CN1337842A - Electronic device - Google Patents
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- CN1337842A CN1337842A CN 01120347 CN01120347A CN1337842A CN 1337842 A CN1337842 A CN 1337842A CN 01120347 CN01120347 CN 01120347 CN 01120347 A CN01120347 A CN 01120347A CN 1337842 A CN1337842 A CN 1337842A
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Abstract
To provide an electronic apparatus to reduce short-circuiting at low cost even when a flexible board is mounted in a position easy to contact a conductive material a possible to form a projected part like a burr. A flexible printed board 20 with at least one wiring pattern 23 is provided on the electronic apparatus 20. A dummy pattern 27a is provided at a position with which part of the flexible printed board 20 is put in contact with an conductive projected part, like burr 33a of the metallic screw 33 preventing the conductive projected part conducting with the wiring pattern 23.
Description
Technical field
The present invention relates to electronic equipment, specifically, relate to the electronic equipment that is carrying the flexible printing substrate.
Background technology
In recent years, in electronic equipment, use various flexible printing substrates.
Fig. 7 is the sectional drawing of one of expression single face flexible printing substrate 10 example.
Among Fig. 7, on base material 1, be provided with bond layer 2.On this bond layer 2, form some Wiring patterns 3, and be provided with the bond layer 4 that covers this Wiring pattern 3.On this bond layer 4, be provided with coverlay 5.
Fig. 8 is the sectional drawing of one of expression double-faced flexible printed base plate 11 example.
Among Fig. 8, on the one side of base material 1, with the single face flexible printing substrate of Fig. 7 similarly, be provided with bond layer 2, Wiring pattern 3, bond layer 4, coverlay 5.At base material 1
On the another side, with above-mentioned one side similarly, be provided with bond layer 6, some Wiring patterns 7, bond layer 8, coverlay 9.
But in the above-mentioned existing electronic equipment, as Fig. 9 (a) with (b), majority is disposing the structure of metal primary screw below the flexible printing substrate.
Fig. 9 (a) is the figure that sees the flexible printing substrate that is positioned on the metallic plate from the top.Fig. 9 (b) is the sectional drawing along A-A ' line among the figure (a).
On single face flexible printing substrate 10a, form some thin Wiring pattern 3a and the Wiring pattern 3a ' thicker than this Wiring pattern 3a.Below flexible printing substrate 10a, be provided with the metallic plate 14 and the pedestal 15 of ground connection.These metallic plates 14 and pedestal 15 usefulness metal primary screws 16 are interfixing.
But, shown in Fig. 9 (b), when the head of metal primary screw 16 is formed with burr 16a, this burr 16a runs through base material 1, the bond layer 2 in the single face flexible printing substrate 10a, arrive Wiring pattern 3a, Wiring pattern 3a and 16 short circuits of metal primary screw have problems.
Figure 10 represents the 2nd conventional example.(a) being the top figure of flexible printing substrate, (b) is the B-B ' line sectional drawing of figure (a).
That is,, on this equipment, in the face of the single face flexible printing substrate 10b that is formed with Wiring pattern 3b, 3b ', avoid metal primary screw 16 head ground and form peristome 17 as Figure 10 (a) with (b).
Figure 11 represents the 3rd conventional example.(a) being the top figure of flexible printing substrate, (b) is the C-C ' line sectional drawing along figure (a).
That is,, in this equipment, form Wiring pattern 3c, 3 c ' in the pairing part of the head of avoiding metal primary screw 16 as Figure 11 (a) with (b).Like this, can avoid being formed on the short circuit risk that the burr 16a of metal primary screw 16 heads causes.
In addition, adopt the equipment of double-faced flexible printed base plate, as shown in figure 12.
Figure 12 (a) is the top figure that represents double-faced flexible printed base plate face side before, (b) is the perspective view of seeing double-faced flexible printed base plate rear side shown in this figure (a) from face side, (c) is along the figure (a) and (b) sectional drawing of middle D-D ' line.
This double-faced flexible printed base plate 11a forms some Wiring pattern 3d and 3d ' in face side, and side is avoided metal primary screw 16 heads institute counterpart overleaf, forms some Wiring pattern 7a and 7a '.
At this moment, in order to ensure the distribution zone, shown in Figure 12 (a), with the head of the metal primary screw 16 direct Wiring pattern of contact side not, do not avoid the head counterpart of metal primary screw 16, shown in Figure 12 (b), only avoid metal primary screw 16 head counterparts with the Wiring pattern of the direct contact side of head of metal primary screw 16.
