CN105072807A - Circuit board production process - Google Patents
Circuit board production process Download PDFInfo
- Publication number
- CN105072807A CN105072807A CN201510395067.4A CN201510395067A CN105072807A CN 105072807 A CN105072807 A CN 105072807A CN 201510395067 A CN201510395067 A CN 201510395067A CN 105072807 A CN105072807 A CN 105072807A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- substrate
- board production
- conductive layer
- production technique
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a circuit board production process. The circuit board production process is characterized in that a copper-clad plate without an insulating layer on the surface is selected as a substrate. The process includes the following production steps: a, cutting the substrate to have a dimension meeting a design requirement; b, combining the insulating layer of the substrate with an enhanced layer in a composite way; c, arranging a conductive layer on one side of the substrate, and shifting a circuit pattern on the substrate; d, puncturing in the position of electric conduction of the conductive layer, and making the conductive layer of the substrate form a through hole for electric conduction; e, flattening burs on the transverse plane of the through hole and obtaining a double-surface circuit board; f, cleaning a panel and a blind hole of the circuit board with normal temperature clear water; and g, air drying the circuit board obtained from the step f through normal temperature natural wind. The circuit board production process helps to solve the problems that batch production is difficult, the production cost is high, the circuit board is liable to be torn during punching, and the outer dimension of the circuit board cannot be well controlled.
Description
Technical field
The present invention relates to printed-board technology field, be specifically related to a kind of board production technique.
Background technology
Existing high-frequency circuit board production technology is general relatively complicated, makes cumbersome, in wiring board production process, to next panel plating operation after heavy copper, need be immersed in the dilute sulfuric acid liquid medicine of 0.05-0.1%, preventing board face and hole internal oxidition, bad after the plating of prevention product; But dilute sulfuric acid to oily waste degradation power is strong simultaneously can microetch copper, soak time must control can not more than 4 hours, otherwise after the hole wall thin copper microetch of one deck of sinking can causing hole without copper, and the per tour of dilute sulfuric acid liquid medicine need change cylinder once.Due to the restriction of strict time controling, control to bring very big inconvenience to production operation, and easily produce quality problem.So existing high-frequency circuit board production technology awaits perfect further.
Summary of the invention
The object of the invention is to overcome weak point of the prior art, providing a kind of technique simple, easy to process, the board production technique that conforming product rate is high.
A kind of board production technique, select surface to be provided with the copper-clad plate of insulating barrier as substrate, comprise following production stage:
A. described substrate is cut into the size that composite design requires;
B. by described substrate insulating layer and enhancement layer compound;
C. substrate side is provided with conductive layer, and carries out the transfer of circuit pattern on substrate;
D. at the position puncture mode acanthopore that conductive layer conducts, conductive layer set by substrate is made to form the through hole conducted;
E. make through hole end face burr smooth, obtain double-sided PCB;
F. plate face and the blind hole of normal temperature clean water circuit board is utilized;
G. utilize normal temperature natural wind by air-dry for the circuit board of step f gained.
Preferably, described complex method is that just enhancement layer is compounded in surface of insulating layer under certain pressure and temperature conditions.
Preferably, described enhancement layer is the PP film being attached with tack coat.
Preferably, the cleaning pressure in step e is 40-60kg/cm.
Preferably, pressure is utilized to be normal temperature clean water its plate face and blind hole of 0.7-1.3kg/cm after step e;
Preferably, after step f, described circuit board is toasted 1-3 minutes under 70-85 DEG C of conditions.
The invention has the advantages that, the problem of easily tearing the bad control with overall dimension when being difficult to the high difficult problem of volume production, production cost and punching of circuit board can be solved, with the mode acanthopore that punctures, the conductive layer of substrate is conducted, efficient and convenient, save a large amount of complicated procedures of forming, improve production efficiency, in piercing process, insulating barrier and conductive layer, after substrate punctures, due to elastic shrinkage, make the insulating barrier after puncturing and conductive layer lose insulation isolation, make both puncture place's conducting, avoid traditional rosin joint defect.
Embodiment
Be clearly and completely described below with reference to the technique effect of embodiment to design of the present invention, concrete structure and generation, to understand object of the present invention, scheme and effect fully.It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.
Embodiment 1
A kind of board production technique, select surface to be provided with the copper-clad plate of insulating barrier as substrate, comprise following production stage:
A. described substrate is cut into the size that composite design requires;
B. by described substrate insulating layer and enhancement layer compound;
C. substrate side is provided with conductive layer, and carries out the transfer of circuit pattern on substrate;
D. at the position puncture mode acanthopore that conductive layer conducts, conductive layer set by substrate is made to form the through hole conducted;
E. make through hole end face burr smooth, obtain double-sided PCB;
F. plate face and the blind hole of normal temperature clean water circuit board is utilized;
G. utilize normal temperature natural wind by air-dry for the circuit board of step f gained.
It should be noted that described complex method is under certain pressure and temperature conditions, just enhancement layer is compounded in surface of insulating layer.
