JP2007305931A - Circuit board outline punching die - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board outline punching die which does not lower work efficiency and which does not damage a product yield. <P>SOLUTION: The circuit board outline punching die 12 comprises a first die 100 provided with a pressing plate 150 and a die plate 130, and a second die 200 provided with a die punch 240 and a stripper plate 250. The die punch 240 is provided with a plurality of posts 210 projected from the surface of the die punch 240. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a circuit board outer shape punching die.

  In recent years, the density of electronic devices has been increased, as represented by mobile phones and personal computers, and as a result, the required quality of circuit boards used has been varied.

  A general manufacturing method of a circuit board uses a metal-clad laminate in which a metal layer is formed on at least one surface of a base material, forms a wiring circuit on the metal layer, performs electrical inspection, and performs outline punching. The circuit board is completed. Depending on the product specifications, steps such as forming a plurality of different coating layers, forming an electromagnetic wave shielding layer, and attaching a reinforcing plate are appropriately added.

  During manufacturing, a plurality of products are placed on a single metal-clad laminate or a roll-like metal-clad laminate, cut to an optimal size in the middle of the process, and finally in the outer shape machining process. It becomes a piece of the product. When performing component mounting or the like, a product may not be completely separated into individual pieces, but may be formed in a state in which a plurality of products are connected and processed into individual pieces after component mounting.

  In such a manufacturing process, the circuit board punching mold is not only a mold for processing the outer shape, a mold for partially drilling holes in the circuit board, but also a coating layer or double-sided tape. Various molds and specifications such as a mold for processing a film-like workpiece into a desired shape such as a reinforcing plate and an electromagnetic wave shielding layer are used (for example, Patent Document 1).

In this, the metal mold | die used for the external shape process of a circuit board is comprised with the 1st type | mold 100 and the 2nd type | mold 200 as shown in FIG. 2, arrange | positioning a circuit board between this type | mold, First, the mold is sandwiched between the mold and the second mold (FIG. 2B), and the outer shape is cut. However, as shown in FIG. 2C, since the circuit board has a certain thickness, even if the outer shape is processed or the outer shape is cut once, a portion where the substrate is punched is hollow. Again, the circuit board gets stuck like a jigsaw puzzle. For this reason, the punched circuit board must be removed every time the punching process is performed, and there is a problem that the working efficiency is lowered, and the product may be broken or wrinkled to make the product defective.
Japanese Patent Laid-Open No. 09-064512

  The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a circuit board outer shape punching die without deteriorating work efficiency and without impairing the product yield.

Such an object is achieved by the present invention described in (1) and (2) below.
(1) A circuit board outer shape punching die including a first die provided with a holding plate 150 and a die plate 130, a second die provided with a die punch 240 and a stripper plate 250. The die punch 240 has a plurality of posts protruding from the die punch surface.
(2) The external punching of the circuit board according to (1) or (2), wherein when the external force is applied to the post, the protruding portion is housed in the die punch and protrudes from the die punch surface again when the external force is removed. Mold.

  According to the present invention, it is possible to provide a circuit board outer shape punching die without deteriorating the working efficiency and without impairing the product yield.

  Hereinafter, a preferred embodiment of a circuit board outer shape punching die of the present invention will be described with reference to the drawings. In all the drawings, common constituent elements are denoted by the same reference numerals, and detailed description will be appropriately omitted in the following description.

  FIG. 1 is a process sectional view showing an embodiment of a circuit board outer shape punching die according to the present invention. The circuit board outer shape punching die 12 includes a first die 100 provided with a pressing plate 150, a die plate 130, a die punch 240, and a second die 200 provided with a stripper plate 250. This is a circuit board outer shape punching die. The die punch 240 has a plurality of posts 210 protruding from the die punch 240 surface. The first mold 100, also referred to as an upper mold, includes a circuit board outer shape punching die 120, a holding plate 150, a circuit board outer shape punching die 120, a punch holder 110, a cushion material 140, and the like. A circuit board outer shape punching die 120 is attached to the punch holder 110, and a pressing plate 150 is attached to the circuit board outer shape punching die 120 via a die plate 130 and a cushion material 140. On the other hand, in the second mold 200, which is also called a lower mold, a stripper plate 250 is attached to a die holder 260 via a die punch 240 and a cushion material 230. A plurality of holes are provided in the die punch 240, and the post 210 protrudes from the surface of the die punch 240 through the holes. The protrusion length of the post 210 from the die punch 240 is not particularly limited, but is preferably 0.5 mm or more and 5 mm or less. If it is within this range, the punched circuit board can be easily taken out from the mold. Moreover, although there is no limitation in particular in the installation place and the number of posts 210, it is preferable to provide in the outer periphery rather than the inner periphery of a circuit board. By providing the outer periphery, the periphery of the circuit board is in a floating state, so that it can be easily taken out. Further, when an external force is applied to the post 210, the protruding portion may be accommodated in the die punch, and may protrude from the die punch surface again when the external force is removed. By doing so, it becomes possible to punch without damaging the circuit board.

  The material of the cushion materials 140, 220, and 230 is not particularly limited, but may be any cushion material that can withstand tens of thousands of compressions, and generally used urethane rubber is suitable.

  Next, it demonstrates in order of a process process using FIG.

  FIG. 1A shows a state in which a circuit board 300 is set in a mold according to an embodiment of the present invention. Although not shown, the second die 200 is provided with a reference pin for improving the accuracy of the punching position, and a reference hole is provided in advance on the circuit board 300 side so as to correspond to the position. Yes. A reference hole is inserted into the reference pin for positioning. Next, the first mold 100 starts to descend. When the descent starts, first, the pressing plate 150 is positioned on the lower side in the drawing in the configuration of the first mold 100, so that it comes into contact with the second mold 200 while pressing the circuit board 300. At substantially the same time, the post 210 provided on the cushion material 220 moves into the die punch 240.

  In this state, when the first mold 100 is further lowered, the holding plate 150 is kept pressed by the force of the cushioning material 140 while the holding plate 150 is deformed by the deformation of the cushioning material 140. Stays in the same position. Then, the die plate 130 comes into contact with the circuit board 300 and further descends, so that the die punch 240 of the second mold 200 is included. At that time, a shearing force acts on the contact surface between the die plate 130 and the die punch 240 to cut the circuit board 300 (FIG. 1B). After the cutting, the first mold 100 starts to rise and leaves the second mold 200. At the same time, the post 210 that has been pressed again protrudes from the surface of the die punch 240, and at the same time the circuit board 300 that has been cut upwards. Lift up (FIG. 1 (c)).

It is process sectional drawing of the circuit board external shape punching die of this invention. It is process schematic of the circuit board external shape punching die which shows a prior art example.

Explanation of symbols

12 Circuit board punching die 100 First die 110 Punch holder 120 Punch plate 130 Die plate 140 Cushion material 150 Holding plate 200 Second die 210 Post 220 Cushion material 230 Cushion material 240 Die punch 250 Stripper plate 260 Die holder 300 Circuit substrate

Claims (2)

A first mold provided with a holding plate and a die plate;
A circuit board outer shape punching die comprising a die punch and a second die provided with a stripper plate,
The die punching die according to claim 1, wherein the die punch has a plurality of posts protruding from the die punch surface. 2. The circuit board outer shape punching die according to claim 1, wherein when the external force is applied to the post, the protruding portion is accommodated in the die punch, and protrudes from the die punch surface again when the external force is removed.

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