But shown in Figure 12 (c), because of varying in size of the burr 16a of metal primary screw 16, big burr runs through coverlay 9, bond layer 8, bond layer 6, base material 1, bond layer 2 sometimes, exists the risk of short-circuits with Wiring pattern 3d.
In addition, on metallic plate the time, be following structure with 2 single face flexible printing substrate overlay configuration.
Figure 13 represent before with the example of 2 single face flexible printing substrate overlay configuration on metallic plate.(a) being the top figure of expression upside single face flexible printing substrate surface side, (b) is the top figure of expression downside single face flexible printing substrate surface side, is along this figure (a) and the sectional drawing of the E-E ' line (b) (c).
The single face flexible printing substrate 10d1 of upside is made of base material 11, bond layer 21, some Wiring pattern 3e1 and 3e1 ', bond layer 41, coverlay 51.Equally, the single face flexible printing substrate 10d2 of downside is made of base material 12, bond layer 22, some Wiring pattern 3e2 and 3e2 ', bond layer 41, coverlay 52.
In order to ensure the distribution zone, not directly Wiring pattern 3e1 and the 3e1 ' of the single face flexible printing substrate 10d1 of contacting metal primary screw 16 heads, do not avoid the counterpart of metal primary screw 16 heads, only the Wiring pattern 3e2 of the single face flexible printing substrate 10d2 of direct contacting metal primary screw 16 heads and the counterpart that 3e2 ' avoids metal primary screw 16 heads.
But, even like this, shown in Figure 13 (c), because of varying in size of burr 16a, big burr runs through the single face flexible printing substrate 10d2 of downside sometimes, run through base material 11, the bond layer 21 of the flexible printing substrate 10d1 of upside, exist and Wiring pattern 3e1 and 3e1 ' risk of short-circuits.
The present invention makes in view of the above problems, its purpose is to provide a kind of electronic equipment and flexible printing substrate, this flexible printing substrate even be configured in and the conductive component position contacting that may form juts such as burr, also can reduce short circuit risk with low cost.
That is, electronic equipment of the present invention is carrying the flexible printing substrate, and this flexible printing substrate has at least more than one Wiring pattern, it is characterized in that, has the conductive component that constitutes this electronic equipment internal; Above-mentioned flexible substrate, with above-mentioned conductive component position contacting double-faced flexible printed base plate of the present invention, holding side's side of base material under the arm, form the 1st Wiring pattern, in the opposing party's side, form the 2nd Wiring pattern,
See from above, with above-mentioned the 1st Wiring pattern position overlapped, promptly with above-mentioned the 2nd Wiring pattern with one side on, form the empty Wiring pattern of above-mentioned the 1st Wiring pattern of protection.
In the electronic equipment of above-mentioned the 1st invention, carry the flexible printing substrate that has an above Wiring pattern at least, having the conductive component that constitutes this electronic equipment internal.In addition, above-mentioned flexible printing substrate, and above-mentioned conductive component contact position near, be provided with the empty Wiring pattern of Wiring pattern of this flexible printing substrate of protection.
In the double-faced flexible printed base plate of above-mentioned the 2nd invention; holding side's side of base material under the arm; form the 1st Wiring pattern; in the opposing party's side; form the 2nd Wiring pattern, it is characterized in that, see from above; with above-mentioned the 1st Wiring pattern position overlapped, promptly with above-mentioned the 2nd Wiring pattern with one side on, form the empty Wiring pattern of above-mentioned the 1st Wiring pattern of protection.
Like this, the available low-cost Wiring pattern of flexible printing substrate and the short circuit risk between conductive component of reducing.
Description of drawings
Fig. 1 represents the structure of the electronic equipment of the present invention the 1st embodiment, (a) be the top figure of expression double-faced flexible printed base plate face side, (b) being the perspective view of representing the rear side of double-faced flexible printed base plate shown in (a) from face side, (c) is along (a) and the sectional drawing of the F-F ' line (b).
Fig. 2 represents the structure of the electronic equipment of the present invention the 2nd embodiment, (a) be the top figure of the single face flexible printing substrate surface side of expression upside, (b) being the top figure of expression downside single face flexible printing substrate surface side, is along (a) and the sectional drawing of the G-G ' line (b) (c).
Fig. 3 represents the structure of the electronic equipment of the present invention the 3rd embodiment, (a) be the top figure of expression double-faced flexible printed base plate face side, (b) being the perspective view of representing the rear side of double-faced flexible printed base plate shown in (a) from face side, (c) is along (a) and the sectional drawing of the H-H ' line (b).
