible printing substrate under the state that is assembled on the electronic equipment.
8. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned empty Wiring pattern is as ground wire.
9. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned empty Wiring pattern is the wire Wiring pattern that forms on the direction vertical with the wiring direction of above-mentioned Wiring pattern.
10. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned conductive component is the metal primary screw.
11. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned conductive component is formed in the hole portion on the conductive component.
12. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned conductive component is the wire portion of electronic unit or this electronic unit.
13. the double-faced flexible printed base plate holding side's side of base material under the arm, forms the 1st Wiring pattern, in the opposing party's side, forms the 2nd Wiring pattern, it is characterized in that,
See from above with above-mentioned the 1st Wiring pattern position overlapped, promptly with above-mentioned the 2nd Wiring pattern with one side on, form the empty Wiring pattern of above-mentioned the 1st Wiring pattern of protection.
14. double-faced flexible printed base plate as claimed in claim 13 is characterized in that, above-mentioned empty Wiring pattern prevents that outside conductive component and above-mentioned the 1st Wiring pattern from electrically contacting.
15. double-faced flexible printed base plate as claimed in claim 13 is characterized in that, above-mentioned empty Wiring pattern insulate with respect to the external component of this substrate.
16. double-faced flexible printed base plate as claimed in claim 13 is characterized in that, above-mentioned empty Wiring pattern is as ground wire.
17. double-faced flexible printed base plate as claimed in claim 13 is characterized in that, above-mentioned empty Wiring pattern is the wire Wiring pattern that forms in the direction vertical with respect to the wiring direction of above-mentioned the 1st Wiring pattern.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP238548/2000 | 2000-08-07 | ||
| JP2000238548A JP2002050839A (en) | 2000-08-07 | 2000-08-07 | Electronic apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1337842A CN1337842A (en) | 2002-02-27 |
| CN1170462C true CN1170462C (en) | 2004-10-06 |
Family
ID=18730235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011203471A Expired - Fee Related CN1170462C (en) | 2000-08-07 | 2001-08-07 | Electronic device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2002050839A (en) |
| CN (1) | CN1170462C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4901332B2 (en) * | 2006-06-30 | 2012-03-21 | 日本メクトロン株式会社 | Flexible printed wiring board |
| CN107708289B (en) * | 2017-09-11 | 2020-07-03 | Oppo广东移动通信有限公司 | Flexible circuit board assembly, manufacturing method thereof and mobile terminal |
| CN107592748B (en) * | 2017-09-11 | 2020-05-08 | Oppo广东移动通信有限公司 | Flexible circuit board assembly, manufacturing method thereof and mobile terminal |
-
2000
- 2000-08-07 JP JP2000238548A patent/JP2002050839A/en not_active Withdrawn
-
2001
- 2001-08-07 CN CNB011203471A patent/CN1170462C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1337842A (en) | 2002-02-27 |
| JP2002050839A (en) | 2002-02-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20041006 Termination date: 20180807 |