In this example, described enhancement layer is the PP film being attached with tack coat.
In this example, the cleaning pressure in step e is 40kg/cm.
In this example, the normal temperature clean water utilizing pressure to be 0.7kg/cm after step e its plate face and blind hole;
In addition, after step f, described circuit board is toasted 1 minute under 70 DEG C of conditions.
Embodiment 2
Adopt embodiment 1 method to produce, its difference is:
In this example, the cleaning pressure in step e is 50kg/cm.
In this example, the normal temperature clean water utilizing pressure to be 1.0kg/cm after step e its plate face and blind hole;
In addition, after step f, described circuit board is toasted 2 minutes under 80 DEG C of conditions.
Embodiment 3
Adopt embodiment 1 method to produce, its difference is:
In this example, the cleaning pressure in step e is 60kg/cm.
In this example, the normal temperature clean water utilizing pressure to be 1.3kg/cm after step e its plate face and blind hole;
In addition, after step f, described circuit board is toasted 3 minutes under 85 DEG C of conditions.
Based on above-mentioned, the present invention can solve the problem of easily tearing the bad control with overall dimension when being difficult to the high difficult problem of volume production, production cost and punching of circuit board, with the mode acanthopore that punctures, the conductive layer of substrate is conducted, efficient and convenient, save a large amount of complicated procedures of forming, improve production efficiency, in piercing process, insulating barrier and conductive layer, after substrate punctures, due to elastic shrinkage, make the insulating barrier after puncturing and conductive layer lose insulation isolation, make both puncture place's conducting, avoid traditional rosin joint defect.
Above-described is only the preferred embodiment of the present invention, it should be pointed out that for the person of ordinary skill of the art, and without departing from the concept of the premise of the invention, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (6)
1. a board production technique, is characterized in that, selects surface to be provided with the copper-clad plate of insulating barrier as substrate, comprises following production stage:
A. described substrate is cut into the size that composite design requires;
B. by described substrate insulating layer and enhancement layer compound;
C. substrate side is provided with conductive layer, and carries out the transfer of circuit pattern on substrate;
D. at the position puncture mode acanthopore that conductive layer conducts, conductive layer set by substrate is made to form the through hole conducted;
E. make through hole end face burr smooth, obtain double-sided PCB;
F. plate face and the blind hole of normal temperature clean water circuit board is utilized;
G. utilize normal temperature natural wind by air-dry for the circuit board of step f gained.
2. a kind of board production technique according to claim 1, is characterized in that, described complex method is that just enhancement layer is compounded in surface of insulating layer under certain pressure and temperature conditions.
3. a kind of board production technique according to claim 1, is characterized in that, described enhancement layer is the PP film being attached with tack coat.
4. a kind of board production technique according to claim 1, is characterized in that, the cleaning pressure in step e is 40-60kg/cm.
5. a kind of board production technique according to claim 1, is characterized in that, utilizes pressure to be normal temperature clean water its plate face and blind hole of 0.7-1.3kg/cm after step e.
6. a kind of board production technique according to claim 1, is characterized in that, is toasted 1-3 minutes by described circuit board after step f under 70-85 DEG C of conditions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510395067.4A CN105072807A (en) | 2015-07-07 | 2015-07-07 | Circuit board production process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510395067.4A CN105072807A (en) | 2015-07-07 | 2015-07-07 | Circuit board production process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105072807A true CN105072807A (en) | 2015-11-18 |
Family
ID=54502043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510395067.4A Pending CN105072807A (en) | 2015-07-07 | 2015-07-07 | Circuit board production process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105072807A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006190835A (en) * | 2005-01-06 | 2006-07-20 | Nippon Mektron Ltd | Punching method for flexible printed board |
| CN102573298A (en) * | 2010-12-07 | 2012-07-11 | 何忠亮 | Production technology for two-sided circuit board |
| CN203510843U (en) * | 2013-07-26 | 2014-04-02 | 开平太平洋绝缘材料有限公司 | Heat-resistant and environment-friendly type copper-clad plate |
-
2015
- 2015-07-07 CN CN201510395067.4A patent/CN105072807A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006190835A (en) * | 2005-01-06 | 2006-07-20 | Nippon Mektron Ltd | Punching method for flexible printed board |
| CN102573298A (en) * | 2010-12-07 | 2012-07-11 | 何忠亮 | Production technology for two-sided circuit board |
| CN203510843U (en) * | 2013-07-26 | 2014-04-02 | 开平太平洋绝缘材料有限公司 | Heat-resistant and environment-friendly type copper-clad plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151118 |
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| RJ01 | Rejection of invention patent application after publication |