Fig. 4 is the 1st application examples of the present invention, is illustrated in the state that forms punching on the metallic plate, (a) is stereogram, the I-I ' line sectional drawing in (b) (a).
Fig. 5 is the 2nd application examples of the present invention, and the engagement state of 2 metallic plates of expression (a) is stereogram, (b) is the J-J ' line sectional drawing in (a).
Fig. 6 is the 3rd application examples of the present invention, and expression lead-type electric parts is installed in the figure of state on the printed base plate.
Fig. 7 is a sectional drawing of representing one of single face flexible printing substrate example before.
Fig. 8 is a sectional drawing of representing one of double-faced flexible printed base plate example before.
Fig. 9 (a) is the figure that sees the flexible printing substrate that is positioned on the metallic plate from the top, and Fig. 9 (b) is the A-A ' line sectional drawing in (a).
Figure 10 represents the 2nd example before, is the top figure of flexible printing substrate (a), (b) is the B-B ' line sectional drawing in (a).
Figure 11 represents the 3rd example before, is the top figure of flexible printing substrate (a), (b) is the C-C ' line sectional drawing in (a).
Among Figure 12, (a) being the top figure that represents double-faced flexible printed base plate face side before, is the perspective view of representing the rear side of double-faced flexible printed base plate shown in (a) from face side (b), (c) be (a) and (b) in D-D ' line sectional drawing.
Figure 13 represent before with the example of 2 single face flexible printing substrate overlay configuration on metallic plate, (a) be the top figure of expression upside single face flexible printing substrate surface side, (b) be the top figure of expression downside single face flexible printing substrate surface side, (c) be (a) and (b) in E-E ' line sectional drawing.
The specific embodiment
Below, with reference to the description of drawings embodiments of the invention.
Fig. 1 represents the structure of the electronic equipment of the present invention the 1st embodiment. (a) be that expression is two The top figure of the flexible printed base plate face side of face is to represent shown in (a) two from face side (b) The perspective view of the flexible printed base plate rear side of face, (c) be (a) and (b) in F-F ' The line sectional drawing.
This two-sided flexible printed base plate 20 is as consist of followingly. That is, of base material 21 On the face, bond layer 22 is set. On this bond layer 22, separate predetermined space, shape Become some distribution patterns 23 and the distribution pattern 23 thicker than this distribution pattern 23 '. On the bond layer 22, arrange cover distribution pattern 23 and 23 ' bond layer 24. On this bond layer 24, coverlay 25 is set.
On another face of base material 21, with an above-mentioned face side similarly, bonding agent is set Layer 26. On this bond layer 26, little with the aftermentioned metal at this flexible printed base plate 20 The counterpart of the head contact position of screw 33 forms empty distribution pattern (ダ ミ-distribution パ -Application) 27a. This void distribution pattern 27a, be with other distribution pattern 27, 27 ' electric independent arrange prevent the distribution pattern that short circuit is used.
On above-mentioned bond layer 26, avoid above-mentioned empty distribution pattern 27a, between predetermined Every form some distribution patterns 27 and the distribution pattern 27 thicker than this distribution pattern 27 '. In addition, on above-mentioned bond layer 26, arrange cover above-mentioned distribution pattern 27,27 ' Bond layer 28 with empty distribution pattern 27a. On this bond layer 28, setting is covered Epiphragma 29. Above-mentioned distribution pattern 23,23 ', 27,27 ' and empty distribution pattern 27a is to consist of with metal materials such as copper, aluminium.
Below the flexible printed base plate 20 of this structure, metallic plate 31 Hes of ground connection are set Pedestal 32. These metallic plates 31 and pedestal 32 usefulness metal primary screws 33 interfix.
Like this, disposing in the electronic equipment of flexible printed base plate 20 at metallic plate 31, Suppose at the jagged 33a of the head of metal primary screw 33. So, before, this burr 3 3a runs through coverlay 29, the bond layer 28 in the flexible printed base plate 20a, exists The danger with the short circuit of distribution pattern.
And in the technology of present embodiment, with the head contact position of above-mentioned metal primary screw 33 Counterpart, form empty distribution pattern 27a. Therefore, run through coverlay 29, sticking Meet the burr 33a of agent layer 28, arrive empty distribution pattern 27a. Because empty distribution pattern 2 7a is the electric independently distribution pattern that prevents that short circuit from using, so, not with metal primary screw 3 3 produce short circuit.
In addition, in flexible printed base plate 20, contact at the head of metal primary screw 33 Part, form empty distribution pattern 27a, like this, the distribution pattern of face side 23 and gold The distance that belongs to the burr 33a of primary screw 33 is pulled open, so, can reduce Yin Maoci 33a Cause the danger of short circuit.
In addition, owing to have the metal level of empty distribution pattern 27a, flexible printed base plate 20 The hardness of itself also increases. Available and the common distribution pattern formation method of the manufacturing of substrate is same Operation carry out, do not need special cost, but qurer is realized.
Below, the 2nd embodiment of the present invention is described.
The 2nd embodiment is that expression is with the stacked example of the flexible printed base plate of single face.
Among Fig. 2, (a) be the top figure of the flexible printed base plate face side of single face of expression upside, (b) be the top figure of expression downside single face flexible printed base plate face side, (c) be (a) and (b) G-G ' line sectional drawing in.
The flexible printed base plate 35 of the single face of upside is by base material 211, be arranged on this base material 2 If the bond layer on 11 221, be formed on this bond layer 221 with predetermined space Dried distribution pattern 231 and the distribution pattern 231 thicker than this distribution pattern 231 ', cover This distribution pattern 231 and distribution pattern 231 ' bond layer 241 and be arranged on this Coverlay 251 on the bond layer 241 consists of.
The flexible printed base plate 36 of the single face of downside is by base material 212, be arranged on this base material 2 If the bond layer on 12 222, be formed on this bond layer 222 with predetermined space Dried distribution pattern 232,232 ', empty distribution pattern 23a, cover this distribution pattern 2 32, distribution pattern 232 ' and bond layer 242 of empty distribution pattern 23a and establishing The coverlay 252 of putting on this bond layer 242 consists of.
Above-mentioned empty distribution pattern 23a is and other distribution pattern 232,232 ' electric The independent anti-short circuit distribution pattern that arranges is formed on flexible printed base plate 36 and the little spiral shell of metal The part corresponding to head contact position of silk 33. In addition, distribution pattern 232,232 ', Avoid the configuration of empty distribution pattern 23a ground.
Like this, at the flexible printed base plate of upside single face that does not directly contact with metal primary screw 33 In 35, distribution pattern Figure 23 1 and 231 ' not avoids metal primary screw 33, with gold On the flexible printed base plate 36 of downside single face that genus primary screw 33 directly contacts, form empty distribution Pattern 23a.
With the flexible printed base plate 36 of downside single face that metal primary screw 33 directly contacts on, Form empty distribution pattern Figure 23 a, like this, the distribution of the flexible printed base plate 35 of upside single face Pattern 231, distribution pattern 231 ' with the distance of the burr 33a of metal primary screw 33 Pull open, so, the danger that burr 33a causes short circuit can be reduced.
In addition, owing to form the metal level of empty distribution pattern 23a, so flexible printed base plate 36 hardness also increases. On making, the worker same with common distribution pattern formation method Order is carried out, thus do not need special cost, but qurer is realized.
Below, the present invention the 3rd embodiment is described.
The 3rd embodiment is that the empty distribution pattern of two-sided flexible printed base plate is also used as ground wire Example.
Among Fig. 3, be the top figure of the two-sided flexible printed base plate face side of expression (a), (b) be Represent (c) to be the perspective view of two-sided flexible printed base plate rear side shown in (a) from face side (a) and the H-H ' line sectional drawing (b).
Two-sided flexible printed base plate 38 is by base material 21, bond layer 22, some distributions Pattern 23 and distribution pattern 23 ', bond layer 24, coverlay 25, bond layer 26, some distribution patterns 27 and distribution pattern 27b, earth wire conductor configuration pattern 27c, sticking Connect agent layer 28, coverlay 29 formations.
Among the 3rd embodiment, some distribution patterns 23 of face side are with above-mentioned the 1st enforcement Example similarly forms with predetermined space. Form and the distribution pattern of rear side is following with stating.
That is, earth wire conductor configuration pattern 27c comprises flexible printed base plate 38 and metal primary screw 33 head contact position counterpart ground form. Avoid this earth wire conductor configuration pattern 27c, with Predetermined space forms some distribution patterns 27 and the distribution pattern 2 thicker than this distribution pattern 27 7b.
In the electronic equipment of the flexible printed base plate 38 of these structures of metallic plate 31 configuration, Suppose at the jagged 33a of the head of metal primary screw 33. So this burr 33a runs through Coverlay 29, bond layer 28 in the flexible printed base plate 38a exist and distribution The danger of pattern short circuit.
But the distribution pattern that contacts with above-mentioned burr 33a is earth wire conductor configuration pattern 27c. So, metallic plate 31 ground connection that are fixed wtih with metal primary screw 33, thus on circuit not Can have problems.
Like this, in the part of metal primary screw 33 contacts, form earth wire conductor configuration pattern 27c, So the distribution pattern 23 of face side draws with the distance of the burr 33a of metal primary screw 33 Open, in addition, owing to form the metal level of earth wire conductor configuration pattern 27c, so, flexible printing Substrate 38 hardness own also increase, and can reduce the danger that burr 33a causes short circuit.
Like this, empty distribution pattern can be used as the distribution pattern, can guarantee easily other distribution Area of the pattern.
In above-described embodiment, the feelings when flexible printed base plate contacts with the metal primary screw have been described Shape, still, flexible printed base plate is configured in that (it is such to produce burr with other conductive component The parts of jut) during the position of contact, also can use.
Below, the use-case of answering of the present invention is described.
Fig. 4 is illustrated in the state that forms punching on the metallic plate, (a) is stereogram, (b) (a) I-I ' line sectional drawing in.
When metallic plate 40 forms hole 41, produced burr. Therefore, flexible printing When substrate is configured on this metallic plate 40, connecing with above-mentioned jut on flexible printed base plate The position of touching forms empty distribution pattern as described above.
Fig. 5 represents the engagement state of 2 metallic plates, (a) is stereogram, (b) is (a) In J-J ' line sectional drawing.
Predetermined position at a side metallic plate 43 forms 2 holes 44. The opposing party's gold 2 juts that belong to plate 45 insert respectively in the above-mentioned hole 44 and bending, such 2 blocks of gold Belonging to plate fixes.
At this moment, owing to produce burr at the jut front end of metallic plate 45, so, flexible When printed base plate is configured on the jut of this metallic plate 45, on flexible printed base plate with The position of above-mentioned jut contact forms empty distribution pattern as described above.
Fig. 6 is the figure that expression lead-type electric parts is installed in state on the printed base plate. The lead 51 of electronic unit 50 inserts the hole 49 that is formed on the printed base plate 48 In, with soldering 52 this electronic unit 50 is fixed on the printed base plate 48. By soldering The lead 51 of electronic unit 50, leading section 53 forms sharp-pointed shape when cutting.
At this moment, the leading section 53 of the lead 51 that is cut is states identical with burr, institute With, when being configured in flexible printed base plate on this leading section 53, form onboard above-mentioned such Empty distribution pattern. In addition, above-mentioned printed base plate 48 can be illustrated hard substrate, It also can be flexible printed base plate.
As mentioned above, according to the present invention, the part that contacts with flexible printed base plate at conductive component, Form empty distribution pattern, the distance of wiring diagram case and conductive component is pulled open, owing to have The metal level of empty distribution pattern so the hardness of flexible printed base plate also increases, can reduce burr Deng the danger that causes short circuit.
In addition, empty distribution pattern is also used as the earth wire conductor configuration pattern, can with empty distribution pattern as The distribution pattern uses, and can easily guarantee other distribution area of the pattern.
Claims (20)
1. electronic equipment, carrying the flexible printing substrate, this flexible printing substrate has at least more than one Wiring pattern, it is characterized in that, at the part of above-mentioned flexible printing substrate, the position that promptly contacts, form the empty Wiring pattern that prevents this conductivity jut and above-mentioned Wiring pattern conducting with conductivity jut in this electronic equipment.
2. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned empty Wiring pattern is between the Wiring pattern and above-mentioned conductivity jut of flexible printing substrate.
3. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned flexible printing substrate is a two sides flexible printing substrate, is formed with the 1st Wiring pattern in a side of substrate, is formed with the 2nd Wiring pattern at the opposite side of substrate.
4. electronic equipment as claimed in claim 3 is characterized in that, above-mentioned empty Wiring pattern is formed on on the one side with the Wiring pattern near above-mentioned conductivity jut in above-mentioned the 1st Wiring pattern and the 2nd Wiring pattern.
5. electronic equipment as claimed in claim 3 is characterized in that, above-mentioned empty Wiring pattern insulate with respect to the parts of the outside of this substrate.
6. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned flexible printing substrate is the single face flexible printing substrate that only forms Wiring pattern in the one side side of this substrate.
7. electronic equipment as claimed in claim 6 is characterized in that, above-mentioned single face flexible printing substrate on above-mentioned single face flexible printing substrate, is also disposing another flexible printing substrate under the state that is assembled on the electronic equipment.
8. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned empty Wiring pattern is as ground wire.
9. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned empty Wiring pattern is the wire Wiring pattern that forms on the direction vertical with the line direction of above-mentioned Wiring pattern.
10. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned conductivity jut is the metal primary screw.
11. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned conductivity jut is formed in the hole portion on the conductive component.
12. electronic equipment as claimed in claim 1 is characterized in that, above-mentioned conductivity jut is the wire portion of electronic unit or this electronic unit.
13. electronic equipment is carrying the flexible printing substrate, this flexible printing substrate has at least more than one Wiring pattern, it is characterized in that,
Have the conductive component that constitutes this electronic equipment internal;
Near above-mentioned flexible substrate and above-mentioned conductive component position contacting, be provided with the empty Wiring pattern of the Wiring pattern of this flexible printing substrate of protection.
14. electronic equipment as claimed in claim 13 is characterized in that, above-mentioned conductive component is the metal primary screw.
15. electronic equipment as claimed in claim 13 is characterized in that, above-mentioned empty Wiring pattern is as ground wire.
16. the double-faced flexible printed base plate holding side's side of base material under the arm, forms the 1st Wiring pattern, in the opposing party's side, forms the 2nd Wiring pattern, it is characterized in that,
See from above with above-mentioned the 1st Wiring pattern position overlapped, promptly with above-mentioned the 2nd Wiring pattern with one side on, form the empty Wiring pattern of above-mentioned the 1st Wiring pattern of protection.
17. double-faced flexible printed base plate as claimed in claim 16 is characterized in that, above-mentioned empty Wiring pattern prevents that outside conductivity jut and above-mentioned the 1st Wiring pattern from electrically contacting.
18. double-faced flexible printed base plate as claimed in claim 16 is characterized in that, above-mentioned empty Wiring pattern insulate with respect to the external component of this substrate.
19. double-faced flexible printed base plate as claimed in claim 16 is characterized in that, above-mentioned empty Wiring pattern is as ground wire.
20. double-faced flexible printed base plate as claimed in claim 16 is characterized in that, above-mentioned empty Wiring pattern is the wire Wiring pattern that forms in the direction vertical with respect to the line direction of above-mentioned the 1st Wiring pattern.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000238548A JP2002050839A (en) | 2000-08-07 | 2000-08-07 | Electronic apparatus |
| JP238548/2000 | 2000-08-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1337842A true CN1337842A (en) | 2002-02-27 |
| CN1170462C CN1170462C (en) | 2004-10-06 |
Family
ID=18730235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011203471A Expired - Fee Related CN1170462C (en) | 2000-08-07 | 2001-08-07 | Electronic device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2002050839A (en) |
| CN (1) | CN1170462C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107592748A (en) * | 2017-09-11 | 2018-01-16 | 广东欧珀移动通信有限公司 | A kind of flexible circuit board assembly and preparation method thereof, mobile terminal |
| CN107708289A (en) * | 2017-09-11 | 2018-02-16 | 广东欧珀移动通信有限公司 | A kind of flexible circuit board assembly and preparation method thereof, mobile terminal |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4901332B2 (en) * | 2006-06-30 | 2012-03-21 | 日本メクトロン株式会社 | Flexible printed wiring board |
-
2000
- 2000-08-07 JP JP2000238548A patent/JP2002050839A/en not_active Withdrawn
-
2001
- 2001-08-07 CN CNB011203471A patent/CN1170462C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107592748A (en) * | 2017-09-11 | 2018-01-16 | 广东欧珀移动通信有限公司 | A kind of flexible circuit board assembly and preparation method thereof, mobile terminal |
| CN107708289A (en) * | 2017-09-11 | 2018-02-16 | 广东欧珀移动通信有限公司 | A kind of flexible circuit board assembly and preparation method thereof, mobile terminal |
| CN107592748B (en) * | 2017-09-11 | 2020-05-08 | Oppo广东移动通信有限公司 | Flexible circuit board assembly, manufacturing method thereof and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002050839A (en) | 2002-02-15 |
| CN1170462C (en) | 2004-10-06 |
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Granted publication date: 20041006 Termination date: 20180807 |
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| CF01 | Termination of patent right due to non-payment of annual fee |